CL6N5-G

CL6 100 mA Fixed Constant-Current Linear LED Driver Features General Description • • • • • • The CL6 is a fixed-current linear regulator designed for driving high-brightness LEDs at 100 mA from nominal 12V, 24V and 48V power supplies. With a maximum rating of 90V, it is able to withstand transients without the need for additional transient protection circuitry. 100 mA ±5% Constant-Current Driver Built-In Reverse Polarity Protection Dimmable via PWM Supply Overtemperature Protection Tab Ground allows Direct Heatsinking to Chassis 90V Maximum Rating for Transient Immunity Applications • • • • Flashlights Specialty Lighting Low-Voltage Signage Low-Voltage Lighting The CL6 is offered in both TO-252 (D-PAK) and TO-220 packages. The tab on the TO-220 is ground, allowing heatsinking directly to a chassis without the need for electrically insulating spacers. Overtemperature protection circuitry shuts off the LED current when the die temperature reaches 135°C (typical). Full LED current resumes when the die temperature falls below 105°C (typical). Package Types TO-252 (DPAK) (Top view) TO-220 (Top view) GND GND OUT GND OUT VDD VDD GND See Table 2-1 and Table 2-2 for pin information.  2018 Microchip Technology Inc. DS20005809A-page 1 CL6 Functional Block Diagram DS20005809A-page 2  2018 Microchip Technology Inc. CL6 Typical Application Circuit VIN 100mA VDD OUT Control CL6 GND   2018 Microchip Technology Inc. DS20005809A-page 3 CL6 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Supply Voltage, VDD .................................................................................................................................–25V to +100V Output Voltage, VOUT ..............................................................................................................................–25V to +100V Junction Temperature, TJ (Note 1) ...................................................................................................... –40°C to +135°C Storage Temperature, TS ..................................................................................................................... –65°C to +150°C † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Note 1: Maximum junction temperature internally limited RECOMMENDED OPERATING CONDITIONS Electrical Specifications: All voltages with respect to GND pin Parameter Sym. Min. Typ. Supply Voltage VDD 6.5 — Voltage at Out Pin VOUT 4 — TJ –40 — Operating Junction Temperature Note 1: 2: Max. 28 90 28 90 119 Unit V V °C Conditions Normal Extended Normal (Note 1) Extended (Note 1) Note 2 Continuous operation at high VOUT voltages may result in activation of overtemperature protection. Use appropriate heat sinking. Maximum junction temperature internally limited DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Over normal recommended operating conditions unless otherwise specified. All voltages with respect to GND pin. Parameter Current into VDD Pin Current into OUT Pin Sym. IDD IOUT Min. Typ. Max. Unit mA Conditions 3 5 10 95 100 105 Normal conditions, 25°C (Note 1) 90 100 110 Normal conditions, full temperature (Note 1, Note 2) 50 — 120 mA Extended conditions (See Recommended Operating Conditions.) (Note 1) Current into OUT Pin with VDD Pin Open IOUT(OFF) — — 10 µA VDD = open Voltage at VDD to Shut off LED Current VOFF — — 1 V IOUT < 10 µA VDD Applied On Delay tON — — 100 µs VDD Removed Off Delay tOFF — — 100 µs Note 1: 2: Continuous operation at high VOUT voltages may result in activation of overtemperature protection. Use appropriate heat sinking. Limits obtained by characterization and not 100% tested in production. DS20005809A-page 4  2018 Microchip Technology Inc. CL6  TEMPERATURE SPECIFICATIONS Parameter Sym. Min. Typ. Max. Unit Conditions TJ –40 — 119 °C Storage Temperature TS –65 — +150 °C Overtemperature Limit TLIM 120 135 150 °C Note 1 Overtemperature Hysteresis THYS — 30 — °C Note 1 3-lead TO-252 (D-PAK) JA — 81 — °C/W Note 2 3-lead TO-220 JA — 29 — °C/W TEMPERATURE RANGE Operating Junction Temperature PACKAGE THERMAL RESISTANCE Note 1: 2: For design guidance only Soldered to 2 cm2 exposed copper area   IOUT vs. Temperature IOUT (normalized) 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 Temperature (OC)  2018 Microchip Technology Inc. DS20005809A-page 5 CL6 2.0 PIN DESCRIPTION The details on the pins of CL6 are listed in Table 2-1 and Table 2-2. Refer to Package Types for the location of pins. TABLE 2-1: TO-252 (DPAK) PIN FUNCTION TABLE Pin Number Pin Name 1 VDD Supply voltage for the CL6 3 OUT Constant-current sink. Connect the LED between this pin and the supply voltage. 4 GND Circuit common ground 2 GND Circuit common ground (not for external connection) TABLE 2-2: Description TO-220 PIN FUNCTION TABLE Pin Number Pin Name 1 VDD Supply voltage for CL6 2 GND Circuit common ground 3 OUT Constant current sink. Connect the LED between this pin and the supply voltage. 4 GND Circuit common ground (tab for mounting to external heatsink) DS20005809A-page 6 Description  2018 Microchip Technology Inc. CL6 3.0 APPLICATION INFORMATION 3.1 Application Circuits VIN VIN 107.5mA 100mA Low current switch VDD OUT VDD Control Control CL6 CL6 GND FIGURE 3-1: Low-Current On/Off Control.  2018 Microchip Technology Inc. OUT Minimum VIN is increased by LED drop. ILED is increased by IDD. FIGURE 3-2: GND Two-Terminal Operation. DS20005809A-page 7 CL6 4.0 PACKAGING INFORMATION 4.1 Package Marking Information TO-252 (D-PAK) XXXX XXXXX e3 YYWWNNN CL 6K4 e3 1812541 3-lead TO-220 Example XXXXXXXXX YYWWNNN CL6N5 e3 1822477 e3 Legend: XX...X Y YY WW NNN e3 * Note: DS20005809A-page 8 Example Product Code or Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo.  2018 Microchip Technology Inc. CL6 Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.  2018 Microchip Technology Inc. DS20005809A-page 9 CL6 3-Lead TO-220 Package Outline (N5) A E2 E Seating Plane A1 A ΦP Thermal Pad E Q H1 4 D2 D D1 Chamfer Optional 1 3 2 E1 L View B A2 c e Front View A Side View 1 View A - A 3 2 L1 b b2 View B Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. Symbol Dimension (inches) A A1 A2 b b2 c D D1 D2 E E1 E2 MIN .140 .020 .080 .015 .045 .012† .560 .326† .474† .380 .270 0.20* NOM - - - .027 .057 - - - - - - - MAX .190 .055 .120 .040 .070 .024 .650 .361 .507 .420 .350 .030 † † e .100 BSC H1 L L1 Q ĭP .230 .500 .200* .100 .139 - - - - - .270 .580 .250 .135 .161 JEDEC Registration TO-220, Variation AB, Issue K, April 2002. 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ ‚7KLVGLPHQVLRQGLIIHUVIURPWKH-('(&GUDZLQJ Drawings not to scale. DS20005809A-page 10  2018 Microchip Technology Inc. CL6 APPENDIX A: REVISION HISTORY Revision A (November 2018) • Converted Supertex Doc# DSFP-CL6 to Microchip DS20005809A • Changed the maximum junction temperature from 150°C to 135°C in the Absolute Maximum Ratings section and added a maximum operating junction temperature of 119°C to the Temperature Specifications table • Changed the package marking format • Made new sections to comply with the standard Microchip document format. • Made minor text changes throughout the document  2018 Microchip Technology Inc. DS20005809A-page 11 CL6 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device Device: Packages: Environmental: Media Types: XX - Package Options CL6 X - Environmental = X Media Type 100 mA Fixed Constant-Current Linear LED Driver K4 = 3-lead TO-252 (D-PAK) N5 = 3-lead TO-220 G = Lead (Pb)-free/RoHS-compliant Package (blank) = 2000/Reel for a TO-252 (D-PAK) Package (blank) = 50/Tube for a TO-220 Package DS20005809A-page 12 Examples: a) CL6K4-G: 100 mA Fixed Constant-Current Linear LED Driver, 3-lead TO-252 (D-PAK) Package, 2000/Reel b) CL6N5-G: 100 mA Fixed Constant-Current Linear LED Driver, 3-lead TO-220 Package, 50/Tube  2018 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-3867-0 == ISO/TS 16949 ==  2018 Microchip Technology Inc. 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