MIC38C42/43/44/45
BiCMOS Current-Mode PWM Controllers
Features
General Description
• Fast 40 ns Output Rise and 30 ns Output Fall
Times
• –40°C to +85°C Ambient Temperature Range
Meets UC284x Specifications
• High-Performance, Low-Power BiCMOS Process
• Ultra-Low Start-Up Current (50 μA Typical)
• Low Quiescent Operating Current (4 mA Typical)
• CMOS Outputs with Rail-to-Rail Swing
• Up to 500 kHz Current-Mode Operation
• Trimmed 5V Bandgap Reference
• Pin-for-Pin Compatible with
UC3842/3843/3844/3845(A)
• Trimmed Oscillator Discharge Current
• UVLO with Hysteresis
• Low Cross-Conduction Currents
The MIC38C4x are fixed-frequency, high performance,
current-mode PWM controllers. Microchip’s BiCMOS
devices are pin compatible with 384x bipolar devices,
but feature several improvements.
Applications
• Current-Mode, Offline, Switched-Mode Power
Supplies
• Current-Mode, DC-to-DC Converters
• Step-Down Buck Regulators
• Step-Up Boost Regulators
• Flyback, Isolated Regulators
• Forward Converters
• Synchronous FET Converters
Undervoltage lockout circuitry allows the ‘42 and ‘44
versions to start up at 14.5V and operate down to 9V,
and the ‘43 and ‘45 versions start at 8.4V with operation
down to 7.6V. All versions operate up to 20V.
When compared to bipolar 384x devices operating
from a 15V supply, start-up current has been reduced
to 50 μA typical and operating current has been
reduced to 4.0 mA typical. Decreased output rise and
fall times drive larger MOSFETs, and rail-to-rail output
capability increases efficiency, especially at lower
supply voltages. The MIC38C4x also features a
trimmed oscillator discharge current and bandgap
reference.
The MIC38C4x denotes 8-pin plastic DIP, SOIC, and
MSOP packages. MIC38C4x-1 denotes 14-pin plastic
DIP and SOIC packages. 8-pin devices feature small
size, while 14-pin devices separate the analog and
power connections for improved performance and
power dissipation.
For fast rise and fall times and higher output drive, refer
to the MIC38HC4x.
Package Types
MIC38C42-1/43-1/44-1/45-1
14-Lead SOIC (M)
14-Lead DIP (N)
MIC38C42/43/44/45
8-Lead SOIC (M)
8-Lead MSOP (MM)
8-Lead DIP (N)
COMP 1
14 V R E F
COMP 1
8
VREF
NC
2
13 N C
FB
2
7
VDD
FB
3
12 VDD
ISNS 3
6
OUT
NC
4
11 VD
RT/CT 4
5
GND
ISNS 5
6
9
AGND
RT/CT 7
8
P GND
NC
2020 - 2022 Microchip Technology Inc. and its subsidiaries
10 OUT
DS20006436B-page 1
MIC38C42/43/44/45
Functional Block Diagram
*
VDD
7 (12)
35V
5V
Reference
VREF
8 (14)
(VD)
UVLO
(11)
†
Oscillator
RT/CT
4 (7)
OUT
6 (10)
T
FB
Q
‡
2R
2 (3)
2.5V
S
R
R
(PGND)
(8)
Q
*
COMP
1 (1)
GND* (AGND) ISNS
5
(9)
3 (5)
( ) pins
*
†
‡
are on MIC38C4x-1 (14-lead) versions only
MIC38C4x, (8-lead) versions only
MIC38C42, MIC38C43 (96% max. duty cycle) versions only
MIC38C44, MIC38C45 (50% max. duty cycle) versions only
DS20006436B-page 2
2020 - 2022 Microchip Technology Inc. and its subsidiaries
MIC38C42/43/44/45
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Zener Current (IZ at VDD Pin).................................................................................................................................30 mA
Operation at ≥ 18V may require special precautions. See Note 1.
Supply Voltage (VDD, Note 1)....................................................................................................................................+20V
Switch Supply Voltage (VD).......................................................................................................................................+20V
Current Sense Voltage (VISNS) ................................................................................................................. –0.3V to +5.5V
Feedback Voltage (VFB)............................................................................................................................ –0.3V to +5.5V
Output Current (IOUT).................................................................................................................................................0.5A
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Note 1: On the 8-pin version, 20V is the maximum input on Pin 7 because this is also the supply pin for the output
stage. On the 14-pin version, 40V is the maximum for Pin 12 and 20V is the maximum for Pin 11.
2020 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006436B-page 3
MIC38C42/43/44/45
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VDD = 15V, Adjust VDD above the start threshold before setting at 15V; RT = 11.0 kΩ;
CT = 3.3 nF; –40°C ≤ TA ≤ +85°C; unless noted. Note 1
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
VREF
4.90
5.00
5.10
V
Line Regulation
ΔVREF(LINE)
—
2
20
mV
12V ≤ VDD ≤ 18V, IVREF = 5 μA, Note 6
Load Regulation
ΔVREF(LOAD)
—
1
25
mV
1 mA ≤ IVREF ≤ 20 mA
Reference
Output Voltage
Temperature Stability
TCVREF
—
0.2
—
Total Output Variation
ΔVREF(TOT)
4.82
—
5.18
TA = +25°C, IVREF = 1 mA
mV/°C Note 2
V
Line, Load, Temperature, Note 2
VNOISE
—
50
—
µV
10 Hz ≤ f ≤ 10 kHz, TA = +25°C, Note 2
Long-Term Stability
ΔVREF(LT)
—
5
25
mV
TA = +125°C, 1000 hours, Note 2
Output Short-Circuit
IVREF(SC)
–30
–80
–180
mA
—
Initial Accuracy
ΔfOSC(INIT)
49
52
55
kHz
Voltage Stability
ΔfOSC(VS)
—
0.2
1.0
%
12V ≤ VDD ≤ 18V, Note 6
—
0.04
—
%/°C
TMIN ≤ TA ≤ TMAX, Note 2
6.0
8.4
9.0
mA
TA = +25°C, VRT/CT = 2V
Output Noise Voltage
Oscillator
Temperature Stability
Clock Ramp Reset
Current
TCFOSC
IDISCHG
TA = +25°C, Note 3
6.0
8.4
9.5
mA
TA = TMIN to TMAX
VAMP
—
1.9
—
VPP
VRT/CT peak-to-peak
VIN(EA)
2.42
2.50
2.58
V
VCOMP = 2.5V
Input Bias Current
IBIAS(EA)
—
–0.1
–2
µA
VFB = 5.0V
Open Loop Voltage
Gain
AVOL
65
90
—
dB
2V ≤ VCOMP ≤ 4V
Unity Gain Bandwidth
GBW
0.7
1.0
—
MHz
PSRREA
60
—
—
dB
12V ≤ VDD ≤ 18V
Output Sink Current
ICOMP(SINK)
2
14
—
mA
VFB = 2.7V, VCOMP = 1.1V
Output Source
Current
ICOMP(SRC)
–0.5
–1
—
mA
VFB = 2.3V, VCOMP = 5V
COMP High Voltage
VCOMP_H
5
6.8
—
V
VFB = 2.3V, RLOAD = 15 kΩ to ground
COMP Low Voltage
VCOMP_L
—
0.1
1.1
V
VFB = 2.7V, RLOAD = 15 kΩ to VREF
ADIV
2.85
3.0
3.15
V/V
Maximum Threshold
VTH(MAX)
0.9
1
1.1
V
VCOMP = 5V, Note 4
Power Supply
Rejection Ratio
PSRRCS
—
70
—
dB
12V ≤ VDD ≤ 18V, Note 4
Input Bias Current
IBIAS(CS)
—
–0.1
–2
µA
—
tD
—
120
250
ns
—
RDS(ON) Pull High
RDSON_H
—
20
—
Ω
ISOURCE = 200 mA
RDS(ON) Pull Low
Amplitude
Error Amp
Input Voltage
Power Supply
Rejection Ratio
Current Sense
Divider Gain
Input-to-Output
Delay to Output
Output
Note 2
Note 4, Note 5
RDSON_L
—
11
—
Ω
ISINK = 200 mA
Rise Time
tR
—
40
80
ns
TA = +25°C, CLOAD = 1 nF
Fall Time
tF
—
30
60
ns
TA = +25°C, CLOAD = 1 nF
DS20006436B-page 4
2020 - 2022 Microchip Technology Inc. and its subsidiaries
MIC38C42/43/44/45
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 15V, Adjust VDD above the start threshold before setting at 15V; RT = 11.0 kΩ;
CT = 3.3 nF; –40°C ≤ TA ≤ +85°C; unless noted. Note 1
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
13.5
14.5
15.5
V
7.8
8.4
9.0
V
MIC38C43/45
8
9
10
V
MIC38C42/44
7.0
7.6
8.2
V
MIC38C43/45
Undervoltage Lockout
Start Threshold
Minimum Operating
Voltage
VTH(ST)
VDD(MIN)
MIC38C42/44
Pulse Width Modulator
94
96
—
%
MIC38C42/43
46
50
—
%
MIC38C44/45
DMIN
—
—
0
%
—
Start-Up Current
IDD(START)
—
50
200
µA
Operating Supply
Current
IDD(Q)
—
4.0
6.0
mA
VZ
30
37
—
V
Maximum Duty Cycle
DMAX
Minimum Duty Cycle
Total Standby Current
Zener Voltage at VDD
Pin
Note 1:
2:
3:
4:
5:
6:
VDD = 13V for MIC38C42/44
VDD = 7.5V for MIC38C43/45
VFB = VISNS = 0V
IDD = 25 mA, Note 6
Specification for packaged product only.
These parameters, although guaranteed, are not 100% tested in production.
Output frequency equals oscillator frequency for the MIC38C42 and MIC38C43. Output frequency for the
MIC38C44 and MIC38C45 equals one-half the oscillator frequency.
Parameter measured at trip point of latch with VFB = 0V.
Gain defined as Equation 1-1; 0V ≤ VTH(ISNS) ≤ 0.8V.
On the 8-pin version, 20V is the maximum input on Pin 7 because this is also the supply pin for the output
stage. On the 14-pin version, 40V is the maximum for Pin 12 and 20V is the maximum for Pin 11.
EQUATION 1-1:
V COMP
A DIV = --------------------------V TH ISNS
2020 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006436B-page 5
MIC38C42/43/44/45
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
TS
–65
—
+150
°C
—
Operating Ambient Temperature Range
TA
–40
—
+85
°C
—
Operating Junction Temperature
Range
TJ
–40
—
+125
°C
—
Maximum Junction Temperature
TJ(MAX)
—
—
+150
°C
—
Thermal Resistance 8-Ld Plastic DIP
θJA
—
125
—
°C/W
—
Thermal Resistance 8-Ld MSOP
θJA
—
250
—
°C/W
—
Thermal Resistance 8-Ld SOIC
θJA
—
170
—
°C/W
—
Thermal Resistance 14-Ld Plastic DIP
θJA
—
90
—
°C/W
—
Thermal Resistance 14-Ld SOIC
θJA
—
145
—
°C/W
—
Temperature Ranges
Package Thermal Resistance
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20006436B-page 6
2020 - 2022 Microchip Technology Inc. and its subsidiaries
MIC38C42/43/44/45
RT5(6,67$1&( N
100
200pF
470pF
1nF
10
1.8nF
4.7nF
10nF
VDD = 15V
1
1x104
1x105
5x105
OSCILLATOR FREQUENCY (Hz)
FIGURE 2-1:
Configuration.
Oscillator Frequency
OUTPUT DEAD TIME (%)
100
VDD = 15V
4.7nF
10
200pF
10nF
470pF
1nF
1
1x104
1.8nF
1x105
FREQUENCY (Hz)
1x106
OSC. DISCHARGE CURRENT (mA)
FIGURE 2-2:
MIC38C42/43 Output Dead
Time vs. Oscillator Frequency.
8.6
8.4
8.2
8.0
7.2
VDD = 15V
VOSC = 2V
7.0
-60 -30 0 30 60 90 120 150
TEMPERATURE (°C)
FIGURE 2-3:
vs. Temperature.
1.2
1.0
125°C
0.8
0.6
25°C
0.4
-50°C
0.2
0
0
2
4
6
8
ERROR AMPLIFIER OUTPUT (V)
FIGURE 2-4:
Current Sense Amplifier
Threshold vs. Error Amplifier Output.
120
100
80
60
40
20
VDD = 15V
0
-60 -30 0 30 60 90 120 150
TEMPERATURE (°C)
FIGURE 2-5:
Short-Circuit Reference
Current vs. Temperature.
25
9.0
8.8
7.8
7.6
7.4
CURRENT SENSE AMP THRESHOLD (V)
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
VREF SHORT CURCUIT CURRENT (mA)
Note:
TYPICAL PERFORMANCE CURVES
Oscillator Discharge Current
2020 - 2022 Microchip Technology Inc. and its subsidiaries
OUTPUT VOLTAGE (V)
2.0
20
15
10
5
0
-5
-10
-15
0.0
FIGURE 2-6:
Waveform.
VD = 15V
CLOAD= 1nF
0.2
0.4
0.6
TIME (μs)
0.8
1.0
MIC38C4x Output
DS20006436B-page 7
MIC38C42/43/44/45
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
8-Pin DIP,
SOIC, MSOP
Pin Number
14-Pin DIP
and SOIC
Pin Name
Description
1
1
COMP
Compensation: Connect external compensation network to modify
the error amplifier output.
—
2
NC
Not internally connected.
2
3
FB
Feedback (Input): Error amplifier input. Feedback is 2.5V at
desired output voltage.
—
4
NC
Not internally connected.
3
5
ISNS
—
6
NC
4
7
RT/CT
5
—
GND
Current Sense (Input): Current sense comparator input. Connect
to current sensing resistor or current transformer.
Not internally connected.
Timing Resistor/Timing Capacitor: Connect external RC network to
select switching frequency.
Ground: Combined analog and power ground.
—
8
PGND
Power Ground: N-channel driver transistor ground.
—
9
AGND
Analog Ground: Controller circuitry ground.
6
10
OUT
—
11
VD
7
12
VDD
—
13
NC
8
14
VREF
DS20006436B-page 8
Gate Driver Output: Totem-pole output.
Power Supply (Input): P-channel driver transistor supply input.
Return to power ground (PGND).
Analog Supply (Input): Controller circuitry supply input. Return to
analog ground (AGND).
Not internally connected.
5V Reference (Output): Connect external RC network.
2020 - 2022 Microchip Technology Inc. and its subsidiaries
MIC38C42/43/44/45
4.0
FUNCTIONAL DESCRIPTION
Familiarity with 384x converter designs is assumed.
4.1
4.1.1
MIC38C4x Advantages
START-UP CURRENT
Start-up current has been reduced to an ultra-low
50 μA
(typical)
permitting
higher-resistance,
lower-wattage, start-up resistors (powers controller
during power supply start-up). The reduced resistor
wattage reduces cost and printed circuit space.
4.1.2
OPERATING CURRENT
Quiescent operating current has been reduced to 4 mA
compared to 11 mA for a typical bipolar controller. The
controller runs cooler and the VDD hold-up capacitance
required during start-up may be reduced.
4.1.3
OUTPUT DRIVER
Complementary internal P-channel and N-channel
MOSFETs produce rail-to-rail output voltages for better
performance driving external power MOSFETs. The
driver transistor’s low on resistance and high peak
current capability can drive gate capacitances of
greater than 1000 pF. The value of output capacitance
which can be driven is determined only by the rise/fall
time requirements. Within the restrictions of output
capacity and controller power dissipation, maximum
switching frequency can approach 500 kHz.
4.2
Design Precautions
When operating near 20V, circuit transients can easily
exceed the 20V absolute maximum rating,
permanently damaging the controller’s CMOS
construction. To reduce transients, connect a 0.1 μF
low-ESR capacitor to next to the controller’s supply
VDD (or VD for ‘-1’ versions) and ground connections.
Film type capacitors, such as Wima MKS2, are
recommended.
When designing high-frequency converters, avoid
capacitive and inductive coupling of the switching
waveform into high impedance circuitry such as the
error amplifier, oscillator, and current sense amplifier.
Avoid long printed-circuit traces and component leads.
Locate oscillator and compensation circuitry near the
IC. Use high frequency decoupling capacitors on VREF,
and if necessary, on VDD. Return high di/dt currents
directly to their source and use large area ground
planes.
4.3
turned on by the gate drive transformer T1, charging
the output filter capacitor C3 through L1. D5 supplies a
regulated +12V to VDD once the circuit is running.
Current sense transformer CT1 provides current
feedback to ISNS for current-mode operation and
cycle-by-cycle current limiting. This is more efficient
than a high-power sense resistor and provides the
required ground-referenced level shift.
When Q1 turns off, current flow continues from ground
through D1 and L1 until Q1 is turned on again.
The 100V Schottky diode D1 reduces the forward
voltage drop in the main current path, resulting in
higher efficiency than could be accomplished using an
ultra-fast-recovery diode. R1 and C2 suppress parasitic
oscillations from D1.
Using a high-value inductance for L1 and a low-ESR
capacitor for C3 permits small capacitance with
minimum output ripple. This inductance value also
improves circuit efficiency by reducing the flux swing in
L1.
Magnetic components are carefully chosen for minimal
loss at 500 kHz. CT1 and T1 are wound on Magnetics,
Inc. P-type material toroids. L1 is wound on a Siemens
N49 EFD core.
TABLE 4-1:
MAGNETIC COMPONENTS
Custom Coils
(Note 1)
Symbol
ETS
(Note 2)
CT1
4923
ETS 92420
T1
4924
ETS 92419
4925
ETS 92421
L1
Note 1:
2:
Custom Coils, Alcester, SD. Tel: (605)
934-2460.
Energy Transformation Systems, Inc. Tel:
(510) 656-2012.
TABLE 4-2:
COMPONENT TEST RESULTS
Test
Conditions
Results
Line
Regulation
VIN = 26V to 80V,
VOUT = 12V, IO = 2A
0.5%
Load
Regulation
VIN = 48V, VOUT = 12V,
IO = 0.2A to 2A
0.6%
Efficiency
VIN = 48V, VOUT = 12V,
IO = 2A
90%
Output Ripple
VIN = 48V, VOUT = 12V,
IO = 2A (20 MHz BW)
100 mV
Buck Converter
Refer to Figure 4-1. When at least 26V is applied to the
input, C5 is charged through R2 until the voltage VDD is
greater than 14.5V (the undervoltage lockout value of
the MIC38C42). Output switching begins when Q1 is
2020 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006436B-page 9
MIC38C42/43/44/45
V IN
26V to 80V
R2
68k
R1
10
1/2W
D4
1N765B
0.1μF*
D2
17V
1W
100k
1
0.22μF
2
3
R4
18
C5
4.7μF
C2
1000pF
4.7Ω
C3
3.3μF
C4
0.1μF
MIC38C42
COM P V R E F
FB
VDD
ISNS
OU T
4
8
1N4001
T1
6
5
R5
16k
D5
7
RT/CT GND
C7
200pF
FIGURE 4-1:
MKS2
L1 48μH
31DQ10
D1
0.1μF
6.8k
D3
MBR030
4.4
V OUT
12V, 2A
Q1
IRF820
CT1
6.19k
1%
C8
0.1μF
1.62k
1%
*Locate near MIC38C42 supply pins
0.1μF
500 kHz, 25W, Buck Converter.
Synchronous Buck Converter
The on-state voltage drop of the low-side MOSFET is
lower than the forward voltage drop of an equivalent
Schottky rectifier. This lower voltage drop results in
higher efficiency.
Refer to Figure 4-2. This MIC38C43 synchronous buck
converter uses an MIC5022 half-bridge driver to
alternately drive the PWM switch MOSFET (driven by
GATEH, or high-side output) and a MOSFET which
functions as a synchronous rectifier (driven by the
GATEL, or low-side output).
A sense resistor (5 mΩ) is connected to the driver’s
high-side current sense inputs to provide overcurrent
protection. Refer to the MIC5020, MIC5021, and
MIC5022 data sheets for more information.
The low-side MOSFET turns on when the high-side
MOSFET is off, allowing current to return from ground.
Current flows through the low-side MOSFET in the
source to drain direction.
+12V
MIC5022
0.15μF
10k
VDD
0.1μF
NC
6.8k
300k
4.7nF
MIC38C43
COM P V R E F
4.3k
47k
2200
pF 3.3k
FB
VDD
ISNS
OU T
NC
470μF
25V
NC
RT/CT
GND
FL T
EN
SQP60N06-15
5mΩ
35μH
V OUT
5V, 8A
VB
GATEL
IN
SH+
CT
SH–
0.1μF*
MKS2
1000μF
Low ESR
SL+
GND
10k
GATEH
0.1μF
S L–
*Locate near the MIC38C43 supply pins.
FIGURE 4-2:
DS20006436B-page 10
100 kHz Synchronous Buck Converter.
2020 - 2022 Microchip Technology Inc. and its subsidiaries
MIC38C42/43/44/45
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead SOIC*
Example
MIC
38C42YM
89Z3
XXX
XXXXXXX
WNNN
8-Lead DIP*
Example
MIC
38C43YN
2PF8 S
XXX
XXXXXXX
WNNN S
8-Lead MSOP*
(Front)
Example
XXXX
XXX
3843
YMM
Legend: XX...X
Y
YY
WW
NNN
e3
*
14-Lead SOIC*
Example
XXX
XXXXX-XXX
WNNN S
MIC
38C45-1YM
1U71 S
14-Lead DIP*
Example
MIC
38C44-1YN
992W S
XXX
XXXXX-XXX
WNNN S
8-Lead MSOP*
(Back)
Example
WNNN
8W7F
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
Note:
If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are
used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N
2020 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006436B-page 11
MIC38C42/43/44/45
8-Lead SOIC Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006436B-page 12
2020 - 2022 Microchip Technology Inc. and its subsidiaries
MIC38C42/43/44/45
8-Lead MSOP Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2020 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006436B-page 13
MIC38C42/43/44/45
8-Lead DIP Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006436B-page 14
2020 - 2022 Microchip Technology Inc. and its subsidiaries
MIC38C42/43/44/45
14-Lead SOIC Package Outline and Recommended Land Pattern
14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]
Atmel Legacy Global Package Code SVQ
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
NOTE 5
D
N
E
2
E2
2
E1
E
2X
0.10 C D
NOTE 1
1
2
2X N/2 TIPS
0.20 C
3
e
NX b
B
0.25
NOTE 5
C A–B D
TOP VIEW
0.10 C
C
A A2
SEATING
PLANE
14X
h
0.10 C
SIDE VIEW
A1
h
R0.13
H
R0.13
c
SEE VIEW C
VIEW A–A
L
(L1)
VIEW C
Microchip Technology Drawing No. C04-065-D3X Rev D
2020 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006436B-page 15
MIC38C42/43/44/45
14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]
Atmel Legacy Global Package Code SVQ
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
Standoff
§
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
Footprint
L1
Lead Angle
Foot Angle
c
Lead Thickness
Lead Width
b
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0°
0.10
0.31
5°
5°
MILLIMETERS
NOM
14
1.27 BSC
6.00 BSC
3.90 BSC
8.65 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimension D does not include mold flash, protrusions or gate burrs, which shall
not exceed 0.15 mm per end. Dimension E1 does not include interlead flash
or protrusion, which shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-065-D3X Rev D Sheet 2 of 2
DS20006436B-page 16
2020 - 2022 Microchip Technology Inc. and its subsidiaries
MIC38C42/43/44/45
14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]
Atmel Legacy Global Package Code SVQ
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
14
SILK SCREEN
C
Y
1
2
X
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Contact Pad Spacing
C
Contact Pad Width (X14)
X
Contact Pad Length (X14)
Y
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2065-D3X Rev D
2020 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006436B-page 17
MIC38C42/43/44/45
14-Lead DIP Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006436B-page 18
2020 - 2022 Microchip Technology Inc. and its subsidiaries
MIC38C42/43/44/45
APPENDIX A:
REVISION HISTORY
Revision A (October 2020)
• Converted Micrel document MIC38C42/43/44/45
to Microchip data sheet DS20006436A.
• Minor text changes throughout.
Revision B (February 2022)
• Updated the Package Marking Information drawing with the most current marking information.
• Updated the 14-Lead SOIC Package Outline and
Recommended Land Pattern drawing with the
most current file.
2020 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006436B-page 19
MIC38C42/43/44/45
NOTES:
DS20006436B-page 20
2020 - 2022 Microchip Technology Inc. and its subsidiaries
MIC38C42/43/44/45
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Device
[-X]
X
XX
[-XX]
Part No.
Product
Feature
Temp. Range
Package
Media Type
Device:
MIC38C4x:
BiCMOS Current-Mode PWM Controller
(See Selection Guide Below for PartSpecific Detail)
MIC38C42:
96% Max. Duty Cycle, UVLO Threshold
Startup 14.5V, Min. Operating 9V
96% Max. Duty Cycle, UVLO Threshold
Startup 8.4V, Min. Operating 7.6V
50% Max. Duty Cycle, UVLO Threshold
Startup 14.5V, Min. Operating 9V
50% Max. Duty Cycle, UVLO Threshold
Startup 8.4V, Min. Operating 7.6V
MIC38C43:
MIC38C44:
MIC38C45:
Examples:
a) MIC38C42:
MIC38C42YM:
MIC38C42-1YM
MIC38C42YM-TR:
MIC38C42-1YM-TR
MIC38C42YMM:
MIC38C42YMM-TR:
MIC38C42-1YN
MIC38C42YN
b) MIC38C43:
Product Feature: = 8-Lead
1
= 14-Lead
Junction
Temperature
Range:
Y
Package:
M
=
MM =
N
=
Media Type:
TR
= 2,500/Reel
= 95/Tube for 8-Lead M Package
= 100/Tube for MM Package
= 50/Tube for 8-Lead N Package
= 25/Tube for 14-Lead N Package
= 54/Tube for 14-Lead M Package
=
–40°C to +125°C, RoHS-Compliant
SOIC Package
MSOP Package
DIP Package
Selection Guide
Duty Cycle
UVLO Thresholds
—
Start-Up 8.4V
Min. Operating 7.6V
Start-Up 14.5V
Min. Operating 9V
0% to 96%
MIC38C43
MIC38C42
0% to 50%
MIC38C45
MIC38C44
MIC38C43YM:
MIC38C43-1YM
MIC38C43YM-TR:
MIC38C43-1YM-TR
MIC38C43YMM:
MIC38C43YMM-TR:
MIC38C43-1YN
MIC38C43YN
c) MIC38C44:
MIC38C44YM:
MIC38C44-1YM
MIC38C44YM-TR:
MIC38C44-1YM-TR
MIC38C44YMM:
MIC38C44YMM-TR:
MIC38C44-1YN
MIC38C44YN
d) MIC38C45:
MIC38C45YM:
MIC38C45-1YM
MIC38C45YM-TR:
MIC38C45-1YM-TR
MIC38C45YMM:
MIC38C45YMM-TR:
MIC38C45-1YN
MIC38C45YN
Note 1:
2020 - 2022 Microchip Technology Inc. and its subsidiaries
BiCMOS Current-Mode PWM
Controller, 96% Max. Duty
Cycle, UVLO Threshold Startup
14.5V, Min. Operating 9V, –40°C
to +125°C Junction Temperature
Range
8-Lead SOIC, 95/Tube
14-Lead SOIC, 54/Tube
8-Lead SOIC, 2,500/Reel
14-Lead SOIC, 2,500/Reel
8-Lead MSOP, 100/Tube
8-Lead MSOP, 2,500/Reel
14-Lead DIP, 25/Tube
8-Lead DIP, 50/Tube
BiCMOS Current-Mode PWM
Controller, 96% Max. Duty
Cycle, UVLO Threshold Startup
8.4V, Min. Operating 7.6V,
–40°C to +125°C Junction
Temperature Range
8-Lead SOIC, 95/Tube
14-Lead SOIC, 54/Tube
8-Lead SOIC, 2,500/Reel
14-Lead SOIC, 2,500/Reel
8-Lead MSOP, 100/Tube
8-Lead MSOP, 2,500/Reel
14-Lead DIP, 25/Tube
8-Lead DIP, 50/Tube
BiCMOS Current-Mode PWM
Controller, 50% Max. Duty
Cycle, UVLO Threshold Startup
14.5V, Min. Operating 9V, –40°C
to +125°C Junction Temperature
Range
8-Lead SOIC, 95/Tube
14-Lead SOIC, 54/Tube
8-Lead SOIC, 2,500/Reel
14-Lead SOIC, 2,500/Reel
8-Lead MSOP, 100/Tube
8-Lead MSOP, 2,500/Reel
14-Lead DIP, 25/Tube
8-Lead DIP, 50/Tube
BiCMOS Current-Mode PWM
Controller, 50% Max. Duty
Cycle, UVLO Threshold Startup
8.4V, Min. Operating 7.6V,
–40°C to +125°C Junction
Temperature Range
8-Lead SOIC, 95/Tube
14-Lead SOIC, 54/Tube
8-Lead SOIC, 2,500/Reel
14-Lead SOIC, 2,500/Reel
8-Lead MSOP, 100/Tube
8-Lead MSOP, 2,500/Reel
14-Lead DIP, 25/Tube
8-Lead DIP, 50/Tube
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006436B-page 21
MIC38C42/43/44/45
NOTES:
DS20006436B-page 22
2020 - 2022 Microchip Technology Inc. and its subsidiaries
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2020 - 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2020 - 2022 Microchip Technology Inc. and its subsidiaries
ISBN: 978-1-5224-9769-1
DS20006436B-page 23
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Tel: 61-2-9868-6733
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DS20006436B-page 24
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09/14/21
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