Obsolete Device
TC1121
100mA Charge Pump Voltage Converter with Shutdown
Features:
Package Type
• Optional High-Frequency Operation Allows Use of
Small Capacitors
• Low Operating Current (FC = Open):
- 50 A
• High Output Current (100 mA)
• Converts a 2.4V to 5.5V Input Voltage to a
Corresponding Negative Output Voltage
(Inverter mode)
• Uses Only 2 Capacitors; No Inductors Required
• Selectable Oscillator Frequency:
- 10 kHz to 200 kHz
• Power-Saving Shutdown Input
• Available in 8-Pin MSOP, 8-Pin PDIP and 8-Pin
Small Outline (SOIC) Packages
Applications:
•
•
•
•
•
8 V+
1
CAP+
2
TC1121CPA 7 OSC
GND 3 TC1121EPA 6 SHDN
CAP–
4
5 VOUT
8-Pin SOIC
8-Pin MSOP
FC
1
8 V+
TC1121COA
CAP+ 2 TC1121EOA 7 OSC
GND 3 TC1121CUA 6 SHDN
TC1121EUA
4
5 VOUT
General Description:
Device Selection Table
Package
Operating
Temp.
Range
TC1121COA
8-Pin SOIC
0°C to +70°C
TC1121CPA
8-Pin PDIP
0°C to +70°C
TC1121CUA
8-Pin MSOP
0°C to +70°C
TC1121EOA
8-Pin SOIC
-40°C to +85°C
TC1121EPA
8-Pin PDIP
-40°C to +85°C
TC1121EUA
8-Pin MSOP
-40°C to +85°C
2006-2014 Microchip Technology Inc.
FC
CAP–
Laptop Computers
Medical Instruments
Disk Drives
P-Based Controllers
Process Instrumentation
Part
Number
8-Pin PDIP
The TC1121 is a charge pump converter with 100 mA
output current capability. It converts a 2.4V to 5.5V
input to a corresponding negative output voltage. As
with all charge pump converters, the TC1121 uses no
inductors saving cost, size and EMI.
An on-board oscillator operates at a typical frequency
of 10 kHz (at V+ = 5V) when the frequency control input
(FC) is left open. The oscillator frequency increases to
200 kHz when FC is connected to V+, allowing the use
of smaller capacitors. Operation at sub-10 kHz
frequencies results in lower quiescent current and is
accomplished with the addition of an external capacitor
from OSC (pin 7) to ground. The TC1121 also can be
driven from an external clock connected OSC. Typical
supply current at 10 kHz is 50 A, and falls to less than
1 A when the shutdown input is brought low, whether
the internal or an external clock is used. The TC1121 is
available in 8-pin SOIC, MSOP and PDIP packages.
DS20001358D-page 1
TC1121
Functional Block Diagram
+
C1
–
CAP+
SHDN
FC
OSC
Control
CAP–
TC1121
VOUT
RC
Oscillator
Switch
Matrix
C2
+
OSC
V+
Logic
Circuits
GND
DS20001358D-page 2
2006-2014 Microchip Technology Inc.
TC1121
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings*
Supply Voltage (VDD) ............................................... 6V
OSC, FC, SHDN Input Voltage .....-0.3V to (V+ + 0.3V)
Output Short Circuit Duration ........................... 10 Sec.
Package Power Dissipation (TA 70°C)
8-Pin PDIP .............................................. 730 mW
8-Pin SOIC .............................................. 470 mW
8-Pin MSOP ............................................ 333 mW
Operating Temperature Range
C Suffix............................................ 0°C to +70°C
E Suffix......................................... -40°C to +85°C
Storage Temperature Range.............. -65°C to +150°C
TC1121 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = 0°C to 70°C (C suffix), -40°C to +85°C (E suffix), V+= 5V ±10% COSC = Open, C1, C2 = 10 F,
FC = V+, SHDN = VIH, typical values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
IDD
Active Supply Current
Min.
Typ.
Max.
Units
—
—
50
0.6
100
1
A
mA
RL = Open, FC = Open or GND
RL = Open, FC = V+
SHDN = 0V
ISHUTDOWN
Shutdown Supply Current
—
0.2
1.0
A
V+
Supply Voltage
2.4
—
5.5
V
VIH
SHDN Input Logic High
VDD x 0.8
—
—
V
VIL
SHDN Input Logic Low
—
—
0.4
V
IIN
Input Leakage Current
-1
-4
—
—
1
4
A
Test Conditions
SHDN, OSC
FC pin
ROUT
Output Source Resistance
—
12
20
IOUT
Output Current
60
100
—
mA
VOUT = more negative than -3.75V
FOSC
Oscillator Frequency
5
100
10
200
—
—
kHz
Pin 7 Open, Pin 1 Open or GND
SHDN = VIH, Pin 1 = V+
PEFF
Power Efficiency
—
93
94
—
—
97
97
92
—
—
—
%
FC = GND for all
RL = 2k between V+ and VOUT
RL = 1k between VOUT and GND
IL = 60 mA to GND
Voltage Conversion Efficiency
99
99.9
—
%
RL = Open
VEFF
Note
1:
IOUT = 60 mA
Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no
inputs from sources operating from external supplies be applied prior to “power up” of the TC1121.
2006-2014 Microchip Technology Inc.
DS20001358D-page 3
TC1121
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin MSOP,
PDIP, SOIC)
Symbol
Description
1
FC
Frequency control for internal oscillator, FC = open, FOSC = 10 kHz typ; FC = V+, FOSC
= 200 kHz typ; FC has no effect when OSC pin is driven externally.
2
CAP+
Charge-pump capacitor, positive terminal.
3
GND
Power-supply ground input.
4
CAP–
Charge-pump capacitor, negative terminal.
5
OUT
Output, negative voltage.
6
SHDN
7
OSC
8
V+
DS20001358D-page 4
Shutdown.
Oscillator control input. An external capacitor can be added to slow the oscillator. Take
care to minimize stray capacitance. An external oscillator also may be connected to
overdrive OSC.
Power-supply positive voltage input.
2006-2014 Microchip Technology Inc.
TC1121
3.0
APPLICATIONS
3.2
3.1
Negative Voltage Converter
The TC1121’s clock frequency is controlled by four
modes:
The TC1121 is typically used as a charge-pump voltage
inverter. C1 and C2 are the only two external capacitors
used in the operating circuit (Figure 3-1).
Changing Oscillator Frequency
TABLE 3-1:
FC
2.4V to 5.5V
1
2 CAP+
C1
+
–
4
GND
CAP–
10 kHz
8
FC = V+
Open
200 kHz
OSC 7
Open or
FC = V+
External Capacitor See Typical Operating
Characteristics
Open
External Clock
SHDN
6
SHDN*
VOUT 5
–
+
VOUT
C2
*SHDN should be tied to VIN if not used.
FIGURE 3-1:
Oscillator Frequency
Open
TC1121
3
OSC
Open
VIN
FC
OSCILLATOR FREQUENCY
MODES
Charge Pump Inverter
The TC1121 is not sensitive to load current changes,
although its output is not actively regulated. A typical
output source resistance of 11.8 means that an input
of +5V results in -5V output voltage under light load,
and only decreases to -3.8V typ with a 100 mA load.
The supplied output current is from capacitor C2 during
one-half the charge-pump cycle. This results in a
peak-to-peak ripple of:
VRIPPLE = IOUT/2(fPUMP) (C2) + IOUT (ESRC2)
Where fPUMP is 5 kHz (one half the nominal 10 kHz
oscillator frequency), and C2 = 150 F with an ESR of
0.2, ripple is about 90 mV with a 100 mA load current.
If C2 is raised to 390 F, the ripple drops to 45 mV.
External Clock Frequency
The oscillator runs at 10 kHz (typical) when FC and
OSC are not connected. The oscillator frequency is
lowered by connecting a capacitor between OSC and
GND, but FC can still multiply the frequency by 20
times in this mode.
An external clock source that swings within 100 mV of
V+ and GND may overdrive OSC in the Inverter mode.
OSC can be driven by any CMOS logic output. When
OSC is overdriven, FC has no effect.
Note that the frequency of the signal appearing at
CAP+ and CAP– is half that of the oscillator. In addition,
by lowering the oscillator frequency, the effective
output resistance of the charge-pump increases. To
compensate for this, the value of the charge-pump
capacitors may be increased.
Because the 5 kHz output ripple frequency may be low
enough to interfere with other circuitry, the oscillator
frequency can be increased with the use of the FC pin
or an external oscillator. The output ripple frequency is
half the selected oscillator frequency. Although the
TC1121’s quiescent current will increase if the clock
frequency is increased, it allows smaller capacitance
values to be used for C1 and C2.
3.3
Capacitor Selection
In addition to load current, the following factors affect
the TC1121 output voltage drop from its ideal value 1)
output resistance, 2) pump (C1) and reservoir (C2)
capacitor ESRs and 3) C1 and C2 capacitance.
The voltage drop is the load current times the output
resistance. The loss in C2 is the load current times C2’s
ESR; C1’s loss is larger because it handles currents
greater than the load current during charge-pump
operation. Therefore, the voltage drop due to C1 is
about four times C1’s ESR multiplied by the load
current, and a low (or high) ESR capacitor has a
greater impact on performance for C1 than for C2.
In general, as the TC1121’s pump frequency increases,
capacitance values needed to maintain comparable
ripple and output resistance diminish proportionately.
2006-2014 Microchip Technology Inc.
DS20001358D-page 5
TC1121
3.4
Cascading Devices
3.5
To produce greater negative magnitudes of the initial
supply voltage, the TC1121 may be cascaded (see
Figure 3-2). Resulting output resistance is approximately equal to the sum of individual TC1121 ROUT
values. The output voltage (where n is an integer
representing the number of devices cascaded) is
defined by VOUT = -n (VIN).
Paralleling Devices
To reduce output resistance, multiple TC1121s may be
paralleled (see Figure 3-3). Each device needs a pump
capacitor C1, but the reservoir capacitor C2 serves all
devices. The value of C2 should be increased by a
factor of n (the number of devices).
+
VIN
VIN 8
FC
2 CAP+
2
OSC
TC1121
+
3
C1n
SHDN*
SHDN
4
VOUT 5
4 CAP–
OSC
CAP+
7
TC1121
+
3 GND
C1
VIN 8
FC
GND
SHDN
CAP–
“1”
“n”
SHDN*
VOUT 5
VOUT
C2n
+
C2
+
*SHDN should be tied to VIN if not used.
FIGURE 3-2:
Cascading TC1121s to Increase Output Voltage
V+IN
OSC 7
2 CAP+
+
C1
3
4
TC1121
GND
SHDN
2
OSC
C1n
+
CAP+
OSC
“1”
7
TC1121
3
GND
SHDN
SHDN*
VOUT 5
CAP–
VIN 8
FC
VIN 8
FC
4
CAP–
“n”
VOUT
SHDN*
5
C2
+
ROUT = ROUT (of TC1121)/n(number of devices)
*SHDN should be tied to VIN if not used.
FIGURE 3-3:
DS20001358D-page 6
Paralleling TC1121s to Reduce Output Resistance
2006-2014 Microchip Technology Inc.
TC1121
3.6
Combined Positive Supply
Multiplication and Negative
Voltage Conversion
Figure 3-4 shows this dual function circuit, in which
capacitors C1 and C2 perform pump and reservoir
functions to generate negative voltage. Capacitors C3
and C4 are the respective capacitors for multiplied
positive voltage. This particular configuration leads to
higher source impedances of the generated supplies
due to the finite impedance of the common
charge-pump driver.
+
VIN
VIN
FC
2
+
C1
3
4
CAP+
8
D1, D2 = 1N4148
OSC
TC1121
GND
VOUT
CAP–
SHDN
D1
5
6
–
VOUT = VIN
+
SHDN*
C2
D2
VOUT = (2VIN) –
(VFD1) – (VFD2)
+
C3
+
C4
*SHDN should be tied to VIN if not used.
FIGURE 3-4:
Combined Positive Multiplier and Negative Converter
2006-2014 Microchip Technology Inc.
DS20001358D-page 7
TC1121
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
Package marking data not available at this time.
4.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
Pin 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin MSOP
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
Pin 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin SOIC (N)
DS20001358D-page 8
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
2006-2014 Microchip Technology Inc.
TC1121
4.3
Package Dimensions
8-Pin MSOP
Pin 1
.122 (3.10)
.114 (2.90)
.197 (5.00)
.189 (4.80)
.026 (0.65) Typ.
.122 (3.10)
.114 (2.90)
.043 (1.10)
Max.
.016 (0.40)
.010 (0.25)
.008 (0.20)
.005 (0.13)
6° Max.
.006 (0.15)
.002 (0.05)
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
8-Pin Plastic DIP
Pin 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
.015 (0.38)
.008 (0.20)
3° Min.
.400 (10.16)
.310 (7.87)
Dimensions: inches (mm)
2006-2014 Microchip Technology Inc.
DS20001358D-page 9
TC1121
Package Dimensions (Continued)
8-Pin SOIC
Pin 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) Typ.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.020 (0.51) .010 (0.25)
.013 (0.33) .004 (0.10)
.010 (0.25)
.007 (0.18)
8° Max.
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
DS20001358D-page 10
2006-2014 Microchip Technology Inc.
TC1121
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
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• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
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representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2006-2014 Microchip Technology Inc.
DS20001358D-page 11
TC1121
NOTES:
DS20001358D-page 12
2006-2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2006-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63276-410-2
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2006-2014 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20001358D-page 13
Worldwide Sales and Service
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DS20001358D-page 14
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Germany - Pforzheim
Tel: 49-7231-424750
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/25/14
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