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LT3014ES5#TRPBF

LT3014ES5#TRPBF

  • 厂商:

    AD(亚德诺)

  • 封装:

    TSOT23-5

  • 描述:

    LT3014ES5#TRPBF

  • 数据手册
  • 价格&库存
LT3014ES5#TRPBF 数据手册
LT3014 20mA, 3V to 80V Low Dropout Micropower Linear Regulator DESCRIPTION FEATURES n n n n n n n n n n n n n ■ Wide Input Voltage Range: 3V to 80V Low Quiescent Current: 7µA Low Dropout Voltage: 350mV Output Current: 20mA LT3014HV Survives 100V Transients (2ms) No Protection Diodes Needed Adjustable Output from 1.22V to 60V 1µA Quiescent Current in Shutdown Stable with 0.47µF Output Capacitor Stable with Aluminum, Tantalum or Ceramic Capacitors Reverse-Battery Protection No Reverse Current Flow from Output Thermal Limiting Available in 5-Lead ThinSOTTM and 8-Lead DFN Packages n n n Other features of the LT3014 include the ability to operate with very small output capacitors. The regulators are stable with only 0.47μF on the output while most older devices require between 10μF and 100μF for stability. Small ceramic capacitors can be used without the necessary addition of ESR as is common with other regulators. Internal protection circuitry includes reverse-battery protection, current limiting, thermal limiting and reverse current protection. The device is available as an adjustable device with a 1.22V reference voltage. The LT3014 regulator is available in the 5-lead ThinSOT and 8-lead DFN packages. APPLICATIONS n The LT®3014 is a high voltage, micropower low dropout linear regulator. The device is capable of supplying 20mA of output current with a dropout voltage of 350mV. Designed for use in battery-powered or high voltage systems, the low quiescent current (7μA operating and 1μA in shutdown) makes the LT3014 an ideal choice. Quiescent current is also well controlled in dropout. Low Current High Voltage Regulators Regulator for Battery-Powered Systems Telecom Applications Automotive Applications L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. ThinSOT is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents including 6118263, 6144250. TYPICAL APPLICATION 5V Supply with Shutdown Dropout Voltage 400 VIN 5.4V TO 80V OUT LT3014 3.92M VOUT 5V 20mA 0.47μF 1μF SHDN GND ADJ 1.27M 3014 TA01 VSHDN OUTPUT 2.0V ON 350 DROPOUT VOLTAGE (mV) IN 300 250 200 150 100 50 0 0 2 4 6 8 10 12 14 16 18 20 OUTPUT CURRENT (mA) 3014 TA02 3014fd 1 LT3014 ABSOLUTE MAXIMUM RATINGS (Note 1) IN Pin Voltage, Operating ................................... ±80V Transient (2ms Survival, LT3014HV) ................ +100V OUT Pin Voltage ................................................. ±60V IN to OUT Differential Voltage ............................ ±80V ADJ Pin Voltage ................................................... ±7V SHDN Pin Input Voltage ..................................... ±80V Output Short-Circuit Duration ......................Indefinite Storage Temperature Range ThinSOT Package .......................... –65°C to 150°C DFN Package ..................................–65°C to 125°C Operating Junction Temperature Range (Notes 3, 10, 11) ............................–40°C to 125°C Lead Temperature (Soldering, 10 sec, SOT-23 Package) ............300°C PIN CONFIGURATION TOP VIEW TOP VIEW IN 1 5 OUT GND 2 SHDN 3 4 ADJ S5 PACKAGE 5-LEAD PLASTIC SOT-23 OUT 1 8 IN ADJ 2 7 NC NC 3 6 NC GND 4 5 SHDN 9 DD PACKAGE 8-LEAD (3mm s 3mm) PLASTIC DFN EXPOSED PAD IS GND (PIN 9) MUST BE SOLDERED TO PCB TJMAX = 125°C, θJA = 150°C/ W θJC = 25°C/W MEASURED AT PIN 2 SEE APPLICATIONS INFORMATION SECTION TJMAX = 125°C, θJA = 40°C/ W θJC = 10°C/W MEASURED AT PIN 9 ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LT3014ES5#PBF LT3014ES5#TRPBF LTBMF 5-Lead Plastic SOT-23 –40°C to 125°C LT3014IS5#PBF LT3014IS5#TRPBF LTBMF 5-Lead Plastic SOT-23 –40°C to 125°C LT3014HVES5#PBF LT3014HVES5#TRPBF LTBRS 5-Lead Plastic SOT-23 –40°C to 125°C LT3014HVIS5#PBF LT3014HVIS5#TRPBF LTBRS 5-Lead Plastic SOT-23 –40°C to 125°C LT3014EDD#PBF LT3014EDD#TRPBF LBMG 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LT3014IDD#PBF LT3014IDD#TRPBF LBMG 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LT3014HVEDD#PBF LT3014HVEDD#TRPBF LBRT 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LT3014HVIDD#PBF LT3014HVIDD#TRPBF LBRT 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LEAD BASED FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LT3014ES5 LT3014ES5#TR LTBMF 5-Lead Plastic SOT-23 –40°C to 125°C LT3014IS5 LT3014IS5#TR LTBMF 5-Lead Plastic SOT-23 –40°C to 125°C LT3014HVES5 LT3014HVES5#TR LTBRS 5-Lead Plastic SOT-23 –40°C to 125°C LT3014HVIS5 LT3014HVIS5#TR LTBRS 5-Lead Plastic SOT-23 –40°C to 125°C LT3014EDD LT3014EDD#TR LBMG 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LT3014IDD LT3014IDD#TR LBMG 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LT3014HVEDD LT3014HVEDD#TR LBRT 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LT3014HVIDD LT3014HVIDD#TR LBRT 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ 3014fd 2 LT3014 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C. SYMBOL CONDITIONS ILOAD = 20mA VIN = 3.3V, ILOAD = 100μA 3.3V < VIN < 80V, 100μA < ILOAD < 20mA l Line Regulation ΔVIN = 3.3V to 80V, ILOAD = 100μA (Note 2) l Load Regulation (Note 2) VIN = 3.3V, ΔILOAD = 100μA to 20mA VIN = 3.3V, ΔILOAD = 100μA to 20mA l Dropout Voltage VIN = VOUT(NOMINAL) (Notes 4, 5) ILOAD = 100μA ILOAD = 100μA l ILOAD = 1mA ILOAD = 1mA l ILOAD = 10mA ILOAD = 10mA l ILOAD = 20mA ILOAD = 20mA l ILOAD = 0mA ILOAD = 100μA ILOAD = 1mA ILOAD = 10mA ILOAD = 20mA l l l l l Output Voltage Noise COUT = 0.47μF, ILOAD = 20mA, BW = 10Hz to 100kHz ADJ Pin Bias Current (Note 7) Shutdown Threshold VOUT = Off to On VOUT = On to Off l l SHDN Pin Current (Note 8) VSHDN = 0V VSHDN = 6V l l Quiescent Current in Shutdown VIN = 6V, VSHDN = 0V l Ripple Rejection VIN = 7V (Avg), VRIPPLE = 0.5VP-P , fRIPPLE = 120Hz, ILOAD = 20mA Current Limit VIN = 7V, VOUT = 0V VIN = 3.3V, ΔVOUT = –0.1V (Note 2) l Input Reverse Leakage Current VIN = –80V, VOUT = 0V l Reverse Output Current (Note 9) VOUT = 1.22V, VIN < 1.22V (Note 2) Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LT3014 is tested and specified for these conditions with the ADJ pin connected to the OUT pin. Note 3: Operating conditions are limited by maximum junction temperature. The regulated output voltage specification will not apply for all possible combinations of input voltage and output current. When operating at maximum input voltage, the output current range must be limited. When operating at maximum output current, the input voltage range must be limited. Note 4: To satisfy requirements for minimum input voltage, the LT3014 is tested and specified for these conditions with an external resistor divider (249k bottom, 392k top) for an output voltage of 3.3V. The external resistor divider adds a 5µA DC load on the output. TYP 3 3.3 V 1.200 1.180 1.220 1.220 1.240 1.260 V V l Minimum Input Voltage ADJ Pin Voltage (Notes 2, 3) GND Pin Current VIN = VOUT(NOMINAL) (Notes 4, 6) MIN MAX 1 10 mV 13 25 40 mV mV 120 180 250 mV mV 200 270 360 mV mV 300 350 450 mV mV 350 410 570 mV mV 7 12 40 250 650 20 30 100 450 1000 μA μA μA μA μA 115 0.25 60 UNITS μVRMS 4 10 nA 1.3 1.3 2 V V 1 0 4 1 μA μA 1 4 μA 70 dB 70 mA mA 25 2 6 mA 4 μA Note 5: Dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a specified output current. In dropout, the output voltage is equal to (VIN – VDROPOUT). Note 6: GND pin current is tested with VIN = VOUT (nominal) and a current source load. This means the device is tested while operating in its dropout region. This is the worst-case GND pin current. The GND pin current decreases slightly at higher input voltages. Note 7: ADJ pin bias current flows into the ADJ pin. Note 8: SHDN pin current flows out of the SHDN pin. Note 9: Reverse output current is tested with the IN pin grounded and the OUT pin forced to the rated output voltage. This current flows into the OUT pin and out of the GND pin. Note 10: The LT3014 is tested and specified under pulse load conditions such that TJ ≅ TA. The LT3014E is 100% tested at TA = 25°C. Performance at –40°C to 125°C is assured by design, characterization, and statistical 3014fd 3 LT3014 ELECTRICAL CHARACTERISTICS process controls. The LT3014I is guaranteed over the full –40°C to 125°C operating junction temperature. Note 11: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 125°C when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability. TYPICAL PERFORMANCE CHARACTERISTICS Typical Dropout Voltage Guaranteed Dropout Voltage 600 500 Dropout Voltage 500 = TEST POINTS 450 500 TJ = 125oC 350 300 TJ = 25oC 250 200 150 100 TJ b 125oC DROPOUT VOLTAGE (mV) 400 DROPOUT VOLTAGE (mV) DROPOUT VOLTAGE (mV) 450 400 TJ b 25oC 300 200 0 2 4 0 6 8 10 12 14 16 18 20 OUTPUT CURRENT (mA) IL = 1mA 200 150 2 4 IL = 100MA 0 –50 6 8 10 12 14 16 18 20 OUTPUT CURRENT (mA) VIN = 6V RL = d IL = 0 VSHDN = VIN 8 6 4 2 0 –50 –25 Quiescent Current IL = 100μA TJ = 25oC 14 RL = d VOUT = 1.22V VSHDN = 0V 75 50 25 TEMPERATURE (oC) 0 100 125 3014 G04 QUIESCENT CURRENT (μA) 10 125 100 16 1.235 12 50 25 0 75 TEMPERATURE (oC) –25 3014 G03 ADJ Pin Voltage 1.240 ADJ PIN VOLTAGE (V) QUIESCENT CURRENT (μA) 250 3014 G02 Quiescent Current 14 IL = 10mA 300 50 0 3014 G01 16 IL = 20mA 350 100 100 50 0 400 1.230 1.225 1.220 1.215 1.210 12 10 8 6 4 1.205 2 1.200 –50 –25 0 75 50 25 TEMPERATURE (oC) 0 100 125 3014 G05 VSHDN = VIN VSHDN = 0V 0 1 2 3 4 5 6 7 INPUT VOLTAGE (V) 8 9 10 3014 G06 3014fd 4 LT3014 TYPICAL PERFORMANCE CHARACTERISTICS GND Pin Current VIN = 3.3V 900 TJ = 25oC = 1.22V V 800 OUT RL = 617 IL = 20mA* 500 400 RL = 1227 IL = 10mA* 300 200 RL = 1.22k IL = 1mA* 100 0 0 1 2 3 4 5 6 7 INPUT VOLTAGE (V) 8 9 700 600 500 400 300 1.6 1.4 1.2 1.0 0.8 0.6 200 0.4 100 0.2 0 10 1.8 SHDN PIN THRESHOLD (V) GND PIN CURRENT (μA) GND PIN CURRENT (μA) 800 600 2.0 1000 TJ = 25oC 900 *FOR VOUT = 1.22V 700 SHDN Pin Threshold GND Pin Current vs ILOAD 1000 2 0 4 0 –50 6 8 10 12 14 16 18 20 OUTPUT CURRENT (mA) –25 0 25 50 75 TEMPERATURE (oC) 100 125 3014 G09 3014 G07 3014 G08 SHDN Pin Current SHDN Pin Current TJ = 25oC CURRENT FLOWS 1.0 OUT OF SHDN PIN 14 VSHDN = 0V 1.4 CURRENT FLOWS OUT OF SHDN PIN 0.8 0.6 0.4 0.2 12 ADJ PIN BIAS CURRENT (nA) SHDN PIN CURRENT (μA) SHDN PIN CURRENT (μA) ADJ Pin Bias Current 1.6 1.2 1.2 1.0 0.8 0.6 0.4 0 2.5 3 1 1.5 2 SHDN PIN VOLTAGE (V) 0.5 3.5 0 –50 –25 4 75 50 25 TEMPERATURE (oC) 0 100 VOUT = 0V 70 TJ = 25oC 90 CURRENT LIMIT (mA) CURRENT LIMIT (mA) 50 40 30 20 VIN = 7V VOUT = 0V 70 60 50 40 30 10 0 6 8 10 12 14 16 18 20 INPUT VOLTAGE (V) 3014 G13 0 –50 100 125 Reverse Output Current 20 10 50 75 25 TEMPERATURE (oC) 50 80 60 0 3014 G12 Current Limit 100 4 4 0 –50 –25 125 REVERSE OUTPUT CURRENT (μA) Current Limit 80 2 6 3014 G11 3014 G10 0 8 2 0.2 0 10 TJ = 25oC 45 VIN = 0V = VADJ V 40 OUT ADJ PIN ESD CLAMP 35 30 25 20 CURRENT FLOWS INTO OUTPUT PIN 15 10 5 –25 50 25 0 75 TEMPERATURE (oC) 100 125 3014 G14 0 0 1 2 3 4 5 6 7 8 OUTPUT VOLTAGE (V) 9 10 3014 G15 3014fd 5 LT3014 TYPICAL PERFORMANCE CHARACTERISTICS Reverse Output Current REVERSE OUTPUT CURRENT (μA) 7 Input Ripple Rejection Input Ripple Rejection 72 VIN = 0V VOUT = VADJ = 1.22V RIPPLE REJECTION (dB) 6 5 4 3 2 80 VIN = 7V + 0.5VP-P 70 RIPPLE AT f = 120Hz IL = 20mA 68 66 64 62 60 58 1 0 –50 –25 75 50 25 TEMPERATURE (oC) 0 100 75 50 25 TEMPERATURE (oC) 100 0 –5 LOAD REGULATION (mV) MINIMUM INPUT VOLTAGE (V) ILOAD = 20mA 2.5 2.0 1.5 1.0 0.5 20 100 COUT = 0.47μF 100 100k 1M 3014 G18 $IL = 100μA TO 20mA VOUT = 1.22V –10 –15 –20 –25 –30 125 –40 –50 –25 0 25 50 75 100 125 10 COUT = 0.47μF IL = 20mA VOUT = 1.22V 1 0.1 0.01 10 100 TEMPERATURE (oC) 3014 G19 1k 10k FREQUENCY (Hz) 100k 3014 G21 3014 G20 Transient Response VOUT 200μV/DIV 3014 G22 LOAD CURRENT (mA) OUTPUT VOLTAGE DEVIATION (V) 10Hz to 100kHz Output Noise 1ms/DIV 1k 10k FREQUENCY (Hz) Output Noise Spectral Density –35 25 75 0 50 TEMPERATURE (oC) COUT = 4.7μF 30 Load Regulation 0 3.0 COUT = 0.47μF IL = 200mA VOUT = 1.22V 40 0 10 125 OUTPUT NOISE SPECTRAL DENSITY (MV/•Hz) Minimum Input Voltage 0 –50 –25 50 3014 G17 3014 G16 3.5 60 10 56 –50 –25 125 VIN = 7V + 50mVRMS RIPPLE IL = 20mA 70 RIPPLE REJECTION (dB) 8 0.04 0.02 0 VIN = 7V VOUT = 5V CIN = COUT = 0.47μF CERAMIC $ILOAD = 1mA TO 5mA –0.02 –0.04 6 4 2 0 0 200 600 400 TIME (μs) 800 1000 3014 G23 3014fd 6 LT3014 PIN FUNCTIONS (SOT-23 Package/DD Package) IN (Pin 1/Pin 8): Input. Power is supplied to the device through the IN pin. A bypass capacitor is required on this pin if the device is more than six inches away from the main input filter capacitor. In general, the output impedance of a battery rises with frequency, so it is advisable to include a bypass capacitor in battery-powered circuits. A bypass capacitor in the range of 0.1μF to 10μF is sufficient. The LT3014 is designed to withstand reverse voltages on the IN pin with respect to ground and the OUT pin. In the case of a reversed input, which can happen if a battery is plugged in backwards, the LT3014 will act as if there is a diode in series with its input. There will be no reverse current flow into the LT3014 and no reverse voltage will appear at the load. The device will protect both itself and the load. GND (Pin 2/Pins 4, 9): Ground. SHDN (Pin 3/Pin 5): Shutdown. The SHDN pin is used to put the LT3014 into a low power shutdown state. The output will be off when the SHDN pin is pulled low. The SHDN pin can be driven either by 5V logic or open-collector logic with a pull-up resistor. The pull-up resistor is only required to supply the pull-up current of the open-collector gate, normally several microamperes. If unused, the SHDN pin must be tied to IN or to a logic high. ADJ (Pin 4/Pin 2): Adjust. This is the input to the error amplifier. This pin is internally clamped to ±7V. It has a bias current of 4nA which flows into the pin (see curve of ADJ Pin Bias Current vs Temperature in the Typical Performance Characteristics). The ADJ pin voltage is 1.22V referenced to ground, and the output voltage range is 1.22V to 60V. OUT (Pin 5/Pin 1): Output. The output supplies power to the load. A minimum output capacitor of 0.47μF is required to prevent oscillations. Larger output capacitors will be required for applications with large transient loads to limit peak voltage transients. See the Applications Information section for more information on output capacitance and reverse output characteristics. 3014fd 7 LT3014 APPLICATIONS INFORMATION The LT3014 is a 20mA high voltage low dropout regulator with micropower quiescent current and shutdown. The device is capable of supplying 20mA at a dropout voltage of 350mV. The low operating quiescent current (7μA) drops to 1μA in shutdown. In addition to the low quiescent current, the LT3014 incorporates several protection features which make it ideal for use in battery-powered systems. The device is protected against both reverse input and reverse output voltages. In battery backup applications where the output can be held up by a backup battery when the input is pulled to ground, the LT3014 acts like it has a diode in series with its output and prevents reverse current flow. Adjustable Operation The LT3014 has an output voltage range of 1.22V to 60V. The output voltage is set by the ratio of two external resistors as shown in Figure 1. The device servos the output to maintain the voltage at the adjust pin at 1.22V referenced to ground. The current in R1 is then equal to 1.22V/R1 and the current in R2 is the current in R1 plus the ADJ pin bias current. The ADJ pin bias current, 4nA at 25°C, flows through R2 into the ADJ pin. The output voltage can be calculated using the formula in Figure 1. The value of R1 should be less than 1.62M to minimize errors in the output voltage caused by the ADJ pin bias current. Note that in shutdown the output is turned off and the divider current will be zero. The device is tested and specified with the ADJ pin tied to the OUT pin and a 5μA DC load (unless otherwise specified) for an output voltage of 1.22V. Specifications for output voltages greater than 1.22V will be proportional to the ratio of the desired output voltage to 1.22V (VOUT/1.22V). For example, load regulation for an output current change of 1mA to 20mA IN VIN VOUT OUT R2 LT3014 + ADJ GND R1 3014 F01  VOUT = 1.22V • 1 + R2 + (IADJ)(R2) R1 VADJ = 1.22V IADJ = 4nA AT 25oC OUTPUT RANGE = 1.22V TO 60V Figure 1. Adjustable Operation is –13mV typical at VOUT = 1.22V. At VOUT = 12V, load regulation is: (12V/1.22V) • (–13mV) = –128mV Output Capacitance and Transient Response The LT3014 is designed to be stable with a wide range of output capacitors. The ESR of the output capacitor affects stability, most notably with small capacitors. A minimum output capacitor of 0.47μF with an ESR of 3Ω or less is recommended to prevent oscillations. The LT3014 is a micropower device and output transient response will be a function of output capacitance. Larger values of output capacitance decrease the peak deviations and provide improved transient response for larger load current changes. Bypass capacitors, used to decouple individual components powered by the LT3014, will increase the effective output capacitor value. Extra consideration must be given to the use of ceramic capacitors. Ceramic capacitors are manufactured with a variety of dielectrics, each with different behavior across temperature and applied voltage. The most common dielectrics used are specified with EIA temperature characteristic codes of Z5U, Y5V, X5R and X7R. The Z5U and Y5V dielectrics are good for providing high capacitances in a small package, but they tend to have strong voltage and temperature coefficients as shown in Figures 2 and 3. When used with a 5V regulator, a 16V 10μF Y5V capacitor can exhibit an effective value as low as 1μF to 2μF for the DC bias voltage applied and over the operating temperature range. The X5R and X7R dielectrics result in more stable characteristics and are more suitable for use as the output capacitor. The X7R type has better stability across temperature, while the X5R is less expensive and is available in higher values. Care still must be exercised when using X5R and X7R capacitors; the X5R and X7R codes only specify operating temperature range and maximum capacitance change over temperature. Capacitance change due to DC bias with X5R and X7R capacitors is better than Y5V and Z5U capacitors, but can still be significant enough to drop capacitor values below appropriate levels. Capacitor DC bias characteristics tend to improve as component case size increases, but expected capacitance at operating voltage should be verified. 3014fd 8 LT3014 APPLICATIONS INFORMATION Voltage and temperature coefficients are not the only sources of problems. Some ceramic capacitors have a piezoelectric response. A piezoelectric device generates voltage across its terminals due to mechanical stress, similar to the way a piezoelectric accelerometer or microphone works. For a ceramic capacitor the stress can be induced by vibrations in the system or thermal transients. 20 BOTH CAPACITORS ARE 16V, 1210 CASE SIZE, 10μF CHANGE IN VALUE (%) 0 X5R For surface mount devices, heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. Copper board stiffeners and plated through-holes can also be used to spread the heat generated by power devices. The following table lists thermal resistance for several different board sizes and copper areas. All measurements were taken in still air on 3/32” FR-4 board with one ounce copper. Table 1. SOT-23 Measured Thermal Resistance –20 COPPER AREA –40 –60 Y5V –80 –100 BOARD AREA THERMAL RESISTANCE (JUNCTION-TO-AMBIENT) 2500 sq mm 2500 sq mm 2500 sq mm 125°C/W 1000 sq mm 2500 sq mm 2500 sq mm 125°C/W 225 sq mm 2500 sq mm 2500 sq mm 130°C/W 100 sq mm 2500 sq mm 2500 sq mm 135°C/W 50 sq mm 2500 sq mm 2500 sq mm 150°C/W TOPSIDE 0 2 4 8 6 10 12 DC BIAS VOLTAGE (V) 14 16 BACKSIDE 3014 F02 Thermal Considerations The power handling capability of the device will be limited by the maximum rated junction temperature (125°C). The power dissipated by the device will be made up of two components: 1. Output current multiplied by the input/output voltage differential: IOUT • (VIN – VOUT) and, 2. GND pin current multiplied by the input voltage: IGND • VIN. The GND pin current can be found by examining the GND Pin Current curves in the Typical Performance Characteristics. Power dissipation will be equal to the sum of the two components listed above. The LT3014 regulator has internal thermal limiting designed to protect the device during overload conditions. For continuous normal conditions the maximum junction temperature rating of 125°C must not be exceeded. It is important to give careful consideration to all sources of thermal resistance from junction to ambient. Additional heat sources mounted nearby must also be considered. Table 2. DFN Measured Thermal Resistance COPPER AREA BOARD AREA THERMAL RESISTANCE (JUNCTION-TO-AMBIENT) 2500 sq mm 2500 sq mm 2500 sq mm 40°C/W 1000 sq mm 2500 sq mm 2500 sq mm 45°C/W 225 sq mm 2500 sq mm 2500 sq mm 50°C/W 100 sq mm 2500 sq mm 2500 sq mm 62°C/W TOPSIDE BACKSIDE For the DFN package, the thermal resistance junction-tocase (θJC), measured at the Exposed Pad on the back of the die, is 16°C/W. 40 20 CHANGE IN VALUE (%) Figure 2. Ceramic Capacitor DC Bias Characteristics 0 X5R –20 –40 Y5V –60 –80 BOTH CAPACITORS ARE 16V, 1210 CASE SIZE, 10μF –100 50 25 75 –50 –25 0 TEMPERATURE (oC) 100 125 3014 F03 Figure 3. Ceramic Capacitor Temperature Characteristics 3014fd 9 LT3014 APPLICATIONS INFORMATION Continuous operation at large input/output voltage differentials and maximum load current is not practical due to thermal limitations. Transient operation at high input/output differentials is possible. The approximate thermal time constant for a 2500sq mm 3/32" FR-4 board with maximum topside and backside area for one ounce copper is 3 seconds. This time constant will increase as more thermal mass is added (i.e. vias, larger board, and other components). For an application with transient high power peaks, average power dissipation can be used for junction temperature calculations as long as the pulse period is significantly less than the thermal time constant of the device and board. Calculating Junction Temperature Example 1: Given an output voltage of 5V, an input voltage range of 24V to 30V, an output current range of 0mA to 20mA, and a maximum ambient temperature of 50°C, what will the maximum junction temperature be? The power dissipated by the device will be equal to: IOUT(MAX) • (VIN(MAX) – VOUT) + (IGND • VIN(MAX)) where: IOUT(MAX) = 20mA VIN(MAX) = 30V IGND at (IOUT = 20mA, VIN = 30V) = 0.55mA So: P = 20mA • (30V – 5V) + (0.55mA • 30V) = 0.52W The thermal resistance for the DFN package will be in the range of 40°C/W to 62°C/W depending on the copper area. So the junction temperature rise above ambient will be approximately equal to: 0.52W • 50°C/W = 26°C The maximum junction temperature will then be equal to the maximum junction temperature rise above ambient plus the maximum ambient temperature or: TJMAX = 50°C + 26°C = 76°C Example 2: Given an output voltage of 5V, an input voltage of 48V that rises to 72V for 5ms(max) out of every 100ms, and a 5mA load that steps to 20mA for 50ms out of every 250ms, what is the junction temperature rise above ambient? Using a 500ms period (well under the time constant of the board), power dissipation is as follows: P1(48V in, 5mA load) = 5mA • (48V – 5V) + (100μA • 48V) = 0.22W P2(48V in, 20mA load) = 20mA • (48V – 5V) + (0.55mA • 48V) = 0.89W P3(72V in, 5mA load) = 5mA • (72V – 5V) + (100μA • 72V) = 0.34W P4(72V in, 20mA load) = 20mA • (72V – 5V) + (0.55mA • 72V) = 1.38W Operation at the different power levels is as follows: 76% operation at P1, 19% for P2, 4% for P3, and 1% for P4. PEFF = 76%(0.22W) + 19%(0.89W) + 4%(0.34W) + 1%(1.38W) = 0.36W With a thermal resistance in the range of 40°C/W to 62°C/W, this translates to a junction temperature rise above ambient of 20°C. 3014fd 10 LT3014 APPLICATIONS INFORMATION Protection Features The LT3014 incorporates several protection features which make it ideal for use in battery-powered circuits. In addition to the normal protection features associated with monolithic regulators, such as current limiting and thermal limiting, the device is protected against reverse-input voltages, and reverse voltages from output to input. Current limit protection and thermal overload protection are intended to protect the device against current overload conditions at the output of the device. For normal operation, the junction temperature should not exceed 125°C. The input of the device will withstand reverse voltages of 80V. Current flow into the device will be limited to less than 6mA (typically less than 100μA) and no negative voltage will appear at the output. The device will protect both itself and the load. This provides protection against batteries which can be plugged in backward. The ADJ pin can be pulled above or below ground by as much as 7V without damaging the device. If the input is left open circuit or grounded, the ADJ pin will act like an open circuit when pulled below ground, and like a large resistor (typically 100k) in series with a diode when pulled above ground. If the input is powered by a voltage source, pulling the ADJ pin below the reference voltage will cause the device to current limit. This will cause the output to go to an unregulated high voltage. Pulling the ADJ pin above the reference voltage will turn off all output current. In situations where the ADJ pin is connected to a resistor divider that would pull the ADJ pin above its 7V clamp voltage if the output is pulled high, the ADJ pin input current must be limited to less than 5mA. For example, a resistor divider is used to provide a regulated 1.5V output from the 1.22V reference when the output is forced to 60V. The top resistor of the resistor divider must be chosen to limit the current into the ADJ pin to less than 5mA when the ADJ pin is at 7V. The 53V difference between the OUT and ADJ pins divided by the 5mA maximum current into the ADJ pin yields a minimum top resistor value of 10.6k. In circuits where a backup battery is required, several different input/output conditions can occur. The output voltage may be held up while the input is either pulled to ground, pulled to some intermediate voltage, or is left open circuit. Current flow back into the output will follow the curve shown in Figure 4. The rise in reverse output current above 7V occurs from the breakdown of the 7V clamp on the ADJ pin. With a resistor divider on the regulator output, this current will be reduced depending on the size of the resistor divider. When the IN pin of the LT3014 is forced below the OUT pin or the OUT pin is pulled above the IN pin, input current will typically drop to less than 2μA. This can happen if the input of the LT3014 is connected to a discharged (low voltage) battery and the output is held up by either a backup battery or a second regulator circuit. The state of the SHDN pin will have no effect on the reverse output current when the output is pulled above the input. REVERSE OUTPUT CURRENT (μA) 50 TJ = 25oC 45 VIN = 0V = VADJ V 40 OUT ADJ PIN ESD CLAMP 35 30 25 20 CURRENT FLOWS INTO OUTPUT PIN 15 10 5 0 0 1 2 3 4 5 6 7 8 OUTPUT VOLTAGE (V) 9 10 3014 F04 Figure 4. Reverse Output Current 3014fd 11 LT3014 TYPICAL APPLICATIONS 5V Buck Converter with Low Current Keep Alive Backup D2 D1N914 6 VIN 5.5V* TO 60V C2 0.33μF BOOST 4 C3 4.7μF 100V CERAMIC VIN SW 2 14 VOUT 5V 1A/20mA D1 10MQ060N LT1766 15 L1† 15μH SHDN BIAS SYNC FB GND 10 R1 15.4k 12 R2 4.99k VC + C1 100μF 10V SOLID TANTALUM 1, 8, 9, 16 11 CC 1nF IN LT3014 OPERATING CURRENT SHDN LOW HIGH 3014 TA03 OUT 3.92M ADJ GND 1.27M * FOR INPUT VOLTAGES BELOW 7.5V, SOME RESTRICTIONS MAY APPLY † INCREASE L1 TO 30μH FOR LOAD CURRENTS ABOVE 0.6A AND TO 60μH ABOVE 1A Buck Converter Efficiency vs Load Current 100 VOUT = 5V L = 68μH VIN = 10V EFFICIENCY (%) 90 VIN = 42V 80 70 60 50 0 0.25 0.75 1.00 0.50 LOAD CURRENT (A) 1.25 3014 TA04 3014fd 12 LT3014 TYPICAL APPLICATIONS LT3014 Automotive Application VIN 12V (LATER 42V) IN + 1μF NO PROTECTION DIODE NEEDED! OUT LT3014 R1 1μF ADJ SHDN GND R2 LOAD: CLOCK, SECURITY SYSTEM ETC OFF ON LT3014 Telecom Application VIN 48V (72V TRANSIENT) IN OUT LT3014 1μF ADJ SHDN GND + R1 NO PROTECTION DIODE NEEDED! 1μF R2 OFF ON LOAD: SYSTEM MONITOR ETC – BACKUP BATTERY 3014 TA05 Constant Brightness for Indicator LED over Wide Input Voltage Range RETURN IN 1μF OFF ON OUT LT3014 SHDN 1μF ADJ GND –48V ILED = 1.22V/RSET –48V CAN VARY FROM –3.3V TO –80V RSET 3014 TA06 3014fd 13 LT3014 PACKAGE DESCRIPTION S5 Package 5-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1635) 0.62 MAX 0.95 REF 2.90 BSC (NOTE 4) 1.22 REF 1.4 MIN 3.85 MAX 2.62 REF 2.80 BSC 1.50 – 1.75 (NOTE 4) PIN ONE RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 0.30 – 0.45 TYP 5 PLCS (NOTE 3) 0.95 BSC 0.80 – 0.90 0.20 BSC 0.01 – 0.10 1.00 MAX DATUM ‘A’ 0.30 – 0.50 REF 0.09 – 0.20 (NOTE 3) NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 1.90 BSC S5 TSOT-23 0302 REV B 3014fd 14 LT3014 PACKAGE DESCRIPTION DD Package 8-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1698) 0.675 p0.05 3.5 p0.05 1.65 p0.05 2.15 p0.05 (2 SIDES) PACKAGE OUTLINE 0.25 p 0.05 0.50 BSC 2.38 p0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS R = 0.115 TYP 5 3.00 p0.10 (4 SIDES) 0.38 p 0.10 8 1.65 p 0.10 (2 SIDES) PIN 1 TOP MARK (NOTE 6) (DD) DFN 1203 0.200 REF 0.75 p0.05 0.00 – 0.05 4 0.25 p 0.05 1 0.50 BSC 2.38 p0.10 (2 SIDES) BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON TOP AND BOTTOM OF PACKAGE 3014fd Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15 LT3014 RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LT1129 700mA, Micropower, LDO VIN: 4.2V to 30V, VOUT(MIN) = 3.75V, VDO = 0.4V, IQ = 50μA, ISD = 16μA, DD, SOT-223, S8, TO220, TSSOP-20 Packages LT1175 500mA, Micropower Negative LDO VIN: –20V to –4.3V, VOUT(MIN) = –3.8V, VDO = 0.50V, IQ = 45μA, ISD = 10μA, DD, SOT-223, S8 Packages LT1185 3A, Negative LDO VIN: –35V to –4.2V, VOUT(MIN) = –2.40V, VDO = 0.80V, IQ = 2.5mA, ISD
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