PBGA

data sheet Features: LAMINATE PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm ball pitch available • 13 mm to 40 mm body sizes • Low Profile and lightweight • Thermal and electrical enhancement capable • Highly flexible internal routing of signal, power and ground for device performance and system compatibility • HDI designs possible • Suitable substrate for multi-die and integrated SMT structures • Mature strip based manufacturing process with high yields • Full in-house design capability • Quickest design-to-prototype delivery • Perimeter, stagger and full ball arrays • Special packaging for memory available • Multi-layer, ground / power • JEDEC MS-034 standard outlines • Excellent reliability • 63 Sn / 37 Pb Eutectic solder balls Thermal Resistance: Plastic Ball Grid Array (PBGA): Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors. Amkor’s PBGAs are designed for low inductance, improved thermal operation and enhanced SMT ability. Custom performance enhancements, like ground and power planes, are available for significant improvements in electrical response demanded by advancing electronics. Additionally, these PBGAs utilize industry proven, semiconductor grade materials for reliable, longterm operations while providing the user flexible design parameters. Applications: Semiconductor technologies find enhanced performance by using the integrated design features of Amkor’s PBGAs. Microprocessors / controllers, ASICs, Gate Arrays, memory, DSPs, PLDs, graphics and PC chip sets find Amkor’s PBGA family to be an ideal package. Applications requiring improved portability, form-factor/size and high-performance such as cellular, wireless telecommunications, PCMCIA cards, global positioning systems (GPS), laptop PC's, video cameras, disc drives, PLDs, graphics and other similar products benefit from Amkor's PBGA attributes. Multi layer PCB, 0 air flow Pkg 272 388 272 388 356* TE 452* TE 356**TE-2 452**TE-2 PCB Cu Theta JA Body Size Layer Thickness (°C/W) 27.0 x 27.0 2 N/A 22 35.0 x 35.0 2 N/A 19 27.0 x 27.0 4 36 µm 19 35.0 x 35.0 4 36 µm 16 27.0 x 27.0 4 72 µm 16 35.0 x 35.0 4 72 µm 14 27.0 x 27.0 4 72 µm 13.5 35.0 x 35.0 4 72 µm 12 *TEPBGA **TEPBGA-2 Results dependent on body size, die size, and PCB design. Reliability: Amkor assures you reliable performance by continuously monitoring key indices: • Moisture sensitivity JEDEC Level 3 characterization 30 °C/60% RH/192 hours • High temp op life 125 °C, 6V, 1000 hours • Autoclave or unbiased hast 130 °C/85% RH/96 hours • High temp storage 150 °C, 1000 hours • Temp cycle -55/+125 °C, 1000 cycles VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION . www.amkor.com DS 520L Rev Date: 05’07 data sheet PBGA PBGA Cross Section LAMINATE Process Highlights Die thickness (max) Bond pad pitch (min) Marking Ball inspection Pack / Ship options Wafer backgrinding 13 mils 2.4 mils Laser Optical JEDEC trays, Dry pack Available PBGA Standard Package Offering (mm) BODY SIZE BALL COUNT BALL PITCH BALL MATRIX BALL DIAM. PCB THICKNESS 2 LYR 4 LYR MOLD CAP THK TOTAL PACKAGE THICKNESS 2 LYR 4LYR 13.0 x 13.0 14.0 x 22.0 15.0 x 15.0 17.0 x 17.0 19.0 x 19.0 23.0 x 23.0 27.0 x 27.0 31.0 x 31.0 35.0 x 35.0 37.5 x 37.5 40.0 x 40.0 144 119 153 121 156/160 196 192/208 256 240 289 324 169 208/217 240/249 289 288/324 484 225 256/272 300/316 356 400 416 676 304/329 360/385 529 516 900 313 352/388 420/456 452 809 580 680 1,156 524 784 564 900 1.0 1.27 1.27 1.27 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.50 1.27 1.27 1.27 1.00 1.00 1.50 1.27 1.27 1.27 1.27 1.00 1.00 1.27 1.27 1.27 1.00 1.00 1.27 1.27 1.27 1.27 1.27 1.00 1.00 1.00 1.27 1.27 1.27 1.27 12 x 12 F 7 x 17 F 9 x 17 F 11 x 11 F 14 x 14 P 14 x 14 F 16 x 16 P 16 x 16 F 18 x 18 P 17 x 17 P 18 x 18 P 13 x 13 F 17 x 17 P 17 x 17 P 17 x 17 F 22 x 22 P 22 x 22 F 15 x 15 F 20 x 20 P 20 x 20 P 20 x 20 P 20 x 20 F 26 x 26 P 26 x 26 F 23 x 23 P 23 x 23 P 23 x 23 F 30 x 30 P 30 x 30 F 25 x 25 S 26 x 26 P 26 x 26 P 26 x 26 P 26 x 26 F 34 x 34 P 34 x 34 P 34 x 34 F 28 x 28 P 28 x 28 F 30 x 30 P 30 x 30 F 0.51 0.76 0.76 0.76 0.51 0.51 0.51 0.51 0.51 0.51 0.51 0.76 0.76 0.76 0.76 0.63 0.63 0.76 0.76 0.76 0.76 0.76 0.63 0.63 0.76 0.76 0.76 0.63 0.63 0.76 0.76 0.76 0.76 0.76 0.63 0.63 0.63 0.76 0.76 0.76 0.76 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.32 0.52 0.52 0.52 0.52 0.52 0.52 0.52 0.52 0.52 0.52 0.52 0.52 0.52 0.52 0.52 0.52 0.52 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.80 0.90 0.90 1.17 0.80 0.80 0.80 0.80 0.80 0.80 0.80 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.17 1.52 1.82 1.82 2.09 1.52 1.52 1.52 1.52 1.52 1.52 1.52 2.09 2.09 2.09 2.09 1.99 1.99 2.09 2.09 2.09 2.09 2.09 1.99 1.99 2.29 2.29 2.29 2.19 2.19 2.29 2.29 2.29 2.29 2.29 2.19 2.19 2.19 2.29 2.29 2.29 2.29 1.76 2.06 2.06 2.33 1.76 1.76 1.76 1.76 1.76 1.76 1.76 2.33 2.33 2.33 2.33 2.23 2.23 2.33 2.33 2.33 2.33 2.33 2.23 2.23 2.33 2.33 2.33 2.23 2.23 2.33 2.33 2.33 2.33 2.33 2.23 2.23 2.23 2.33 2.33 2.33 2.33 Standard Materials Package Substrate: Die attach: Au wire: Mold compound: Solder balls: CCL-HL832 Ablestik 2300 25 µm or 30 µm Nitto GE 100L 63 Sn / 37 Pb Test Services Program generation/conversion Product engineering Wafer sort 256 Pin x 20 MHz test system available -55 °C to + 125 °C test available Tape and Reel services Burn-in Shipping Low profile tray (JEDEC Outline CO-029) NOTE: All measurements in mm. P = Perimeter F = Full Array S = Stagger = Maximum possible ball count (may not be tooled). Additional depopulated options are available. Contact account manager for additional tooling. www.amkor.com With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.