UltraPort™ QSFP+
QSFP28 with Stamped and
Formed Contact Design
Amphenol ICC’s UltraPort™ QSFP+ interconnect system
comprises of a 38-position, 0.8mm pitch connector
built for use in high speed serial applications. Each port
offers 4 channels to increase port density which allows
more board real estate and cost optimized solutions. The
UltraPort™ QSFP+ connector supports next generation
100G+ applications and transmits up to 28Gb/s per
channel. It features a stamped and formed contact
design providing improved mechanical durability. The
resonance dampening features of the design allows
superior signal integrity. The design minimizes crosstalk
and transmission line impedance discontinuity across the
connector interface.
TARGET MARKETS
§§Electrical interface employs 4 lanes that operates up to
28 Gb/s per channel
§§Passive copper and optical solutions
§§Stamped and formed contact design provides improved
mechanical durability
§§The resonance dampening features minimize crosstalk
and transmission line impedance discontinuity across the
connector interface
FEATURES
BENEFITS
§§Electrical interface employs 4 lanes that operate up to 28
§§100Gb/s aggregated bandwidth solution
Gb/s per channel
§§Passive copper and optical solutions
§§Support various application requirements
§§Stamped and formed contact design
§§Improved mechanical durability
§§Resonance dampening features
§§Minimizes crosstalk and transmission line impedance
discontinuity and provides enhanced signal integrity
www.amphenol-icc.com
Amphenol Information Communications and Commercial Products
UltraPort™ QSFP+
TECHNICAL INFORMATION
MATERIAL
ELECTRICAL PERFORMANCE
§§
Housing: Black color, Glass reinforced, Lead
§§
Operating Voltage: 30 VDC per contact
Free Solder Reflow Process Compatible Thermo
Plastic
§§
Contacts Base Material: Phosphor Bronze
§§
Plating Solder Tails: Matte tin or Gold flash
options
§§
Plating Mating Area: Gold
§§
Resonance Dampening Feature: Conductive
Polymer
MECHANICAL PERFORMANCE
§§
Durability: 250 mating cycles
§§
Mating Force: 60 N max.
§§
Contact Normal Force: 0.5 N min./PIN
§§
PCB Thickness Single Side (Cage): 1.44 mm
(0.057in.) min.
§§
Operating Current: 0.5 A per contact
§§
Differential Impedance: 100Ω +/- 10Ω
ENVIRONMENTAL
§§
Operating and (Storage) Temperature: -20° to +85° C
§§
RoHS & Halogen-Free
TOOLING INFORMATION
§§
Heat Sinks and Light Pipes: Available
§§
Configurations:
§§
1XN (N=1,2,3,4,6)
§§
2XN (N=1,2,3)
TARGET MARKETS/APPLICATIONS
§§
PCB Thickness Belly to Belly (Cage): 2.35 mm
(0.093in.) min.
Cellular Infrastructure
Network Interface Cards
§§780 N for 1 port
Hubs
Switch
Servers
Storage
§§
1000 N for 2 Ports
Test and Measurement Equipment
§§
Unmating Force (Cage): 30 N max.
§§
Insertion Force to PCB (Cage):
§§
1700 N for 4 Ports
§§
2400 N for 6 Ports
www.amphenol-icc.com
Disclaimer
Please note that the above information is subject to change without notice.
UltraPort™ QSFP+
UltraPort™ QSFP+ Connector
FS1
Z38
Style
Z38
X
0
Z
6
38 Position
Option 3
6
Plating Option
2
3
Special Option
Resonance Dampening, No Hold
60
Down Tabs
60
30 μ” (0.76 μm) Gold Plating on Mating Area; 100 μ” (2.54 μm) Matte Tin
on Tails Over Nickel Underplate
15 μ” (0.38 μm) Gold Plating on Mating Area; 100 μ” (2.54 μm) Matte Tin
on Tails Over Nickel Underplate
Standard
Option 2
Z
Option 1
0
Standard
Standard
UltraPort™ QSFP+ Cages
U95
X
X
X
1
1
X
X
Packaging
X
Tray (Light Pipe and/or Heat Sink Shipped
Unassembled if Ordered)
Tray (Light Pipe and/or Heat Sink Shipped
Assembled)
1
Style
A 0°, One Rear Pin (1X1 Only) through the bezel
L 0°, No Rear Pin through the bezel
0°, Two Rear Pin (1XN: One Rear Pin, 1X1: Two Rear Pin) through
T
the bezel
W 1°, No Rear Pin (1X1 Only) through the bezel
A
Light Pipe Option
0
No Light Pipe
1
Dual Barrel Light Pipe - Round Outlet
4
Quad Barrel Light Pipe - Round Outlet
7
Single Barrel Light Pipe - Round Outlet
F
Quad Barrel Light Pipe -Square Outlet
Number of Ports in row
1 1X1
2 1X2
3 1X3
4 1X4
6 1X6
Dust Cover Option
0
Without Dust Cover
D
With Dust Cover (Shipped Loose)
Heat Sink Option
0 No Heat Sink or Clip Shipped, Closed Top With Vent Holes
1 No Heat Sink or Clip Shipped
Round Pin Style (Nickel Plated) Heat Sink & Clip (H = 6.5mm) - N/A with Quad
5
Light Pipe
Round Pin Style (Nickel Plated) Heat Sink & Clip (H = 4.2mm) - N/A with Quad
6
Light Pipe
Round Pin Style (Nickel Plated) Heat Sink & Clip (H =13.5mm)- N/A with Quad
7
Light Pipe
A Square Pin Style (Nickel Plated) Heat Sink & Clip (H = 6.5mm)
B Square Pin Style (Nickel Plated) Heat Sink & Clip (H = 4.2mm)
C Square Pin Style (Nickel Plated) Heat Sink & Clip (H = 13.5mm)
N Pin-Fin Style (Nickel Plated) Heat Sink & Clip (H = 6.5mm)
P Pin-Fin Style (Nickel Plated) Heat Sink & Clip (H = 4.2mm)
R Pin-Fin Style (Nickel Plated) Heat Sink & Clip (H = 13.5mm)
Extruded Custom Heat Sink for Front to Back Air Flow (Nickel Plated) & Clip
Y
(H = 6.94mm)
Extruded Custom Heat Sink for Front to Back Air Flow (Nickel Plated) & Clip
W
(H = 8.72mm)
Plating
1
Nickel
Application
1
Press-Fit Pins
UltraPort™ Stacked QSFP+
Z
X
0
5
4
X
X
1
X
X
1
Style
Z Standard
Connector Footprint
1
Standard
Vent Holes
0 Large Vent Holes
2 Small Vent Holes
4 Rectangular Vent Holes
Number of Ports in row
1 2X1
2 2X2
3 2X3
EMI Gasket Option
1 Chomerics 1273 Conductive Elastomer
2 Chomerics S6305 Conductive Elastomer
3 Through the Bezel
L Longer Spring Finger
Heat Sink Option
0 No Heat Sink or Clip Shipped
Application
5
Press-Fit Pins (2mm Long)
Packaging
1
Tray
Cage & Connector Contact Plating
30 μ” (0.76 μm) Gold over 50 μ” (1.27 μm) to 3.81 μm of Nickel; 15 μ” (0.38 μm) to1.52
4 μm of Matte Tin over 50 μ” (1.27 μm) to 3.81 μm of Nickel on Press-Fit Tail Area; Nickel
Plating for Cage
Light Pipe Option
Light Pipes (Triangular Outlet); Left Arrow Pointing Bot6
tom Outlet & Right Arrow Pointing Top Port
Dust Cover Option
0
Without Dust Cover
D
With Dust Cover
www.amphenol-icc.com
7
Without Light Pipes
8
With Light Pipes; Left Arrow Pointing Top Port & Right
Arrow Pointing Bottom Port
Disclaimer
Please note that the above information is subject to change without notice.
HSIOULTRAPORTQSFP1118EA4
U95
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