Data Sheet
HLMP-C115, HLMP-C123, HLMP-C215,
HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515,
HLMP-C523, HLMP-C615
T-1¾ Super Ultra-Bright LED Lamps
Description
These Broadcom® non-diffused lamps are designed to
produce a bright light source and smooth radiation pattern.
This lamp has been designed with a 20-mil lead frame,
enhanced flange, and tight meniscus controls, making it
compatible with radial lead automated insertion equipment.
Features
Very high intensity
AlInGaP LED technology
Exceptional uniformity
Consistent viewability
All colors:
– Deep Red
– Red
– Yellow
– Orange
– Green
– Emerald Green
15° and 25° family
Tape and reel options available
Binned for color and intensity
Applications
Broadcom
Ideal for backlighting front panels*
Used for lighting switches
Adapted for indoor and outdoor signs
AV02-1561EN
September 8, 2021
HLMP-C115, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615 Data Sheet
T-1¾ Super Ultra-Bright LED Lamps
Package Dimensions
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
1.85 (0.073)
MAX.
0.70 (0.028)
MAX.
31.60 MIN.
(1.244)
CATHODE
LEAD
1.00 MIN.
(0.039)
CATHODE
FLAT
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
NOTE:
1. All dimensions are in millimeters (inches).
2. An epoxy meniscus may extend about 0.5 mm (0.020 in.) down the leads.
3. For PCB hole recommendations, see Precautions.
Broadcom
AV02-1561EN
2
HLMP-C115, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615 Data Sheet
T-1¾ Super Ultra-Bright LED Lamps
Device Selection Guide
Luminous Intensity Iv (mcd)
Viewing Angle
(Degrees) 2½a
Standoff Leads
Part Number
Min.
Max.
Deep Red
15
No
HLMP-C115
290.0
—
25
No
HLMP-C123-L00xx
90.2
—
Red
15
No
HLMP-C215
138.0
—
25
No
HLMP-C223
90.2
—
15
No
HLMP-C315
147.0
—
25
No
HLMP-C323
96.2
—
15
No
HLMP-C415
138.0
—
25
No
—
Color
Yellow
Orange
Green
Emerald Green
15
No
25
No
15
No
HLMP-C423
90.2
HLMP-C423-L00xx
90.2
—
HLMP-C515
170.0
—
HLMP-C515-L00xx
170.0
—
HLMP-C523
69.8
—
HLMP-C523-J00xx
69.8
—
HLMP-C615-G00xx
17.0
—
a. ½ is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
Absolute Maximum Ratings at TA = 25°C
Deep Red
Red and
Orange
Yellow
Green and
Emerald Green
Units
DC Forward Currenta
30
30
20
30
mA
Reverse Voltage (IR = 100 µA)
5
5
5
5
V
110
110
110
110
°C
Parameter
LED Junction Temperature
Operating Temperature Range
–20 to +100
–40 to +100
–40 to +100
–20 to +100
°C
Storage Temperature Range
–40 to +100
–40 to +100
–40 to +100
–40 to +100
°C
a. See Figure 5 and Figure 6 for maximum current derating vs. ambient temperature.
Broadcom
AV02-1561EN
3
HLMP-C115, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615 Data Sheet
T-1¾ Super Ultra-Bright LED Lamps
Electrical Characteristics at TA = 25°C
Forward Voltage VF (Volts)
at IF = 20 mA
Reverse
Breakdown VR
(Volts)
at IR = 100 µA
Capacitance C
(pF) VF = 0,
f = 1 MHz
Speed of
Response s (ns)
Time Constant
e–t/s
Part Number
Typ.
Max.
Min.
Typ.
Thermal
Resistance
RJ-PIN (°C/W)
HLMP-C115
HLMP-C123
2.0
2.4
5
30
210
30
HLMP-C215
HLMP-C223
2.0
2.6
5
11
210
90
HLMP-C315
HLMP-C323
2.0
2.6
5
15
210
90
HLMP-C415
HLMP-C423
2.0
2.6
5
4
210
280
HLMP-C515
HLMP-C523
2.1
3.0
5
18
210
260
HLMP-C615
2.2
3.0
5
18
210
260
Peak Wavelength
peak (nm)
Color, Dominant
Wavelength
db (nm)
Viewing Angle
2½ (Degrees)c
Typ.
Optical Characteristics at TA = 25°C
Luminous Intensity Iv (mcd)
at 20 mAa
Part Number
Min.
Typ.
Typ.
Typ.
Typ.
Luminous
Efficacy
v (lm/w)
HLMP-C115
290
600
660
640
11
65
632
626
17
590
589
17
610
605
17
570
569
20
560
559
20
HLMP-C123
90
200
HLMP-C215
138
300
HLMP-C223
90
170
HLMP-C315
146
300
HLMP-C323
96
170
HLMP-C415
138
300
HLMP-C423
90
170
HLMP-C515
170
300
HLMP-C523
69
170
HLMP-C615
17
45
26
180
23
500
25
350
23
640
28
660
a. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not
be aligned with this axis.
b. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the device.
c. 2½ is the off-axis angle where the luminous intensity is ½ the on-axis intensity.
Broadcom
AV02-1561EN
4
HLMP-C115, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615 Data Sheet
T-1¾ Super Ultra-Bright LED Lamps
Part Numbering System
H
L
M
P
-
x1
x2
x3
x4
-
x5
x6
x7
x8
x9
Code
Description
Option
x1
Package Type
C
T -1¾ (5 mm)
x2
Color
1
Deep Red
2
Red
3
Yellow
4
Orange
5
Green
6
Emerald Green
x3 x4
Viewing Angle and Stand-off Option
15
15° without Stand-off
23
25° without Stand-off
x5
Minimum Intensity Bin
See Intensity Bin Limits
x6
Maximum Intensity Bin
0
Open Bins (no max Iv bin limit)
x7
Color Bin Option
0
Full distribution
x8 x9
Packing Option
00
Bulk (loose forms packaging)
01
Tape and Reel, Crimped Leads
02
Tape and Reel, Straight Leads
B2
Right Angle Housing, Even Leads
Broadcom
AV02-1561EN
5
HLMP-C115, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615 Data Sheet
T-1¾ Super Ultra-Bright LED Lamps
Bin Information
Intensity Bin Limits
Intensity Range (mcd)
Intensity Range (mcd)
Color
Bin
Min.
Max.
Red/Orange
L
101.5
162.4
M
162.4
234.6
Yellow
Broadcom
N
234.6
340.0
O
340.0
540.0
P
540.0
850.0
Q
850.0
1200.0
R
1200.0
1700.0
S
1700.0
2400.0
T
2400.0
3400.0
U
3400.0
4900.0
V
4900.0
7100.0
W
7100.0
10200.0
X
10200.0
14800.0
Y
14800.0
21400.0
Z
21400.0
30900.0
L
173.2
250.0
M
250.0
360.0
N
360.0
510.0
O
510.0
800.0
P
800.0
1250.0
Q
1250.0
1800.0
R
1800.0
2900.0
S
2900.0
4700.0
T
4700.0
7200.0
U
7200.0
11700.0
V
11700.0
18000.0
W
18000.0
27000.0
Color
Bin
Min.
Max.
Green/
Emerald Green
E
7.6
12.0
F
12.0
19.1
G
19.1
30.7
H
30.7
49.1
I
49.1
78.5
J
78.5
125.7
K
125.7
201.1
L
201.1
289.0
M
289.0
417.0
N
417.0
680.0
O
680.0
1100.0
P
1100.0
1800.0
Q
1800.0
2700.0
R
2700.0
4300.0
S
4300.0
6800.0
T
6800.0
10800.0
U
10800.0
16000.0
V
16000.0
25000.0
W
25000.0
40000.0
Maximum tolerance for each bin limit is ± 18%.
AV02-1561EN
6
HLMP-C115, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615 Data Sheet
Color Categories
Packaging Option Matrix
Lambda (nm)
Color
Category
Number
Min.
Max.
Green
6
561.5
564.5
5
564.5
567.5
4
567.5
570.5
3
570.5
573.5
2
573.5
576.5
1
582.0
584.5
3
584.5
587.0
2
587.0
589.5
4
589.5
592.0
5
592.0
593.0
1
597.0
599.5
2
599.5
602.0
3
602.0
604.5
4
604.5
607.5
5
607.5
610.5
6
610.5
613.5
7
613.5
616.5
8
616.5
619.5
Yellow
Orange
T-1¾ Super Ultra-Bright LED Lamps
Packaging
Option Code
Definition
00
Bulk Packaging, minimum increment
500 pieces/bag
01
Tape and Reel, crimped leads, minimum
increment 1300 pieces/reel
02
Tape and Reel, straight leads, minimum
increment 1300 pieces/reel
B2
Right Angle Housing, even leads, minimum
increment 500 pieces/bag
NOTE:
All categories are established for classification of
products. Products may not be available in all
categories. Contact your local Broadcom
representative for further clarification and
information.
Tolerance for each bin limit is ± 0.5 nm.
Broadcom
AV02-1561EN
7
HLMP-C115, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615 Data Sheet
T-1¾ Super Ultra-Bright LED Lamps
Figure 1: Relative Intensity vs. Wavelength
1
YELLOW ORANGE
RELATIVE INTENSITY
0.9
RED
DEEP RED
EMERALD
GREEN
0.8
0.7
0.6
GREEN
0.5
0.4
0.3
0.2
0.1
0
500
520
540
560
580
600
620
640
660
680
700
WAVELENGTH - nm
Figure 2: Forward Current vs. Forward Voltage
25
EMERALD
GREEN,
GREEN
DEEP
RED,RED,
ORANGE,
YELLOW
20
15
2
1.8
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
FORWARD CURRENT - mA
30
Figure 3: Relative Luminous Intensity vs. Forward Current
(Deep Red, Red, and Yellow)
10
5
1.6
DEEP RED
1.4
1.2
RED, YELLOW
1
0.8
0.6
0.4
0.2
0
0
1
2
3
0
0
5
FORWARD VOLTAGE - V
Figure 4: Relative Luminous Intensity vs. Forward Current
(Green, Emerald Green, and Orange)
1.6
IF – FORWARD CURRENT – mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
GREEN, ORANGE
0.8
0.6
0.4
0.2
0
5
10
15
20
25
25
30
35
30
25
30
RTJA = 559°C/W
20
RTJA = 689°C/W
15
10
5
0
0
20
DEEP RED
40
1.2
1
15
Figure 5: Maximum Forward DC Current vs. Ambient
Temperature. Derating based on TJMAX = 110°C.
EMERALD
GREEN
1.4
10
DC FORWARD CURRENT - mA
0
20
40
60
80
TA – AMBIENT TEMPERATURE – °C
100
DC FORWARD CURRENT - mA
Broadcom
AV02-1561EN
8
HLMP-C115, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615 Data Sheet
Figure 6: Maximum Forward DC Current vs. Ambient
Temperature. Derating based on TJMAX = 110°C.
IF – FORWARD CURRENT – mA
40
35
RED, ORANGE, GREEN, EMERALD GREEN
30
RTJA = 470°C/W
RTJA = 300°C/W
25
20
15
YELLOW
10
5
0
RTJA = 705°C/W
0
20
40
60
80
TA – AMBIENT TEMPERATURE – °C
Figure 7: Relative Luminous Intensity vs. Angular
Displacement – 15° Family
NORMALIZED LUMINOUS INTENSITY
RED, ORANGE, YELLOW,
GREEN, EMERALD GREEN
T-1¾ Super Ultra-Bright LED Lamps
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
45
35
25
15
5
-5 -15 -25
ANGULAR DISPLACEMENT – DEGREES
-35
-45
NORMALIZED LUMINOUS INTENSITY
Figure 8: Relative Luminous Intensity vs. Angular
Displacement – 25° Family
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
45
Broadcom
35
25
15
5
-5 -15 -25
ANGULAR DISPLACEMENT – DEGREES
-35
-45
AV02-1561EN
9
HLMP-C115, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615 Data Sheet
Precautions
T-1¾ Super Ultra-Bright LED Lamps
Lead Forming
Preform or cut to length the leads of an LED lamp prior
to insertion and soldering on PC board.
For better control, use the proper tool to precisely form
and cut the leads to applicable length rather than doing
it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground that prevents mechanical stress
due to lead cutting from traveling into LED package.
use this process for the hand solder operation, because
the excess lead length also acts as small heat sink.
Soldering and Handling
Take care during the PCB assembly and soldering
process to prevent damage to the LED component.
LED component may be effectively hand soldered to
PCB. However, do this only under unavoidable
circumstances, such as rework. The closest manual
soldering distance of the soldering heat source
(soldering iron's tip) to the body is 1.59 mm. Soldering
the LED using soldering iron tip closer than 1.59 mm
might damage the LED.
Apply ESD precautions on the soldering station and by
personnel to prevent ESD damage to the LED
component , which is ESD sensitive. For details, refer to
Broadcom application note AN 1142. The soldering iron
must have a grounded tip to ensure that the
electrostatic charge is properly grounded.
Recommended soldering conditions follow.
Wave
Solderinga, b
Manual Solder
Dipping
Pre-heat Temperature
105°C max.
—
Pre-heat Time
60s max.
—
Peak Temperature
250°C max.
260°C max.
Dwell Time
3s max.
5s max.
a. These conditions refer to measurement with a thermocouple
mounted at the bottom of PCB.
b. To reduce thermal stress experienced by the LED, use only
the bottom preheaters.
Broadcom
NOTE:
1. PCBs with different sizes and designs (component
density) have different heat mass (heat capacity). This
might cause a change in temperature experienced by
the board if the same wave soldering setting is used. So,
re-calibrate the soldering profile again before loading a
new type of PCB.
2. Take extra precautions during wave soldering to ensure
that the maximum wave temperature does not exceed
250°C and the solder contact time does not exceed 3s.
Over-stressing the LED during soldering process might
cause premature failure to the LED due to delamination.
1.59 mm
Set and maintain wave soldering parameters according
to the recommended temperature and dwell time.
Perform daily checks on the soldering profile to ensure
that it always conforms to the recommended soldering
conditions.
Loosely fit any alignment fixture that is being applied
during wave soldering and it should not apply weight or
force on the LED. Use non-metal material because it
absorbs less heat during the wave soldering process.
At elevated temperature, the LED is more susceptible
to mechanical stress. Therefore, allow the PCB to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
If the PCB board contains both through hole (TH) LEDs
and other surface mount components, solder the
surface mount components on the top side of the PCB.
If surface mount must be on the bottom side, solder
these components using reflow soldering prior to
inserting the TH LED.
The recommended PC board plated through holes
(PTH) size for LED component leads follows.
LED
Component
Lead Size
Diagonal
Plated ThroughHole Diameter
Lead size (typ.) 0.45 × 0.45 mm 0.636 mm
(0.018 × 0.018 in.) (0.025 in.)
0.98 to 1.08 mm
(0.039 to 0.043 in.)
Dambar shear- 0.65 mm
off area (max.) (0.026 in.)
0.919 mm
(0.036 in.)
Lead size (typ.) 0.50 × 0.50 mm 0.707 mm
(0.020 × 0.020 in.) (0.028 in.)
Dambar shear- 0.70 mm
off area (max.) (0.028 in).
1.05 to 1.15 mm
(0.041 to 0.045 in.)
0.99 mm
(0.039 in.)
Over-sizing the PTH can lead to a twisted LED after it is
clinched. On the other hand, undersizing the PTH can
make inserting the TH LED difficult.
AV02-1561EN
10
HLMP-C115, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615 Data Sheet
T-1¾ Super Ultra-Bright LED Lamps
For more information about soldering and handling of TH LED lamps, refer to application note AN5334.
Figure 9: Example of Wave Soldering Temperature Profile for TH LED
LAMINAR
HOT AIR KNIFE
TURBULENT WAVE
250
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
TEMPERATURE (°C)
200
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
150
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
100
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
50
PREHEAT
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
0
10
20
30
40
50
60
TIME (SECONDS)
70
80
90
100 Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Packaging Label
(i) Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 250C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Color Bin
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
Broadcom
AV02-1561EN
11
HLMP-C115, HLMP-C123, HLMP-C215, HLMP-C223, HLMP-C315, HLMP-C323,
HLMP-C415, HLMP-C423, HLMP-C515, HLMP-C523, HLMP-C615 Data Sheet
T-1¾ Super Ultra-Bright LED Lamps
(ii) Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Color Bin
DATECODE: Date Code
Broadcom
AV02-1561EN
12
Copyright © 2016–2021 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its
subsidiaries. For more information, go to www.broadcom.com. All trademarks, trade names, service marks, and logos
referenced herein belong to their respective companies.
Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability,
function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does
not assume any liability arising out of the application or use of this information, nor the application or use of any product or
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