0805ZC103KAT7A

X7R Dielectric General Specifications X7R formulations are called “temperature stable” ceramics and fall into EIA Class II materials. X7R is the most popular of these intermediate dielectric constant materials. Its temperature variation of capacitance is within ±15% from -55°C to +125°C. This capacitance change is non-linear. Capacitance for X7R varies under the influence of electrical operating conditions such as voltage and frequency. X7R dielectric chip usage covers the broad spectrum of industrial applications where known changes in capacitance due to applied voltages are acceptable. PART NUMBER (see page 2 for complete part number explanation) 0805 Size (L" x W") 5 Voltage 4V = 4 6.3V = 6 10V = Z 16V = Y 25V = 3 50V = 5 100V = 1 200V = 2 500V = 7 C Dielectric X7R = C 103 Capacitance Code (In pF) 2 Sig. Digits + Number of Zeros M Capacitance Tolerance J = ± 5% K = ±10% M = ± 20% A Failure Rate A = Not Applicable T Terminations T = Plated Ni and Sn 7 = Gold Plated 2 Packaging 2 = 7" Reel 4 = 13" Reel 7 = Bulk Cass. 9 = Bulk A Special Code A = Std. Product Contact Factory For Multiples Capacitance vs. Frequency +30 +20 Insulation Resistance (Ohm-Farads) X7R Dielectric Typical Temperature Coefficient 10 5 Insulation Resistance vs Temperature 10,000 Capacitance % Cap Change 0 -5 -10 -15 -20 -25 -60 -40 -20 0 20 40 60 80 100 120 140 +10 0 -10 -20 -30 1KHz 1,000 100 % 10 KHz 100 KHz 1 MHz 10 MHz 0 0 20 40 60 80 100 120 Temperature °C Frequency Temperature °C Variation of Impedance with Cap Value Impedance vs. Frequency 1,000 pF vs. 10,000 pF - X7R 0805 10.00 1,000 pF 10,000 pF Variation of Impedance with Chip Size Impedance vs. Frequency 10,000 pF - X7R 10 1206 0805 1210 Variation of Impedance with Chip Size Impedance vs. Frequency 100,000 pF - X7R 10 1206 0805 1210 Impedance, Impedance, 1.00 1.0 Impedance, 1.0 0.10 0.1 0.1 0.01 10 100 1000 .01 1 10 .01 100 1,000 1 10 100 1,000 Frequency, MHz Frequency, MHz Frequency, MHz 12 X7R Dielectric Specifications and Test Methods Parameter/Test Operating Temperature Range Capacitance Dissipation Factor X7R Specification Limits -55ºC to +125ºC Within specified tolerance ≤ 2.5% for ≥ 50V DC rating ≤ 3.0% for 25V DC rating ≤ 3.5% for 16V DC rating ≤ 5.0% for ≤ 10V DC rating 100,000MΩ or 1000MΩ - µF, whichever is less No breakdown or visual defects Measuring Conditions Temperature Cycle Chamber Freq.: 1.0 kHz ± 10% Voltage: 1.0Vrms ± .2V For Cap > 10 µF, 0.5Vrms @ 120Hz Charge device with rated voltage for 120 ± 5 secs @ room temp/humidity Charge device with 300% of rated voltage for 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Note: Charge device with 150% of rated voltage for 500V devices. Deflection: 2mm Test Time: 30 seconds 1mm/sec Insulation Resistance Dielectric Strength Resistance to Flexure Stresses Appearance Capacitance Variation Dissipation Factor Insulation Resistance No defects ≤ ±12% Meets Initial Values (As Above) ≥ Initial Value x 0.3 ≥ 95% of each terminal should be covered with fresh solder No defects, 230°C: 40s Max. Preheat It is important to avoid the possibility of thermal shock during soldering and carefully controlled preheat is therefore required. The rate of preheat should not exceed 4°C/second 71 Surface Mounting Guide MLC Chip Capacitors and a target figure 2°C/second is recommended. Although an 80°C to 120°C temperature differential is preferred, recent developments allow a temperature differential between the component surface and the soldering temperature of 150°C (Maximum) for capacitors of 1210 size and below with a maximum thickness of 1.25mm. The user is cautioned that the risk of thermal shock increases as chip size or temperature differential increases. POST SOLDER HANDLING Once SMP components are soldered to the board, any bending or flexure of the PCB applies stresses to the soldered joints of the components. For leaded devices, the stresses are absorbed by the compliancy of the metal leads and generally don’t result in problems unless the stress is large enough to fracture the soldered connection. Ceramic capacitors are more susceptible to such stress because they don’t have compliant leads and are brittle in nature. The most frequent failure mode is low DC resistance or short circuit. The second failure mode is significant loss of capacitance due to severing of contact between sets of the internal electrodes. Cracks caused by mechanical flexure are very easily identified and generally take one of the following two general forms: Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder to give a good joint should be used. Excessive solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. AVX terminations are suitable for all wave and reflow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Cooling Natural cooling in air is preferred, as this minimizes stresses within the soldered joint. When forced air cooling is used, cooling rate should not exceed 4°C/second. Quenching is not recommended but if used, maximum temperature differentials should be observed according to the preheat conditions above. Cleaning Flux residues may be hygroscopic or acidic and must be removed. AVX MLC capacitors are acceptable for use with all of the solvents described in the specifications MIL-STD202 and EIA-RS-198. Alcohol based solvents are acceptable and properly controlled water cleaning systems are also acceptable. Many other solvents have been proven successful, and most solvents that are acceptable to other components on circuit assemblies are equally acceptable for use with ceramic capacitors. Type A: Angled crack between bottom of device to top of solder joint. Type B: Fracture from top of device to bottom of device. Mechanical cracks are often hidden underneath the termination and are difficult to see externally. However, if one end termination falls off during the removal process from PCB, this is one indication that the cause of failure was excessive mechanical stress due to board warping. 72 Surface Mounting Guide MLC Chip Capacitors COMMON CAUSES OF MECHANICAL CRACKING The most common source for mechanical stress is board depanelization equipment, such as manual breakapart, vcutters and shear presses. Improperly aligned or dull cutters may cause torqueing of the PCB resulting in flex stresses being transmitted to components near the board edge. Another common source of flexural stress is contact during parametric testing when test points are probed. If the PCB is allowed to flex during the test cycle, nearby ceramic capacitors may be broken. A third common source is board to board connections at vertical connectors where cables or other PCBs are connected to the PCB. If the board is not supported during the plug/unplug cycle, it may flex and cause damage to nearby components. Special care should also be taken when handling large (>6" on a side) PCBs since they more easily flex or warp than smaller boards. REWORKING OF MLCs Thermal shock is common in MLCs that are manually attached or reworked with a soldering iron. AVX strongly recommends that any reworking of MLCs be done with hot air reflow rather than soldering irons. It is practically impossible to cause any thermal shock in ceramic capacitors when using hot air reflow. However direct contact by the soldering iron tip often causes thermal cracks that may fail at a later date. If rework by soldering iron is absolutely necessary, it is recommended that the wattage of the iron be less than 30 watts and the tip temperature be