0100MS

® 100MS EMI SHIELD DESCRIPTION The 100MS is an epoxy encapsulated electromagnetic/ electrostatic interference (EMI) shield for use with circuits where sensitivity to EMI is critical. It was designed to attenuate EMI by converting electromagnetic field energy into heat that is absorbed by the shield and by shunting electrostatic fields to common. The 100MS may be used in applications to either confine or exclude EMI. Its cavity was designed for 28.45mm x 28.45mm x 7.24mm, 20-pin hybrid packages. The shields in the cover and base plate are in two separate halves to maintain the electrical isolation between the adjacent rows of pins of the module it encloses. Because of the spacing between the shield halves and epoxy flow holes, the 100MS provides a partial, but adequate low reluctance path for electromagnetic flux. The 100MS is well suited for use with isolation modules such as the Burr-Brown 3656, 722, and 724. over the module so the tabs are aligned and fit into the slots in the base plate. Bend the four wide shield soldering tabs protruding from the cover to make contact with the bare metal on the base plate. Solder these four tabs to insure the integrity of their connection to the base plate. The 100MS and the module it contains are mounted and secured to a printed circuit board (PCB) by soldering the two narrow PCB solder tabs to the appropriate common. The PCB solder tab closest to the input side of the module should be soldered to the input common. The other tab should be soldered to the output common. Figure 2 illustrates the assembly of the 100MS. Cover ASSEMBLY INSTRUCTIONS Assemble the base plate to the module by pushing the pins of the module through the beveled holes in the base plate until the base plate and bottom of the module are in contact with each other. Place the cover Epoxy Encapsulant Shield Solder Tab PCB Solder Tab Shield Solder Tab Module (reference only) Half Cover Shield Half Cover Shield Base Plate Shield VISO Connection to Input Common VISO = Isolation Voltage Connection to Output Common Base Plate FIGURE 1. Cross-Sectional Side View of 100MS. International Airport Industrial Park • Mailing Address: PO Box 11400 Tel: (520) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP • FIGURE 2. Assembly Diagram. • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 © 1979 Burr-Brown Corporation PDS-421A Printed in U.S.A. October, 1993 SBFS013 SPECIFICATIONS ELECTRICAL Specifications apply between solder tabs. 100MS PARAMETER Isolation Voltage Rated Continuous, DC Rated Continuous, AC Test Capacitance Resistance Leakage Current CONDITIONS MIN 3500 2000 8000 5 1010 0.23 TYP MAX UNITS VDC Vrms VDC pF Ω µA 10 Seconds 120V, 60Hz NOTE: Temperature changes (∆T/∆t) greater than 1°C per minute below 0°C and long term storage above 100°C are not recommended. PACKAGE INFORMATION(1) MODEL 100MS PACKAGE EMI Shield PACKAGE DRAWING NUMBER 124 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix D of Burr-Brown IC Data Book. 20kΩ 2MΩ 2MΩ APPLICATIONS INFORMATION MULTIPLE DEVICE ORIENTATION A typical application for the 100MS is shown in Figure 3. Using multiple devices within 30mm of each other can cause them to interact by forming beat frequency interference outputs. The 100MS can reduce this interference by as much as a factor of 200:1 depending on the distance between the devices and their relative orientation. Minimum EMI results when the gaps of both shields are paralleled as in Figure 3a. G = 100 10 6 11 13 9 3656 2 16 19.6kΩ 17 7 20 19 C(1) 14 15 12 Power C(1) Supply Common VOUT1 100kΩ 3 C(1) Thermocouple #1 20kΩ 2MΩ +VCC 2MΩ 10 ® 6 G = 100 11 13 100kΩ Gap in Shield 9 3656 2 19.6kΩ 17 7 20 19 14 15 12 100MS VOUT2 ® 16 Power C(1) C(1) Supply Common Gap in Shield 3 100MS (a) Optimum PCB Layout. C(1) Thermocouple #2 NOTE: (1) C = 0.47µF. +VCC FIGURE 3a. Optimum PCB Layout. Orientation for minimum EMI. FIGURE 3b. Isolated Data Acquisition Input Circuitry. Orientation for Minimum EMI. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. ® 100MS 2 PACKAGE OPTION ADDENDUM www.ti.com 9-Dec-2004 PACKAGING INFORMATION Orderable Device 0100MS (1) Status (1) ACTIVE Package Type PDIP Package Drawing NSP Pins Package Eco Plan (2) Qty 20 25 None Lead/Ball Finish Call TI MSL Peak Temp (3) Level-NA-NA-NA The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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