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bq51010B
SLUSBB8A – DECEMBER 2012 – REVISED JUNE 2016
bq51010B Highly Integrated Wireless Receiver Qi (WPC v1.1) Compliant Power Supply
1 Features
3 Description
•
The bq51010B is a family of advanced, flexible,
secondary-side devices for wireless power transfer in
portable applications. The bq51010B devices provide
the AC-DC power conversion and regulation while
integrating the digital control required to comply with
the Qi v1.1 communication protocol. Together with
the bq50xxx primary-side controller, the bq51010B
enables a complete contact-less power transfer
system for a wireless power supply solution. Global
feedback is established from the secondary to the
primary to control the power transfer process using
the Qi v1.1 protocol.
1
•
•
•
•
•
•
•
•
Integrated Wireless Power Supply Receiver
Solution With a 7-V Regulated Supply
– 93% Overall Peak AC-DC Efficiency
– Full Synchronous Rectifier
– WPC v1.1 Compliant Communication Control
– Output Voltage Conditioning
– Only IC Required Between RX Coil and 7-V
Output
WPC v1.1 Compliant (FOD Enabled) Highly
Accurate Current Sense
Dynamic Rectifier Control for Improved Load
Transient Response
Dynamic Efficiency Scaling for Optimized
Performance Over Wide Range of Output Power
Adaptive Communication Limit for Robust
Communication
Supports 20-V Maximum Input
Low-power Dissipative Rectifier Overvoltage
Clamp (VOVP = 15 V)
Thermal Shutdown
Multifunction NTC and Control Pin for
Temperature Monitoring, Charge Complete and
Fault Host Control
The bq51010B devices integrate a low resistance
synchronous rectifier, low-dropout regulator, digital
control, and accurate voltage and current loops to
ensure high efficiency and low power dissipation.
The bq51010B also includes a digital controller that
can calculate the amount of power received by the
mobile device within the limits set by the WPC v1.1
standard. The controller will then communicate this
information to the transmitter to allow the transmitter
to determine if a foreign object is present within the
magnetic interface and introduces a higher level of
safety within magnetic field. This Foreign Object
Detection (FOD) method is part of the requirements
under the WPC v1.1 specification.
(1)
Device Information
2 Applications
•
•
•
•
•
•
WPC v1.1 Compliant Receivers
Cell Phones and Smart Phones
Headsets
Digital Cameras
Portable Media Players
Hand-Held Devices
PART NUMBER
bq51010B
PACKAGE
BODY SIZE (NOM)
DSBGA (28)
1.90 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Wireless Power Consortium (WPC or Qi) Inductive
Power System
Power
AC to DC
Drivers
bq5101x
Rectification
Voltage
Conditioning
Load
Communication
Controller
V/I
Sense
Controller
bq500210
Transmitter
Receiver
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq51010B
SLUSBB8A – DECEMBER 2012 – REVISED JUNE 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Tables...................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
5
7.1
7.2
7.3
7.4
7.5
7.6
5
5
5
5
6
8
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 11
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 23
9
Application and Implementation ........................ 24
9.1 Application Information............................................ 24
9.2 Typical Applications ................................................ 24
10 Power Supply Recommendations ..................... 31
11 Layout................................................................... 31
11.1 Layout Guidelines ................................................. 31
11.2 Layout Example .................................................... 31
12 Device and Documentation Support ................. 32
12.1
12.2
12.3
12.4
12.5
12.6
12.7
Device Support ....................................................
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
32
32
32
32
32
32
32
13 Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
Changes from Original (December 2012) to Revision A
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
•
Removed Package Summary, see POA at the end of the data sheet ................................................................................... 1
2
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SLUSBB8A – DECEMBER 2012 – REVISED JUNE 2016
5 Device Comparison Tables
FUNCTION
VOUT (VBAT-REG)
PROTOCOL
MAXIMUM
POUT
I2C
bq51003
Wireless receiver
5V
Qi v1.1
2.5 W
No
bq51013B
Wireless receiver
5V
Qi v1.1
5W
No
bq51010B
Wireless receiver
7V
Qi v1.1
5W
No
bq51020
Wireless receiver
4.5 to 8 V
Qi v1.1
5W
No
bq51021
Wireless receiver
4.5 to 8 V
Qi v1.1
5W
Yes
bq51221
Dual mode wireless
receiver
4.5 to 8 V
Qi v1.1, PMA
5W
Yes
bq51025
Wireless receiver
4.5 to 10 V
Qi v1.1 (in 5 W mode)
10 W
Yes
bq51020B
Wireless receiver and
direct charger
4.2 V
Qi v1.1
5W
No
bq51051B
Wireless receiver and
direct charger
4.35 V
Qi v1.1
5W
No
bq51052B
Wireless receiver and
direct charger
4.4 V
Qi v1.1
5W
No
DEVICE
Table 1. Device Options
DEVICE
bq51010B
(1)
(2)
FUNCTION
WPC
VERSION
VRECT-OVP
VOUT-(REG)
OVER
CURRENT
SHUTDOWN
AD-OVP
TERMINATION
COMMUNICATION
CURRENT LIMIT (1) (2)
7-V power supply
v1.1
15 V
7V
Disabled
Disabled
Disabled
Adaptive + 1s Hold-Off
Enabled if EN2 is low and disabled if EN2 is high
Communication current limit is disabled for 1 second at start-up
6 Pin Configuration and Functions
YFP Package
28-Pin DSBGA
Top View
A1
PGND
A2
PGND
A3
PGND
A4
PGND
B1
AC2
B2
AC2
B3
AC1
B4
AC1
C1
BOOT2
C2
RECT
C3
RECT
C4
BOOT1
D1
OUT
D2
OUT
D3
OUT
D4
OUT
E1
COM2
E2
CLMP2
E3
CLMP1
E4
COM1
F1
TS-CTRL
F2
FOD
F3
/AD-EN
F4
/WPG
G1
ILIM
G2
EN2
G3
EN1
G4
AD
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Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
AC1
B3, B4
I
AC2
B1, B2
I
AD
G4
I
Connect this pin to the wired adapter input. When a voltage is applied to this pin wireless
charging is disabled and AD_EN is driven low. Connect to GND through a 1-µF capacitor. If
unused, capacitor is not required and must be grounded directly.
Push-pull driver for external PFET connecting AD and OUT. This node is pulled to the higher
of OUT and AD when turning off the external FET. This voltage tracks approximately 4 V
below AD when voltage is present at AD and provides a regulated VSG bias for the external
FET. Float this pin if unused.
AC input from receiver coil antenna.
AD-EN
F3
O
BOOT1
C4
O
BOOT2
C1
O
CLMP1
E3
O
CLMP2
E2
O
COM1
E4
O
COM2
E1
O
EN1
G3
I
EN2
G2
I
FOD
F2
I
Input for the received power measurement. Connect to GND with a 140-Ω resistor. See the
FOD section for more detail.
Bootstrap capacitors for driving the high-side FETs of the synchronous rectifier. Connect a
10-nF ceramic capacitor from BOOT1 to AC1 and from BOOT2 to AC2.
Open drain FETs are used for a non-power dissipative overvoltage AC clamp protection.
When the RECT voltage goes above 15 V, both switches is turned on and the capacitors
acts as a low impedance to protect the IC from damage. If used, Clamp1 is required to be
connected to AC1, and Clamp2 is required to be connected to AC2 through 0.47-µF
capacitors.
Open-drain output used to communicate with primary by varying reflected impedance.
Connect through a capacitor to either AC1 or AC2 for capacitive load modulation (COM2
must be connected to the alternate AC1 or AC2 pin). For resistive modulation connect COM1
and COM2 to RECT through a single resistor; connect through separate capacitors for
capacitive load modulation.
Inputs that allow user to enable or disable wireless and wired charging :
wireless charging is enabled unless AD voltage > 3.6 V
Dynamic communication current limit disabled
AD-EN pulled low, wireless charging disabled
wired and wireless charging disabled.
ILIM
G1
I/O
Programming pin for the over current limit. Connect external resistor to VSS. Size RILIM with
the following equation: RILIM = 314 / IMAX where IMAX is the expected maximum output
current of the wireless power supply. The hardware current limit (IILIM) is 20% greater than
IMAX or 1.2 x 1MAX. If the supply is meant to operate in current limit use:
RILIM = 314 / IILIM, RILIM = R1 + RFOD
OUT
D1, D2,
D3, D4
O
Output pin, delivers power to the load.
PGND
A1, A2,
A3, A4
—
Power ground
RECT
C2, C3
O
Filter capacitor for the internal synchronous rectifier. Connect a ceramic capacitor to PGND.
Depending on the power levels, the value may be 4.7 μF to 22 μF.
TS/CTRL
F1
I
Must be connected to ground through a resistor. If an NTC function is not desired connect to
GND with a 10-kΩ resistor. As a CTRL pin pull to ground to send end power transfer (EPT)
fault to the transmitter or pull-up to an internal rail (that is, 1.8 V) to send EPT termination to
the transmitter. Note that a 3-state driver must be used to interface this pin (see the 3-State
Driver Recommendations For the TS-CTRL Pin section for further description)
WPG
F4
O
Open-drain output – Active when the output of the wireless power supply is enabled.
4
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SLUSBB8A – DECEMBER 2012 – REVISED JUNE 2016
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
Input voltage
MIN
MAX
AC1, AC2
–0.8
20
RECT, COM1, COM2, OUT, WPG, CLAMP1, CLAMP2
–0.3
20
AD, AD-EN
–0.3
30
BOOT1, BOOT2
–0.3
26
EN1, EN2, TERM, FOD, TS-CTRL, ILIM
–0.3
UNIT
V
7
Input current
AC1, AC2
1.5
A(RMS)
Output current
OUT
750
mA
WPG
15
mA
COM1, COM2
1
A
Output sink current
Junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the VSS terminal, unless otherwise noted.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
UNIT
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
V
±500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VRECT
Voltage range
RECT
IRECT
Current through internal
rectifier
RECT
IOUT
Output current
OUT
IAD-EN
Sink current
ICOMM
COMM sink current
TJ
Junction temperature
MIN
MAX
4
10
UNIT
V
1
A
750
mA
AD-EN
1
mA
COMM
400
mA
125
°C
0
7.4 Thermal Information
bq51010B
THERMAL METRIC
(1)
YFP (DSBGA)
UNIT
28 PINS
RθJA
Junction-to-ambient thermal resistance
58.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
0.2
°C/W
RθJB
Junction-to-board thermal resistance
9.1
°C/W
ψJT
Junction-to-top characterization parameter
1.4
°C/W
ψJB
Junction-to-board characterization parameter
8.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
over operating free-air temperature range, 0°C to 125°C (unless otherwise noted)
PARAMETER
UVLO
TEST CONDITIONS
MIN
MAX
2.7
2.8
Undervoltage lockout
VRECT = 0 V to 3 V
Hysteresis on UVLO
VRECT = 3 V to 2 V
250
Hysteresis on OVP
VRECT = 16 V to 5 V
150
Input overvoltage threshold
VRECT = 5 V to 16 V
Dynamic VRECT threshold 1
ILOAD < 0.1 × IIMAX (ILOAD rising)
9.08
Dynamic VRECT threshold 2
0.1 × IIMAX < ILOAD < 0.2 × IIMAX
(ILOAD rising)
8.28
Dynamic VRECT threshold 3
0.2 × IIMAX < ILOAD < 0.4 × IIMAX
(ILOAD rising)
7.53
Dynamic VRECT threshold 4
ILOAD > 0.4 × IIMAX (ILOAD rising)
VRECT tracking
In current limit voltage above VOUT
ILOAD
ILOAD hysteresis for dynamic VRECT
thresholds as a percentage of IILIM
ILOAD falling
VRECT-DPM
Rectifier undervoltage protection, restricts
IOUT at VRECT-DPM
VRECT-REV
Rectifier reverse voltage protection at the
output
VHYS
VRECT
VRECT-REG
2.6
TYP
14.5
15
UNIT
V
mV
15.5
V
V
7.11
VO + 0.25
4%
3
3.1
3.2
V
VRECT-REV = VOUT – VRECT,
VOUT = 10 V
8
9
V
ILOAD = 0 mA, 0°C ≤ TJ ≤ 85°C
8
10
ILOAD = 300 mA,
0°C ≤ TJ ≤ 85°C
2
3
28
40
µA
120
Ω
QUIESCENT CURRENT
IRECT
Active chip quiescent current consumption
from RECT
IOUT
Quiescent current at the output when
wireless power is disabled (standby)
VOUT = 7 V, 0°C ≤ TJ ≤ 85°C
mA
ILIM SHORT CIRCUIT
RILIM
Highest value of ILIM resistor considered a
fault (short). Monitored for IOUT > 100 mA
tDGL
Deglitch time transition from ILIM short to
IOUT disable
ILIM_SC
IOUT
RILIM = 200 Ω to 50 Ω. IOUT latches
off, cycle power to reset
1
ILIM-SHORT,OK enables the ILIM short
comparator when IOUT is greater than this
value
ILOAD = 0 mA to 200 mA
Hysteresis for ILIM-SHORT,OK comparator
ILOAD = 0 mA to 200 mA
Maximum output current limit, CL
Maximum ILOAD that is delivered
for 1 ms when ILIM is shorted
110
145
ms
165
mA
30
2.45
A
OUTPUT
ILOAD = 750 mA
6.9
6.96
7.02
ILOAD = 10 mA
6.9
6.95
7.05
RLIM = KILIM / IILIM, where IILIM is
the hardware current limit.
IOUT = 750 mA
303
314
322
VOUT-REG
Regulated output voltage
KILIM
Current programming factor for hardware
protection
KIMAX
I
= KIMAX / RLIM, where IMAX is
Current programming factor for the nominal IMAX
the maximum normal operating
operating current
current. IOUT = 750 mA
IOUT
Current limit programming range
Current limit during WPC communication
tHOLD
Hold off time for the communication current
limit during start-up
IOUT > 300 mA
IOUT < 300 mA
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IOUT + 50
343
378
1
AΩ
AΩ
1.5
ICOMM
6
262
V
425
A
mA
s
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Electrical Characteristics (continued)
over operating free-air temperature range, 0°C to 125°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
2
2.2
2.4
UNIT
TS / CTRL
Internal TS bias voltage
ITS-Bias < 100 µA (periodically
driven see tTS-CTRL)
Rising threshold
VTS = 50% to 60%
Falling hysteresis
VTS = 60% to 50%
Falling threshold
VTS = 20% to 15%
Rising hysteresis
VTS = 15% to 20%
CTRL pin threshold for a high
VTS/CTRL = 50 mV to 150 mV
80
100
130
CTRL pin threshold for a low
VTS/CTRL = 150 mV to 50 mV
50
80
100
tTS-CTRL
Time VTS-Bias is active when TS
measurements occur
Synchronous to the
communication period
tTS
Deglitch time for all TS comparators
RTS
Pullup resistor for the NTC network. Pulled
up to the voltage bias
VTS
VCOLD
VHOT
VCTRL
56.5%
58.7% 60.8%
2%
18.5%
19.6% 20.7%
3%
18
V
VTS-Bias
VTS-Bias
mV
24
ms
10
ms
20
22
kΩ
THERMAL PROTECTION
TJ
Thermal shutdown temperature
155
Thermal shutdown hysteresis
°C
20
OUTPUT LOGIC LEVELS ON WPG
VOL
Open drain WPG pin
ISINK = 5 mA
IOFF
WPG leakage current when disabled
V WPG = 20 V
RDS(ON)
COM1 and COM2
VRECT = 2.6 V
fCOMM
Signaling frequency on COMM pin
IOFF
Comm pin leakage current
500
mV
1
µA
COMM PIN
1.5
Ω
2
VCOM1 = 20 V, VCOM2 = 20 V
Kb/s
1
µA
CLAMP PIN
RDS(ON)
Clamp1 and Clamp2
0.8
Ω
ADAPTER ENABLE
VAD rising threshold voltage. EN-UVLO
VAD = 0 V to 5 V
V AD-EN hysteresis, EN-HYS
VAD = 5 V to 0 V
IAD
Input leakage current
VRECT = 0 V, VAD = 5 V
RAD
Pullup resistance from AD-EN to OUT
when adapter mode is disabled and VOUT > VAD = 0 V, VOUT = 5 V
VAD, EN-OUT
VAD
Voltage difference between VAD and V ADEN when adapter mode is enabled, EN-ON
V AD-EN
VAD = 5 V, 0°C ≤ TJ ≤ 85°C
3.5
3.6
3.8
400
V
mV
60
μA
200
350
Ω
3
4.5
5
V
80
100
130
SYNCHRONOUS RECTIFIER
IOUT
VHS-DIODE
IOUT at which the synchronous rectifier
enters half-synchronous mode, SYNC_EN
ILOAD = 200 mA to 0 mA
Hysteresis for IOUT,RECT-EN (fullsynchronous mode enabled)
ILOAD = 0 mA to 200 mA
25
High-side diode drop when the rectifier is in IAC-VRECT = 250 mA and
half-synchronous mode
TJ = 25°C
0.7
mA
V
EN1 AND EN2
VIL
Input low threshold for EN1 and EN2
VIH
Input high threshold for EN1 and EN2
RPD
EN1 and EN2 pull down resistance
0.4
1.3
V
V
200
kΩ
ADC (WPC RELATED MEASUREMENTS AND COEFFICIENTS)
IOUT SENSE
Accuracy of the current sense over the
load range
IOUT = 0 mA to 750 mA
–1.5%
0%
0.9%
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7.6 Typical Characteristics
90.0
9.00
80.0
8.00
70.0
7.00
6.00
Vrect (V)
%Efficiency
60.0
50.0
40.0
5.00
4.00
30.0
3.00
20.0
2.00
10.0
1.00
0.0
0.0
200.0
400.0
600.0
800.0
1000.0
0.00
0.0
200.0
400.0
600.0
800.0
1000.0
Load Current (mA)
Load Current (mA)
Figure 2. VRECT vs Load Current
Figure 1. System Efficiency from DC Input to DC Output
6.986
6.985
6.984
Vout (V)
6.983
6.982
6.981
6.980
6.979
6.978
6.977
0.0
200.0
400.0
600.0
800.0
1000.0
Load Current (mA)
8
Figure 3. Load Current Sweep (I-V Curve)
Figure 4. 720-mA Load Step Full System Response
Figure 5. 720-mA Load Dump Full System Response
Figure 6. Typical Start-Up With a 720-mA System Load
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Typical Characteristics (continued)
Figure 8. TS Fault GND
Figure 7. TS Fault
80
9.5
Falling
60
Efficiency (%)
VRECT (V)
70
Rising
9.0
8.5
8.0
50
40
30
20
7.5
Ÿ
10
Ÿ
7.0
0
0
200
400
600
800
Iout (mA)
1
2
3
4
Power (W)
C001
Figure 9. Impact of Load Current on Rectifier Voltage
5
C002
Figure 10. Light Load System Efficiency Improvement Due
to Dynamic Efficiency Scaling Feature
9.5
Ÿ
Ÿ
VRECT (V)
9.0
8.5
8.0
7.5
7.0
0
200
400
600
Iout (mA)
800
C003
Figure 11. Impact of Maximum Current Setting on Rectifier Voltage
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8 Detailed Description
8.1 Overview
The principle of the bq51010B wireless power transfer devices are simply to provide an open-cored transformer
consisting of transmitter and receiver coils. The transmitter coil and electronics are built into a charger pad, and
the receiver coil and electronics are typically built into a portable device such as a cell phone. When the receiver
coil is positioned on the transmitter coil, magnetic coupling occurs when the transmitter coil is driven. The flux is
coupled into the secondary coil, which induces a voltage and current flows. The secondary voltage is rectified,
and power can be transferred effectively to a load wirelessly. Power transfer can be managed through any of the
various closed-loop control schemes.
8.1.1 A Brief Description of the Wireless System
A wireless system consists of a charging pad (transmitter or primary) and the secondary-side equipment
(receiver or secondary). There is a coil in the charging pad and in the secondary equipment which are
magnetically coupled to each other when the secondary is placed on the primary. Power is then transferred from
the transmitter to the receiver through coupled inductors (for example, an air-core transformer). Controlling the
amount of power transferred is achieved by sending feedback (error signal) communication to the primary (for
example, to increase or decrease power).
The receiver communicates with the transmitter by changing the load seen by the transmitter. This load variation
results in a change in the transmitter coil current, which is measured and interpreted by a processor in the
charging pad. Communication is done through digital-packets which are transferred from the receiver to the
transmitter. Differential biphase encoding is used for the packets. The bit rate is 2-kbps.
Various types of communication packets have been defined. These include identification and authentication
packets, error packets, control packets, end power packets, and power usage packets.
The transmitter coil stays powered off most of the time. It occasionally wakes up to see if a receiver is present.
When a receiver authenticates itself to the transmitter, the transmitter remains powered on. The receiver
maintains full control over the power transfer using communication packets.
Power
AC to DC
Drivers
bq5101x
Rectification
Voltage
Conditioning
Load
Communication
Controller
V/I
Sense
Controller
bq500210
Transmitter
Receiver
Figure 12. WPC Wireless Power System Indicating the Functional Integration of the bq51010B
10
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8.2 Functional Block Diagram
M1
RECT
OUT
VOUT,FB
+
_
+
_
VREF,ILIM
VILIM
VOUT,REG
VREF,IABS
VIABS,FB
+
_
VIN,FB
VIN,DPM
+
_
ILIM
AD
+
_
VREFAD,OVP
BOOT2
+
_
BOOT1
VREFAD,UVLO
/AD-EN
AC1
AC2
Sync
Rectifier
Control
VREF,TS-BIAS
COMM1
COMM2
DATA_
OUT
CLAMP1
ADC
CLAMP2
TS_COLD
VBG,REF
VIN,FB
VOUT,FB
VILIM
VIABS,FB
VIABS,REF
VIC,TEMP
Digital Control
VFOD
+
_
TS_HOT
FOD
+
_
+
_
TS-CTRL
TS_DETECT
+
_
VREF_100MV
VFOD
50 uA
+
_
/WPG
ILIM
EN1
200k
VRECT
VOVP,REF
+
_
OVP
EN2
200k
PGND
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8.3 Feature Description
8.3.1 Qi Wireless Power System and bq51010B Power Transfer Flow Diagrams
The bq51010B family integrates a fully compliant WPC v1.1 communication algorithm to streamline receiver
designs (no extra software development required). Other unique algorithms such has Dynamic Rectifier Control
are also integrated to provide best-in-class system performance. This section provides a high-level overview of
these features by illustrating the wireless power transfer flow diagram from start-up to active operation.
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Feature Description (continued)
During start-up operation, the wireless power receiver must comply with proper handshaking to be granted a
power contract from the TX. The TX initiates the hand shake by providing an extended digital ping. If an RX is
present on the TX surface, the RX then provides the signal strength, configuration, and identification packets to
the TX (see volume 1 of the WPC specification for details on each packet). These are the first three packets sent
to the TX. The only exception is if there is a true shutdown condition on the EN1 or EN2, the AD, or the TSCTRL pins where the RX shuts down the TX immediately (see Table 5 for details). Once the TX has successfully
received the signal strength, configuration, and identification packets, the RX is granted a power contract and is
then allowed to control the operating point of the power transfer. With the use of the Dynamic Rectifier Control
algorithm, the RX informs the TX to adjust the rectifier voltage above 9 V prior to enabling the output supply. This
method enhances the transient performance during system start-up (see Figure 13 for the start-up flow diagram
details).
Tx Powered
without Rx
Active
Tx Extended Digital Ping
EN1/EN2/AD/TS-CTRL
EPT Condition?
Yes
Send EPT packet with
reason value
No
Identification and
Configuration and SS,
Received by Tx?
No
Yes
Power Contract
Established. All
proceeding control is
dictated by the Rx.
Yes
VRECT < 9.08V?
Send control error packet
to increase VRECT
No
Startup operating point
established. Enable the
Rx output.
Rx Active
Power Transfer
Stage
Figure 13. Wireless Power Start-Up Flow Diagram
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Feature Description (continued)
Once the start-up procedure has been established, the RX enters the active power transfer stage. This is
considered the main loop of operation. The Dynamic Rectifier Control algorithm determines the rectifier voltage
target based on a percentage of the maximum output current level setting (set by KIMAX and the ILIM resistance
to GND). The RX sends control error packets to converge on these targets. As the output current changes, the
rectifier voltage target dynamically changes. As a note, the feedback loop of the WPC system is relatively slow
where it can take up to 90 ms to converge on a new rectifier voltage target. It must be understood that the
instantaneous transient response of the system is open loop and dependent on the RX coil output impedance at
that operating point. The main loop also determines if any conditions in Table 5 are true to discontinue power
transfer. See Figure 14 which illustrates the active power transfer loop.
Rx Active
Power Transfer
Stage
Rx Shutdown
conditions per the EPT
Table?
Yes
Tx Powered
without Rx
Active
Send EPT packet with
reason value
No
Yes VRECT target = 9.08V. Send
IOUT < 10% of IMAX?
control error packets to
converge.
No
Yes
VRECT target = 8.28V
Send control error packets
to converge.
Yes
VRECT target = 7.53V
Send control error packets
to converge.
IOUT < 20% of IMAX?
No
IOUT < 40% of IMAX?
No
VRECT target = 7.11V
Send control error packets
to converge.
Measure Rectified Power
and Send Value to Tx
Figure 14. Active Power Transfer Flow Diagram
Another requirement of the WPC v1.1 specification is to send the measured recieved power. This task is enabled
on the IC by measuring the voltage on the FOD pin which is proportional to the output current and can be scaled
based on the choice of the resitor to ground on the FOD pin.
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Feature Description (continued)
8.3.2 Dynamic Rectifier Control
The dynamic rectifier control algorithm offers the end system designer optimal transient response for a given max
output current setting. This is achieved by providing enough voltage headroom across the internal regulator at
light loads to maintain regulation during a load transient. The WPC system has a relatively slow global feedback
loop where it can take more than 90 ms to converge on a new rectifier voltage target. Therefore, the transient
response is dependent on the loosely coupled transformers output impedance profile. The dynamic rectifier
control allows for a 2-V change in rectified voltage before the transient response is observed at the output of the
internal regulator (output of the bq51010B). A 720-mA application allows up to a 1.5-Ω output impedance.
8.3.3 Dynamic Efficiency Scaling
The dynamic efficiency scaling feature allows for the loss characteristics of the bq51010B to be scaled based on
the maximum expected output power in the end application. This effectively optimizes the efficiency for each
application. This feature is achieved by scaling the loss of the internal LDO based on a percentage of the
maximum output current. Note that the maximum output current is set by the KIMAX term and the RILIM resistance
(where RILIM = KIMAX / IMAX). The flow diagram show in Figure 14 illustrates how the rectifier is dynamically
controlled (Dynamic Rectifier Control) based on a fixed percentage of the IMAX setting. Table 2 summarizes how
the rectifier behavior is dynamically adjusted based on two different RILIM settings.
Table 2. Dynamic Efficiency Scaling
OUTPUT CURRENT
PERCENTAGE
RILIM = 890 Ω
IMAX = 0.35 A
RILIM = 417 Ω
IMAX = 0.75 A
VRECT
0% to 10%
0 A to 0.035 A
0 A to 0.075 A
9.08 V
10% to 20%
0.035 A to 0.07 A
0.075 A to 0.150 A
8.28 V
20% to 40%
0.07 A to 0.14 A
0.150 A to 0.225 A
7.53 V
>40%
>0.14 A
>0.225 A
7.11 V
8.3.4 RILIM Calculations
The bq51010B includes a means of providing hardware overcurrent protection by means of an analog current
regulation loop. The hardware current limit provides an extra level of safety by clamping the maximum allowable
output current (for example, a current compliance). The RILIM resistor size also sets the thresholds for the
dynamic rectifier levels and thus providing efficiency tuning per the maximum system current of each application.
Calculate the total RILIM resistance with Equation 1.
R ILIM = 262
IMAX
IILIM = 1.2 ´ IMAX = 314
R ILIM
R ILIM = R1 + R FOD
where
•
•
IMAX is the expected maximum output current during normal operation
IILIM is the hardware over current limit
(1)
When referring to the application diagram shown in Figure 27, RILIM is the sum of RFOD and the R1 resistance (for
example, the total resistance from the ILIM pin to GND).
8.3.5 Input Overvoltage
If the input voltage suddenly increases in potential (for example, due to a change in position of the equipment on
the charging pad), the voltage-control loop inside the bq51010B becomes active, and prevents the output from
going beyond VOUT-REG. The receiver then starts sending back error packets to the transmitter every 30 ms until
the input voltage comes back to the VRECT-REG target, and then maintains the error communication every 250 ms.
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If the input voltage increases in potential beyond VOVP, the IC switches off the LDO and communicates to the
primary to bring the voltage back to VRECT-REG. In addition, a proprietary voltage protection circuit is activated by
means of CCLAMP1 and CCLAMP2 that protects the IC from voltages beyond the maximum rating of the IC (for
example, 20 V).
8.3.6 Adapter Enable Functionality and EN1 or EN2 Control
Figure 32 is an example application that shows the bq51010B used as a wireless power receiver that can power
multiplex between wired or wireless power for the down-system electronics. In the default operating mode pins
EN1 and EN2 are low, which activates the adapter enable functionality. In this mode, if an adapter is not present
the AD pin is low, and AD-EN pin is pulled to the higher of the OUT and AD pins so that the PMOS between
OUT and AD is turned off. If an adapter is plugged in and the voltage at the AD pin goes above 3.6 V then
wireless charging is disabled and the AD-EN pin is pulled approximately 4 V below the AD pin to connect AD to
the secondary charger. The difference between AD and AD-EN is regulated to a maximum of 7V to ensure the
VGS of the external PMOS is protected.
The EN1 and EN2 pins include internal 200-kΩ pulldown resistors, so that if these pins are not connected
bq51010B defaults to AD-EN control mode. However, these pins can be pulled high to enable other operating
modes as described in Table 3.
Table 3. EN/EN2 Control
EN1
EN2
RESULT
0
0
Adapter control enabled. If adapter is present then secondary charger is powered by adapter, otherwise wireless
charging is enabled when wireless power is available. Communication current limit is enabled.
0
1
Disables communication current limit.
1
0
AD-EN is pulled low, whether or not adapter voltage is present. This feature can be used, for example, in USB OTG
applications.
1
1
Adapter and wireless charging are disabled, that is, power is never delivered by the OUT pin in this mode.
Table 4. Adapter Enable Functionality
EN1
(1)
(2)
EN2
WIRELESS
POWER
WIRED POWER
OTG MODE
ADAPTIVE COMMUNICATION
LIMIT
EPT
(1)
Disabled
Enabled
Not Sent to TX
Disabled
Disabled
Not Sent to TX
—
No Response
—
Termination
0
0
Enabled
Priority
0
1
Priority (1)
Enabled
1
0
Disabled
Enabled
1
1
Disabled
Disabled
Enabled
(2)
Disabled
If both wired and wireless power are present, wired power is given priority.
Allows for a boost-back supply to be driven from the output terminal of the RX to the adapter port through the external back-to-back
PMOS FET.
As described in Table 4, pulling EN2 high disables the adapter mode and only allows wireless charging. In this
mode the adapter voltage is always blocked from the OUT pin. An application example where this mode is useful
is when USB power is present at AD, but the USB is in suspend mode so that no power can be taken from the
USB supply. Pulling EN1 high enables the off-chip PMOS regardless of the presence of a voltage. This function
can be used in USB OTG mode to allow a charger connected to the OUT pin to power the AD pin. Finally, pulling
both EN1 and EN2 high disables both wired and wireless charging.
NOTE
It is required to connect a back-to-back PMOS between AD and OUT so that voltage is
blocked in both directions. Also, when AD mode is enabled no load can be pulled from the
RECT pin as this could cause an internal device overvoltage in bq51010B.
8.3.7 End Power Transfer Packet (WPC Header 0x02)
The WPC allows for a special command for the receiver to terminate power transfer from the transmitter termed
End Power Transfer (EPT) packet. Table 5 specifies the v1.1 reasons column and their corresponding data field
value. The condition column corresponds to the methodology used by bq51010B to send equivalent message.
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Table 5. End Power Transfer Packet
MESSAGE
VALUE
CONDITION
Unknown
0x00
AD > 3.6 V
Charge Complete
0x01
TS/CTRL = 1, or EN1 = 1, or =
Internal Fault
0x02
TJ > 150°C or RILIM < 100 Ω
Over Temperature
0x03
TS < VHOT, TS > VCOLD, or TS/CTRL < 100 mV
Over Voltage
0x04
Not Sent
Over Current
0x05
NOT USED
Battery Failure
0x06
Not Sent
Reconfigure
0x07
Not Sent
No Response
0x08
VRECT target doesn't converge
8.3.8 Status Outputs
The bq51010B has one status output, WPG. This output is an open-drain NMOS device that is rated to 20 V.
The open-drain FET connected to the WPG pin is turned on whenever the output of the power supply is enabled.
The output of the power supply is not enabled if the VRECT-REG does not converge at the no-load target voltage.
8.3.9 WPC Communication Scheme
The WPC communication uses a modulation technique termed back-scatter modulation where the receiver coil is
dynamically loaded to provide amplitude modulation of the coil voltage and current of the transmitter. This
scheme is possible due to the fundamental behavior between two loosely coupled inductors (for example,
between the TX and RX coil). This type of modulation can be accomplished by switching in and out a resistor at
the output of the rectifier, or by switching in and out a capacitor across the AC1/AC2 net. Figure 15 shows how to
implement resistive modulation.
CRES1
AC1
VRECT
R MOD
COIL
C RES2
AC2
GND
Figure 15. Resistive Modulation
Figure 16 shows how to implement capacitive modulation.
CRES1
AC1
VRECT
C MOD
COIL
C RES2
AC2
GND
Figure 16. Capacitive Modulation
The amplitude change in TX coil voltage or current can be detected by the transmitters decoder. Figure 17
shows the resulting signal observed by the TX.
16
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Power
AC to DC
bq5101x
Drivers
Rectification
Voltage
Conditioning
Communication
Controller
V/I
Sense
Controller
bq500210
Transmitter
0
Receiver
1
0
1
0
TX COIL VOLTAGE / CURRENT
Figure 17. TX Coil Voltage and Current
The WPC protocol uses a differential biphase encoding scheme to modulate the data bits onto the TX coil
voltage and current. Each data bit is aligned at a full period of 0.5 ms (tCLK) or 2 kHz. An encoded ONE results in
two transitions during the bit period and an encoded ZERO results in a single transition. See Figure 18 for an
example of the differential biphase encoding.
Figure 18. Differential Biphase Encoding Scheme (WPC volume 1: Low Power, Part 1 Interface Definition)
The bits are sent LSB first and use an 11-bit asynchronous serial format for each portion of the packet. This
includes one start bit, n-data bytes, a parity bit, and a single stop bit. The start bit is always ZERO and the parity
bit is odd. The stop bit is always ONE. Figure 19 shows the details of the asynchronous serial format.
Figure 19. Asynchronous Serial Formatting (WPC volume 1: Low Power, Part 1 Interface Definition)
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Each packet format is organized as shown in Figure 20.
Preamble
Header
Message
Checksum
Figure 20. Packet Format (WPC volume 1: Low Power, Part 1 Interface Definition)
8.3.10 Communication Modulator
The bq51010B provides two identical, integrated communication FETs which are connected to the pins COM1
and COM2. These FETs are used for modulating the secondary load current which allows bq51010B to
communicate error control and configuration information to the transmitter. Figure 21 below shows how the
COMM pins can be used for resistive load modulation. Each COMM pin can handle at most a 24-Ω
communication resistor. Therefore, if a COMM resistor between 12 Ω and 24 Ω is required COM1 and COM2
pins must be connected in parallel. bq51010B does not support a COMM resistor less than 12 Ω.
RECTIFIER
24W
24W
COMM1
COMM2
COMM_DRIVE
Figure 21. Resistive Load Modulation
In addition to resistive load modulation, the bq51010B is also capable of capacitive load modulation as shown in
Figure 22 below. In this case, a capacitor is connected from COM1 to AC1 and from COM2 to AC2. When the
COMM switches are closed there is effectively a 22-nF capacitor connected between AC1 and AC2. Connecting
a capacitor in between AC1 and AC2 modulates the impedance seen by the coil, which is reflected in the primary
as a change in current.
18
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Figure 22. Capacitive Load Modulation
8.3.11 Adaptive Communication Limit
The Qi communication channel is established through backscatter modulation as described in the previous
sections. This type of modulation takes advantage of the loosely coupled inductor relationship between the RX
and TX coil. Essentially the switching in-and-out of the communication capacitor or resistor adds a transient load
to the RX coil to modulate the TX coil voltage or current waveform (amplitude modulation). The consequence of
this technique is that a load transient (load current noise) from the mobile device has the same signature. To
provide noise immunity to the communication channel, the output load transients must be isolated from the RX
coil. The proprietary feature adaptive communication limit achieves this by dynamically adjusting the current limit
of the regulator. When the regulator is put in current limit, any load transients is offloaded to the battery in the
system.
Note that this requires the battery charger IC to have input voltage regulation (weak adapter mode). The output
of the RX appears as a weak supply if a transient occurs above the current limit of the regulator.
The adaptive communication limit feature has two current limit modes listed in Table 6.
Table 6. Adaptive Communication Limit
IOUT
COMMUNICATION CURRENT LIMIT
< 300 mA
Fixed 400 mA
> 300 mA
IOUT + 50 mA
8.3.12 Synchronous Rectification
The bq51010B provides an integrated, self-driven synchronous rectifier that enables high-efficiency AC to DC
power conversion. The rectifier consists of an all NMOS H-Bridge driver where the backgates of the diodes are
configured to be the rectifier when the synchronous rectifier is disabled. During the initial start-up of the WPC
system the synchronous rectifier is not enabled. At this operating point, the DC rectifier voltage is provided by the
diode rectifier. Once VRECT is greater than UVLO, half-synchronous mode is enabled until the load current
surpasses 120 mA. Above 120 mA, the full synchronous rectifier stays enabled until the load current drops back
below 100 mA where half-synchronous mode is enabled instead.
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8.3.13 Temperature Sense Resistor Network (TS)
bq51010B includes a ratiometric external temperature sense function. The temperature sense function has two
ratiometric thresholds which represent a hot and cold condition. TI recommends an external temperature sensor
to provide safe operating conditions for the receiver product. This pin is best used for monitoring the surface that
can be exposed to the end user (for example, place the NTC resistor closest to the user).
Figure 23 allows for any NTC resistor to be used with the given VHOT and VCOLD thresholds.
VTSB (2.2V)
20kΩ
R2
TS-CTRL
R1
R3
NTC
Figure 23. NTC Circuit Used for Safe Operation of the Wireless Receiver Power Supply
The resistors R1 and R3 can be solved by resolving the system of equations at the desired temperature
thresholds (see Equation 2 and Equation 3).
(
(
)
)
æ R R
+ R1 ö÷
ç
3
NTC TCOLD
ç
÷
+ R1 ÷
ç R 3 + R NTC
TCOLD
è
ø ´100
%VCOLD =
æ R R
ö
R
+
ç
3
NTC TCOLD
1 ÷
ç
÷ + R2
+ R1 ÷
ç R 3 + R NTC
TCOLD
è
ø
)
)
æ R R
+ R1 ) ö÷
ç
3 ( NTC THOT
ç
÷
+ R1 )÷
ç R 3 + (R NTC
THOT
è
ø ´100
%VHOT =
æ R R
ö
R
+
ç
3 ( NTC THOT
1) ÷
ç
÷ + R2
+ R1 )÷
ç R 3 + (R NTC
THOT
è
ø
(
(
R NTC
TCOLD
R NTC
THOT
(2)
bæçç 1TCOLD-1To ö÷÷
ø
= R oe è
bæçç 1
-1 ö÷÷
= R oe è THOT To ø
where
•
•
•
•
20
TCOLD and THOT are the desired temperature thresholds in degrees Kelvin
RO is the nominal resistance
β is the temperature coefficient of the NTC resistor
RO is fixed at 20 kΩ
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An example solution is provided:
• R1 = 4.23 kΩ
• R3 = 66.8 kΩ
Where the chosen parameters are:
• %VHOT = 19.6%
• %VCOLD = 58.7%
• TCOLD = –10°C
• THOT = 100°C
• β = 3380
• RO = 10 kΩ
Figure 24 shows the plot of the percent VTSB vs temperature.
Figure 24. Example Solution for an NTC resistor with RO = 10 kΩ and β = 4500
Figure 25 illustrates the periodic biasing scheme used for measuring the TS state. The TS_READ signal enables
the TS bias voltage for 24 ms. During this period the TS comparators are read (each comparator has a 10 ms
deglitch) and appropriate action is taken based on the temperature measurement. After this 24 ms period has
elapsed, the TS_READ signal goes low, which causes the TS-Bias pin to become high impedance. During the
next 35 ms (priority packet period) or 235 ms (standard packet period), the TS voltage is monitored and
compared to 100 mV. If the TS voltage is greater than 100 mV then a secondary device is driving the TS or
CTRL pin and a CTRL = 1 is detected.
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Figure 25. Timing Diagram for TS Detection Circuit
8.3.14 3-State Driver Recommendations For the TS-CTRL Pin
The TS-CTRL pin offers three functions with one 3-state driver interface:
1. NTC temperature monitoring,
2. Fault indication,
3. Charge done indication
A 3-state driver can be implemented with the circuit in Figure 26 and the use of two GPIO connections.
BATT
M3
TERM
TS-CTRL
FAULT
M4
Figure 26. 3-state Driver for TS-CTRL
Note that the signals TERM and FAULT are given by two GPIOs. The truth table for this circuit is found in
Table 7.
Table 7. Truth Table
TERM
FAULT
F (RESULT)
1
0
Z (Normal mode)
0
0
Charge complete
1
1
System fault
The default setting is TERM = 1 and FAULT = 0. In this condition, the TS-CTRL net is high impedance (hi-z);
therefore, the NTC is function is allowed to operate. When the TS-CTRL pin is pulled to GND by setting
FAULT = 1, the RX is shutdown with the indication of a fault. When the TS-CTRL pin is pulled to the battery by
setting TERM = 1, the RX is shutdown with the indication of a charge complete condition. Therefore, the host
controller can indicate whether the RX is system is turning off due to a fault or due to a charge complete
condition.
22
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8.3.15 Thermal Protection
The bq51010B includes a thermal shutdown protection. If the die temperature reaches TJ(OFF), the LDO is shut
off to prevent any further power dissipation. In this case bq51010B sends an EPT message of internal fault
(0x02).
8.3.16 WPC 1.1 Compliance – Foreign Object Detection
The bq51010B is a WPC 1.1 compatible device. To enable a power transmitter to monitor the power loss across
the interface as one of the possible methods to limit the temperature rise of foreign objects, the bq51010B
reports its received power to the power transmitter. The received power equals the power that is available from
the output of the power receiver plus any power that is lost in producing that output power (the power loss in the
secondary coil and series resonant capacitor, the power loss in the shielding of the power receiver, the power
loss in the rectifier). In WPC1.1 specification, foreign object detection (FOD) is enforced. This means the
bq51010B sends received power information with known accuracy to the transmitter.
WPC 1.1 defines received power as “the average amount of power that the power receiver receives through its
interface surface, in the time window indicated in the configuration packet".
To receive certification as a WPC 1.1 receiver, the Device Under Test (DUT) is tested on a reference transmitter
whose transmitted power is calibrated, the receiver must send a received power such that Equation 4.
0 < (TX PWR)REF – (RX PWR out)DUT < –250 mW
(4)
This 250-mW bias ensures that system remains interoperable.
WPC 1.1 transmitter is tested to see if they can detect reference foreign objects with a reference receiver.
WPC 1.1 specification allows much more accurate sensing of foreign objects.
8.4 Device Functional Modes
The operational modes of the bq51010B are described in Feature Description. The bq51010B has several
functional modes. Start-up refers to the initial power transfer and communication between the receiver
(bq51010B circuit) and the transmitter. Power transfer refers to any time that the TX and RX are communicating
and power is being delivered from the TX to the RX. Power transfer termination occurs when the RX is removed
from the TX, power is removed from the TX or the RX requests power transfer termination.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The bq51010B is a fully integrated, wireless power receiver in a single device. The device complies with the
WPC v1.1 specifications for a wireless power receiver. When paired with a WPC v1.1 compliant transmitter, the
device can provide up to 5-W of power. There are several tools available for the design of the system. These
tools may be obtained by checking the product page at www.ti.com/product/bq51010B.
9.2 Typical Applications
9.2.1 bq51010B Wireless Power Receiver Used as a Power Supply
System
Load
/AD-EN
AD
OUT
CCOMM1
C4
COMM1
CBOOT1
ROS1
BOOT1
C1
AC1
C3
bq5101xB
COIL
D1
ROS2
RECT
R4
HOST
C2
TS-CTRL
AC2
NTC
BOOT2
CBOOT2
COMM2
/WPG
CCOMM2
CCLAMP2
CCLAMP1
Tri-State
CLAMP2
EN1 / TERM
Bi-State
CLAMP1
EN2
Bi-State
ILIM
R1
FOD
PGND
RFOD
Copyright © 2016, Texas Instruments Incorporated
Only one of ROS1 or ROS2 required
Figure 27. bq51010B Used as a Wireless Power Receiver and Power Supply for System Loads
9.2.1.1 Design Requirements
This application is for a system that has varying loads from less than 100 mA up to 1 A. The application must
work with any Qi-certified transmitter. There is no requirement for any external thermal measurements. An LED
indication is required to indicate an active power supply. Each of the components from the application drawing is
examined.
9.2.1.2 Detailed Design Procedure
9.2.1.2.1 Using the bq51010B as a Wireless Power Supply
Figure 27 is the schematic of a system which uses the bq51010B as a power supply.
When the system shown in Figure 27 is placed on the charging pad, the receiver coil is inductively coupled to the
magnetic flux generated by the coil in the charging pad, which consequently induces a voltage in the receiver
coil. The internal synchronous rectifier feeds this voltage to the RECT pin, which has the filter capacitor C3.
24
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Typical Applications (continued)
The bq51010B identifies and authenticates itself to the primary using the COMM pins by switching on and off the
COMM FETs and hence switching in and out CCOMM. If the authentication is successful, the transmitter remains
powered on. The bq51010B measures the voltage at the RECT pin, calculates the difference between the actual
voltage and the desired voltage VRECT-REG, (threshold 1 at no load) and sends back error packets to the primary.
Dynamic VRECT thresholds are shown in Electrical Characteristics. This process goes on until the input voltage
settles at VRECT-REG. During a load transient, the dynamic rectifier algorithm sets the targets specified by VRECTREG thresholds 1, 2, 3, and 4. This algorithm is termed dynamic rectifier control and is used to enhance the
transient response of the power supply.
During power up, the LDO is held off until the VRECT-REG threshold 1 converges. The voltage control loop ensures
that the output voltage is maintained at VOUT-REG to power the system. The bq51010B meanwhile continues to
monitor the input voltage and maintains sending error packets to the primary every 250 ms. If a large overshoot
occurs, the feedback to the primary speeds up to every 32 ms to converge on an operating point in less time.
9.2.1.2.2 Series and Parallel Resonant Capacitor Selection
Shown in Figure 27, the capacitors C1 (series) and C2 (parallel) make up the dual resonant circuit with the
receiver coil. These two capacitors must be sized correctly per the WPC v1.1 specification. Figure 28 illustrates
the equivalent circuit of the dual resonant circuit.
C1
Ls’
C2
Figure 28. Dual Resonant Circuit With the Receiver Coil
Section 4.2 (Power Receiver Design Requirements) in Part 1 of the WPC v1.1 specification highlights in detail
the sizing requirements. To summarize, the receiver designer is required take inductance measurements with a
fixed test fixture. Figure 29 shows the test fixture.
Interface
Surface
Magnetic
Attractor
(example)
Secondary Coil
Shielding (optional)
Mobile
Device
Spacer
dz
Primary Shielding
Figure 29. WPC v1.1 Receiver Coil Test Fixture for the Inductance Measurement Ls’ (Copied from
System Description Wireless Power Transfer, Volume 1: Low Power, Part 1 Interface Definition,
Version 1.1)
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Typical Applications (continued)
The primary shield is to be 50 mm × 50 mm × 1 mm of Ferrite material PC44 from TDK Corp. The gap dZ is to be
3.4 mm. The receiver coil, as it is placed in the final system (for example, the back cover and battery must be
included if the system calls for this), is to be placed on top of this surface and the inductance is to be measured
at 1-V RMS and a frequency of 100 kHz. This measurement is termed Ls’. The same measurement is to be
repeated without the test fixture shown in Figure 8. This measurement is termed Ls or the free-space inductance.
Each capacitor can then be calculated using Equation 5.
-1
2
é
ù
C1 = ê fS ´ 2p ´ L'S ú
ë
û
-1
é
2
1ù
C2 = ê fD ´ 2p ´ LS ú
C1 ûú
ëê
(
)
(
)
where
•
•
fS is 100 kHz +5/-10%
fD is 1 MHz ±10%
(5)
C1 must be chosen first prior to calculating C2.
The quality factor must be greater than 77 and can be determined by Equation 6.
2p× f × LS
D
Q=
R
where
•
R is the DC resistance of the receiver coil
(6)
All other constants are defined above.
9.2.1.2.3 COMM, CLAMP, and BOOT Capacitors
For most applications, the COMM, CLAMP, and BOOT capacitance values is chosen to match the bq51010B.
The BOOT capacitors are used to allow the internal rectifier FETs to turn on and off properly. These capacitors
are from AC1 to BOOT1 and from AC2 to BOOT2 and must have a minimum 25-V rating. A 10-nF capacitor with
a 25-V rating is chosen.
The CLAMP capacitors are used to aid in the clamping process to protect against overvoltage. These capacitors
are from AC1 to CLAMP1 and from AC2 to CLAMP2 and must have a minimum 25-V rating. A 0.47-µF capacitor
with a 25-V rating is chosen.
The COMM capacitors are used to facilitate the communication from the RX to the TX. This selection can vary a
bit more than the BOOT and CLAMP capacitors. In general, TI recommends a 22-nF capacitor. Based on the
results of testing of the communication robustness in the final solution, a change to a 47-nF capacitor may be in
order. The larger the capacitor the larger the deviation is on the coil which sends a stronger signal to the TX.
This also decreases the efficiency somewhat. In this case, a 22-nF capacitor with a 25-V rating is chosen.
9.2.1.2.4 Control Pins and WPG
This section discusses the pins that control the functions of the bq51010B (AD, AD_EN, EN1, EN2, and TS or
CTRL).
This solution uses wireless power exclusively. The AD pin is tied low to disable wired power interaction. The
output pin AD_EN is left floating.
EN1 and EN2 are tied to the system controller GPIO pins. This allows the system to control the wireless power
transfer. Normal operation leaves EN1 and EN2 low or floating (GPIO low or high impedance). EN1 and EN2
have internal pulldown resistors. With both EN1 and EN2 low, wireless power is enabled and power can be
transferred whenever the RX is on a suitable TX. The RX system controller can terminate power transfer and
send an EPT 0x01 (Charge Complete) by setting EN1=EN2=1. The TX terminates power when the EPT 0x01 is
received. The TX continues to test for power transfer, but not engage until the RX requests power. For example,
if the TX is the bq500212A, the TX sends digital pings approximately once per 5 seconds. During each ping, the
26
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Typical Applications (continued)
bq51010B resends the EPT 0x01. Between the pings, the bq500212A goes into low power sleep mode reducing
power consumption. When the RX system controller determines it is time to resume power transfer (for example,
the battery voltage is below its recharge threshold) the controller simply returns EN1 and EN2 to low (or float)
states. The next ping of the bq500212A powers the bq51010B which now communicates that it is time to transfer
power. The TX and RX communication resumes and power transfer is reinitiated.
The TS or CTRL pin is used as a temperature sensor (with the NTC) and maintain the ability to terminate power
transfer through the system controller. In this case, the GPIO is in high impedance for normal NTC (Temperature
Sense) control.
The WPG pin is used to indicate power transfer. A 2.1-V forward bias LED is used for D1 with a current limiting
1.5-kΩ series resistor. The LED and resistor are tied from OUT to PGND and D1 lights during power transfer.
9.2.1.2.5 Current Limit and FOD
The current limit and foreign object detection functions are related. The current limit is set by R1 + RFOD. RFOD
and Ros are determined by FOD calibration. Default values of 20 kΩ for Ros (to RECT, Ros2. Ros1 is not
populated). 200 Ω for RFOD are used. The final values required to be determined based on the FOD calibration.
The tool for FOD calibration can be found on the bq51010B web folder under Tools & Software. Good practice is
to set the layout with 2 resistors for Ros and 2 for RFOD to allow for precise values once the calibration is
complete.
After setting RFOD, R1 can be calculated based on the desired current limit. The maximum current for this solution
under normal operating conditions (IMAX) is 714 mA. Using Equation 1 to calculate the maximum current yields a
value of 367 Ω for RILIM. With RFOD set to 200 Ω the remaining resistance for R1 is 167 Ω. Choose the closest
standard resistor of 165 Ω. This also sets the hardware current limit to 856 mA to allow for temporary current
surges without system performance concerns.
9.2.1.2.6 RECT and OUT Capacitance
RECT capacitance is used to smooth the AC to DC conversion and to prevent minor current transients from
passing to OUT. For this 714-mA IMAX, select two 10-µF capacitors and one 0.1-µF capacitor. These must be
rated to 16 V.
OUT capacitance is used to reduce any ripple from minor load transients. For this solution, a single 10-µF
capacitor and a single 0.1-µF capacitor are used.
9.2.1.3 Application Curves
Figure 30. Start-Up With 700-mA Load
Figure 31. Load Transitions (0.7 A to 0.1 A to 0.7 A)
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Typical Applications (continued)
9.2.2 Dual Power Path: Wireless Power and DC Input
System
Load
Q1
USB or
AC Adapter
Input
/AD-EN
AD
OUT
CCOMM1
C5
COMM1
C4
BOOT1
ROS2
ROS1
CBOOT1
RECT
C1
AC1
C3
bq5101xB
COIL
D1
R4
C2
TS-CTRL
AC2
NTC
BOOT2
CBOOT2
HOST
COMM2
/WPG
CCOMM2
CCLAMP2
CCLAMP1
Tri-State
CLAMP2
EN1 / TERM
Bi-State
CLAMP1
EN2
Bi-State
ILIM
R1
FOD
PGND
RTERM
(bq51014)
RFOD
Copyright © 2016, Texas Instruments Incorporated
Only one of ROS1 or ROS2 required
Figure 32. bq51010B Used as a Wireless Power Receiver and Power Supply for System Loads With
Adapter Power-Path Multiplexing
9.2.2.1 Design Requirements
This solution adds the ability to disable wireless charging with the AD and AD_EN pins. A DC supply (USB or AC
adapter with DC output) can also be used to power the subsystem. This can occur during wireless power transfer
or without wireless power transfer. The system must allow power transfer without any backflow or damage to the
circuitry.
9.2.2.2 Detailed Design Procedure
The basic components used in Figure 27 are reused here in Figure 32. The additional circuitry needed for source
control will be discussed. Adding a blocking FET while using the bq51010B for control is the only addition to the
circuitry. The AD pin is tied to the DC input as a threshold detector. The AD_EN pin is used to enable or disable
the blocking FET. The blocking FET must be chosen to handle the appropriate current level and the DC voltage
level supplied from the input. In this example, the expectation is that the DC input is 7 V with a maximum current
of 700 mA (same configuration as the wireless power supply). The CSD75207W15 is a good fit because it is a PChannel, –20-V, 3.9-A FET pair in a 1.5-mm2 WCSP.
9.2.2.3 Application Curves
The following scope plots show behavior under different conditions.
Figure 33 shows the transition from wireless power to wired power when power is added to the AD pin. VRECT
drops and there is a short time (IOUT drops to zero) when neither source is providing power. When Q1 is enabled
(through AD_EN) the output current turns back on. Note the RECT voltage after about 500 ms. This is the TX
sending a ping to check to see if power is required. RECT returns to low after the bq51010B informs the TX it
does not required power (without enabling the OUT pin). This timing is based on the TX (bq500212A used here).
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Typical Applications (continued)
Figure 34 shows the transition to wireless power when the AD voltage is removed. Note that after wired power is
removed, the next ping from bq500212A energizes the bq51010B. Once the rectifier voltage is stable the output
turns on.
Figure 35 shows a system placed onto the transmitter with AD already powered. The TX sends a ping which the
RX responds to and informs the TX that no power is required. The ping continues with the timing based on the
TX used.
Figure 36 shows the AD added when the RX is not on a TX. This indicates normal start-up without requirement
of the TX.
CH1: VRECT
CH3: VAD
CH2: VOUT
CH4: IOUT
CH1: VRECT
CH3: VAD
Figure 33. Transition Between Wireless Power and Wired
Power (EN1 = EN2 = LOW)
CH1: VRECT
CH3: VAD
CH2: VOUT
CH4: IOUT
Figure 34. Transition Between Wired Power and Wireless
Power (EN1 = EN2 = LOW)
CH1: VRECT
CH3: VAD
Figure 35. Wireless Power Start-Up With VAD = 5 V
(EN1 = EN2 = LOW)
CH2: VOUT
CH4: IOUT
CH2: VOUT
CH4: IOUT
Figure 36. AD Power Start-Up With No Transmitter
(EN1 = EN2 = LOW)
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Typical Applications (continued)
9.2.3 Wireless and Direct Charging of a Li-Ion Battery at 800 mA
USB VIN
Q1
AC INPUT
IN
SW
PMIDI
1 µF
0.01 µF
10 µF
System
Load
4.7 µF
BOOT
USB INPUT
/AD-EN
VBUS
D+
1 µF
PMIDU
D-
PGND
GND
1 µF
4.7 µF
BGATE
AD
OUT
CCOMM1
CBOOT1
RECT
1 µF
AC1
250 kΩ
BATGDIN
R4
C3
PACK +
bq5101xB
C2
500 kΩ
1 µF
DRV
D1
BOOT1
C1
COIL
GSM
PA
BAT
C4
COMM1
C5
SYS
USB
USB VIN
USB PHY
TEMP
TS
PSEL
TS-CTRL
PACK-
AC2
VDRV
NTC
BOOT2
CBOOT2
VSYS
(1.8 V)
COMM2
/WPG
CCOMM2
CCLAMP2
CCLAMP1
CLAMP2
EN1 / TERM
R1
BATGD
EN2
CLAMP1
ILIM
bq24161
HOST
GPIO1
FOD
PGND
RFOD
STAT
SDA
SDA
SCL
SCL
R2
Figure 37. bq51010B Used as a Wireless Power Supply With Adapter Multiplexing on a Two Input
Charger
9.2.3.1 Design Requirements
The goal of this design is to charge a 3.7-V Li-Ion battery at 800 mA either wirelessly or with a direct USB wired
input. This design will use the bq51010B wireless power supply and the bq24161 single-cell Li-Ion battery
charger. A low resistance path has to be created between the output of bq51010B and the input of bq24161.
9.2.3.2 Detailed Design Procedure
The basic components used in Figure 27 and Figure 32 are reused in Figure 37, as well. The bq51010B OUT pin
is tied to the output of Q1 and directly to the IN pin of the bq24040. No other changes to the bq51010B circuitry
are required. Consult the bq24161 data sheet bq2416xx 2.5A, Dual-Input, Single-Cell Switched-Mode Li-Ion
Battery Charger with Power Path Management and I2C Interface for selecting its correct components.
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10 Power Supply Recommendations
The bq51010B requires a Qi-compatible transmitter as its power source.
11 Layout
11.1 Layout Guidelines
•
•
•
•
•
•
Keep the trace resistance as low as possible on AC1, AC2, and BAT.
Detection and resonant capacitors must be as close to the device as possible.
COMM, CLAMP, and BOOT capacitors must be placed as close to the device as possible.
Via interconnect on PGND net is critical for appropriate signal integrity and proper thermal performance.
High-frequency bypass capacitors must be placed close to RECT and OUT pins.
ILIM and FOD resistors are important signal paths and the loops in those paths to PGND must be minimized.
Signal and sensing traces are the most sensitive to noise; the sensing signal amplitudes are usually
measured in mV, which is comparable to the noise amplitude. Make sure that these traces are not being
interfered by the noisy and power traces. AC1, AC2, BOOT1, BOOT2, COMM1, and COMM2 are the main
source of noise in the board. These traces must be shielded from other components in the board. It is usually
preferred to have a ground copper area placed underneath these traces to provide additional shielding. Also,
make sure they do not interfere with the signal and sensing traces. The PCB must have a ground plane
(return) connected directly to the return of all components through vias (two vias per capacitor for powerstage capacitors, one via per capacitor for small-signal components).
For a 1-A fast charge current application, the current rating for each net is as follows:
• AC1 = AC2 = 1.2 A
• OUT = 1 A
• RECT = 100 mA (RMS)
• COMMx = 300 mA
• CLAMPx = 500 mA
• All others can be rated for 10 mA or less
11.2 Layout Example
CLAMP2
capacitor
BOOT2
TS
/C
AC2
2
M
M
CO
OUT
BOOT2
capacitor
L
TR
ILIM
EN2
PGND
TERM
AC1-AC2 capacitors
AD
/WPG
CLAMP2
capacitor
COMM1
capacitor
OUT
BOOT1
BOOT1
capacitor
AC1 Series capacitors
AC1
COMM1
BAT capacitors
Figure 38. Layout Schematic
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation, see the following:
• Application Note, Test and Troubleshoot a Wireless Power Receiver
• EVM User’s Guide, bq51010BEVM-764 Evaluation Module
• bq2416xx 2.5A, Dual-Input, Single-Cell Switched-Mode Li-Ion Battery Charger with Power Path Management
and I2C Interface
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
BQ51010BYFPR
ACTIVE
DSBGA
YFP
28
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ51010B
BQ51010BYFPT
NRND
DSBGA
YFP
28
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ51010B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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