SCLS477B − APRIL 2003 − REVISED APRIL 2004
D Controlled Baseline
D
D
D
D
D
D
D
D Balanced Propagation Delay and Transition
− One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance of Up
To −55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree†
Buffered Inputs
Typical Propagation Delay 7 ns
at VCC = 5 V, CL = 15 pF, TA = 25°C
Fanout (Over Temperature Range)
− Standard Outputs . . . 10 LSTTL Loads
− Bus Driver Outputs . . . 15 LSTTL Loads
Times
Significant Power Reduction Compared to
LSTTL Logic ICs
2-V to 6-V VCC Operation
High Noise Immunity NIL or NIH = 30% of
VCC at VCC = 5 V
CMOS Input Compatibility, Il ≤ 1 µA at VOL,
VOH
D
D
D
D
M PACKAGE
(TOP VIEW)
1A
1B
1Y
2A
2B
2Y
GND
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4B
4A
4Y
3B
3A
3Y
description/ordering information
The CD74HC08 logic gates utilize silicon-gate CMOS technology to achieve operating speeds similar to LSTTL
gates, with the low power consumption of standard CMOS integrated circuits. All devices can drive 10 LSTTL
loads.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
PACKAGE‡
TA
TOP-SIDE
MARKING
−40°C to 125°C
SOIC − M
Tape and reel
CD74HC08QM96EP
−55°C to 125°C
SOIC − M
Tape and reel
CD74HC08MM96EP§
HC08QEP
HC08MEP
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
§ Product Preview
FUNCTION TABLE
(each gate)
INPUTS
A
B
OUTPUT
Y
H
H
H
L
X
L
X
L
L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
! "#$ ! %#&'" ($)
(#"! " !%$""! %$ *$ $! $+! !#$!
!(( ,-)
(#" %"$!!. ($! $"$!!'- "'#($
$!. '' %$$!)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS477B − APRIL 2003 − REVISED APRIL 2004
logic diagram (positive logic)
A
Y
B
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < −0.5 V or VI > VCC + 0.5 V) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < −0.5 V or VO > VCC + 0.5 V) (see Note 1) . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO > −0.5 or VO < VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180°C/W
Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature (during soldering):
At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max . . . . . . . . . . . . . . . . . . . . . . . 300°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
VCC
Supply voltage
VIH
High-level input voltage
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
VCC = 2 V
VIL
MIN
NOM
MAX
2
5
6
0.5
1.35
V
1.8
Input voltage
0
Output voltage
0
∆t/∆v
Input transition rise/fall time
VCC = 2 V
VCC = 4.5 V
Operating free-air temperature
V
4.2
VI
VO
TA
V
1.5
3.15
VCC = 4.5 V
VCC = 6 V
Low-level input voltage
UNIT
VCC
VCC
V
V
1000
500
VCC = 6 V
Q suffix
−40
125
M suffix
−55
125
ns
400
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS477B − APRIL 2003 − REVISED APRIL 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
IO
(mA)
TEST CONDITIONS
CMOS loads
VOH
VI = VIH or VIL
TTL loads
CMOS loads
VOL
VI = VIH or VIL
TTL loads
II
ICC
VI = VCC or GND
VI = VCC or GND
TA = 25°C
TYP
MAX
VCC
MIN
−0.02
2V
1.9
1.9
−0.02
4.5 V
4.4
4.4
−0.02
6V
5.9
5.9
−4
4.5 V
3.98
3.7
−5.2
6V
5.48
0.02
2V
0.1
0.1
0.02
4.5 V
0.1
0.1
0.02
6V
0.1
0.1
4
4.5 V
0.26
0.4
5.2
6V
0.26
0.4
6V
±0.1
±1
µA
2
40
µA
10
10
pF
0
MIN
MAX
UNIT
V
5.2
6V
Ci
V
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
A or B
TO
(OUTPUT)
CONDITIONS
CL = 50 pF
Y
CL = 15 pF
tt
A or B
Y
VCC
TA = 25°C
TYP
MAX
MIN
MAX
2V
90
135
4.5 V
18
27
6V
15
23
2V
75
110
4.5 V
15
22
6V
13
19
5V
CL = 50 pF
MIN
UNIT
ns
7
ns
operating characteristics, TA = 25°C, VCC = 5V
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per gate (see Note 4)
No load
TYP
37
UNIT
pF
NOTE 4: Cpd is used to determine the dynamic power consumption, per gate.
PD = VCC2 fI (Cpd + CL)
fI = input frequency
CL = output load capacitance
VCC = supply voltage
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCLS477B − APRIL 2003 − REVISED APRIL 2004
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
Test
Point
Input
VCC
50%
50%
0V
CL = 50 pF
(see Note A)
tPLH
In-Phase
Output
LOAD CIRCUIT
50%
10%
tPHL
90%
90%
tr
Input
50%
10%
90%
90%
tr
VCC
50%
10% 0 V
tPHL
Out-of-Phase
Output
90%
tf
VOH
50%
10%
VOL
tf
tPLH
50%
10%
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time, with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CD74HC08QM96EP
ACTIVE
SOIC
D
14
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
HC08QEP
V62/04704-01XE
ACTIVE
SOIC
D
14
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
HC08QEP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of