EMB1499Q
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SNOSCV7B – NOVEMBER 2011 – REVISED SEPTEMBER 2013
EMB1499Q Bidirectional Current DC-DC Controller
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FEATURES
DESCRIPTION
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The EMB1499Q bidirectional current dc/dc controller
IC works in conjunction with the EMB1428 switch
matrix gate driver IC to support TI’s switch matrix
based active cell balancing scheme for a battery
management system. The EMB1499Q provides three
PWM MOSFET gate signals to a bidirectional forward
converter so that its output current, either positive or
negative, is regulated around a user-defined
magnitude. This inductor current is channeled by the
EMB1428 through the switch matrix to the cell that
needs to be charged or discharged. In a typical
scheme, the EMB1499Q-based forward converter
exchanges energy between a single cell and the
battery stack to which it belongs, with a maximum
stack voltage of up to 60 V. The switching frequency
is fixed at 250 kHz. The EMB1499Q senses cell
voltage, inductor current and stack current and
provides protection from abnormal conditions during
balancing.
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60-V Maximum Stack Operating Voltage
Bidirectional Balancing Current
Fully Synchronous Operation
Active Clamp Signal
250-kHz Switching Frequency
Fault Detection Includes Two Separate UVLO
Cells (One for Each External Supply), Primary
and Secondary Side Current Limit, OVP/UVP
Sense on Cell Being Charged, Thermal
Shutdown, and Watchdog Timer
Balancing Current User-selectable Through
External Voltage
EMB1499Q is an Automotive Grade Product
that is AEC-Q100 Grade 1 Qualified (–40°C to
+125°C Operating Junction Temperature)
APPLICATIONS
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Li-Ion Battery Management Systems
Hybrid and Electric Vehicles
Grid Storage
The EMB1499Q also provides an active clamp timing
signal to control an external FET driver for the
primary-side active clamp FET. The EMB1499Q is
enabled and disabled by the EMB1428. Fault
conditions detected by the EMB1499Q are
communicated to the EMB1428 through the DONE
and FAULT pins.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2013, Texas Instruments Incorporated
EMB1499Q
SNOSCV7B – NOVEMBER 2011 – REVISED SEPTEMBER 2013
www.ti.com
Typical Application
Vstack
Vstack
°
7-Cell
HalfStack
EMB1499
®
GATE_LS
GATE_HS2
GATE_HS1 VSENSE_LS
VSENSE_HS
PWM_CLAMP
CELLPLUS
VINA
VINP
VINF
PVINF
MOSFET
DRIVER
+12V
Floating
12V Supply
PGNDF
GNDF
°
¯
VSET
EMB1428
SOURCE[11..0]
GATE[11..0]
VDDCP
EN
DIR
DIR_RT
DONE
FAULT2
FAULT1
FAULT0
DAC
EN
DIR
DIR_RT
DONE
FAULT2
FAULT1
FAULT0
CEXT2
GNDA GNDP
CEXT1
SPI BUS
CS
SD0
SDI
SCLK
VSTACK
VDD12V
VDDP
+12V
+5V
+3.3V
TO OTHER BALANCING CIRCUIT
CPU OR
MCU
VDD5V
FAULT_INT
VDDIO
RST
GNDP GND
Figure 1. Typical Application
Connection Diagram
VSENSE_HS
CELLPLUS
LOR
TM
GNDA
VSET
WDOR
EN
DIR
DIR_RT
DONE
FAULT0
FAULT1
FAULT2
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
EMB1499
(Top View)
21
9
20
10
19
11
18
12
17
13
16
14
15
VINF
GNDF
N/C
GATE_HS2
PGNDF
GATE_HS1
PVINF
VINP
GNDP
GATE_LS
PWM_CLAMP
GNDA
VINA
VSENSE_LS
Figure 2. 28-Pin HTSSOP
See PWP Package
2
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Product Folder Links: EMB1499Q
EMB1499Q
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SNOSCV7B – NOVEMBER 2011 – REVISED SEPTEMBER 2013
PIN DESCRIPTIONS
Pin
Name
1
VSENSE_HS
2
CELLPLUS
3
LOR
Description
Application Information
Secondary side current sense input
Connect to transformer side of secondary sense resistor
Senses the cell voltage, used for
OVP/UVP fault detection
Connect to top of secondary side of the converter. This is the
top of the cell being charged.
Fault latch override input
Grounded for normal operation.
4
TM
Test mode input
Grounded for normal operation.
5, 17
GNDA
IC signal ground
Connect to module ground at board level.
6
VSET
Control voltage for adjusting the
balancing current
This voltage is set by the user.
7
WDOR
Watchdog timer override
Grounded for normal operation.
8
EN
Input from EMB1428, signals charge or
discharge cycle to begin.
Rising edge of this signal clears all fault latches, the DONE
latch, and initiates charge or discharge current. Falling edge of
this signal causes the charge current to ramp down to zero,
then asserts the DONE signal, causing shutdown.
9
DIR
Input from EMB1428, determines the
direction of the converter output current
"High" indicates charge mode, "Low" indicates discharge
mode.
10
DIR_RT
Output to EMB1428, inverted copy of the
DIR signal
Used as a handshake signal to ensure DIR signal has been
received correctly.
11
DONE
Output to EMB1428, indicates that the
balancing current has ramped down
towards zero.
When the EMB1499Q is disabled by toggling the EN pin low,
the chip goes into a 'soft shutdown', ramping the charging
current down within several hundred microseconds. When the
current has ramped down, the EMB1499Q shuts down and the
DONE signal latches high. The DONE latch is cleared at the
next rising edge of the EN signal.
12,13,14
FAULT[0,1,2]
Outputs to EMB1428, three bit digital fault If a fault condition is detected, the proper three bit word is
code
latched into the FAULT pins and the EMB1499Q is shut down.
The FAULT pins are cleared by the rising edge of the EN input.
15
VSENSE_LS
Primary side current sense input
Connect to transformer side of primary sense resistor.
16
VINA
External 12V supply
Powers all internal circuitry besides the primary gate side
driver. VINA and VINP should be connected together at the
board level.
18
PWM_CLAMP
19
GATE_LS
20
GNDP
IC power ground
Provides ground return for primary side gate driver. Connect to
board level ground.
21
VINP
External 12V supply
Powers the primary side gate driver. VINP and VINA should be
connected together at the board level.
22
PVINF
External floating 12V supply
This floating supply must be referenced to the bottom of the
transformer secondary. Supplies power to the secondary side
gate drivers. PVINF and VINF should be connected together at
the board level.
23
GATE_HS1
24
PGNDF
25
GATE_HS2
Output, PWM signal used to control
primary side active clamp (external driver
required)
Output, gate signal for external primary
side power FET
Output, gate signal for external secondary
side power FET
Floating power ground
Connect to secondary side of converter. Provides the ground
return for the secondary side gate drivers.
Output, gate signal for external secondary
side power FET
26
N/C
No connect
No connect pin. Do not connect
27
GNDF
Floating signal ground
Connected to secondary side of converter. Provides ground
reference for all internal circuitry that floats with the transformer
secondary except the secondary side gate drivers.
28
VINF
External floating 12V supply
This floating supply must be referenced to the bottom of the
transformer secondary. Supplies power to all internal circuitry
that floats with the transformer secondary except the
secondary side gate drivers. PVINF and VINF should be
connected together at the board level.
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EMB1499Q
SNOSCV7B – NOVEMBER 2011 – REVISED SEPTEMBER 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1)
VINA, VINP to GND
-0.5V to 15V
VINF, PVINF to GNDF
-0.5V to 15V
GNDF to GND
-0.5V to 60V
VSENSE_LS to GND
-0.5V to 0.5V
VSENSE_HS to GNDF
-0.5V to 0.5V
VSET to GND
-0.5V to 7.5V
CELLPLUS to GNDF
-0.5V to 7.5V
All other inputs to GND
-0.5V to 15V
ESD Rating (2)
Human Body Model
±2kV
Soldering Information
Junction Temperature
150°C
Storage Temperature
-65°C to 150°C
(1)
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/ or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the recommended Operating Ratings is not implied. The recommended Operating Ratings
indicate conditions at which the device is functional and should not be operated beyond such conditions.
The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD22–A114.
OPERATING RATINGS
VINA, VINP to GND
10V to 14V
VINF, PVINF to GNDF
10V to 14V
GNDF to GND
0V to 56V
VSENSE_LS to GND
-0.2V to 0.2V
VSENSE_HS to GNDF
-0.2V to 0.2V
VSET to GND
1V to 2.2V
CELLPLUS to GNDF
0V to 6V
All other inputs to GND
0V to 14V
Junction Temperature (TJ)
-40°C to 125°C
4
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Product Folder Links: EMB1499Q
EMB1499Q
www.ti.com
SNOSCV7B – NOVEMBER 2011 – REVISED SEPTEMBER 2013
ELECTRICAL CHARACTERISTICS
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of −40°C
to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent
the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. For all tests, VINA = VINP =
VINF = PVINF = 12V unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ (1)
Max
Units
VSET = 2V
45
50
55
mV
VSET = 1.2V
24
30
36
mV
220
250
290
kHz
Feedback Voltage
VSENSE_HS
Feedback Voltage
Switching Parameters
FSW
Switching Frequency
DMAX
Maximum Duty Cycle
DMIN
Minimum Duty Cycle
Charge
Direction
91
%
Discharge
Direction
91
%
Charge
Direction
4
%
Discharge
Direction
3
%
Operating Thresholds
UVLO
Under-voltage Lockout
VINA, VINP,
VINF, PVINF
Rising
VINA, VINP,
VINF, PVINF
Falling
VEN_TH
Enable Threshold
VDIR_TH
Direction Threshold
10.8
5
V
EN Rising
EN Falling
1.55
V
0.45
V
DIR Rising
DIR Falling
V
2.75
V
2.2
V
Quiescent Currents
IQ_VINA
VINA Quiescent Current
(Operating)
VSET = 2V,
VSENSE_HS =
0V
2
2.8
mA
VINA Quiescent Current
(Shutdown)
EN = 0V