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LM4941
1.25 Watt Fully Differential Audio Power Amplifier
With RF Suppression and Shutdown
Check for Samples: LM4941, LM4941SDBD, LM4941TMBD
FEATURES
DESCRIPTION
•
The LM4941 is a fully differential audio power
amplifier
primarily
designed
for
demanding
applications in mobile phones and other portable
communication device applications. It is capable of
delivering 1.25 watts of continuous average power to
a 8Ω load with less than 1% distortion (THD+N) from
a 5VDC power supply. The LM4941 does not require
output coupling capacitors or bootstrap capacitors,
and therefore is ideally suited for mobile phone and
other small form factor applications where minimal
PCB space is a primary requirement.
1
2
•
•
•
•
•
•
•
Improved RF Suppression, By Up to 20dB
Over Previous Designs in Selected
Applications
Fully Differential Amplification
Available in Space-Saving DSBGA Package
Ultra Low Current Shutdown Mode
Can Drive Capacitive Loads up to 100pF
Improved Pop & Click Circuitry Eliminates
Noises During Turn-On and Turn-Off
Transitions
2.4 - 5.5V Operation
No Output Coupling Capacitors, Snubber
Networks or Bootstrap Capacitors Required
APPLICATIONS
•
•
•
Mobile Phones
PDAs
Portable Electronic Devices
KEY SPECIFICATIONS
•
•
•
•
Improved PSRR at 217Hz 95dB (typ)
Power Output, VDD = 5.0V, RL = 8Ω, 1% THD+N
1.25W (typ)
Power Output, VDD = 3.0V, RL = 8Ω, 1% THD+N
430mW (typ)
Shutdown Current 0.1µA (typ)
The LM4941 also features proprietary internal
circuitry that suppresses the coupling of RF signals
into the chip. This is important because certain types
of RF signals (such as GSM) can couple into audio
amplifiers in such a way that part of the signal is
heard through the speaker. The RF suppression
circuitry in the LM4941 makes it well-suited for
portable applications in which strong RF signals
generated by an antenna from or a cellular phone or
other portable electronic device may couple audibly
into the amplifier.
Other features include a low-power consumption
shutdown
mode,
internal
thermal
shutdown
protection, and advanced pop & click circuitry.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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Typical Application
VDD
CS
1 PF
RF1
+
20 k:
Ri1
20 k:
-IN
- Differential Input
+
Bias
SHUTDOWN
1.0 PF
+ Differential Input
CB
RL
Common
Mode
8:
-
BYP
VO-
+
+IN
Ri2
VO+
20 k:
GND
RF2
20 k:
Figure 1. Typical Audio Amplifier Application Circuit
Connection Diagram
xxx
xxx
3
2
1
OUT-
+IN
VDD
OUT+
-IN
1
8
OUT+
BYP
2
7
VDD
SHDN
3
6
GND
+IN
4
5
OUT-
-IN
GND
SHDN
GND
BYP
A
B
C
Figure 3. 8-Pin WSON - Top View
See NGS0008C Package
Figure 2. 9-Bump DSBGA - Top View
See YFQ0009 Package
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings (1) (2) (3)
Supply Voltage
6.0V
−65°C to +150°C
Storage Temperature
−0.3V to VDD +0.3V
Input Voltage
Power Dissipation (4) (5)
ESD Susceptibility
Internally Limited
(6)
2000V
ESD Susceptibility (7)
200V
Junction Temperature
150°C
θJA (TM)
Thermal Resistance
100°C/W
θJA (WSON)
71°C/W
Soldering Information
(1)
(2)
(3)
(4)
(5)
(6)
(7)
See AN-1187 (SNOA401)
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX – TA) / θJA or the number given in Absolute Maximum Ratings,
whichever is lower. For the LM4941, see power derating curve for additional information.
Maximum Power Dissipation (PDMAX) in the device occurs at an output power level significantly below full output power. PDMAX can be
calculated using Equation 3 shown in the Application section. It may also be obtained from the Power Dissipation graphs.
Human body model, 100pF discharged through a 1.5kΩ resistor.
Machine Model, 220pF – 240pF discharged through all pins.
Operating Ratings
Temperature Range TMIN ≤ TA ≤ TMAX
−40°C ≤ TA ≤ 85°C
2.4V ≤ VDD ≤ 5.5V
Supply Voltage
Electrical Characteristics VDD = 5V (1) (2)
The following specifications apply for VDD = 5V, AV = 1V/V, and 8Ω load unless otherwise specified. Limits apply for TA =
25°C.
Symbol
Parameter
Conditions
LM4941
Typical
(3)
Limit (4) (5)
Units
(Limits)
IDD
Quiescent Power Supply Current
VIN = 0V, no load
VIN = 0V, RL = 8Ω
1.7
1.7
2.3
mA (max)
mA
ISD
Shutdown Current
VSHDN = GND
0.1
0.8
µA (max)
THD+N = 1% (max); f = 1 kHz
RL = 8Ω
1.25
1.15
W (min)
THD+N = 10% (max); f = 1 kHz
RL = 8Ω
1.54
W
PO = 0.7 W; f = 1kHz
0.04
%
PO
Output Power
THD+N
Total Harmonic Distortion + Noise
VRIPPLE = 200mVP-P Sine
PSRR
(1)
(2)
(3)
(4)
(5)
(6)
Power Supply Rejection Ratio
f = 217Hz (6)
95
f = 1kHz (6)
90
80
dB (min)
dB
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
Typicals are measured at 25°C and represent the parametric norm.
Limits are specified to TI's AOQL (Average Outgoing Quality Level).
Datasheet min/max specification limits are specified by design, test, or statistical analysis.
10Ω terminated input.
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Electrical Characteristics VDD = 5V(1)(2) (continued)
The following specifications apply for VDD = 5V, AV = 1V/V, and 8Ω load unless otherwise specified. Limits apply for TA =
25°C.
Symbol
Parameter
Conditions
LM4941
Typical (3)
f = 217Hz, VCM = 200mVP-P Sine
70
f = 20Hz–20kHz , VCM = 200mVpp
70
VIN = 0V
2
Limit (4) (5)
Units
(Limits)
dB
CMRR
Common-Mode Rejection Ratio
VOS
Output Offset Voltage
VSDIH
Shutdown Voltage Input High
VSDIL
Shutdown Voltage Input Low
SNR
Signal-to-Noise Ratio
PO = 1W, f = 1kHz
108
dB
TWU
Wake-up Time from Shutdown
CBYPASS = 1μF
12
ms
dB
6
mV (max)
1.4
V (min)
0.4
V (max)
Electrical Characteristics VDD = 3V (1) (2)
The following specifications apply for VDD = 3V, AV = 1V/V, and 8Ω load unless otherwise specified. Limits apply for TA =
25°C.
Symbol
Parameter
Conditions
LM4941
Typical (3)
Limit (4) (5)
Units
(Limits)
IDD
Quiescent Power Supply Current
VIN = 0V, no load
VIN = 0V, RL = 8Ω
1.6
1.6
2.2
mA (max)
mA
ISD
Shutdown Current
VSHDN = GND
0.1
0.8
µA (max)
THD+N = 1% (max); f = 1 kHz
RL = 8Ω
0.43
W
THD+N = 10% (max); f = 1 kHz
RL = 8Ω
0.54
W
PO = 0.25W; f = 1kHz
0.05
%
f = 217Hz (6)
95
dB
f = 1kHz (6)
90
dB
dB
PO
Output Power
THD+N
Total Harmonic Distortion + Noise
PSRR
Power Supply Rejection Ratio
VRIPPLE = 200mVPP Sine
CMRR
Common-Mode Rejection Ratio
f = 217Hz, VCM = 200mVPP Sine
70
VOS
Output Offset Voltage
VIN = 0V
2
VSDIH
Shutdown Voltage Input High
1.4
V (min)
VSDIL
Shutdown Voltage Input Low
0.4
V (max)
TWU
Wake-up Time from Shutdown
(1)
(2)
(3)
(4)
(5)
(6)
4
CBYPASS = 1μF
8
6
mV (max)
ms
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
Typicals are measured at 25°C and represent the parametric norm.
Limits are specified to TI's AOQL (Average Outgoing Quality Level).
Datasheet min/max specification limits are specified by design, test, or statistical analysis.
10Ω terminated input.
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External Components Description
(Figure 1)
Components
Functional Description
1.
CS
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing section for
information concerning proper placement and selection of the supply bypass capacitor.
2.
CB
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External
Components, for information concerning proper placement and selection of CB.
3.
Ri
Inverting input resistance which sets the closed-loop gain in conjunction with RF.
4.
RF
External feedback resistance which sets the closed-loop gain in conjunction with Ri.
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Typical Performance Characteristics
Data taken with Bandwidth = 80kHz, AV = 1V/V and inputs are AC-coupled except where specified.
THD+N vs Output Power
VDD = 5V, RL = 8Ω, f = 1kHz
10
10
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
0.001
10m
100m
1
0.001
10m
2
OUTPUT POWER (W)
10
100m
Figure 4.
Figure 5.
THD+N vs Frequency
VDD = 5V, RL = 8Ω, PO = 700mW
THD+N vs Frequency
VDD = 3V, RL = 8Ω, PO = 250mW
10
THD+N (%)
0.01
0.1
0.01
0.001
20
100
1k
0.001
20
10k 20k
100
FREQUENCY (Hz)
10k 20k
Figure 7.
PSRR vs Frequency
VDD = 5V, RL = 8Ω, Inputs terminated
0
-10
-10
-20
-20
-30
-30
-40
-40
PSRR (dB)
PSRR (dB)
1k
FREQUENCY (Hz)
Figure 6.
-50
-60
-70
PSRR vs Frequency
VDD = 3V, RL = 8Ω, Inputs terminated
-50
-60
-70
-80
-80
-90
-90
-100
-100
-110
-110
-120
20
-120
20
100
1k
FREQUENCY (Hz)
10k 20k
100
1k
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10k 20k
FREQUENCY (Hz)
Figure 8.
6
2
1
0.1
0
1
OUTPUT POWER (W)
1
THD+N (%)
THD+N vs Output Power
VDD = 3V, RL = 8Ω, f = 1kHz
Figure 9.
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Typical Performance Characteristics (continued)
Data taken with Bandwidth = 80kHz, AV = 1V/V and inputs are AC-coupled except where specified.
CMRR vs Frequency
VDD = 5V, RL = 8Ω
-40
-50
-50
-60
-60
CMRR (dB)
CMRR (dB)
-40
-70
-70
-80
-80
-90
-90
-100
20
100
CMRR vs Frequency
VDD = 3V, RL = 8Ω
-100
20
10k 20k
1k
100
FREQUENCY (Hz)
Figure 10.
Figure 11.
PSRR vs Common Mode Voltage
VDD = 5V, RL = 8Ω, f = 217Hz
PSRR vs Common Mode Voltage
VDD = 3V, RL = 8Ω, f = 217Hz
0
-10
-10
-20
-20
-30
-30
PSRR (dB)
PSRR (dB)
0
-40
-50
-60
-40
-50
-60
-70
-70
-80
-80
-90
-90
-100
-100
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
0
5
1.5
2
2.5
3
Figure 13.
Power Dissipation vs Output Power
VDD = 5V, RL = 8Ω
Power Dissipation vs Output Power
VDD = 3V, RL = 8Ω
300
POWER DISSIPATION (mW)
POWER DISSIPATION (mW)
1
Figure 12.
600
500
400
300
200
100
0
0.5
DC COMMON MODE VOLTAGE (V)
DC COMMON MODE VOLTAGE (V)
700
10k 20k
1k
FREQUENCY (Hz)
0
200
400
600
800 1000 1200 1400
OUTPUT POWER (mW)
250
200
150
100
50
0
0
100
200
400
500
OUTPUT POWER (mW)
Figure 14.
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300
Figure 15.
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Typical Performance Characteristics (continued)
Data taken with Bandwidth = 80kHz, AV = 1V/V and inputs are AC-coupled except where specified.
Output Power vs Supply Voltage
RL = 8Ω, Top-THD+N = 10%; Bot-THD+N = 1%
Clipping Voltage vs Supply Voltage
0.5
2
1.8
0.4
DROPOUT VOLTAGE (V)
OUTPUT POWER (W)
1.6
1.4
1.2
1
0.8
0.6
0.3
0.2
0.1
0.4
0.2
0
0
2
2
2.5
3
3.5
4
4.5
5
5.5
2.5
3
6
3.5
4
4.5
5
5.5
6
5
5.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 16.
Figure 17.
Output Power vs Load Resistance
Top-VDD = 5V, 10% THD+N, Topmid-VDD = 5V, 1% THD+N
Bot-VDD = 3V, 10% THD+N, Botmid-VDD = 3V, 1% THD+N
IDDQ vs Supply Voltage
1.8
1.6
1.6
1.4
1.4
1.2
1.2
IDDQ (mA)
OUTPUT POWER (W)
1.8
1
0.8
1
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0
0
0
10
20
30
40
50
60
1
70
1.5
LOAD RESISTANCE (:)
2
1.5
3
3.5
4
4.5
SUPPLY VOLTAGE (V)
Figure 18.
Figure 19.
Power Derating Curve
fIN = 1kHz, RL = 8Ω
TOTAL POWER DISSIPATION (W)
0.7
Note 11
0.6
0.5
LLP
0.4
TM
0.3
0.2
0.1
0
0
30
60
90
120
150
180
AMBIENT TEMPRATURE (oC)
Figure 20.
8
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APPLICATION INFORMATION
OPTIMIZING RF IMMUNITY
The internal circuitry of the LM4941 suppresses the amount of RF signal that is coupled into the chip. However,
certain external factors, such as output trace length, output trace orientation, distance between the chip and the
antenna, antenna strength, speaker type, and type of RF signal, may affect the RF immunity of the LM4941. In
general, the RF immunity of the LM4941 is application specific. Nevertheless, optimal RF immunity can be
achieved by using short output traces and increasing the distance between the LM4941 and the antenna.
DIFFERENTIAL AMPLIFIER EXPLANATION
The LM4941 is a fully differential audio amplifier that features differential input and output stages. Internally this is
accomplished by two circuits: a differential amplifier and a common mode feedback amplifier that adjusts the
output voltages so that the average value remains VDD / 2. When setting the differential gain, the amplifier can be
considered to have "halves". Each half uses an input and feedback resistor (Ri and RF) to set its respective
closed-loop gain (see Figure 1). With Ri1 = Ri2 and RF1 = RF2, the gain is set at -RF / Ri for each half. This results
in a differential gain of
AVD = -RF/Ri
(1)
It is extremely important to match the input resistors to each other, as well as the feedback resistors to each
other for best amplifier performance. See the Proper Selection of External Components section for more
information. A differential amplifier works in a manner where the difference between the two input signals is
amplified. In most applications, input signals will be 180° out of phase with each other. The LM4941 can be used,
however, as a single-ended input amplifier while still retaining its fully differential benefits because it simply
amplifies the difference between the inputs.
All of these applications provide what is known as a "bridged mode" output (bridge-tied-load, BTL). This results in
output signals that are 180° out of phase with respect to each other. Bridged mode operation is different from the
single-ended amplifier configuration that connects the load between the amplifier output and ground. A bridged
amplifier design has distinct advantages over the single-ended configuration: it provides differential drive to the
load, thus doubling maximum possible output swing for a specific supply voltage. Four times the output power is
possible compared with a single-ended amplifier under the same conditions. This increase in attainable output
power assumes that the amplifier is not current limited or clipped. Choose an amplifier's closed-loop gain without
causing excess clipping.
A bridged configuration, such as the one used in the LM4941, also creates a second advantage over singleended amplifiers. Since the differential outputs are biased at half-supply, no net DC voltage exists across the
load. This assumes that the input resistor pair and the feedback resistor pair are properly matched (see Proper
Selection of External Components). BTL configuration eliminates the output coupling capacitor required in singlesupply, single-ended amplifier configurations. If an output coupling capacitor is not used in a single-ended output
configuration, the half-supply bias across the load would result in both increased internal IC power dissipation as
well as permanent loudspeaker damage. Further advantages of bridged mode operation specific to fully
differential amplifiers like the LM4941 include increased power supply rejection ratio, common-mode noise
reduction, and click and pop reduction.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful amplifier, whether the amplifier is bridged or
single-ended. Equation 2 states the maximum power dissipation point for a single-ended amplifier operating at a
given supply voltage and driving a specified output load.
PDMAX = (VDD)2 / (2π2RL) Single-Ended
(2)
However, a direct consequence of the increased power delivered to the load by a bridge amplifier is an increase
in internal power dissipation versus a single-ended amplifier operating at the same conditions.
PDMAX = 4 * (VDD)2 / (2π2RL) Bridge Mode
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Since the LM4941 has bridged outputs, the maximum internal power dissipation is four times that of a singleended amplifier. Even with this substantial increase in power dissipation, the LM4941 does not require additional
heatsinking under most operating conditions and output loading. From Equation 3, assuming a 5V power supply
and an 8Ω load, the maximum power dissipation point is 625mW. The maximum power dissipation point obtained
from Equation 3 must not be greater than the power dissipation results from Equation 4:
PDMAX = (TJMAX - TA) / θJA
(4)
The LM4941's θJA in a DSBGA package is 100°C/W. Depending on the ambient temperature, TA, of the system
surroundings, Equation 4 can be used to find the maximum internal power dissipation supported by the IC
packaging. If the result of Equation 3 is greater than that of Equation 4, then either the supply voltage must be
decreased, the load impedance increased, the ambient temperature reduced, or the θJA reduced with
heatsinking. In many cases, larger traces near the output, VDD, and GND pins can be used to lower the θJA. The
larger areas of copper provide a form of heatsinking allowing higher power dissipation. For the typical application
of a 5V power supply, with an 8Ω load, the maximum ambient temperature possible without violating the
maximum junction temperature is approximately 87.5°C provided that device operation is around the maximum
power dissipation point. Recall that internal power dissipation is a function of output power. If typical operation is
not around the maximum power dissipation point, the LM4941 can operate at higher ambient temperatures.
Refer to the Typical Performance Characteristics curves for power dissipation information.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection ratio (PSRR). The capacitor location on both the bypass and power supply pins should be as close to
the device as possible. Typical applications employ a 5V regulator with 10µF and 0.1µF bypass capacitors that
increase supply stability. This, however, does not eliminate the need for bypassing the supply nodes of the
LM4941. The LM4941 will operate without the bypass capacitor CB, although the PSRR may decrease. A 1µF
capacitor is recommended for CB. This value maximizes PSRR performance. Lesser values may be used, but
PSRR decreases at frequencies below 1kHz. The issue of CB selection is thus dependant upon desired PSRR
and click and pop performance as explained in the section Proper Selection of External Components.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4941 contains shutdown circuitry that is used to
turn off the amplifier's bias circuitry. The device may then be placed into shutdown mode by toggling the SHDN
pin to logic low. It is best to switch between ground and supply for maximum performance. While the device may
be disabled with shutdown voltages in between ground and supply, the idle current may be greater than the
typical value of 0.1µA. In either case, the SHDN pin should be tied to a definite voltage to avoid unwanted state
changes.
In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry, which
provides a quick, smooth transition to shutdown. Another solution is to use a single-throw switch in conjunction
with an external pull-up resistor. This scheme ensures that the shutdown pin will not float, thus preventing
unwanted state changes.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using integrated power amplifiers is critical when
optimizing device and system performance. Although the LM4941 is tolerant to a variety of external component
combinations, consideration of component values must be made when maximizing overall system quality.
The LM4941 is unity-gain stable, giving the designer maximum system flexibility. The LM4941 should be used in
low closed-loop gain configurations to minimize THD+N values and maximize signal to noise ratio. Low gain
configurations require large input signals to obtain a given output power. Input signals equal to or greater than
1VRMS are available from sources such as audio codecs. When used in its typical application as a fully differential
power amplifier the LM4941 does not require input coupling capacitors for input sources with DC common-mode
voltages of less than VDD. Exact allowable input common-mode voltage levels are actually a function of VDD, Ri,
and RF and may be determined by Equation 5:
VCMi < (VDD-1.2)(Ri+RF)/RF-VDD/2(Ri/ RF)
-RF / Ri = AVD
10
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(5)
(6)
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM4941 LM4941SDBD LM4941TMBD
LM4941, LM4941SDBD, LM4941TMBD
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SNAS347C – JUNE 2006 – REVISED MAY 2013
When using DC coupled inputs, special care must be taken to match the values of the input resistors (Ri1 and
Ri2) to each other. Because of the balanced nature of differential amplifiers, resistor matching differences can
result in net DC currents across the load. This DC current can increase power consumption, internal IC power
dissipation, reduce PSRR, and possibly damaging the loudspeaker. The chart below demonstrates this problem
by showing the effects of differing values between the feedback resistors while assuming that the input resistors
are perfectly matched. The results below apply to the application circuit shown in Figure 1, and assumes that VDD
= 5V, RL = 8Ω, and the system has DC coupled inputs tied to ground.
Tolerance
Ri1
Ri2
V01–V02
ILOAD
20%
0.8R
1.2R
–0.500V
62.5mA
10%
0.9R
1.1R
–0.250V
31.25mA
5%
0.95R
1.05R
–0.125V
15.63mA
1%
0.99R
1.01R
–0.025V
3.125mA
0%
R
R
0
0
Since the same variations can have a significant effect on PSRR and CMRR performance, it is highly
recommended that the input resistors be matched to 1% tolerance or better for best performance.
Recommended TM Board Layout
Figure 21. Recommended TM Board Layout: Top
Layer
Copyright © 2006–2013, Texas Instruments Incorporated
Figure 22. Recommended TM Board Layout: Top
Overlay
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11
LM4941, LM4941SDBD, LM4941TMBD
SNAS347C – JUNE 2006 – REVISED MAY 2013
www.ti.com
Figure 23. Recommended TM Board Layout: Bottom Layer
Recommended WSON Board Layout
Figure 24. Recommended WSON Board Layout:
Top Layer
12
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Figure 25. Recommended WSON Board Layout:
Top Overlay
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM4941 LM4941SDBD LM4941TMBD
LM4941, LM4941SDBD, LM4941TMBD
www.ti.com
SNAS347C – JUNE 2006 – REVISED MAY 2013
Figure 26. Recommended WSON Board Layout: Bottom Layer
LM4941 Reference Design Boards Bill Of Materials
Designator
Value
Tolerance
Part Description
Ri1, Ri2
20kΩ
0.10%
1/10W, 0.1% 0805 Resistor
Rf1, Rf2
20kΩ
0.10%
1/10W, 0.1% 0805 Resistor
Ci1, Ci2
0Ω
Cb, Cs
1μF
Comments
1/10W, 0.1% 0805 Resistor
10%
In, Out, VDD, J1
16V Tantalum 1210 Capacitor
0.100” 1x2 header, Vertical mount
Copyright © 2006–2013, Texas Instruments Incorporated
Input, Output, VDD/GND, Shutdown
Control
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13
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SNAS347C – JUNE 2006 – REVISED MAY 2013
www.ti.com
REVISION HISTORY
14
Rev
Date
Description
1.0
06/28/06
Initial release.
1.1
07/10/06
Added the WSON pkg mktg outline (per
Kashif J.)
1.2
08/04/06
Added the WSON package and marking
diagrams.
1.3
10/12/06
Edited some of the Typical Performance
curves' labels and some text edits.
1.4
10/25/06
Added the WSON boards.
1.5
11/07/06
Text edits.
1.6
11/15/06
Replaced curve 20170381 with 20170382
and input text edits.
1.7
03/09/07
Changed the Limit value from 70 to 80 on the
PSRR in the EC 5V EC table.
C
05/03/13
Changed layout of National Data Sheet to TI
format.
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Product Folder Links: LM4941 LM4941SDBD LM4941TMBD
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM4941SD/NOPB
ACTIVE
WSON
NGS
8
1000
RoHS & Green
SN
Level-1-260C-UNLIM
4941
LM4941SDX/NOPB
ACTIVE
WSON
NGS
8
4500
RoHS & Green
SN
Level-1-260C-UNLIM
4941
LM4941TM/NOPB
ACTIVE
DSBGA
YFQ
9
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
G
H6
LM4941TMX/NOPB
ACTIVE
DSBGA
YFQ
9
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
G
H6
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of