PTRF1216IRGPR

TRF1216 www.ti.com SLWS172A – APRIL 2005 – REVISED DECEMBER 2005 3.5-GHz, HIGH DYNAMIC RANGE, LOW-NOISE DOWN-CONVERTER DEVICE INFORMATION FEATURES MXRI RFATTN 17 16 GND GND 18 15 RFAGC VDDA 2 14 IFOP GND 3 13 IFON GND 4 12 VDDIF LNAI 5 11 IFB 6 7 8 9 10 VDDLO LNAO 1 GND • • 19 LON • • 20 LOP • • RGP PACKAGE (TOP VIEW) VDD2 • • Performs First Down-Conversion in 3.5-GHz Radios (3300–3800 MHz) Integrated LNA/Mixer/IF Amp/LO Buffer Provision for External Image Reject/Band-Pass Filter Low Noise-Figure/High Linearity Digital 10-dB Attenuator for High-Level Signals Frequency Range: 3.3–3.8 GHz 28 dB of Gain with 20 dB of Gain Control (10-dB Fixed) 2.5-dB Noise Figure, Typical LO Drive Level = 0 dBm, Typical GND • P0031-02 DESCRIPTION The TRF1216 is the first of two integrated circuits used in the receiver section of Texas Instruments’ 3.5-GHz radio chipset. The TRF1216 down-converts the 3.5-GHz input frequency to an intermediate frequency in the range of 400 MHz to 500 MHz. The device provides a differential output that passes through a SAW filter before connecting to a second down converter. For the best performance, Texas Instruments TRF1212 should be used to perform both the second down conversion and also provide the local oscillator for the TRF1216. The TRF1216 includes a LNA with switchable attenuation, a balanced mixer, a variable gain IF amplifier and a differential LO Buffer for improved performance. In order to provide exceptional image rejection and extra jammer immunity, the TRF1216 offers a signal path to an off-chip filter. Specifications are provided assuming an in-band 2-dB insertion loss filter. To maximize input dynamic range, a 10-dB switchable attenuator is provided in the RF path as well as 10 dB of analog IF gain control. After the image reject filter, an on-chip Balun converts the signal from single ended to differential in order to provide better noise immunity at the mixer. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005, Texas Instruments Incorporated TRF1216 www.ti.com SLWS172A – APRIL 2005 – REVISED DECEMBER 2005 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. BLOCK DIAGRAM The detailed block diagram and the pin-out of the ASIC are shown in Figure 1 and Table 1. VDD2 VDD1 VDDIF LNAO MXRI Dual Stage-LNA VGA Mixer IFOP IFON BALUN LNAI IFB RFAGC LOP LON LO Buffer GND RFATTN VDDLO B0084-01 Figure 1. Detailed Block Diagram of TRF1216 TERMINAL FUNCTIONS TERMINAL NO. NAME I/O TYPE DESCRIPTION 1 LNAO O Analog LNA Output, 50 Ω, ac-coupled 2 VDD1 I Power LNA1 DC Bias (+5 V nominal) 3, 4, 6, 9, 16, 19 GND – – 5 LNAI I Analog RF input – Needs dc block and input matching for optimum noise figure 7 LOP I Analog LO input positive, ac coupled 8 LON I Analog LO input negative, ac coupled 10 VDDLO I Power LO DC Bias (+5 V nominal) 11 IFB – – 12 VDDIF I Power IF Bias Network dc Bias (+5 V nominal) 13 IFON O Analog IF output and bias (see the application schematic for connections). 14 IFOP O Analog IF output and bias (see the application schematic for connections). 15 RFAGC I Analog Input voltage for analog gain control VRFAGC = 0 V to 1.5 V Max gain at VRFAGC = 0 V Min gain at VRFAGC = 1.5 V 17 RFATTN I Digital TTL control for switched attenuator TTL low – Attenuator switched in TTL high – Attenuator switched out Ground Not connected for normal operation. IF Bias Adjustment. Do not ground this pin or connect to any other pin. 18 MXRI I Analog Mixer Input 50 Ω 20 VDD2 – Power LNA2 dc bias (+5 V nominal) Back GND – – 2 Back of package has metal base that must be grounded for thermal and RF performance. TRF1216 www.ti.com SLWS172A – APRIL 2005 – REVISED DECEMBER 2005 ABSOLUTE MAXIMUM RATINGS VALUES UNIT VDD DC supply voltage, VDD 0 to 5.5 V PIN RF input power 10 dBm TJ Junction temperature 200 °C PD Power dissipation 1100 mW VD Digital input voltage –0.3 to 5.5 V VA Analog input voltage –0.3 to 5 V θJC Thermal resistance 9.1 °C/W Tstg Storage temperature –40 to 105 °C Top Operating temperature –40 to 85 °C 260 °C junction-to-case (1) Lead temperature (40 Sec Max) (1) Thermal resistance is junction to ambient assuming thermal pad with nine thermal vias under package metal base. See the recommended PCB layout. ELECTRICAL CHARACTERISTICS The characteristics listed in the following tables are at VCC = 5 V, TA = 25°C unless otherwise specified. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 5 5.5 V 175 200 mA DC CHARACTERISTICS VDD Supply voltage IDD Total supply current I LNA1 LNA1 supply current Pin 2 (VDD1) 35 mA I LNA2 LNA2 supply current Pin 20 (VDD2) 35 mA IIF IF AMP supply current Pin 12 (VDDIF) plus IF drain bias on pins 13 and 14 (IFOP, IFON) 55 mA ILO LO supply current Pin 10 (VDDLO) 50 mA VAGC Gain control voltage 0 2 V IAGC Gain control current 0 100 µA VIH Input high voltage 2.5 5 V VIL Input low voltage 0 0.8 V IIH Input high current 300 µA IIL Input low current –50 µA 3 TRF1216 www.ti.com SLWS172A – APRIL 2005 – REVISED DECEMBER 2005 DOWNCONVERTER CHARACTERISTICS Unless otherwise stated VDD = 5 V, FRF = 3500 MHz, TA = 25°C MAX UNIT FRF RF input frequency PARAMETER 3300 3800 MHz FLO LO input frequency 2800 3400 MHz FIF IF output frequency 400 480 500 MHz G Maximum gain VAGC = 0 V, RFATTN disabled, Measured into 100-Ω differential load 27 30 33 dB ∆AGC Analog gain control range VAGC from 0 to 1.5 V, Any RFATTN setting. Measured into 100-Ω differential load 7 10 ∆ATTN Switched attenuator range RFATTN from high-to-low, any VAGC setting. Measured into 100-Ω differential load 8.5 10 GHG Gain flatness full band Any 200-MHz band GNB Gain flatness / 6 MHz Any 6-MHz band Noise figure (1) NF IP-1dB Input power at 1-dB compression TEST CONDITIONS MIN TYP 1 VAGC = 0 V, RFATTN disabled 2.5 VAGC = 0 V, RFATTN enabled 4.8 VAGC = 1.5 V, RFATTN disabled 3.2 VAGC = 1.5 V, RFATTN enabled 6.8 VAGC = 0 V, RFATTN disabled –17 VAGC = 0 V, RFATTN enabled –6 VAGC = 1.5 V, RFATTN disabled –10 VAGC = 1.5 V, RFATTN enabled –4 VAGC = 0 V, RFATTN disabled –7 VAGC = 0 V, RFATTN enabled -1 VAGC = 1.5 V, RFATTN disabled –5 VAGC = 1.5 V, RFATTN enabled 5 dB 11.5 dB 2 dB 0.4 dB dB dBm IIP3 Input 3rd order intercept point PLO LO input power Referenced to 100-Ω differential LO to MXRI leakage LO input = 3 dBm, VAGC = 0 V –35 –45 dB LO to IF leakage LO input = 3 dBm, VAGC = 0 V –40 –50 dB LNAO to RXI isolation FRF F = 3300 to 3800 MHz, RFATTN = TTL High (1) 4 Assured by lab characterization/design and not subject to production test. 0 40 dBm dBm dB TRF1216 www.ti.com SLWS172A – APRIL 2005 – REVISED DECEMBER 2005 TYPICAL CHARACTERISTICS Measurements resulting in the following graphs were taken on the evaluation board of the ASIC (see Figure 9). 40 VAGC = 0 V 35 Gain With Attenuator Disabled 30 Gain − dB 25 20 15 Gain With Attenuator Enabled 10 5 0 3300 −40°C 25°C 85°C 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 f − Frequency − MHz G001 Figure 2. Gain vs Frequency for VAGC = 0 V 30 −40°C 25°C 85°C VAGC = 1.5 V 25 Gain − dB 20 Gain With Attenuator Disabled 15 10 Gain With Attenuator Enabled 5 0 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 f − Frequency − MHz G002 Figure 3. Gain vs Frequency for VAGC = 1.5 V 5 TRF1216 www.ti.com SLWS172A – APRIL 2005 – REVISED DECEMBER 2005 TYPICAL CHARACTERISTICS (continued) 30 TA = 25°C 25 Gain − dB 20 Attenuator Enabled 15 10 5 3300 MHz 3550 MHz 3800 MHz 0 0.00 0.25 Attenuator Disabled 0.50 0.75 1.00 1.25 1.50 VAGC − Analog Gain Control Voltage − V G003 Figure 4. Gain vs VAGC for Different Frequencies, (TA = 25°C) 5 TA = 25°C Input P1dB − dBm 0 −5 Attenuator Enabled, VAGC = 1.5 V Attenuator Enabled, VAGC = 0 V −10 Attenuator Disabled, VAGC = 1.5 V −15 Attenuator Disabled, VAGC = 0 V −20 −25 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 f − Frequency − MHz G004 Figure 5. Input P1dB vs Frequency, (TA = 25°C) 6 TRF1216 www.ti.com SLWS172A – APRIL 2005 – REVISED DECEMBER 2005 TYPICAL CHARACTERISTICS (continued) 10 TA = 25°C Attenuator Enabled, VAGC = 1.5 V 0 Attenuator Enabled, VAGC = 0 V Attenuator Disabled, VAGC = 1.5 V −5 Attenuator Disabled, VAGC = 0 V −10 −15 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 f − Frequency − MHz G005 Figure 6. Input IP3 vs Frequency, (TA = 25°C) 30 7 −40
C 25 6 25
C 20 5 85
C 15 4 85
C 10 25
C 5 NF [dB] Gain [dB] Input IP3 − dBm 5 3 2 −40
C 0 1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 Frequency [GHz] Figure 7. LNA Noise Figure vs Frequency With VAGC = 0 V 7 TRF1216 www.ti.com SLWS172A – APRIL 2005 – REVISED DECEMBER 2005 APPLICATION INFORMATION A typical application schematic is shown in Figure 9. The PCB material recommendations are shown in Table 1 and Figure 8. Table 1. PCB Recommendations Board Material FR4 Board Material Core Thickness 10 mil Copper Thickness (starting) 1 oz Prepreg Thickness 8 mil Recommended Number of Layers 4 Via Plating Thickness 1/2 oz Final Plate White immersion tin Final Board Thickness 33–37 mil Dia. 15 Mil 1 oz. Copper + ½ oz. Copper Plated Upper and Lower Surfaces Layer 1 10 Mil Core FR4 35 Mil Layer 2: 1 oz. Copper 8 Mil Prepreg Layer 3: 1 oz. Copper 10 Mil Core FR4 DuPont CB 100 Conductive ViaPlug Layer 4 ½ oz. Copper Plated M0020-02 NOTE: Top and bottom surface finish: copper flash with 50–70 µin white tin immersion. Figure 8. PCB Construction and Via Cross Section 8 TRF1216 www.ti.com SLWS172A – APRIL 2005 – REVISED DECEMBER 2005 Z = 50 W RFATTN BPF VDD VRFAGC (A) 100 pF (A) 100 pF 0.01 mF 22 nH (B) IF OUT_POS 2 100 pF 16 3 4 10 pF 270 nH GND MXRI RFATTN 17 LNAO RFAGC IFOP VDD1 (A) GND IFON GND VDDIF 15 (A) RF_IN IFB LNAI 7 LO_POS GND LON LOP GND 0W 6 8 9 0.01 mF 100 pF 270 nH 14 22 nH 13 (B) IF OUT_NEG 12 VDD (A) 5 VDD 11 100 pF 0.01 mF VDDLO 0.01 mF 18 GND Back 1 19 VDD2 20 10 (A) 100 pF 0.01 mF LO_NEG S0122-01 A. Place 100-pF capacitors close to package pins. B. Place 22-nH inductors close to package pins. Figure 9. Recommended Application Schematic 9 TRF1216 www.ti.com SLWS172A – APRIL 2005 – REVISED DECEMBER 2005 2.00 0.50 TYP 0.20 TYP 0.60 TYP PIN 1 1.00 TYP 2.80 2.00 1.00 TYP DIA 0.38 TYP 0.25 TYP 2.80 Solder Mask. No Solder Mask Under Chip, On Lead Pads or On Ground Connections. Notes: 9 Via Holes, Each 0.38 mm. Dimensions in mm M0022-02 Figure 10. Recommended Pad Layout 10 PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) TRF1216IRGPR ACTIVE QFN RGP 20 3000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 TRF 1216 TRF1216IRGPRG3 ACTIVE QFN RGP 20 3000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 TRF 1216 TRF1216IRGPT ACTIVE QFN RGP 20 TBD Call TI Call TI -40 to 85 TRF 1216 TRF1216IRGPTG3 ACTIVE QFN RGP 20 TBD Call TI Call TI -40 to 85 TRF 1216 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TRF1216IRGPR QFN RGP 20 3000 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 TRF1216IRGPT QFN RGP 20 250 180.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRF1216IRGPR QFN RGP 20 3000 338.1 338.1 20.6 TRF1216IRGPT QFN RGP 20 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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