SN74HC139N

SN54HC139, SN74HC139 SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022 SNx4HC139 Dual 2-Line To 4-Line Decoders/Demultiplexers 1 Features 2 Description • The SNx4HC139 contains two two-to-four decoders with one active low output strobe G. When the outputs of one channel are gated by the strobe input, they are all forced into the high state. When the outputs are not disabled by the strobe input, only the selected output is low while all others are high. • • • • • • • Targeted specifically for high-speed memory decoders and data-transmission systems Wide operating voltage range of 2 V to 6 V Outputs can drive up to 10 LSTTL loads Low power consumption, 80-μA max ICC Typical tpd = 10 ns ±4-mA output drive at 5 V Low input current of 1 μA max Incorporate two enable inputs to simplify cascading and/or data reception Device Information (1) PART NUMBER PACKAGE BODY SIZE (NOM) SN74HC139D SOIC (16) 9.90 mm × 3.90 SN74HC139DB SSOP (16) 6.20 mm × 5.30 mm SN74HC139N PDIP (16) 19.31 mm × 6.35 mm SN74HC139NS SO (16) 6.20 mm × 5.30 mm SN74HC139PW TSSOP (16) 5.00 mm × 4.40 mm SN54HC139J CDIP (16) 24.38 mm × 6.92 mm SNJ54HC139FK LCCC (20) 8.89 mm × 8.45 mm SNJ54HC139W CFP (16) 10.16 mm × 6.73 mm (1) DECODER For all available packages, see the orderable addendum at the end of the data sheet. OUTPUT ENABLE 00 xY0 xA0 01 xY1 10 xY2 xA1 11 xY3 xG Pin numbers shown are for the D, DB, J, N, NS, PW, W Functional Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN54HC139, SN74HC139 www.ti.com SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022 Table of Contents 1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Pin Configuration and Functions...................................3 5 Specifications.................................................................. 4 5.1 Absolute Maximum Ratings........................................ 4 5.2 Recommended Operating Conditions(1) .................... 4 5.3 Thermal Information....................................................4 5.4 Electrical Characteristics.............................................5 5.5 Switching Characteristics ...........................................5 5.6 Operating Characteristics........................................... 5 6 Parameter Measurement Information............................ 6 7 Detailed Description........................................................7 7.1 Overview..................................................................... 7 7.2 Functional Block Diagram........................................... 7 7.3 Device Functional Modes............................................7 8 Power Supply Recommendations..................................8 9 Layout...............................................................................8 9.1 Layout Guidelines....................................................... 8 10 Device and Documentation Support............................9 10.1 Receiving Notification of Documentation Updates....9 10.2 Support Resources................................................... 9 10.3 Trademarks............................................................... 9 10.4 Electrostatic Discharge Caution................................9 10.5 Glossary....................................................................9 11 Mechanical, Packaging, and Orderable Information...................................................................... 9 3 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (September 2003) to Revision E (February 2022) Page • Updated the numbering, formatting, tables, figures, and cross-refrences throughout the document to reflect modern data sheet standards............................................................................................................................. 1 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC139 SN74HC139 SN54HC139, SN74HC139 www.ti.com SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022 4 Pin Configuration and Functions J , W, D, DB, N, NS, OR PW Package 16-Pin CDIP, CFP, SOIC, SSOP, PDIP, SO, TSSOP Top View FK package 20-Pin LCCC Top View Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC139 SN74HC139 3 SN54HC139, SN74HC139 www.ti.com SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) VCC Supply voltage range current(2) MIN MAX –0.5 7 UNIT V IIK Input clamp VI < 0 or VI > VCC ±20 mA IOK Output clamp current(2) VO < 0 or VO > VCC ±20 mA IO Continuous output current VO = 0 to VCC ±25 mA ±50 mA 150 °C 150 °C Continuous current through VCC or GND TJ Junction temperature Tstg Storage temperature (1) (2) –65 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 5.2 Recommended Operating Conditions(1) SN54HC139 VCC Supply voltage VCC = 2 V VIH High-level input voltage VCC = 4.5 V VCC = 6 V SN74HC139 MIN NOM MAX 2 5 6 Low-level input voltage VI Input voltage VO Output voltage TA (1) 2 5 6 3.15 3.15 4.2 4.2 VCC = 4.5 V 0.5 0.5 1.35 1.8 0 0 VCC 0 V VCC V VCC = 4.5 V 500 500 VCC = 6 V 400 400 125 V VCC 1000 −55 V 1.8 VCC 1000 Operating free-air temperature UNIT V 1.35 0 VCC = 2 V Input transition rise/fall time MAX 1.5 VCC = 6 V Δt/Δv NOM 1.5 VCC = 2 V VIL MIN −40 85 ns °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature numberSCBA004. 5.3 Thermal Information THERMAL METRIC RθJA (1) 4 Junction-to-ambient thermal (1) resistance D (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS UNIT 73 82 67 64 108 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC139 SN74HC139 SN54HC139, SN74HC139 www.ti.com SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022 5.4 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST (1) CONDITIONS VCC (V) IOH = −20 μA 2 1.9 1.998 1.9 1.9 4.5 4.4 4.499 4.4 4.4 6 5.9 5.999 5.9 5.9 4.5 3.98 4.3 3.7 3.84 6 5.48 5.8 5.2 5.34 MAX MIN MAX UNIT V 2 0.002 0.1 0.1 0.1 4.5 0.001 0.1 0.1 0.1 6 0.001 0.1 0.1 0.1 IOL = 4 mA 4.5 0.17 0.26 0.4 0.33 IOL = 5.2 mA 6 0.15 0.26 0.4 0.33 VI = VCC or 0 6 ±0.1 ±100 ±1000 ±1000 nA IO = 0 6 8 160 80 μA 10 10 10 pF Ci (1) MIN IOL = 20 μA VOL II MAX SN74HC139 TYP IOH = −5.2 mA ICC SN54HC139 MIN VOH IOH = −4 mA TA = 25°C 2 to 6 3 V VI = VIH or VIL, unless otherwise noted. 5.5 Switching Characteristics over recommended operating free-air temperature range, CL= 50 pF (unless otherwise noted) (see Figure 6-1) PARAMETER FROM (INPUT) A or B TO (OUTPUT) Y tpd G tt Y Y VCC (V) TA = 25°C MIN SN54HC139 MIN SN74HC139 TYP MAX MAX MIN MAX 2 47 175 255 220 4.5 14 35 51 44 6 12 30 44 38 2 39 175 255 220 4.5 11 35 51 44 6 10 30 44 38 2 38 75 110 95 4.5 8 15 22 19 6 6 13 19 16 UNIT ns ns 5.6 Operating Characteristics TA = 25℃ PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per decoder No load TYP 25 UNIT pF Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC139 SN74HC139 5 SN54HC139, SN74HC139 www.ti.com SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022 6 Parameter Measurement Information Figure 6-1. Load Circuit and Voltage Waveforms 6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC139 SN74HC139 SN54HC139, SN74HC139 www.ti.com SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022 7 Detailed Description 7.1 Overview The SNx4HC139 devices are designed for high- performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, these decoders can minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay time of these decoders and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible. The SNx4HC139 devices comprise two individual 2-line to 4-line decoders in a single package. The active-low enable (G) input can be used as a data line in demultiplexing applications. These decoders/demultiplexers feature fully buffered inputs, each of which represents only one normalized load to its driving circuit. 7.2 Functional Block Diagram DECODER OUTPUT ENABLE 00 xY0 xA0 01 xY1 10 xY2 xA1 11 xY3 xG Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. 7.3 Device Functional Modes INPUTS G OUTPUTS SELECT B A Y0 Y1 Y2 Y3 H X X H H H H L L L L H H H L L H H L H H L H L H H L H L H H H H H L Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC139 SN74HC139 7 SN54HC139, SN74HC139 SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022 www.ti.com 8 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 9 Layout 9.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC139 SN74HC139 SN54HC139, SN74HC139 www.ti.com SCLS108E – DECEMBER 1982 – REVISED FEBRUARY 2022 10 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 10.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 10.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 10.3 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 10.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 10.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 11 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: SN54HC139 SN74HC139 9 PACKAGE OPTION ADDENDUM www.ti.com 20-Jun-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) 5962-8409201VFA ACTIVE CFP W 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8409201VF A SNV54HC139W 84092012A ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 84092012A SNJ54HC 139FK 8409201EA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8409201EA SNJ54HC139J Samples 8409201FA ACTIVE CFP W 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8409201FA SNJ54HC139W Samples JM38510/65803BEA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65803BEA Samples M38510/65803BEA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 JM38510/ 65803BEA Samples SN54HC139J ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 SN54HC139J Samples SN74HC139D ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC139 Samples SN74HC139DBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC139 Samples SN74HC139DE4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC139 Samples SN74HC139DR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC139 Samples SN74HC139DRE4 ACTIVE SOIC D 16 2500 TBD Call TI Call TI -40 to 85 Samples SN74HC139DRG4 ACTIVE SOIC D 16 2500 TBD Call TI Call TI -40 to 85 Samples SN74HC139DT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC139 Samples SN74HC139N ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HC139N Samples SN74HC139NE4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74HC139N Samples SN74HC139NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC139 Samples Addendum-Page 1 Samples Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 20-Jun-2022 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN74HC139PW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC139 Samples SN74HC139PWG4 ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC139 Samples SN74HC139PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC139 Samples SN74HC139PWT ACTIVE TSSOP PW 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 HC139 Samples SNJ54HC139FK ACTIVE LCCC FK 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 84092012A SNJ54HC 139FK SNJ54HC139J ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8409201EA SNJ54HC139J Samples SNJ54HC139W ACTIVE CFP W 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 8409201FA SNJ54HC139W Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of