TPSM82903EVM

www.ti.com Table of Contents User’s Guide TPSM8290x Step-Down Converter Evaluation Module User's Guide ABSTRACT The TPSM8290xEVM (BSR188) facilitates the evaluation of the TPSM8290x 1-A, 2-A, and 3-A pin-to-pin compatible buck converter modules in a small 3.0-mm by 2.8-mm MicroSiP™ package with integrated inductor. The BSR188-003 uses the 3-A TPSM82903 to output a 1.2-V output voltage from input voltages between 3 V and 17 V. The BSR188-002 uses the 2-A TPSM82902 to output a 1.8-V output voltage from input voltages between 3 V and 17 V. The BSR188-001 uses the 1-A TPSM82901 to output a 3.3-V output voltage from input voltages up to 17 V. The TPSM8290x is a high-efficiency, low IQ buck converter module for use in a variety of industrial, enterprise, and personal electronics applications, such as the following: • • • • • • • Factory and building automation IP network cameras Industrial PC Data center switches Servo drives Mobile and embedded computing Any application with a 12-V input voltage or a 1-4 cell lithium battery pack Table of Contents 1 Introduction.............................................................................................................................................................................2 1.1 Performance Specification................................................................................................................................................. 2 1.2 Modifications...................................................................................................................................................................... 2 2 Setup........................................................................................................................................................................................3 2.1 Input/Output Connector Descriptions................................................................................................................................. 3 3 Safety Instructions..................................................................................................................................................................4 4 Test Results.............................................................................................................................................................................4 5 Board Layout ..........................................................................................................................................................................5 6 Schematic and Bill of Materials...........................................................................................................................................10 6.1 Schematic........................................................................................................................................................................ 10 6.2 Bill of Materials.................................................................................................................................................................13 List of Figures Figure 4-1. Thermal Performance (VIN = 12 V, VOUT = 1.2 V, IOUT = 3000 mA, JP3 Open).........................................................4 Figure 5-1. Top Assembly............................................................................................................................................................ 5 Figure 5-2. Top Layer...................................................................................................................................................................6 Figure 5-3. Internal Layer 1 ........................................................................................................................................................ 7 Figure 5-4. Internal Layer 2......................................................................................................................................................... 8 Figure 5-5. Bottom Layer ............................................................................................................................................................ 9 Figure 6-1. TPSM82901EVM Schematic...................................................................................................................................10 Figure 6-2. TPSM82902EVM Schematic................................................................................................................................... 11 Figure 6-3. TPSM82903EVM Schematic...................................................................................................................................12 List of Tables Table 1-1. TPSM82903EVM Performance Specification Summary.............................................................................................2 Table 1-2. TPSM82902EVM Performance Specification Summary.............................................................................................2 Table 1-3. TPSM82901EVM Performance Specification Summary.............................................................................................2 Table 6-1. TPSM8290xEVM Bill of Materials............................................................................................................................. 13 SNVU796 – MARCH 2022 Submit Document Feedback TPSM8290x Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 1 Trademarks www.ti.com Trademarks MicroSiP™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 1 Introduction The TPSM8290x are synchronous, step-down converter modules in a small 3.0-mm × 2.8-mm × 1.6-mm MicroSiP package. Three different devices in this family support 1 A, 2 A, or 3 A of output current. 1.1 Performance Specification Table 1-1, Table 1-2, and Table 1-3 provide a summary of the TPSM8290xEVM performance specifications. Table 1-1. TPSM82903EVM Performance Specification Summary Specification Test Conditions Input voltage MIN 3 Output voltage setpoint TYP MAX Unit 12 17 V 1.2 Output current 0 MODE/S-CONF (R7) setting 2.5 MHz, auto PFM/PWM with AEE, external FB, output discharge disabled V 3 7.15 A kΩ Table 1-2. TPSM82902EVM Performance Specification Summary Specification Test Conditions Input voltage MIN 3 Output voltage setpoint TYP MAX Unit 12 17 V 1.8 Output current 0 MODE/S-CONF (R7) setting 2.5 MHz, auto PFM/PWM with AEE, external FB, output discharge disabled V 2 7.15 A kΩ Table 1-3. TPSM82901EVM Performance Specification Summary Specification Test Conditions Input voltage MIN TYP MAX Unit 3.4 12 17 V Output voltage setpoint 3.3 Output current MODE/S-CONF (R7) setting 0 2.5 MHz, auto PFM/PWM with AEE, external FB, output discharge disabled V 1 7.15 A kΩ 1.2 Modifications The printed-circuit board (PCB) for this EVM is designed to accommodate some modifications by the user. Additionally, the following modifications can be made: • • • • • • Input and output capacitors can be added. The input voltage at which the IC turns on can be adjusted with two resistors The soft-start time can be changed. The output voltage can track an applied voltage A feedforward capacitor can be added. The switching frequency, output discharge setting, MODE setting, and output voltage setting configuration can be changed. See the TPSM82903, 3-A, 3-V to 17-V, High Efficiency and Low IQ Buck Converter Module in a MicroSiP Package with an Integrated Inductor Data Sheet for details of the various settings. 1.2.1 Input and Output Capacitors C2, C3, and C4 are provided for additional input capacitors. These capacitors are not required for proper operation but can be used to reduce the input voltage ripple. 2 TPSM8290x Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated SNVU796 – MARCH 2022 Submit Document Feedback www.ti.com Introduction C7, C8, C9, and C10 are provided for additional bulk output capacitors. These capacitors are not required for proper operation but can be used to reduce the output voltage ripple. The total output capacitance must remain within the recommended range in the TPSM82903, 3-A, 3-V to 17-V, High Efficiency and Low IQ Buck Converter Module in a MicroSiPTM Package with an Integrated Inductor Data Sheet for proper operation. 1.2.2 Configurable Enable Threshold Voltage With JP2 removed, R3 and R4 can be installed to set a user-selectable input voltage at which the IC turns on. 1.2.3 SS/TR Capacitor C12 sets the soft-start time. This capacitor can be changed to set other soft-start times. 1.2.4 Feedforward Capacitor C11 is provided as an optional feedforward capacitor (CFF). 1.2.5 MODE/S-CONF Resistor R7 selects the switching frequency, output discharge, MODE setting, and output voltage setting configuration. When using the VSET configuration for setting the output voltage, remove R2 and change the value of R5. See the TPSM82903, 3-A, 3-V to 17-V, High Efficiency and Low IQ Buck Converter Module in a MicroSiPTM Package with an Integrated Inductor Data Sheet for details of the various settings. 2 Setup This section describes how to properly use the EVM. 2.1 Input/Output Connector Descriptions J2, Pin 1 and 2 – VIN Positive input connection from the input supply for the EVM J2, Pin 3 and 4 – S+/S- Input voltage sense connections. Measure the input voltage at this point. J2, Pin 5 and 6 – GND Return connection from the input supply for the EVM J3, Pin 1 and 2 – VOUT Output voltage connection J3, Pin 3 and 4 – S+/S- Output voltage sense connections. Measure the output voltage at this point. J3, Pin 5 and 6 – GND Output return connection J4 – PG/GND The PG output is on pin 1 of this header with a convenient ground on pin 2. J5 – TRACK-IN/SS/TR/GND By removing C12, the IC tracks an externally applied voltage. Apply the voltage on pin 1 to scale the applied voltage through R8 and R9. The SS/TR voltage can be measured on pin 2. JP1 – PG Pullup Voltage PG pin pullup voltage jumper. Place the supplied jumper on JP1 to connect the PG pin pullup resistor to VOUT. Alternatively, the jumper can be removed and a different voltage can be supplied on pin 1 to pull up the PG pin to a different level. This externally applied voltage must remain below 18 V. JP2 – EN EN pin input jumper. Place the supplied jumper across ON and EN to turn on the IC. Place the jumper across OFF and EN to turn off the IC. Remove the jumper to set a configurable enable threshold voltage with R3 and R4. JP3 – MODE/SCONF MODE/S-CONF pin input jumper. Place the supplied jumper across PWM and MODE/S-CONF to operate the IC in forced PWM mode. Place the jumper across PFM/PWM and MODE/S-CONF to operate the IC in auto PFM/PWM mode. Remove the jumper to operate the IC with the MODE/S-CONF settings set by R7. Note If it is desired to change between PWM and PFM/PWM modes during operation, JP3 must be set to either PWM or PFM/PWM before enabling the IC. SNVU796 – MARCH 2022 Submit Document Feedback TPSM8290x Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 3 Safety Instructions www.ti.com 3 Safety Instructions WARNING Hot surface. Contact may cause burns. Do not touch. 4 Test Results The TPSM8290xEVM was used to take all the data in the TPSM82903, 3-A, 3-V to 17-V, High Efficiency and Low IQ Buck Converter Module in a MicroSiPTM Package with an Integrated Inductor Data Sheet. See the device data sheet for the performance of this EVM. Figure 4-1 shows the thermal performance of the EVM. "Spot" shows the temperature of the PCB. Figure 4-1. Thermal Performance (VIN = 12 V, VOUT = 1.2 V, IOUT = 3000 mA, JP3 Open) 4 TPSM8290x Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated SNVU796 – MARCH 2022 Submit Document Feedback www.ti.com Board Layout 5 Board Layout This section provides the EVM board layout and illustrations in Figure 5-1 through Figure 5-5. The Gerbers are available on the EVM product page. Figure 5-1. Top Assembly SNVU796 – MARCH 2022 Submit Document Feedback TPSM8290x Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 5 Board Layout www.ti.com Figure 5-2. Top Layer 6 TPSM8290x Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated SNVU796 – MARCH 2022 Submit Document Feedback www.ti.com Board Layout Figure 5-3. Internal Layer 1 SNVU796 – MARCH 2022 Submit Document Feedback TPSM8290x Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 7 Board Layout www.ti.com Figure 5-4. Internal Layer 2 8 TPSM8290x Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated SNVU796 – MARCH 2022 Submit Document Feedback www.ti.com Board Layout Figure 5-5. Bottom Layer SNVU796 – MARCH 2022 Submit Document Feedback TPSM8290x Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 9 Schematic and Bill of Materials www.ti.com 6 Schematic and Bill of Materials This section provides the EVM schematic and bill of materials (BOM). 6.1 Schematic Figure 6-1, Figure 6-2, and Figure 6-3 illustrate the EVM schematics. U1 J2 VIN 1 2 3 4 5 6 VIN 3V to 17V S+ SGND 1 2 C1 47uF C2 10uF C3 10uF C4 10uF C5 10uF EN MODE S S /TR ON EN OFF MODE/S-CONF SS/TR PG GND R2 113k 8 7 FB/VSET 6 PG C11 22pF C6 22uF C7 22uF C8 22uF C9 22uF VOUT 2 3 4 5 6 C10 47uF S+ SGND R5 24.9k 11 PG P ULL-UP VOUT 2 1 VOUT J P1 R4 100k GND P WM MODE/S-CONF P FM/PWM 5 SW/NC FB/VSET VOUT 1 9 10 1.00M J P2 1 2 3 4 EN VOUT VOUT TPSM82901SISR R3 VIN 1 2 3 3 J3 VIN VIN R6 100k VIN J4 PG R7 7.15k J P3 1 2 PG GND R8 1 2 3 TRACK-IN S S /TR GND J5 100k R9 100k C12 3300pF Figure 6-1. TPSM82901EVM Schematic 10 TPSM8290x Step-Down Converter Evaluation Module User's Guide SNVU796 – MARCH 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Schematic and Bill of Materials U1 J2 VIN 1 2 3 4 5 6 VIN 3V to 17V S+ SGND 1 2 C1 47uF C2 10uF C3 10uF C4 10uF C5 10uF EN MODE S S /TR MODE/S-CONF SS/TR PG GND R2 200k 8 7 FB/VSET 6 PG C11 22pF C6 22uF C7 22uF C8 22uF C9 22uF VOUT 2 3 4 5 6 C10 47uF S+ SGND R5 100k 11 PG P ULL-UP VOUT 2 1 VOUT J P1 R4 100k GND P WM MODE/S-CONF P FM/PWM 5 SW/NC FB/VSET VOUT 1 9 10 1.00M J P2 1 2 3 4 EN VOUT VOUT TPSM82902SISR R3 VIN 1 2 3 ON EN OFF 3 J3 VIN VIN R6 100k VIN J4 PG R7 7.15k J P3 1 2 PG GND R8 1 2 3 TRACK-IN S S /TR GND J5 100k R9 100k C12 3300pF Figure 6-2. TPSM82902EVM Schematic SNVU796 – MARCH 2022 Submit Document Feedback TPSM8290x Step-Down Converter Evaluation Module User's Guide Copyright © 2022 Texas Instruments Incorporated 11 Schematic and Bill of Materials www.ti.com U1 J2 VIN 1 2 3 4 5 6 VIN 3V to 17V S+ SGND 1 2 C1 47uF C2 10uF C3 10uF C4 10uF C5 10uF EN MODE S S /TR MODE/S-CONF SS/TR PG GND R2 100k 8 7 FB/VSET 6 PG C11 22pF C6 22uF C7 22uF C8 22uF C9 22uF VOUT 2 3 4 5 6 C10 47uF S+ SGND R5 100k 11 PG P ULL-UP VOUT 2 1 VOUT J P1 R4 100k GND P WM MODE/S-CONF P FM/PWM 5 SW/NC FB/VSET VOUT 1 9 10 1.00M J P2 1 2 3 4 EN VOUT VOUT TPSM82903SISR R3 VIN 1 2 3 ON EN OFF 3 J3 VIN VIN R6 100k VIN J4 PG R7 7.15k J P3 1 2 PG GND R8 1 2 3 TRACK-IN S S /TR GND J5 100k R9 100k C12 3300pF Figure 6-3. TPSM82903EVM Schematic 12 TPSM8290x Step-Down Converter Evaluation Module User's Guide SNVU796 – MARCH 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Schematic and Bill of Materials 6.2 Bill of Materials Table 6-1 lists the BOM for this EVM. Table 6-1. TPSM8290xEVM Bill of Materials -001 -002 -003 Reference Designator 1 1 1 C1 47 µF CAP, TA, 47 µF, 35 V, ±10%, 0.3 Ω 7343-43 1 1 1 C5 10 µF CAP, CERM, 10 µF, 25 V, ±10%, X7R 1206 C3216X7R1E106K160AE TDK 1 1 1 C6 22 µF CAP, CERM, 22 µF, 10 V, ±20%, X7S 0805 C2012X7S1A226M125AC TDK 1 1 1 C12 3300 pF CAP, CERM, 3300 pF, 50 V, ±5%, C0G/NP0 0603 GRM1885C1H332JA01D muRata 1 0 0 R2 113 kΩ RES, 113 k, 1%, 0.1 W, 0603 0603 Std Std 0 1 0 R2 200 kΩ RES, 200 kΩ, 1%, 0.1 W 0603 Std Std 0 0 1 R2 100 kΩ RES, 100 kΩ, 1%, 0.1 W 0603 Std Std 0 1 1 R5 100 kΩ RES, 100 kΩ, 1%, 0.1 W 0603 Std Std 1 0 0 R5 24.5 kΩ RES, 24.9 k, 1%, 0.1 W, 0603 0603 Std Std 1 1 1 R6 100 kΩ RES, 100 k, 1%, 0.1 W, 0603 0603 Std Std 1 1 1 R7 7.15 kΩ RES, 7.15 kΩ, 1%, 0.1 W 0603 Std Std 1 0 0 U1 TPSM82901(1) 3-V to 17-V, Low IQ Buck Converter Module in MicroSiP Package with Integrated Inductor 3 × 2.8 mm TPSM82901SISR Texas Instruments 0 1 0 U1 TPSM82902(1) 3-V to 17-V, Low IQ Buck Converter Module in MicroSiP Package with Integrated Inductor 3 × 2.8 mm TPSM82902SISR Texas Instruments 0 0 1 U1 TPSM82903(1) 3-V to 17-V, Low IQ Buck Converter Module in MicroSiP Package with Integrated Inductor 3 × 2.8 mm TPSM82903SISR Texas Instruments (1) Value Description Package Part Number Manufacturer T495X476K035ATE300 Kemet The TPSM8290xEVM may be populated with TPSM8290x (U1) devices that do not contain the correct top-side markings on the top of the device itself. 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