PROCESS
CP792V
Small Signal Transistor
PNP - Amp/Switch Transistor Chip
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 93,826 PRINCIPAL DEVICE TYPES 2N3906 CMKT3906 CMLT3906E CMPT3906 CMPT3906E CMST3906 CXT3906 CZT3906
R0
EPITAXIAL PLANAR 11 x 11 MILS 7.0 MILS 3.7 x 3.7 MILS 3.7 x 3.7 MILS Al - 30,000Å Au - 18,000Å
BACKSIDE COLLECTOR 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R1 (15 -April 2005)
Central
TM
PROCESS
CP792V
Semiconductor Corp.
Typical Electrical Characteristics
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R1 (15 -April 2005)
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