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CY62256LL-70ZRXIT

CY62256LL-70ZRXIT

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    TSSOP28

  • 描述:

    IC SRAM 256KBIT PAR 28TSOP I

  • 数据手册
  • 价格&库存
CY62256LL-70ZRXIT 数据手册
CY62256 256K (32K x 8) Static RAM Functional Description[1] Features • High speed — 55 ns • Temperature Ranges — Commercial: 0°C to 70°C — Industrial: –40°C to 85°C — Automotive: –40°C to 125°C • Voltage range — 4.5V – 5.5V • Low active power and standby power • Easy memory expansion with CE and OE features • TTL-compatible inputs and outputs • Automatic power-down when deselected • CMOS for optimum speed/power • Available in a Pb-free and non Pb-free standard 28-pin narrow SOIC, 28-pin TSOP-1, 28-pin Reverse TSOP-1 and 28-pin DIP packages The CY62256 is a high-performance CMOS static RAM organized as 32K words by 8 bits. Easy memory expansion is provided by an active LOW chip enable (CE) and active LOW output enable (OE) and Tri-state drivers. This device has an automatic power-down feature, reducing the power consumption by 99.9% when deselected. An active LOW write enable signal (WE) controls the writing/reading operation of the memory. When CE and WE inputs are both LOW, data on the eight data input/output pins (I/O0 through I/O7) is written into the memory location addressed by the address present on the address pins (A0 through A14). Reading the device is accomplished by selecting the device and enabling the outputs, CE and OE active LOW, while WE remains inactive or HIGH. Under these conditions, the contents of the location addressed by the information on address pins are present on the eight data input/output pins. The input/output pins remain in a high-impedance state unless the chip is selected, outputs are enabled, and write enable (WE) is HIGH. Logic Block Diagram I/O0 INPUTBUFFER I/O1 32K × 8 ARRAY I/O2 SENSE AMPS ROW DECODER A10 A9 A8 A7 A6 A5 A4 A3 A2 I/O3 I/O4 I/O5 CE WE COLUMN DECODER I/O6 POWER DOWN I/O7 A12 A11 A1 A0 A13 A14 OE Note: 1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com. Cypress Semiconductor Corporation Document #: 38-05248 Rev. *F • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised August 3, 2006 CY62256 Product Portfolio Power Dissipation Operating, ICC (mA) VCC Range (V) Product CY62256L Com’l/Ind’l CY62256LL Commercial CY62256LL Industrial CY62256LL Automotive Standby, ISB2 (µA) Min. Typ.[2] Max. Speed (ns) Typ.[2] Max. Typ.[2] Max. 4.5 5.0 5.5 55/70 25 50 2 50 70 25 50 0.1 5 55/70 25 50 0.1 10 55 25 50 0.1 15 Pin Configurations Narrow SOIC Top View A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 I/O0 I/O1 I/O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 DIP Top View VCC WE A4 A3 A2 A1 OE A0 CE I/O7 I/O6 I/O5 I/O4 I/O3 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 I/O0 I/O1 I/O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC WE A4 A3 A2 A1 OE A0 CE I/O7 I/O6 I/O5 I/O4 I/O3 OE A1 A2 A3 A4 WE VCC A5 A6 A7 A8 A9 A10 A11 A11 A10 A9 A8 A7 A6 A5 VCC WE A4 A3 A2 A1 OE 21 22 23 24 25 26 27 28 1 2 3 4 5 6 7 TSOP I Top View (not to scale) 8 9 7 6 5 4 3 2 1 28 27 26 25 24 23 22 20 19 18 17 16 15 14 13 12 11 10 9 8 TSOP I Reverse Pinout Top View (not to scale) 10 11 12 13 14 15 16 17 18 19 20 21 A0 CE I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A14 A13 A12 A12 A13 A14 I/O0 I/O1 I/O2 GND I/O3 I/O4 I/O5 I/O6 I/O7 CE A0 Pin Definitions Pin Number Type Description 1–10, 21, 23–26 Input A0–A14. Address Inputs 11–13, 15–19, Input/Output I/O0–/O7. Data lines. Used as input or output lines depending on operation 27 Input/Control WE. When selected LOW, a WRITE is conducted. When selected HIGH, a READ is conducted 20 Input/Control CE. When LOW, selects the chip. When HIGH, deselects the chip 22 Input/Control OE. Output Enable. Controls the direction of the I/O pins. When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are Tri-stated, and act as input data pins 14 Ground GND. Ground for the device 28 Power Supply VCC. Power supply for the device Note: 2. Typical specifications are the mean values measured over a large sample size across normal production process variations and are taken at nominal conditions (TA = 25°C, VCC). Parameters are guaranteed by design and characterization, and not 100% tested. Document #: 38-05248 Rev. *F Page 2 of 14 CY62256 DC Input Voltage[3] ................................ –0.5V to VCC + 0.5V Maximum Ratings Output Current into Outputs (LOW)............................. 20 mA (Above which the useful life may be impaired. For user guidelines, not tested.) Static Discharge Voltage.......................................... > 2001V (per MIL-STD-883, Method 3015) Storage Temperature ................................. –65°C to +150°C Latch-up Current.................................................... > 200 mA Ambient Temperature with Power Applied............................................. –55°C to +125°C Operating Range Supply Voltage to Ground Potential (Pin 28 to Pin 14) .............................................. –0.5V to +7V DC Voltage Applied to Outputs in High-Z State[3] ....................................–0.5V to VCC + 0.5V Range Ambient Temperature (TA)[4] VCC Commercial 0°C to +70°C 5V ± 10% Industrial –40°C to +85°C 5V ± 10% Automotive –40°C to +125°C 5V ± 10% Electrical Characteristics Over the Operating Range CY62256−55 Parameter Description Test Conditions Min. Typ.[2] CY62256−70 Max. VOH Output HIGH Voltage VCC = Min., IOH = −1.0 mA VOL Output LOW Voltage VCC = Min., IOL = 2.1 mA VIH Input HIGH Voltage 2.2 VCC +0.5V VIL Input LOW Voltage –0.5 IIX Input Leakage Current IOZ Output Leakage Current GND < VO < VCC, Output Disabled ICC VCC Operating Supply Current ISB1 ISB2 Unit Max. 2.4 V 0.4 GND < VI < VCC VCC = 5.5V, IOUT = 0 mA, f = fMax = 1/tRC 2.4 Min. Typ.[2] 0.4 V 2.2 VCC +0.5V V 0.8 –0.5 0.8 V –0.5 +0.5 –0.5 +0.5 µA –0.5 +0.5 –0.5 +0.5 µA mA L 25 50 25 50 LL 25 50 25 50 Automatic CE VCC = 5.5V, CE > VIH, Power-down Current— VIN > VIH or VIN < VIL, TTL Inputs f = fMax L 0.4 0.6 0.4 0.6 LL 0.3 0.5 0.3 0.5 VCC = 5.5V, Automatic CE Power-down Current— CE > VCC − 0.3V CMOS Inputs VIN > VCC − 0.3V, or VIN < 0.3V, f = 0 L 2 50 2 50 0.1 5 0.1 5 LL - Ind’l 0.1 10 0.1 10 LL - Auto 0.1 15 LL - Com’l mA µA Capacitance[5] Parameter Description CIN Input Capacitance COUT Output Capacitance Test Conditions TA = 25°C, f = 1 MHz, VCC = VCC(typ.) Max. Unit 6 pF 8 pF Thermal Resistance[5] Parameter Description ΘJA Thermal Resistance (Junction to Ambient) ΘJC Thermal Resistance (Junction to Case) Test Conditions DIP SOIC TSOP RTSOP Unit Still Air, soldered on a 4.25 x 1.125 inch, 2-layer printed circuit board 75.61 76.56 93.89 93.89 °C/W 43.12 36.07 24.64 24.64 °C/W Notes: 3. VIL (min.) = −2.0V for pulse durations of less than 20 ns. 4. TA is the “Instant-On” case temperature. 5. Tested initially and after any design or process changes that may affect these parameters. Document #: 38-05248 Rev. *F Page 3 of 14 CY62256 AC Test Loads and Waveforms R1 1800Ω R1 1800Ω 5V 5V ALL INPUT PULSES 3.0V OUTPUT OUTPUT R2 990Ω 100 pF INCLUDING JIG AND SCOPE R2 990Ω 5 pF INCLUDING JIG AND SCOPE (a) Equivalent to: 90% 10% 90% 10% GND < 5 ns < 5 ns (b) THEVENIN EQUIVALENT 639Ω OUTPUT 1.77V Data Retention Characteristics Parameter Conditions[6] Description VDR VCC for Data Retention ICCDR Data Retention Current Typ.[2] Min. Max. 2.0 Unit V VCC = 2.0V, CE > VCC − 0.3V, VIN > VCC − 0.3V, or VIN < 0.3V 2 50 µA 0.1 5 µA LL - Ind’l 0.1 10 µA LL - Auto 0.1 10 µA L LL - Com’l tCDR[5] Chip Deselect to Data Retention Time tR[5] Operation Recovery Time 0 ns tRC ns Data Retention Waveform DATA RETENTION MODE VCC VCC(min) tCDR VDR > 2V VCC(min) tR CE Note: 6. No input may exceed VCC + 0.5V. Document #: 38-05248 Rev. *F Page 4 of 14 CY62256 Switching Characteristics Over the Operating Range[7] CY62256−55 Parameter Description Min. Max. CY62256−70 Min. Max. Unit Read Cycle tRC Read Cycle Time 55 tAA Address to Data Valid tOHA Data Hold from Address Change tACE CE LOW to Data Valid 55 70 ns tDOE OE LOW to Data Valid 25 35 ns tLZOE OE LOW to Low-Z[8] 55 5 OE HIGH to tLZCE CE LOW to Low-Z[8] tHZCE CE HIGH to tPU CE LOW to Power-up tPD CE HIGH to Power-down 70 5 ns 25 5 20 0 ns ns 25 0 55 ns ns 5 20 High-Z[8, 9] ns 5 5 High-Z[8, 9] tHZOE 70 ns ns 70 ns Write Cycle[10, 11] tWC Write Cycle Time 55 70 ns tSCE CE LOW to Write End 45 60 ns tAW Address Set-up to Write End 45 60 ns tHA Address Hold from Write End 0 0 ns tSA Address Set-up to Write Start 0 0 ns tPWE WE Pulse Width 40 50 ns tSD Data Set-up to Write End 25 30 ns tHD Data Hold from Write End 0 0 ns High-Z[8, 9] tHZWE WE LOW to tLZWE WE HIGH to Low-Z[8] 20 5 25 5 ns ns Notes: 7. Test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 100 pF load capacitance. 8. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 9. tHZOE, tHZCE, and tHZWE are specified with CL = 5 pF as in (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage. 10. The internal Write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a Write and either signal can terminate a Write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the Write. 11. The minimum Write cycle time for Write Cycle #3 (WE controlled, OE LOW) is the sum of tHZWE and tSD. Document #: 38-05248 Rev. *F Page 5 of 14 CY62256 Switching Waveforms Read Cycle No. 1 (Address Transition Controlled)[12, 13] tRC ADDRESS tOHA DATA OUT tAA DATA VALID PREVIOUS DATA VALID Read Cycle No. 2 (OE Controlled)[13, 14] t RC CE tACE OE t HZOE tHZCE tDOE t LZOE HIGH IMPEDANCE HIGH IMPEDANCE DATA VALID DATA OUT tLZCE t PD t PU ICC VCC SUPPLY CURRENT 50% 50% ISB Write Cycle No. 1 (WE Controlled)[10, 15, 16] tWC ADDRESS CE tAW tSA WE tHA t PWE OE tSD DATA I/O NOTE 17 tHD DATAINVALID t HZOE Notes: 12. Device is continuously selected. OE, CE = VIL. 13. WE is HIGH for Read cycle. 14. Address valid prior to or coincident with CE transition LOW. 15. Data I/O is high impedance if OE = VIH. 16. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state. 17. During this period, the I/Os are in output state and input signals should not be applied. Document #: 38-05248 Rev. *F Page 6 of 14 CY62256 Switching Waveforms (continued) Write Cycle No. 2 (CE Controlled)[10, 15, 16] tWC ADDRESS tSCE CE tSA tAW tHA WE tSD DATA I/O t HD DATAINVALID Write Cycle No. 3 (WE Controlled, OE LOW)[11, 16] tWC ADDRESS CE tAW t HA tSA WE tSD DATA I/O NOTE 17 DATA INVALID t HZWE Document #: 38-05248 Rev. *F t HD tLZWE Page 7 of 14 CY62256 Typical DC and AC Characteristics 1.4 1.0 0.8 0.6 VIN = 5.0V TA = 25°C 0.4 2.5 1.0 2.0 0.8 0.6 VCC = 5.0V VIN = 5.0V 0.4 4.5 5.0 5.5 25 1.4 1.6 1.3 1.4 NORMALIZED tAA NORMALIZED tAA 125 NORMALIZED ACCESS TIME vs. AMBIENT TEMPERATURE NORMALIZED ACCESS TIME vs. SUPPLY VOLTAGE 1.2 1.1 TA = 25°C 1.0 1.2 1.0 VCC = 5.0V 0.8 0.9 4.5 5.0 5.5 VCC = 5.0V VIN = 5.0V –0.5 −55 0.6 −55 6.0 25 125 AMBIENT TEMPERATURE (°C) OUTPUT SOURCE CURRENT (mA) SUPPLY VOLTAGE (V) 25 105 AMBIENT TEMPERATURE (°C) AMBIENT TEMPERATURE (°C) SUPPLY VOLTAGE (V) 0.8 4.0 1.0 0.0 0.0 −55 6.0 ISB 1.5 0.5 0.2 ISB 0.0 4.0 1.2 OUTPUT SINK CURRENT (mA) 0.2 3.0 ICC ISB2 µA 1.2 NORMALIZED ICC NORMALIZED ICC, ISB 1.4 ICC STANDBY CURRENT vs. AMBIENT TEMPERATURE NORMALIZED SUPPLY CURRENT vs. AMBIENT TEMPERATURE NORMALIZED SUPPLY CURRENT vs. SUPPLY VOLTAGE OUTPUT SINK CURRENT vs. OUTPUT VOLTAGE 140 120 100 80 60 VCC = 5.0V TA = 25°C 40 20 0 0.0 1.0 2.0 3.0 4.0 OUTPUT VOLTAGE (V) OUTPUT SOURCE CURRENT vs. OUTPUT VOLTAGE 120 100 80 VCC = 5.0V TA = 25°C 60 40 20 0 0.0 1.0 2.0 3.0 4.0 OUTPUT VOLTAGE (V) Document #: 38-05248 Rev. *F Page 8 of 14 CY62256 Typical DC and AC Characteristics (continued) TYPICAL ACCESS TIME CHANGE vs. OUTPUT LOADING 30.0 2.5 25.0 2.0 1.5 1.0 20.0 15.0 VCC = 4.5V TA = 25°C 10.0 NORMALIZED ICC vs. CYCLE TIME 1.00 VCC =5.0V TA = 2 5°C VIN = 0.5V 0.75 5.0 0.5 0.0 0.0 1.25 NORMALIZED ICC 3.0 DELTA tAA (ns) NORMALIZED IPO TYPICAL POWER-ON CURRENT vs. SUPPLY VOLTAGE 1.0 2.0 3.0 4.0 5.0 0.0 0 SUPPLY VOLTAGE (V) 200 400 600 800 1000 CAPACITANCE (pF) 0.50 10 20 30 40 CYCLE FREQUENCY (MHz) Truth Table CE WE OE Inputs/Outputs H X X High-Z Deselect/Power-down Standby (ISB) L H L Data Out Read Active (ICC) L L X Data In Write Active (ICC) L H H High-Z Output Disabled Active (ICC) Document #: 38-05248 Rev. *F Mode Power Page 9 of 14 CY62256 Ordering Information Speed (ns) 55 Ordering Code CY62256LL−55SNI Package Diagram Package Type 51-85092 28-pin (300-mil Narrow Body) SNC CY62256LL−55SNXI 51-85071 28-pin TSOP I (Pb-free) CY62256LL−55SNE 51-85092 28-pin (300-mil Narrow Body) SNC CY62256LL−55SNXE 51-85071 28-pin TSOP I 28-pin TSOP I (Pb-free) CY62256LL−55ZRXE 51-85074 28-pin Reverse TSOP I (Pb-free) CY62256LL−70PC 51-85017 28-pin (600-Mil) Molded DIP CY62256LL−70PXC CY62256L−70SNC 51-85092 28-pin (300-mil Narrow Body) SNC 28-pin (300-mil Narrow Body) SNC (Pb-free) CY62256LL−70SNC 28-pin (300-mil Narrow Body) SNC CY62256LL−70SNXC 28-pin (300-mil Narrow Body) SNC (Pb-free) 51-85071 CY62256LL−70ZXC CY62256L–70SNI 28-pin TSOP I 28-pin TSOP I (Pb-free) 51-85092 28-pin (300-mil Narrow Body) SNC CY62256L–70SNXI 28-pin (300-mil Narrow Body) SNC (Pb-free) CY62256LL−70SNI 28-pin (300-mil Narrow Body) SNC CY62256LL−70SNXI 28-pin (300-mil Narrow Body) SNC (Pb-free) CY62256LL−70ZXI 51-85071 28-pin TSOP I (Pb-free) CY62256LL−70ZRI 51-85074 28-pin Reverse TSOP I CY62256LL−70ZRXI Commercial 28-pin (600-Mil) Molded DIP (Pb-free) CY62256L−70SNXC CY62256LL−70ZC Automotive 28-pin (300-mil Narrow Body) SNC (Pb-free) CY62256LL−55ZXE 70 Industrial 28-pin (300-mil Narrow Body) SNC (Pb-free) CY62256LL−55ZXI CY62256LL−55ZE Operating Range Industrial 28-pin Reverse TSOP I (Pb-free) Please contact your local Cypress sales representative for availability of these parts Document #: 38-05248 Rev. *F Page 10 of 14 CY62256 Package Diagrams 28-pin (600-mil) Molded DIP (51-85017) 14 MIN. MAX. DIMENSIONS IN INCHES REFERENCE JEDEC Ms-020 1 0.530 0.550 15 28 0.070 0.090 SEATING PLANE 1.380 1.480 0.140 0.195 0.155 0.200 0.115 0.160 0.009 0.012 0.015 0.060 0.090 0.110 0.055 0.065 0.600 0.625 0.014 0.022 3° MIN. 0.610 0.700 51-85017-*B 28-pin (300-mil) SNC (Narrow Body) (51-85092) 51-85092-*B Document #: 38-05248 Rev. *F Page 11 of 14 CY62256 Package Diagrams (continued) 28-pin Thin Small Outline Package Type 1 (8 x 13.4 mm) (51-85071) 51-85071-*G Document #: 38-05248 Rev. *F Page 12 of 14 CY62256 Package Diagrams (continued) 28-pin Reverse Thin Small Outline Package Type 1 (8x13.4 mm) (51-85074) 51-85074-*F All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05248 Rev. *F Page 13 of 14 © Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY62256 Document History Page Document Title: CY62256, 256K (32K x 8) Static RAM Document Number: 38-05248 REV. ECN NO. Issue Date Orig. of Change ** 113454 03/06/02 MGN Description of Change Change from Spec number: 38-00455 to 38-05248 Remove obsolete parts from ordering info, standardize format *A 115227 05/23/02 GBI Changed SN Package Diagram *B 116506 09/04/02 GBI Added footnote 1 Corrected package description in Ordering Information table *C 238448 See ECN AJU Added Automotive product information *D 344595 See ECN SYT Added Pb-free packages on page# 10 *E 395936 See ECN SYT Changed address of Cypress Semiconductor Corporation on Page# 1 from “3901 North First Street” to “198 Champion Court” Added CY62256L–70SNXI package in the Ordering Information on Page # 10 *F 493277 See ECN VKN Updated Ordering Information table Document #: 38-05248 Rev. *F Page 14 of 14
CY62256LL-70ZRXIT 价格&库存

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CY62256LL-70ZRXIT
  •  国内价格
  • 100+9.78287
  • 500+9.43961
  • 1000+8.83891

库存:0