CY7C1019BV33-10VC

019V33 CY7C1019BV33 CY7C1018BV33 128K x 8 Static RAM Features • High speed — tAA = 10 ns • CMOS for optimum speed/power • Center power/ground pinout • Automatic power-down when deselected • Easy memory expansion with CE and OE options • Functionally equivalent to CY7C1019V33 and/or CY7C1018V33 Writing to the device is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. Data on the eight I/O pins (I/O0 through I/O7) is then written into the location specified on the address pins (A0 through A16). Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing Write Enable (WE) HIGH. Under these conditions, the contents of the memory location specified by the address pins will appear on the I/O pins. The eight input/output pins (I/O0 through I/O7) are placed in a high-impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), or during a write operation (CE LOW, and WE LOW). The CY7C1019BV33 is available in standard 32-pin TSOP Type II and 400-mil-wide package. The CY7C1018BV33 is available in a standard 300-mil-wide package. Functional Description The CY7C1019BV33/CY7C1018BV33 is a high-performance CMOS static RAM organized as 131,072 words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE), an active LOW Output Enable (OE), and three-state drivers. This device has an automatic power-down feature that significantly reduces power consumption when deselected. Logic Block Diagram Pin Configurations SOJ / TSOPII Top View A0 A1 A2 A3 CE I/O0 I/O1 VCC V SS I/O2 I/O3 WE A4 A5 A6 A7 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 A16 A15 A14 A13 OE I/O7 I/O6 VSS VCC I/O5 I/O4 A12 A11 A10 A9 A8 I/O0 INPUT BUFFER A0 A1 A2 A3 A4 A5 A6 A7 A8 I/O1 ROW DECODER I/O2 SENSE AMPS 512 x 256 x 8 ARRAY I/O3 I/O4 I/O5 I/O6 CE WE OE COLUMN DECODER POWER DOWN I/O7 Selection Guide 7C1019BV33-10 7C1018BV33-10 Maximum Access Time (ns) Maximum Operating Current (mA) Maximum Standby Current (mA) L 10 175 5 − 7C1019BV33-12 7C1018BV33-12 12 160 5 0.5 7C1019BV33-15 7C1018BV33-15 15 145 5 0.5 A9 A 10 A 11 A 12 A 13 A 14 A 15 A 16 Cypress Semiconductor Corporation • 3901 North First Street • San Jose • CA 95134 • 408-943-2600 June 11, 2001 CY7C1019BV33 CY7C1018BV33 Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................. –65°C to +150°C Ambient Temperature with Power Applied ............................................. –55°C to +125°C Supply Voltage on VCC to Relative GND[1] .... –0.5V to +7.0V DC Voltage Applied to Outputs in High Z State[1] .................................... –0.5V to VCC + 0.5V DC Input Voltage[1] ................................. –0.5V to VCC + 0.5V Current into Outputs (LOW)......................................... 20 mA Static Discharge Voltage ........................................... >2001V (per MIL-STD-883, Method 3015) Latch-Up Current..................................................... >200 mA Operating Range Range Commercial Ambient Temperature[2] 0°C to +70°C VCC 3.3V ± 10% Electrical Characteristics Over the Operating Range 7C1019BV33-10 7C1019BV33-12 7C1019BV33-15 7C1018BV33-10 7C1018BV33-12 7C1018BV33-15 Parameter VOH VOL VIH VIL IIX IOZ ICC Description Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage[1] Input Load Current Output Leakage Current VCC Operating Supply Current Automatic CE Power-Down Current — TTL Inputs Automatic CE Power-Down Current — CMOS Inputs GND < VI < VCC GND < VI < VCC, Output Disabled VCC = Max., IOUT = 0 mA, f = fMAX = 1/tRC Max. VCC, CE > VIH VIN > VIH or VIN < VIL, f = fMAX Max. VCC, CE > VCC – 0.3V, VIN > VCC – 0.3V, or VIN < 0.3V, f = 0 L Test Conditions VCC = Min., IOH = – 4.0 mA VCC = Min., IOL = 8.0 mA 2.2 –0.3 –1 –5 Min. 2.4 0.4 VCC + 0.3 0.8 +1 +5 175 2.2 –0.3 –1 –5 Max. Min. 2.4 0.4 VCC + 0.3 0.8 +1 +5 160 2.2 –0.3 –1 –5 Max. Min. 2.4 0.4 VCC + 0.3 0.8 +1 +5 145 Max. Unit V V V V µA µA mA ISB1 20 20 20 mA ISB2 5 − 5 0.5 5 0.5 mA Capacitance[3] Parameter CIN COUT Description Input Capacitance Output Capacitance Test Conditions TA = 25°C, f = 1 MHz, VCC = 5.0V Max. 6 8 Unit pF pF Notes: 1. VIL (min.) = –2.0V for pulse durations of less than 20 ns. 2. TA is the “Instant On” case temperature. 3. Tested initially and after any design or process changes that may affect these parameters. 2 CY7C1019BV33 CY7C1018BV33 AC Test Loads and Waveforms R1 480 Ω R1 480 Ω 3.3V OUTPUT 30 pF INCLUDING JIG AND SCOPE (a) R2 255 Ω 5 pF INCLUDING JIG AND SCOPE (b) R2 255 Ω GND ≤ 3 ns 3.0V 90% 10% 90% 10% ≤ 3 ns ALL INPUT PULSES 3.3V OUTPUT Equivalent to: THÉVENIN EQUIVALENT 167 Ω 1.73V OUTPUT Switching Characteristics[4] Over the Operating Range 7C1019BV33-10 7C1018BV33-10 Parameter READ CYCLE tRC tAA tOHA tACE tDOE tLZOE tHZOE tLZCE tHZCE tPU tPD tWC tSCE tAW tHA tSA tPWE tSD tHD tLZWE tHZWE Read Cycle Time Address to Data Valid Data Hold from Address Change CE LOW to Data Valid OE LOW to Data Valid OE LOW to Low Z OE HIGH to High CE LOW to Low Z[5, 6] 3 5 0 10 10 8 7 0 0 7 5 0 3 5 12 9 8 0 0 8 6 0 3 6 0 12 15 10 10 0 0 10 8 0 3 7 Z[6] 0 5 3 6 0 15 3 10 5 0 6 3 7 10 10 3 12 6 0 7 12 12 3 15 7 15 15 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Description Min. Max. 7C1019BV33-12 7C1018BV33-12 Min. Max. 7C1019BV33-15 7C1018BV33-15 Min. Max. Unit CE HIGH to High Z[5, 6] CE LOW to Power-Up CE HIGH to Power-Down [7, 8] WRITE CYCLE Write Cycle Time CE LOW to Write End Address Set-Up to Write End Address Hold from Write End Address Set-Up to Write Start WE Pulse Width Data Set-Up to Write End Data Hold from Write End WE HIGH to Low Z[6] WE LOW to High Z[5, 6] Notes: 4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 30-pF load capacitance. 5. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage. 6. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 7. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. CE and WE must be LOW to initiate a write, and the transition of any of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write. 8. The minimum write cycle time for Write Cycle no. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD. 3 CY7C1019BV33 CY7C1018BV33 Data Retention Characteristics Over the Operating Range (L Version Only) Parameter VDR ICCDR tCDR tR [3] Description VCC for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time Conditions No input may exceed VCC + 0.5V VCC = VDR = 2.0V, CE > VCC – 0.3V, VIN > VCC – 0.3V or VIN < 0.3V Min. 2.0 Max. 150 Unit V µA ns µs 0 200 Data Retention Waveform DATA RETENTION MODE VCC 3.0V tCDR CE VDR > 2V 3.0V tR Switching Waveforms Read Cycle No. 1[9, 10] tRC ADDRESS tAA tOHA DATA OUT PREVIOUS DATA VALID DATA VALID Read Cycle No. 2 (OE Controlled)[10, 11] ADDRESS tRC CE tACE OE tHZOE tDOE DATA OUT VCC SUPPLY CURRENT tLZOE HIGH IMPEDANCE tLZCE tPU 50% tHZCE DATA VALID tPD 50% ISB ICC HIGH IMPEDANCE Notes: 9. Device is continuously selected. OE, CE = VIL. 10. WE is HIGH for read cycle. 11. Address valid prior to or coincident with CE transition LOW. 4 CY7C1019BV33 CY7C1018BV33 Switching Waveforms (continued) Write Cycle No. 1 (CE Controlled)[12, 13] tWC ADDRESS tSCE CE tSA tSCE tAW tPWE WE tSD DATA I/O DATA VALID tHD tHA Write Cycle No. 2 (WE Controlled, OE HIGH During Write)[12, 13] tWC ADDRESS tSCE CE tAW tSA WE tPWE tHA OE tSD DATA I/O NOTE 14 tHZOE Notes: 12. Data I/O is high impedance if OE = VIH. 13. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state. 14. During this period the I/Os are in the output state and input signals should not be applied. tHD DATAIN VALID 5 CY7C1019BV33 CY7C1018BV33 Switching Waveforms (continued) Write Cycle No. 3 (WE Controlled, OE LOW)[13] tWC ADDRESS tSCE CE tAW tSA WE tSD DATA I/O NOTE 14 tHZWE DATA VALID tLZWE tHD tPWE tHA Truth Table CE H X L L L OE X X L X H WE X X H L H High Z High Z Data Out Data In High Z I/O0–I/O7 Power-Down Power-Down Read Write Selected, Outputs Disabled Mode Power Standby (ISB) Standby (ISB) Active (ICC) Active (ICC) Active (ICC) 6 CY7C1019BV33 CY7C1018BV33 Ordering Information Ordering Code CY7C1018V33-10VC CY7C1019BV33-10VC CY7C1019BV33-10ZC 12 CY7C1018BV33-12VC CY7C1018BV33L-12VC CY7C1019BV33-12VC CY7C1019BV33-12ZC CY7C1019BV33L-12VC CY7C1019BV33L-12ZC 15 CY7C1018BV33-15VC CY7C1018BV33L-15VC CY7C1018BV33-15VI CY7C1019BV33-15VC CY7C1019BV33-15ZC CY7C1019BV33L-15VC CY7C1019BV33L-15ZC CY7C1019BV33-15VI CY7C1019BV33-15ZI Document #: 38-01053-*B Speed (ns) 10 Package Name V32 V33 ZS32 V32 V32 V33 ZS32 V33 ZS32 V32 V32 V32 V33 ZS32 V33 ZS32 V33 ZS32 Package Type 32-Lead 300-Mil Molded SOJ 32-Lead 400-Mil Molded SOJ 32-Lead TSOP Type II 32-Lead 300-Mil Molded SOJ 32-Lead 300-Mil Molded SOJ 32-Lead 400-Mil Molded SOJ 32-Lead TSOP Type II 32-Lead 400-Mil Molded SOJ 32-Lead TSOP Type II 32-Lead 300-Mil Molded SOJ 32-Lead 300-Mil Molded SOJ 32-Lead 300-Mil Molded SOJ 32-Lead 400-Mil Molded SOJ 32-Lead TSOP Type II 32-Lead 400-Mil Molded SOJ 32-Lead TSOP Type II 32-Lead 400-Mil Molded SOJ 32-Lead TSOP Type II Operating Range Commercial Industrial 7 CY7C1019BV33 CY7C1018BV33 Package Diagram 32-Lead (400-Mil) Molded SOJ V33 51-85041-A 32-Lead (300-Mil) Molded SOJ V32 51-85041 8 CY7C1019BV33 CY7C1018BV33 Package Diagram 32-Lead TSOP II ZS32 51-85095 © Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.