CY7C1019CV33-12ZC

CY7C1019CV33 128K x 8 Static RAM Features • Pin and function compatible with CY7C1019BV33 • High speed — tAA = 8, 10, 12, 15 ns • CMOS for optimum speed/power • Data retention at 2.0V • Center power/ground pinout • Automatic power-down when deselected • Easy memory expansion with CE and OE options • Available in 32-pin TSOP II and 400-mil SOJ package device has an automatic power-down feature that significantly reduces power consumption when deselected. Writing to the device is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. Data on the eight I/O pins (I/O0 through I/O7) is then written into the location specified on the address pins (A0 through A16). Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing Write Enable (WE) HIGH. Under these conditions, the contents of the memory location specified by the address pins will appear on the I/O pins. The eight input/output pins (I/O0 through I/O7) are placed in a high-impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), or during a write operation (CE LOW, and WE LOW). The CY7C1019CV33 is available in a standard 32-pin TSOP II and 400-mil-wide SOJ. Functional Description The CY7C1019CV33 is a high-performance CMOS static RAM organized as 131,072 words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE), an active LOW Output Enable (OE), and three-state drivers. This Logic Block Diagram Pin Configuration SOJ/TSOP II Top View A0 A1 A2 A3 CE I/O0 I/O1 VCC V SS I/O2 I/O3 WE A4 A5 A6 A7 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 A16 A15 A14 A13 OE I/O7 I/O6 VSS VCC I/O5 I/O4 A12 A11 A10 A9 A8 I/O INPUT BUFFER 0 A0 A1 A2 A3 A4 A5 A6 A7 A8 I/O ROW DECODER 1 I/O SENSE AMPS 2 512 x 256 x 8 ARRAY I/O I/O I/O I/O I/O 3 4 5 CE WE OE COLUMN DECODER POWER DOWN 6 7 Selection Guide 7C1019CV33-8 Maximum Access Time Maximum Operating Current Maximum Standby Current 8 85 5 7C1019CV33-10 10 80 5 7C1019CV33-12 12 75 5 7C1019CV33-15 15 70 5 Unit ns mA mA A9 A 10 A 11 A 12 A 13 A 14 A 15 A 16 Cypress Semiconductor Corporation Document #: 38-05130 Rev. *D • 3901 North First Street • San Jose, CA 95134 • 408-943-2600 Revised December 16, 2002 CY7C1019CV33 Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature .................................–65°C to +150°C Ambient Temperature with Power Applied............................................. –55°C to +125°C Supply Voltage on VCC to Relative GND[1] ... –0.5V to + 4.6V DC Voltage Applied to Outputs in High-Z State[1] ....................................–0.5V to VCC + 0.5V DC Input Voltage[1] .................................–0.5V to VCC + 0.5V Current into Outputs (LOW)......................................... 20 mA Static Discharge Voltage............................................ >2001V (per MIL-STD-883, Method 3015) Latch-up Current...................................................... >200 mA Operating Range Range Commercial Industrial Ambient Temperature 0°C to +70°C –40°C to +85°C VCC 3.3V ± 10% 3.3V ± 10% Electrical Characteristics Over the Operating Range 7C1019CV33 7C1019CV33 7C1019CV33 7C1019CV33 -8 -10 -12 -15 Parameter VOH VOL VIH VIL IIX IOZ IOS[2.] ICC Description Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage[1] Input Load Current Output Leakage Current Output Short Circuit Current VCC Operating Supply Current Automatic CE Power-down Current — TTL Inputs Automatic CE Power-down Current — CMOS Inputs GND < VI < VCC GND < VI < VCC, Output Disabled VCC = Max., VOUT = GND VCC = Max., IOUT = 0 mA, f = fMAX = 1/tRC Max. VCC, CE > VIH VIN > VIH or VIN < VIL, f = fMAX Max. VCC, CE > VCC – 0.3V, VIN > VCC – 0.3V, or VIN < 0.3V, f = 0 Test Conditions VCC = Min., IOH = –4.0 mA VCC = Min., IOL = 8.0 mA 2.0 –0.3 –1 –1 Min. 2.4 0.4 VCC + 0.3 0.8 +1 +1 –300 85 2.0 –0.3 –1 –1 Max. Min. 2.4 0.4 VCC + 0.3 0.8 +1 +1 –300 80 2.0 –0.3 –1 –1 Max. Min. 2.4 0.4 VCC + 0.3 0.8 +1 +1 –300 75 2.0 –0.3 –1 –1 Max. Min. 2.4 0.4 VCC + 0.3 0.8 +1 +1 –300 70 Max. Unit V V V V µA µA mA mA ISB1 15 15 15 15 mA ISB2 5 5 5 5 mA Capacitance[3] Parameter CIN COUT Description Input Capacitance Output Capacitance Test Conditions TA = 25°C, f = 1 MHz, VCC = 5.0V Max. 8 8 Unit pF pF Notes: 1. VIL (min.) = –2.0V for pulse durations of less than 20 ns. 2. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds. 3. Tested initially and after any design or process changes that may affect these parameters. Document #: 38-05130 Rev. *D Page 2 of 8 CY7C1019CV33 AC Test Loads and Waveforms[4] 8-ns devices: OUTPUT 50 Ω * CAPACITIVE LOAD CONSISTS OF ALL COMPONENTS OF THE TEST ENVIRONMENT 1.5V Z = 50 Ω 10-, 12-, 15-ns devices: 3.3V R 317 Ω 30pF* OUTPUT 30 pF R2 351Ω (a) 3.0V 90% GND 10% ALL INPUT PULSES 90% 10% (b) High-Z characteristics: R 317 Ω 3.3V OUTPUT 5 pF 351 Rise Time: 1 V/ns (c) Fall Time: 1 V/ns (d) R2 Ω Switching Characteristics[5] Over the Operating Range 7C1019CV33-8 7C1019CV33-10 7C1019CV33-12 7C1019CV33-15 Parameter Read Cycle tRC tAA tOHA tACE tDOE tLZOE tHZOE tLZCE tHZCE tPU[8] tPD[8] Write tWC tSCE tAW tHA tSA tPWE tSD tHD tLZWE tHZWE Read Cycle Time Address to Data Valid Data Hold from Address Change CE LOW to Data Valid OE LOW to Data Valid OE LOW to Low Z OE HIGH to High Z[6, 7] CE LOW to Low Z [7] Description Min. 8 Max. Min. 10 Max. Min. 12 Max. Min. 15 Max. Unit ns 8 3 8 5 0 4 3 4 0 8 8 7 7 0 0 6 5 0 3 4 10 8 8 0 0 7 5 0 3 0 3 0 3 10 3 10 5 0 5 3 5 0 10 12 9 9 0 0 8 6 0 3 5 12 3 12 6 0 6 3 6 0 12 15 10 10 0 0 10 8 0 3 6 15 15 7 7 7 15 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns CE HIGH to High Z[6, 7] CE LOW to Power-Up CE HIGH to Power-Down Cycle[9, 10] Write Cycle Time CE LOW to Write End Address Set-Up to Write End Address Hold from Write End Address Set-Up to Write Start WE Pulse Width Data Set-Up to Write End Data Hold from Write End WE HIGH to Low Z[7] WE LOW to High Z[6, 7] 7 ns Notes: 4. AC characteristics (except High-Z) for all 8-ns parts are tested using the load conditions shown in Figure (a). All other speeds are tested using the Thevenin load shown in Figure (b). High-Z characteristics are tested for all speeds using the test load shown in Figure (d). 5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V. 6. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (d) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 8. This parameter is guaranteed by design and is not tested. 9. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. CE and WE must be LOW to initiate a write, and the transition of any of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write. 10. The minimum write cycle time for Write Cycle no. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD. Document #: 38-05130 Rev. *D Page 3 of 8 CY7C1019CV33 Switching Waveforms Read Cycle No. 1[11, 12] tRC ADDRESS tAA tOHA DATA OUT PREVIOUS DATA VALID DATA VALID Read Cycle No. 2 (OE Controlled)[12, 13] ADDRESS tRC CE tACE OE tDOE tLZOE HIGH IMPEDANCE tLZCE VCC SUPPLY CURRENT tPU 50% tHZOE tHZCE DATA VALID tPD 50% ISB ICC HIGH IMPEDANCE DATA OUT Write Cycle No. 1 (CE Controlled)[14, 15] tWC ADDRESS tSCE CE tSA tSCE tAW tPWE WE tSD DATA I/O DATA VALID tHD tHA Notes: 11. Device is continuously selected. OE, CE = VIL. 12. WE is HIGH for read cycle. 13. Address valid prior to or coincident with CE transition LOW. 14. Data I/O is high impedance if OE = VIH. 15. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state. Document #: 38-05130 Rev. *D Page 4 of 8 CY7C1019CV33 Switching Waveforms (continued) Write Cycle No. 2 (WE Controlled, OE HIGH During Write)[14, 15] tWC ADDRESS tSCE CE tAW tSA WE tPWE tHA OE tSD DATA I/O NOTE 16 tHZOE DATAIN VALID tHD Write Cycle No. 3 (WE Controlled, OE LOW)[15] tWC ADDRESS tSCE CE tAW tSA WE tSD DATA I/O NOTE 16 tHZWE DATA VALID tLZWE tHD tPWE tHA Truth Table CE H L L L OE X L X H WE X H L H High Z Data Out Data In High Z I/O0–I/O7 Power-Down Read Write Selected, Outputs Disabled Mode Power Standby (ISB) Active (ICC) Active (ICC) Active (ICC) Note: 16. During this period the I/Os are in the output state and input signals should not be applied. Document #: 38-05130 Rev. *D Page 5 of 8 CY7C1019CV33 Ordering Information Speed (ns) 8 10 Ordering Code CY7C1019CV33-8VC CY7C1019CV33-8VI CY7C1019CV33-10VC CY7C1019CV33-10ZC CY7C1019CV33-10VI CY7C1019CV33-10ZI 12 CY7C1019CV33-12VC CY7C1019CV33-12ZC CY7C1019CV33-12VI CY7C1019CV33-12ZI 15 CY7C1019CV33-15VC CY7C1019CV33-15ZC CY7C1019CV33-15VI CY7C1019CV33-15ZI Package Name V33 V33 V33 ZS32 V33 ZS32 V33 ZS32 V33 ZS32 V33 ZS32 V33 ZS32 Package Type 32-Lead 400-Mil Molded SOJ 32-Lead 400-Mil Molded SOJ 32-Lead 400-Mil Molded SOJ 32-Lead TSOP II 32-Lead 400-Mil Molded SOJ 32-Lead TSOP II 32-Lead 400-Mil Molded SOJ 32-Lead TSOP II 32-Lead 400-Mil Molded SOJ 32-Lead TSOP II 32-Lead 400-Mil Molded SOJ 32-Lead TSOP II 32-Lead 400-Mil Molded SOJ 32-Lead TSOP II Industrial Commercial Industrial Commercial Industrial Operating Range Commercial Industrial Commercial Package Diagram 32-lead (400-Mil) Molded SOJ V33 51-85033-A 51-85033-*B Document #: 38-05130 Rev. *D Page 6 of 8 CY7C1019CV33 Package Diagram (continued) 32-lead TSOP II ZS32 51-85095-** All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-05130 Rev. *D Page 7 of 8 © Cypress Semiconductor Corporation, 2002. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. CY7C1019CV33 Document History Page Document Title: CY7C1019CV33 128K x 8 Static RAM Document Number: 38-05130 REV. ** *A *B *C *D ECN NO. 109245 113431 115047 119796 123030 Issue Date 12/16/01 04/10/02 08/01/02 10/11/02 12/17/02 Orig. of Change HGK NSL HGK DFP DFP New Data Sheet AC Test Loads split based on speed. Added TSOP II Package and I Temp. Improved ICC limits. Updated standby current from 5 nA to 5 mA. Updated Truth Table to reflect single Chip Enable option. Description of Change Document #: 38-05130 Rev. *D Page 8 of 8