B72500T60M60

Ceramic transient voltage suppressors SMD multilayer transient voltage suppressors, standard series The following products presented in this data sheet are being withdrawn. Ordering Code Substitute Product B72580V0110K062 B72580V0080L062 B72580V0060M062 Date of Withdrawal 2021-10-01 2021-10-01 2021-10-01 Deadline Last Orders 2022-01-07 2022-01-07 2022-01-07 Last Shipments 2022-04-08 2022-04-08 2022-04-08 © EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company. Ordering Code B72580V0040M062 B72540V0080L062 Substitute Product Date of Withdrawal 2021-10-01 2021-10-01 Deadline Last Orders 2022-01-07 2022-01-07 Last Shipments 2022-04-08 2022-04-08 For further information please contact your nearest EPCOS sales office, which will also support you in selecting a suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales. Multilayer varistors (MLVs) Standard series EPCOS type designation system for standard series CT 0603 Construction: CT  Single chip with nickel barrier termination (AgNiSn) CN  Single chip with silver-palladium termination (AgPd) CN...K2  Single chip with silver-platinum termination (AgPt) Case sizes: 0201 0402 0603 0805 1206 1210 1812 2220 Tolerance of the varistor voltage: K  ±10% L  ±15% M  ±20% S  Special tolerance Maximum RMS operating voltage (VRMS): 17  17 V Taping mode: G  180-mm reel AgPt termination Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 81 K 17 G K2 Multilayer varistors (MLVs) Standard series Features ESD acc. to IEC 61000-4-2 level 4 (8 kV contact, 15 kV air discharge) Surge current up to 1200 A Bidirectional protection No derating up to 125°C (for case sizes ≥ 0603) Fast response (< 0.5 ns) RoHS-compatible CT version suitable for lead-free soldering PSpice simulation models available Single chip Applications ESD protection in mobile phones, cordless phones and accessories ESD protection in data bus applications ESD protection in control electronics, detectors and sensors, touch screens, plug-in cards, remote controls EIA 0201 0402 0603 0805 1206 Metric 0603 1005 1608 2012 3216 1210 3225 Design Multilayer technology Lack of plastic or epoxy encapsulation for flammability rating better than UL 94 V-0 Termination (see “Soldering directions”):  CT types with nickel barrier terminations (AgNiSn), recommended for lead-free soldering, and compatible with tin/lead solder.  CN types with silver-palladium terminations (AgPd) only suitable for reflow and wave soldering with solder on tin/lead basis.  CN...K2 types with silver-platinum terminations (AgPt) suitable for reflow lead-free soldering. 1812 4532 2220 5750 V/I characteristics and derating curves V/I and derating curves are attached to the data sheet. The curves are sorted by VRMS and then by case size, which is included in the type designation. Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 81 Internal circuit Available case sizes: Multilayer varistors (MLVs) Standard series General technical data Maximum RMS operating voltage Maximum DC operating voltage Maximum surge current Maximum energy absorption Maximum power dissipation Maximum clamping voltage Operating temperature Storage temperature Please read Cautions and warnings and Important notes at the end of this document. (8/20 µs) (2 ms) (8/20 µs) for case size 0201, 0402 for case size ≥ 0603 for case size 0201, 0402 for case size ≥ 0603 Page 4 of 81 VRMS,max VDC,max Isurge,max Wmax Pdiss,max Vclamp,max Top Top LCT/UCT LCT/UCT 4 ... 60 5.5 ... 85 10 ... 1200 7.5 ... 12000 3 ... 20 17 ... 165 40/+85 55/+125 40/+125 55/+150 V V A mJ mW V °C °C °C °C Multilayer varistors (MLVs) Standard series Temperature derating Climatic category: 40/+85 °C for case size 0201 and 0402 Climatic category: 55/+125 °C for case size ≥ 0603 Please read Cautions and warnings and Important notes at the end of this document. Page 5 of 81 Multilayer varistors (MLVs) Standard series Electrical specifications and ordering codes Maximum ratings (Top,max) Type CN standard series CN1812M4G CN2220M4G CN1812M6G CN2220M6G CN1812L8G CN2220L8G CN1812K11G CN2220K11G CN1812K14G CN1812K14GK2 CN2220K14G CN1812K17G CN2220K17G CN1812K20G CN2220K20G CN2220K20GK2 CN1812K25G CN2220K25G CN2220K25GK2 CN1812K30G CN1812K30GK2 CN2220K30G CN2220K30GK2 CN1812K35GK2 CN2220K35GK2 CN2220K40GK2 CT standard series CT0201S4AG CT0402M4G CT0603M4G CT0805M4G CT1206M4G CT1210M4G CT0603M6G V V Isurge,max Wmax (8/20 µs) (2 ms) A mJ B72580V0040M062 B72540V0040M062 B72580V0060M062 B72540V0060M062 B72580V0080L062 B72540V0080L062 B72580V0110K062 B72540V0110K062 B72580V0140K062 B72582V0140K062 B72540V0140K062 B72580V0170K062 B72540V0170K062 B72580V0200K062 B72540V0200K062 B72542V0200K062 B72580V0250K062 B72540V0250K062 B72542V0250K062 B72580V0300K062 B72582V0300K062 B72540V0300K062 B72542V0300K062 B72582V0350K062 B72542V0350K062 B72542V0400K062 4 4 6 6 8 8 11 11 14 14 14 17 17 20 20 20 25 25 25 30 30 30 30 35 35 40 5.5 5.5 8 8 11 11 14 14 18 18 18 22 22 26 26 26 31 31 31 38 38 38 38 45 45 56 500 1000 500 1200 800 1200 800 1200 800 800 1200 800 1200 800 1200 1200 800 1200 1200 800 800 1200 1200 500 1000 1000 800 1400 1000 3600 1800 4200 1900 5400 2300 2300 5800 2700 7200 3000 7800 7800 3700 9600 9600 4200 4200 12000 12000 4000 7700 9000 15 20 15 20 15 20 15 20 15 15 20 15 20 15 20 20 15 20 20 15 15 20 20 15 20 20 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 B72440T0040S160 B72590T0040M060 B72500T0040M060 B72510T0040M062 B72520T0040M062 B72530T0040M062 B72500T0060M060 4 4 4 4 4 4 6 5.5 5.5 5.5 5.5 5.5 5.5 8 - - - +85 +85 +125 +125 +125 +125 +125 Ordering code Please read Cautions and warnings and Important notes at the end of this document. VRMS,max VDC,max Page 6 of 81 20 30 100 150 250 30 7.5 100 100 300 400 100 Pdiss,max Top,max mW °C 3 3 5 8 10 3 Multilayer varistors (MLVs) Standard series Characteristics (TA = 25 °C) Type ∆VV Vclamp,max % 8 8 11 11 15 15 18 18 22 22 22 27 27 33 33 33 39 39 39 47 47 47 47 56 56 68 15 10 8 8 8 8 11 VV (1 mA) V CN standard series CN1812M4G CN2220M4G CN1812M6G CN2220M6G CN1812L8G CN2220L8G CN1812K11G CN2220K11G CN1812K14G CN1812K14GK2 CN2220K14G CN1812K17G CN2220K17G CN1812K20G CN2220K20G CN2220K20GK2 CN1812K25G CN2220K25G CN2220K25GK2 CN1812K30G CN1812K30GK2 CN2220K30G CN2220K30GK2 CN1812K35GK2 CN2220K35GK2 CN2220K40GK2 CT standard series CT0201S4AG CT0402M4G CT0603M4G CT0805M4G CT1206M4G CT1210M4G CT0603M6G V Iclamp (8/20 µs) A Ctyp (1 kHz, 1 V) pF ±20 ±20 ±20 ±20 ±15 ±15 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 17 17 25 25 30 30 33 33 38 38 38 44 44 54 54 54 65 65 65 77 77 77 77 90 90 110 5 10 5 10 5 10 5 10 5 5 10 5 10 5 10 10 5 10 10 5 5 10 10 5 10 10 10000 24000 8000 20000 6000 16000 5000 12000 4500 4500 10000 4000 9000 3000 7000 7000 2500 5000 5000 2000 2000 4000 4000 1200 2500 2000 ±20 ±20 ±20 ±20 ±20 ±20 ±20 35 24 19 19 17 17 27 1) Measured @ 1 MHz, 1 V Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 81 1 1 1 1 1 2.5 1 221) 2001) 200 700 1500 5000 200 Multilayer varistors (MLVs) Standard series Electrical specifications and ordering codes Maximum ratings (Top,max) Type CT standard series CT0805M6G CT1206M6G CT1210M6G CT0603K7G CT0603M7G CT0603L8G CT0805L8G CT1206L8G CT1210L8G CT0402S11AG CT0603K11G CT0805K11G CT1206K11G CT1210K11G CT0402L14G CT0402L14UG CT0603K14G CT0603S14BG CT0805K14G CT1206K14G CT1210K14G CT0402S17AG CT0603K17G CT0805K17G CT1206K17G CT1210K17G CT0603K20G CT0805K20G CT1206K20G CT1210K20G CT0603K25G CT0805K25G CT1206K25G CT1210K25G CT0805K30G Ordering code B72510T0060M062 B72520T0060M062 B72530T0060M062 B72500T0070K060 B72500T0070M060 B72500T0080L060 B72510T0080L062 B72520T0080L062 B72530T0080L062 B72590T0110S160 B72500T0110K060 B72510T0110K062 B72520T0110K062 B72530T0110K062 B72590T0140L060 B72590T0140L960 B72500T0140K060 B72500T0140S160 B72510T0140K062 B72520T0140K062 B72530T0140K062 B72590T0170S160 B72500T0170K060 B72510T0170K062 B72520T0170K062 B72530T0170K062 B72500T0200K060 B72510T0200K062 B72520T0200K062 B72530T0200K062 B72500T0250K060 B72510T0250K062 B72520T0250K062 B72530T0250K062 B72510T0300K062 Please read Cautions and warnings and Important notes at the end of this document. VRMS,max VDC,max V V 6 6 6 7 7 8 8 8 8 11 11 11 11 11 14 14 14 14 14 14 14 17 17 17 17 17 20 20 20 20 25 25 25 25 30 8 8 8 9 9 11 11 11 11 14 14 14 14 14 16 16 18 18 18 18 18 19 22 22 22 22 26 26 26 26 31 31 31 31 38 Page 8 of 81 Isurge,max Wmax (8/20 µs) (2 ms) A mJ 120 200 300 30 30 30 120 200 400 20 30 120 200 400 20 10 30 30 120 200 400 20 30 120 200 400 30 80 200 400 30 80 200 300 80 200 400 700 100 100 100 200 500 1000 7.5 200 200 500 1200 10 10 200 200 300 500 1500 10 200 300 600 1700 200 300 700 1900 300 300 1000 1700 300 Pdiss,max Top,max mW °C 5 8 10 3 3 3 5 8 10 3 3 5 8 10 3 3 3 3 5 8 10 3 3 5 8 10 3 5 8 10 3 5 8 10 5 +125 +125 +125 +125 +125 +125 +125 +125 +125 +85 +125 +125 +125 +125 +85 +85 +125 +125 +125 +125 +125 +85 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 Multilayer varistors (MLVs) Standard series Characteristics (TA = 25 °C) Type VV (1 mA) V CT standard series CT0805M6G CT1206M6G CT1210M6G CT0603K7G CT0603M7G CT0603L8G CT0805L8G CT1206L8G CT1210L8G CT0402S11AG CT0603K11G CT0805K11G CT1206K11G CT1210K11G CT0402L14G CT0402L14UG CT0603K14G CT0603S14BG CT0805K14G CT1206K14G CT1210K14G CT0402S17AG CT0603K17G CT0805K17G CT1206K17G CT1210K17G CT0603K20G CT0805K20G CT1206K20G CT1210K20G CT0603K25G CT0805K25G CT1206K25G CT1210K25G CT0805K30G 11 11 11 12.5 12.5 15 15 15 15 18.4 18 18 18 18 23.5 23.5 22 22 22 22 22 32 27 27 27 27 33 33 33 33 39 39 39 39 47 ∆VV Vclamp,max % V ±20 ±20 ±20 ±10 ±20 ±15 ±15 ±15 ±15 ±10 ±10 ±10 ±10 ±10 ±15 ±15 ±10 +23/0 ±10 ±10 ±10 ±25 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 1) Measured @ 1 MHz, 1 V Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 81 27 25 25 27 30 33 33 30 30 35 35 35 33 33 46 46 40 42 40 38 38 59 46 46 44 44 56 56 54 54 67 67 65 65 77 Iclamp (8/20 µs) A 1 1 2.5 1 1 1 1 1 2.5 1 1 1 1 2.5 1 1 1 1 1 1 2.5 1 1 1 1 2.5 1 1 1 2.5 1 1 1 2.5 1 Ctyp (1 kHz, 1 V) pF 600 1200 4000 130 200 150 500 1000 3000 1201) 100 400 800 2400 471) 471) 100 120 350 700 2000 331) 100 400 650 1800 90 300 600 1500 901) 250 550 1200 200 Multilayer varistors (MLVs) Standard series Electrical specifications and ordering codes Maximum ratings (Top,max) Type CT standard series CT1206K30G CT1210K30G CT1206K35G CT1210K35G CT1206K40G CT1210K40G CT1206K50G CT1210K50G CT1206K60G CT1210K60G Ordering code B72520T0300K062 B72530T0300K062 B72520T0350K062 B72530T0350K062 B72520T0400K062 B72530T0400K062 B72520T0500K062 B72530T0500K062 B72520T0600K062 B72530T0600K062 VRMS,max VDC,max V V 30 30 35 35 40 40 50 50 60 60 38 38 45 45 56 56 65 65 85 85 Isurge,max Wmax (8/20 µs) (2 ms) A mJ 200 300 100 250 100 250 100 200 100 200 1100 2000 400 2000 500 2300 600 1600 700 2000 Pdiss,max Top,max mW °C 8 10 8 10 8 10 8 10 8 10 +125 +125 +125 +125 +125 +125 +125 +125 +125 +125 Characteristics (TA = 25 °C) Type CT standard series CT1206K30G CT1210K30G CT1206K35G CT1210K35G CT1206K40G CT1210K40G CT1206K50G CT1210K50G CT1206K60G CT1210K60G VV (1 mA) V ∆VV Vclamp,max % V 47 47 56 56 68 68 82 82 100 100 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 ±10 77 77 90 90 110 110 135 135 165 165 Please read Cautions and warnings and Important notes at the end of this document. Page 10 of 81 Iclamp (8/20 µs) A 1 2.5 1 2.5 1 2.5 1 2.5 1 2.5 Ctyp (1 kHz, 1 V) pF 500 1000 200 600 250 500 120 250 100 200 Multilayer varistors (MLVs) Standard series Dimensional drawing Dimensions in mm Case size EIA / mm l w h k 0201 / 0603 0.6 ±0.03 0.30 ±0.03 0.33 max. 0.15 ±0.05 0402 / 1005 1.0 ±0.15 0.50 ±0.10 0.6 max. 0.10 ... 0.30 0603 / 1608 1.6 ±0.15 0.80 ±0.10 0.9 max. 0.10 ... 0.40 0805 / 2012 2.0 ±0.20 1.25 ±0.15 1.4 max. 0.13 ... 0.75 1206 / 3216 3.2 ±0.30 1.60 ±0.20 1.7 max. 0.25 ... 0.75 1210 / 3225 3.2 ±0.30 2.50 ±0.25 1.7 max. 0.25 ... 0.75 1812 / 4532 4.5 ±0.40 3.20 ±0.30 2.5 max. 0.25 ... 1.00 2220 / 5750 5.7 ±0.40 5.00 ±0.40 2.5 max. 0.25 ... 1.00 Recommended solder pad layout Dimensions in mm Please read Cautions and warnings and Important notes at the end of this document. Case size EIA / mm A B C 0201 / 0603 0.30 0.25 0.30 0402 / 1005 0.60 0.60 0.50 0603 / 1608 1.00 1.00 1.00 0805 / 2012 1.40 1.20 1.00 1206 / 3216 1.80 1.20 2.10 1210 / 3225 2.80 1.20 2.10 1812 / 4532 3.60 1.50 3.00 2220 / 5750 5.50 1.50 4.20 Page 11 of 81 Multilayer varistors (MLVs) Standard series Delivery mode EIA case size Taping 0201 0402 0402 0402 0402 0402 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Reel size mm 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 180 Please read Cautions and warnings and Important notes at the end of this document. Packing unit pcs. 15000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 2000 2000 2000 2000 2000 2000 3000 3000 3000 3000 3000 3000 Type Ordering code CT0201S4AG CT0402L14G CT0402L14UG CT0402M4G CT0402S11AG CT0402S17AG CT0603K11G CT0603K14G CT0603K17G CT0603K20G CT0603K25G CT0603K7G CT0603L8G CT0603M4G CT0603M6G CT0603M7G CT0603S14BG CT0805K11G CT0805K14G CT0805K17G CT0805K20G CT0805K25G CT0805K30G CT0805L8G CT0805M4G CT0805M6G CT1206K11G CT1206K14G CT1206K17G CT1206K20G CT1206K25G CT1206K30G CT1206K35G CT1206K40G CT1206K50G CT1206K60G CT1206L8G CT1206M4G CT1206M6G CT1210K11G CT1210K14G CT1210K17G B72440T0040S160 B72590T0140L060 B72590T0140L960 B72590T0040M060 B72590T0110S160 B72590T0170S160 B72500T0110K060 B72500T0140K060 B72500T0170K060 B72500T0200K060 B72500T0250K060 B72500T0070K060 B72500T0080L060 B72500T0040M060 B72500T0060M060 B72500T0070M060 B72500T0140S160 B72510T0110K062 B72510T0140K062 B72510T0170K062 B72510T0200K062 B72510T0250K062 B72510T0300K062 B72510T0080L062 B72510T0040M062 B72510T0060M062 B72520T0110K062 B72520T0140K062 B72520T0170K062 B72520T0200K062 B72520T0250K062 B72520T0300K062 B72520T0350K062 B72520T0400K062 B72520T0500K062 B72520T0600K062 B72520T0080L062 B72520T0040M062 B72520T0060M062 B72530T0110K062 B72530T0140K062 B72530T0170K062 Page 12 of 81 Multilayer varistors (MLVs) Standard series EIA case size Taping 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 2220 2220 2220 2220 2220 2220 2220 2220 2220 2220 2220 2220 2220 2220 Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Blister Reel size Packing unit mm pcs. 180 3000 180 2000 180 2000 180 2000 180 2000 180 2000 180 2000 180 3000 180 3000 180 3000 180 1500 180 1500 180 1500 180 1500 180 1500 180 1000 180 1000 180 1000 180 1000 180 1500 180 1500 180 1500 180 1500 180 1500 180 1500 180 1500 180 1500 180 1000 180 1000 180 1000 180 1000 180 1000 180 1000 180 1500 180 1500 180 1500 Please read Cautions and warnings and Important notes at the end of this document. Type Ordering code CT1210K20G CT1210K25G CT1210K30G CT1210K35G CT1210K40G CT1210K50G CT1210K60G CT1210L8G CT1210M4G CT1210M6G CN1812K11G CN1812K14G CN1812K14GK2 CN1812K17G CN1812K20G CN1812K25G CN1812K30G CN1812K30GK2 CN1812K35GK2 CN1812L8G CN1812M4G CN1812M6G CN2220K11G CN2220K14G CN2220K17G CN2220K20G CN2220K20GK2 CN2220K25G CN2220K25GK2 CN2220K30G CN2220K30GK2 CN2220K35GK2 CN2220K40GK2 CN2220L8G CN2220M4G CN2220M6G B72530T0200K062 B72530T0250K062 B72530T0300K062 B72530T0350K062 B72530T0400K062 B72530T0500K062 B72530T0600K062 B72530T0080L062 B72530T0040M062 B72530T0060M062 B72580V0110K062 B72580V0140K062 B72582V0140K062 B72580V0170K062 B72580V0200K062 B72580V0250K062 B72580V0300K062 B72582V0300K062 B72582V0350K062 B72580V0080L062 B72580V0040M062 B72580V0060M062 B72540V0110K062 B72540V0140K062 B72540V0170K062 B72540V0200K062 B72542V0200K062 B72540V0250K062 B72542V0250K062 B72540V0300K062 B72542V0300K062 B72542V0350K062 B72542V0400K062 B72540V0080L062 B72540V0040M062 B72540V0060M062 Page 13 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0201S4AG CT0402M4G Please read Cautions and warnings and Important notes at the end of this document. Page 14 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0402S11AG CT0402L14G Please read Cautions and warnings and Important notes at the end of this document. Page 15 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0402L14UG CT0402S17AG Please read Cautions and warnings and Important notes at the end of this document. Page 16 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0603M4G CT0603M6G Please read Cautions and warnings and Important notes at the end of this document. Page 17 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0603K7G CT0603M7G Please read Cautions and warnings and Important notes at the end of this document. Page 18 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0603L8G CT0603K11G Please read Cautions and warnings and Important notes at the end of this document. Page 19 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0603K14G CT0603S14BG Please read Cautions and warnings and Important notes at the end of this document. Page 20 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0603K17G CT0603K20G Please read Cautions and warnings and Important notes at the end of this document. Page 21 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0603K25G CT0805M4G Please read Cautions and warnings and Important notes at the end of this document. Page 22 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0805M6G CT0805L8G Please read Cautions and warnings and Important notes at the end of this document. Page 23 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0805K11G CT0805K14G Please read Cautions and warnings and Important notes at the end of this document. Page 24 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0805K17G CT0805K20G Please read Cautions and warnings and Important notes at the end of this document. Page 25 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT0805K25G CT0805K30G Please read Cautions and warnings and Important notes at the end of this document. Page 26 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1206M4G CT1206M6G Please read Cautions and warnings and Important notes at the end of this document. Page 27 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1206L8G CT1206K11G Please read Cautions and warnings and Important notes at the end of this document. Page 28 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1206K14G CT1206K17G Please read Cautions and warnings and Important notes at the end of this document. Page 29 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1206K20G CT1206K25G Please read Cautions and warnings and Important notes at the end of this document. Page 30 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1206K30G CT1206K35G Please read Cautions and warnings and Important notes at the end of this document. Page 31 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1206K40G CT1206K50G Please read Cautions and warnings and Important notes at the end of this document. Page 32 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1206K60G CT1210M4 Please read Cautions and warnings and Important notes at the end of this document. Page 33 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1210M6G CT1210L8G Please read Cautions and warnings and Important notes at the end of this document. Page 34 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1210K11G CT1210K14G Please read Cautions and warnings and Important notes at the end of this document. Page 35 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1210K17G CT1210K20G Please read Cautions and warnings and Important notes at the end of this document. Page 36 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1210K25G CT1210K30G Please read Cautions and warnings and Important notes at the end of this document. Page 37 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1210K35G CT1210K40G Please read Cautions and warnings and Important notes at the end of this document. Page 38 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CT1210K50G CT1210K60G Please read Cautions and warnings and Important notes at the end of this document. Page 39 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CN1812M4G CN1812M6G Please read Cautions and warnings and Important notes at the end of this document. Page 40 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CN1812L8G CN1812K11G Please read Cautions and warnings and Important notes at the end of this document. Page 41 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CN1812K14G(K2) CN1812K17G Please read Cautions and warnings and Important notes at the end of this document. Page 42 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CN1812K20G CN1812K25G Please read Cautions and warnings and Important notes at the end of this document. Page 43 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CN1812K30G(K2) CN2220M4G Please read Cautions and warnings and Important notes at the end of this document. Page 44 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CN1812K35GK2 CN2220M6G Please read Cautions and warnings and Important notes at the end of this document. Page 45 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CN2220L8G CN2220K11G Please read Cautions and warnings and Important notes at the end of this document. Page 46 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CN2220K14G CN2220K17G Please read Cautions and warnings and Important notes at the end of this document. Page 47 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CN2220K20G(K2) CN2220K25G(K2) Please read Cautions and warnings and Important notes at the end of this document. Page 48 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CN2220K30G(K2) CN2220K35GK2 Please read Cautions and warnings and Important notes at the end of this document. Page 49 of 81 Multilayer varistors (MLVs) Standard series V/I characteristics CN2220K40GK2 Please read Cautions and warnings and Important notes at the end of this document. Page 50 of 81 Multilayer varistors (MLVs) Standard series Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2 CT0402M4G ... S17AG CT0402L14UG Please read Cautions and warnings and Important notes at the end of this document. Page 51 of 81 Multilayer varistors (MLVs) Standard series Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2 CT0603M4G ... K25G CT0805M4G CT1206K35G ... K60G Please read Cautions and warnings and Important notes at the end of this document. Page 52 of 81 Multilayer varistors (MLVs) Standard series Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2 CT0805M6G ... K17G CT0805K20G ... K30G Please read Cautions and warnings and Important notes at the end of this document. Page 53 of 81 Multilayer varistors (MLVs) Standard series Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2 CT1206M4G CT1206M6G ... K30G CT1210K50G ... K60G Please read Cautions and warnings and Important notes at the end of this document. Page 54 of 81 Multilayer varistors (MLVs) Standard series Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2 CT1210M4G CT1210K35G ... K40G CT1210M6G CT1210K25G ... K30G Please read Cautions and warnings and Important notes at the end of this document. Page 55 of 81 Multilayer varistors (MLVs) Standard series Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2 CT1210L8G ... K20G CN1812M4G ... M6G CN1812K35GK2 Please read Cautions and warnings and Important notes at the end of this document. Page 56 of 81 Multilayer varistors (MLVs) Standard series Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2 CN1812L8G ... K30G(K2) CN2220M4G CN2220K35GK2, CN2220K40GK2 Please read Cautions and warnings and Important notes at the end of this document. Page 57 of 81 Multilayer varistors (MLVs) Standard series Derating curves Maximum surge current Isurge,max = f (tr, pulse train) For explanation of the derating curves refer to "General technical information", chapter 2.7.2 CN2220M6G ... K30G(K2) Please read Cautions and warnings and Important notes at the end of this document. Page 58 of 81 Multilayer varistors (MLVs) Standard series Taping and packing 1 Taping and packing for SMD components 1.1 Blister tape (the taping to IEC 60286-3) Dimensions in mm 8-mm tape 12-mm tape 16-mm tape Case size (inch/mm) Case size (inch/mm) Case size (inch/mm) 0508/ 1220 0612/ 1632 1012/ 2532 Tolerance 0603/ 1608 0506/ 1216 0805/ 2012 1206/ 3216 1210/ 3225 1812/ 4532 2220/ 5750 3225 4032 A0 0.9 ±0.10 1.50 1.60 1.90 2.80 3.50 5.10 7.00 B0 1.75 ±0.10 1.80 2.40 3.50 3.50 4.80 6.00 8.70 10.60 ±0.20 K0 1.0 0.80 T T2 1.80 0.30 1.3 1.20 2.50 8.60 ±0.20 2.60 5.00 max. 0.30 0.30 max. 3.50 5.50 max. D0 1.50 1.50 1.50 +0.10/0 D1 1.00 1.50 1.50 min. P0 4.00 4.00 4.00 ±0.101) P2 2.00 2.00 2.00 ±0.05 P1 4.00 8.00 12.00 ±0.10 W 8.00 12.00 16.00 ±0.30 E 1.75 1.75 1.75 ±0.10 F 3.50 5.50 7.50 ±0.05 G 0.75 0.75 0.75 min. 1) ≤±0.2 mm over 10 sprocket holes. Please read Cautions and warnings and Important notes at the end of this document. Page 59 of 81 Multilayer varistors (MLVs) Standard series Part orientation in tape pocket for blister tape For discrete chip, case sizes 0603, 0805, 1206, 1210, 1812 and 2220 For array, case sizes 0612 For arrays 0506 and 1012 For filter array, case size 0508 Additional taping information Reel material Polystyrol (PS) Tape material Polystyrol (PS) or Polycarbonat (PC) or PVC Tape break force min. 10 N Top cover tape strength min. 10 N Top cover tape peel force 0.2 to 0.6 N for 8-mm tape and 0.2 to 0.8 N for 12-mm tape at a peel speed of 300 mm/min Tape peel angle Angle between top cover tape and the direction of feed during peel off: 165° to 180° Cavity play Each part rests in the cavity so that the angle between the part and cavity center line is no more than 20° Please read Cautions and warnings and Important notes at the end of this document. Page 60 of 81 Multilayer varistors (MLVs) Standard series 1.2 Cardboard tape (taping to IEC 60286-3) Dimensions in mm 8-mm tape Case size Tolerance (inch/mm) Case size (inch/mm) 0201/0603 0402/1005 0405/1012 0603/1608 1003/2508 0508/1220 A0 0.38 ±0.05 0.60 1.05 0.95 1.00 1.60 ±0.20 B0 0.68 ±0.05 1.15 1.60 1.80 2.85 2.40 ±0.20 T 0.35 ±0.02 0.60 0.75 0.95 1.00 0.95 max. T2 0.4 min. 0.70 0.90 1.10 1.10 1.12 max. D0 1.50 ±0.1 1.50 +0.10/0 1.50 P0 4.00 ±0.102) P2 2.00 ±0.05 P1 2.00 ±0.05 2.00 4.00 4.00 4.00 4.00 ±0.10 W 8.00 ±0.30 E 1.75 ±0.10 F G ±0.05 3.50 1.35 0.75 2) ≤0.2 mm over 10 sprocket holes. Please read Cautions and warnings and Important notes at the end of this document. Page 61 of 81 min. Multilayer varistors (MLVs) Standard series Part orientation in tape pocket for cardboard tape For discrete chip case sizes 0201, 0402, 0603 and 1003 For array case size 0405 For array case size 0508 For filter array, case size 0405 Additional taping information Reel material Polystyrol (PS) Tape material Cardboard Tape break force min. 10 N Top cover tape strength min. 10 N Top cover tape peel force 0.1 to 0.65 N at a peel speed of 300 mm/min Tape peel angle Angle between top cover tape and the direction of feed during peel off: 165° to 180° Cavity play Each part rests in the cavity so that the angle between the part and cavity center line is no more than 20° Please read Cautions and warnings and Important notes at the end of this document. Page 62 of 81 Multilayer varistors (MLVs) Standard series 1.3 Reel packing Dimensions in mm 8-mm tape 180-mm reel 330-mm reel 12-mm tape 180-mm reel 330-mm reel 16-mm tape 330-mm reel A 180 3/+0 330 2.0 180 3/+0 330 2.0 330 2.0 W1 8.4 +1.5/0 8.4 +1.5/0 12.4 +1.5/0 12.4 +1.5/0 16.4 +1.5/0 W2 14.4 max. 14.4 max. 18.4 max. 18.4 max. 22.4 max. Leader, trailer Please read Cautions and warnings and Important notes at the end of this document. Page 63 of 81 Multilayer varistors (MLVs) Standard series 1.4 Packing units for discrete chip and array chip Case size Chip thickness inch/mm 0201/0603 0402/1005 0405/1012 0506/1216 0508/1220 0603/1608 0612/1632 0805/2012 th 0.33 mm 0.6 mm 0.7 mm 0.5 mm 0.9 mm 0.9 mm 0.9 mm 0.7 mm 0.9 mm 1.3 mm 0.9 mm 1.0 mm 0.9 mm 1.3 mm 1.4 mm 1.6 mm 0.9 mm 1.3 mm 1.4 mm 1.6 mm 1.3 mm 1.4 mm 1.6 mm 2.3 mm 1.3 mm 1.4 mm 2.0 mm 2.3 mm 3.2 mm 4.5 mm 3.2 mm 4.5 mm 1003/2508 1012/2532 1206/3216 1210/3225 1812/4532 2220/5750 3225 4032 Please read Cautions and warnings and Important notes at the end of this document. Cardboard tape Blister tape W 8 mm 8 mm 8 mm  8 mm 8 mm     8 mm                      W    8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm  8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 16 mm 16 mm 16 mm 16 mm Page 64 of 81 ∅ 180-mm reel ∅ 330-mm reel pcs. 15000 10000 5000 4000 4000 4000 3000 3000 3000 3000 4000 2000 3000 3000 2000 2000 3000 3000 2000 2000 1500 1000   1500 1000       pcs.      16000   12000              4000 3000   3000 3000 1000 1000 1000 1000 Multilayer varistors (MLVs) Standard series 2 Delivery mode for leaded SHCV varistors Standard delivery mode for SHCV types is bulk. Alternative taping modes (AMMO pack or taped on reel) are available upon request. Packing units for: Type Pieces SR6 2000 SR1 / SR2 1000 For types not listed in this data book please contact EPCOS. Please read Cautions and warnings and Important notes at the end of this document. Page 65 of 81 Multilayer varistors (MLVs) Standard series Soldering directions 1 Terminations 1.1 Nickel barrier termination The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base metallization layer. This allows great flexibility in the selection of soldering parameters. The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is suitable for all commonly-used soldering methods. Multilayer CTVS: Structure of nickel barrier termination 1.2 Silver-palladium termination Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips intended for conductive adhesion. This metallization improves the resistance of large chips to thermal shock. In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corrosion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid applications as well. The silver-palladium termination is not approved for lead-free soldering. Multilayer varistor: Structure of silver-palladium termination Please read Cautions and warnings and Important notes at the end of this document. Page 66 of 81 Multilayer varistors (MLVs) Standard series 1.3 Silver-platinum termination Silver-platinum terminations are mainly used for the large case sizes 1812 and 2220. The silverplatinum termination is approved for reflow soldering, SnPb soldering and lead-free soldering with a silver containing solder paste. In case of SnPb soldering, a solder paste Sn62Pb36Ag2 is recommended. For lead-free reflow soldering, a solder paste SAC, e.g. Sn95.5Ag3.8Cu0.7, is recommended. Multilayer varistor: Structure of silver-platinum termination 2 Recommended soldering temperature profiles 2.1 Reflow soldering temperature profile Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D Please read Cautions and warnings and Important notes at the end of this document. Page 67 of 81 Multilayer varistors (MLVs) Standard series Profile feature Sn-Pb eutectic assembly Pb-free assembly Preheat and soak - Temperature min - Temperature max - Time Tsmin Tsmax tsmin to tsmax 100 °C 150 °C 60 ... 120 s 150 °C 200 °C 60 ... 180 s Average ramp-up rate Tsmax to Tp 3 °C/ s max. 3 °C/ s max. Liquidous temperature Time at liquidous TL tL 183 °C 60 ... 150 s 217 °C 60 ... 150 s Peak package body temperature Tp1) 220 °C ... 235 °C2) 245 °C ... 260 °C2) 20 s3) 30 s3) 6 °C/ s max. 6 °C/ s max. maximum 6 min maximum 8 min Time (tP) within 5 °C of specified classification temperature (Tc) 3) Average ramp-down rate Tp to Tsmax Time 25 °C to peak temperature 1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. 2) Depending on package thickness. For details please refer to JEDEC J-STD-020D. 3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum. Note: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 2.2 Wave soldering temperature profile Temperature characteristics at component terminal with dual-wave soldering Please read Cautions and warnings and Important notes at the end of this document. Page 68 of 81 Multilayer varistors (MLVs) Standard series 2.3 Lead-free soldering processes EPCOS multilayer CTVS with AgNiSn termination are designed for the requirements of lead-free soldering processes only. Soldering temperature profiles to JEDEC J-STD-020D, IEC 60068-2-58 and ZVEI recommendations. 3 Recommended soldering methods - type-specific releases by EPCOS 3.1 Overview Reflow soldering Wave soldering Type Case size SnPb Lead-free SnPb Lead-free CT... / CD... 0201/ 0402 Approved Approved No No CT... / CD... 0603 ... 2220 Approved Approved Approved Approved CN... 0603 ... 2220 Approved No Approved No CN...K2 1812, 2220 Approved Approved No No Arrays 0405 ... 1012 Approved Approved No No ESD/EMI filters 0405, 0508 Approved Approved No No CU 3225, 4032 Approved Approved Approved Approved SHCV - No No Approved Approved 3.2 Nickel barrier and AgPt terminated multilayer CTVS All EPCOS MLVs with nickel barrier and AgPt termination are suitable and fully qualiyfied for leadfree soldering. The nickel barrier layer is 100% matte tin-plated. 3.3 Silver-palladium terminated MLVs AgPd-terminated MLVs are mainly designed for conductive adhesion technology on hybrid material. Additionally MLVs with AgPd termination are suitable for reflow and wave soldering with SnPb solder. Note: Lead-free soldering is not approved for MLVs with AgPd termination. 3.4 Silver-platinum terminated MLVs The silver-platinum termination is approved for reflow soldering, SnPb soldering and lead-free with a silver containing solder paste. In case of SnPb soldering, a solder paste Sn62Pb36Ag2 is recommended. For lead-free reflow soldering, a solder paste SAC, e.g. Sn95.5Ag3.8Cu0.7, is recommended. Please read Cautions and warnings and Important notes at the end of this document. Page 69 of 81 Multilayer varistors (MLVs) Standard series 3.5 Tinned copper alloy All EPCOS CU types with tinned termination are approved for lead-free and SnPb soldering. 3.6 Tinned iron wire All EPCOS SHCV types with tinned termination are approved for lead-free and SnPb soldering. 4 Solder joint profiles / solder quantity 4.1 Nickel barrier termination If the meniscus height is too low, that means the solder quantity is too low, the solder joint may break, i.e. the component becomes detached from the joint. This problem is sometimes interpreted as leaching of the external terminations. If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur. As the solder cools down, the solder contracts in the direction of the component. If there is too much solder on the component, it has no leeway to evade the stress and may break, as in a vise. The figures below show good and poor solder joints for dual-wave and infrared soldering. 4.1.1 Solder joint profiles for nickel barrier termination - dual-wave soldering Good and poor solder joints caused by amount of solder in dual-wave soldering. 4.1.2 Solder joint profiles for nickel barrier termination / silver-palladium / silver-platinum termination - reflow soldering Please read Cautions and warnings and Important notes at the end of this document. Page 70 of 81 Multilayer varistors (MLVs) Standard series Good and poor solder joints caused by amount of solder in reflow soldering. 5 Conductive adhesion Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commercially attractive method of component connection to supplement or even replace conventional soldering methods. Electrically conductive adhesives consist of a non-conductive plastic (epoxy resin, polyimide or silicon) in which electrically conductive metal particles (gold, silver, palladium, nickel, etc) are embedded. Electrical conduction is effected by contact between the metal particles. Adhesion is particularly suitable for meeting the demands of hybrid technology. The adhesives can be deposited ready for production requirements by screen printing, stamping or by dispensers. As shown in the following table, conductive adhesion involves two work operations fewer than soldering. Reflow soldering Wave soldering Conductive adhesion Screen-print solder paste Apply glue dot Screen-print conductive adhesive Mount SMD Mount SMD Mount SMD Predry solder paste Cure glue Cure adhesive Reflow soldering Wave soldering Inspect Wash Wash Inspect Inspect Please read Cautions and warnings and Important notes at the end of this document. Page 71 of 81 Multilayer varistors (MLVs) Standard series A further advantage of adhesion is that the components are subjected to virtually no temperature shock at all. The curing temperatures of the adhesives are between 120 °C and 180 °C, typical curing times are between 30 minutes and one hour. The bending strength of glued chips is, in comparison with that of soldered chips, higher by a factor of at least 2, as is to be expected due to the elasticity of the glued joints. The lower conductivity of conductive adhesive may lead to higher contact resistance and thus result in electrical data different to those of soldered components. Users must pay special attention to this in RF applications. 6 Solderability tests Test Standard Wettability Leaching resistance Test conditions Pb-free soldering Criteria/ test results IEC Immersion in 60068-2-58 60/40 SnPb solder using non-activated flux at 215 ± 3 °C for 3 ± 0.3 s Immersion in Sn96.5Ag3.0Cu0.5 solder using non- or low activated flux at 245 ± 5 °C for 3 ± 0.3 s Covering of 95% of end termination, checked by visual inspection IEC Immersion in 60068-2-58 60/40 SnPb solder using mildly activated flux without preheating at 260 ± 5 °C for 10 ±1 s Immersion in No leaching of Sn96.5Ag3.0Cu0.5 contacts solder using non- or low activated flux without preheating at 255 ± 5 °C for 10 ±1 s Thermal shock (solder shock) Test conditions Sn-Pb soldering Dip soldering at 300 °C/5 s Dip soldering at 300 °C/5 s No deterioration of electrical parameters. Capacitance change: ≤ ±15% Tests of resistance IEC Immersion in Immersion in to soldering heat 60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5 for SMDs at 260 °C for 10 s at 260 °C Change of varistor voltage: ≤ ±5% Tests of resistance IEC to soldering heat 60068-2-20 for radial leaded components (SHCV) Change of varistor voltage: ≤ ±5% Change of capacitance X7R: ≤ 5/+10% Please read Cautions and warnings and Important notes at the end of this document. Immersion of leads in 60/40 SnPb for 10 s at 260 °C Immersion of leads in Sn96.5Ag3.0Cu0.5 for 10 s at 260 °C Page 72 of 81 Multilayer varistors (MLVs) Standard series Note: Leaching of the termination Effective area at the termination might be lost if the soldering temperature and/or immersion time are not kept within the recommended conditions. Leaching of the outer electrode should not exceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B, shown below as mounted on substrate. As a single chip 7 As mounted on substrate Notes for proper soldering 7.1 Preheating and cooling According to JEDEC J-STD-020D. Please refer to chapter 2. 7.2 Repair / rework Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for rework purposes. 7.3 Cleaning All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning solution according to the type of flux used. The temperature difference between the components and cleaning liquid must not be greater than 100 °C. Ultrasonic cleaning should be carried out with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metallized surfaces. 7.4 Solder paste printing (reflow soldering) An excessive application of solder paste results in too high a solder fillet, thus making the chip more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be applied smoothly to the end surface. Please read Cautions and warnings and Important notes at the end of this document. Page 73 of 81 Multilayer varistors (MLVs) Standard series 7.5 Adhesive application Thin or insufficient adhesive causes chips to loosen or become disconnected during curing. Low viscosity of the adhesive causes chips to slip after mounting. It is advised to consult the manufacturer of the adhesive on proper usage and amounts of adhesive to use. 7.6 Selection of flux Used flux should have less than or equal to 0.1 wt % of halogenated content, since flux residue after soldering could lead to corrosion of the termination and/or increased leakage current on the surface of the component. Strong acidic flux must not be used. The amount of flux applied should be carefully controlled, since an excess may generate flux gas, which in turn is detrimental to solderability. 7.7 Storage of CTVSs Solderability is guaranteed for one year from date of delivery for multilayer varistors, CeraDiodes and ESD/EMI filters (half a year for chips with AgPd and AgPt terminations) and two years for SHCV and CU components, provided that components are stored in their original packages. Storage temperature: 25 °C to +45 °C Relative humidity: ≤75% annual average, ≤95% on 30 days a year The solderability of the external electrodes may deteriorate if SMDs and leaded components are stored where they are exposed to high humidity, dust or harmful gas (hydrogen chloride, sulfurous acid gas or hydrogen sulfide). Do not store SMDs and leaded components where they are exposed to heat or direct sunlight. Otherwise the packing material may be deformed or SMDs/ leaded components may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, it is recommended to use the SMDs or leaded components as soon as possible. 7.8 Placement of components on circuit board Especially in the case of dual-wave soldering, it is of advantage to place the components on the board before soldering in that way that their two terminals do not enter the solder bath at different times. Ideally, both terminals should be wetted simultaneously. 7.9 Soldering cautions An excessively long soldering time or high soldering temperature results in leaching of the outer electrodes, causing poor adhesion and a change of electrical properties of the varistor due to the loss of contact between electrodes and termination. Wave soldering must not be applied for MLVs designated for reflow soldering only. Keep the recommended down-cooling rate. Please read Cautions and warnings and Important notes at the end of this document. Page 74 of 81 Multilayer varistors (MLVs) Standard series 7.10 Standards CECC 00802 IEC 60068-2-58 IEC 60068-2-20 JEDEC J-STD-020D Please read Cautions and warnings and Important notes at the end of this document. Page 75 of 81 Multilayer varistors (MLVs) Standard series Symbols and terms Symbol Term Cline,typ Typical capacitance per line Cmax Maximum capacitance Cmin Minimum capacitance Cnom Nominal capacitance ∆Cnom Tolerance of nominal capacitance Ctyp Typical capacitance fcut-off,min Minimum cut-off frequency I Current Iclamp Clamping current Ileak Leakage current Ileak,typ Typical leakage current IPP Peak pulse current Isurge,max Maximum surge current (also termed peak current) LCT Lower category temperature Ltyp Typical inductance Pdiss,max Maximum power dissipation PPP Peak pulse power Rins Insulation resistance Rmin Minimum resistance RS Resistance per line TA Ambient temperature Top Operating temperature Tstg Storage temperature tr Duration of equivalent rectangular wave tresp Response time UCT Upper category temperature V Voltage VBR,min Minimum breakdown voltage Vclamp,max Maximum clamping voltage VDC,max Maximum DC operating voltage (also termed working voltage) VESD,air Air discharge ESD capability VESD,contact Contact discharge ESD capability Vjump Maximum jump start voltage Please read Cautions and warnings and Important notes at the end of this document. Page 76 of 81 Multilayer varistors (MLVs) Standard series VRMS,max Maximum AC operating voltage, root-mean-square value VV Varistor voltage (also termed breakdown voltage) VV,min Minimum varistor voltage VV,max Maximum varistor voltage ∆VV Tolerance of varistor voltage WLD Maximum load dump Wmax Maximum energy absorption (also termed transient energy) αtyp Typical insertion loss Lead spacing * Maximum possible application conditions All dimensions are given in mm. The commas used in numerical values denote decimal points. Please read Cautions and warnings and Important notes at the end of this document. Page 77 of 81 Multilayer varistors (MLVs) Standard series Cautions and warnings General Some parts of this publication contain statements about the suitability of our ceramic transient voltage suppressor (CTVS) components (multilayer varistors (MLVs), CeraDiodes, ESD/EMI filters, SMD disk varistors (CU types), leaded transient voltage/ RFI suppressors (SHCV types)) for certain areas of application, including recommendations about incorporation/design-in of these products into customer applications. The statements are based on our knowledge of typical requirements often made of our CTVS devices in the particular areas. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our CTVS components for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always incumbent on the customer to check and decide whether the CTVS devices with the properties described in the product specification are suitable for use in a particular customer application. Do not use EPCOS CTVS components for purposes not identified in our specifications, application notes and data books. Ensure the suitability of a CTVS in particular by testing it for reliability during design-in. Always evaluate a CTVS component under worst-case conditions. Pay special attention to the reliability of CTVS devices intended for use in safety-critical applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant). Design notes Always connect a CTVS in parallel with the electronic circuit to be protected. Consider maximum rated power dissipation if a CTVS has insufficient time to cool down between a number of pulses occurring within a specified isolated time period. Ensure that electrical characteristics do not degrade. Consider derating at higher operating temperatures. Choose the highest voltage class compatible with derating at higher temperatures. Surge currents beyond specified values will puncture a CTVS. In extreme cases a CTVS will burst. If steep surge current edges are to be expected, make sure your design is as low-inductance as possible. In some cases the malfunctioning of passive electronic components or failure before the end of their service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In applications requiring a very high level of operational safety and especially when the malfunction or failure of a passive electronic component could endanger human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line applications such as clamp 30), ensure by suitable design of the application or other measures (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of such a malfunction or failure. Only use CTVS components from the automotive series in safety-relevant applications. Please read Cautions and warnings and Important notes at the end of this document. Page 78 of 81 Multilayer varistors (MLVs) Standard series Specified values only apply to CTVS components that have not been subject to prior electrical, mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is therefore not advisable, and it is only allowed together with safety countermeasures like thermal fuses. Storage Only store CTVS in their original packaging. Do not open the package before storage. Storage conditions in original packaging: temperature 25 to +45°C, relative humidity ≤75% annual average, maximum 95%, dew precipitation is inadmissible. Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the packaging material may be deformed or CTVS may stick together, causing problems during mounting. Avoid contamination of the CTVS surface during storage, handling and processing. Avoid storing CTVS devices in harmful environments where they are exposed to corrosive gases for example (SOx, Cl). Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages. Solder CTVS components after shipment from EPCOS within the time specified:  CTVS with Ni barrier termination, 12 months  CTVS with AgPd and AgPt termination, 6 months  SHCV and CU series, 24 months Handling Do not drop CTVS components and allow them to be chipped. Do not touch CTVS with your bare hands - gloves are recommended. Avoid contamination of the CTVS surface during handling. Mounting When CTVS devices are encapsulated with sealing material or overmolded with plastic material, electrical characteristics might be degraded and the life time reduced. Make sure an electrode is not scratched before, during or after the mounting process. Make sure contacts and housings used for assembly with CTVS components are clean before mounting. The surface temperature of an operating CTVS can be higher. Ensure that adjacent components are placed at a sufficient distance from a CTVS to allow proper cooling. Avoid contamination of the CTVS surface during processing. Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering. Soldering Complete removal of flux is recommended to avoid surface contamination that can result in an instable and/or high leakage current. Use resin-type or non-activated flux. Bear in mind that insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack. Please read Cautions and warnings and Important notes at the end of this document. Page 79 of 81 Multilayer varistors (MLVs) Standard series Conductive adhesive gluing Only multilayer varistors (MLVs) with an AgPd termination are approved for conductive adhesive gluing. Operation Use CTVS only within the specified operating temperature range. Use CTVS only within specified voltage and current ranges. Environmental conditions must not harm a CTVS. Only use them in normal atmospheric conditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited. Prevent a CTVS from contacting liquids and solvents. Make sure that no water enters a CTVS (e.g. through plug terminals). Avoid dewing and condensation. EPCOS CTVS components are mainly designed for encased applications. Under all circumstances avoid exposure to:  direct sunlight  rain or condensation  steam, saline spray  corrosive gases  atmosphere with reduced oxygen content EPCOS CTVS devices are not suitable for switching applications or voltage stabilization where static power dissipation is required. Multilayer varistors (MLVs) are designed for ESD protection and transient suppression. CeraDiodes are designed for ESD protection only, ESD/EMI filters are designed for ESD and EMI protection only. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG. Please read Cautions and warnings and Important notes at the end of this document. Page 80 of 81 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply. 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. Release 2018-10 Page 81 of 81