B82498F3391G001

SMT inductors SIMID series, SIMID 0805-F3 Series/Type: B82498F3*001 Date: September 2019 a~í~=pÜÉÉí ¤TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics’ prior express consent is prohibited. SMT inductors, SIMID series B82498F3*001 SIMID 0805-F3 Size 0805 (EIA) and/or 2012 (IEC) Rated inductance 2.7 ... 820 nH Rated current 180 ... 1000 mA Construction ■ Cubic coil with ceramic core ■ Epoxy-molded flat top for vacuum pickup ■ Winding ends welded to terminals Features ■ ■ ■ ■ ■ ■ Temperature range up to +125 °C High resonance frequency Narrow inductance tolerance Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D RoHS-compatible Qualified to AEC-Q200 Applications Resonant circuits, impedance matching for ■ ■ ■ ■ ■ ■ Antenna amplifiers Multimedia Wireless communication systems Automotive electronics GPS (Global Positioning System) Low-pass filters for data lines Terminals ■ Base material Al2O3 ceramic ■ Layer composition W/Ni/Au ■ Electro-plated Marking ■ No marking on component ■ Minimum data on reel: Manufacturer, ordering code, L value, quantity, date of packing Delivery mode and packing unit ■ 8-mm blister tape, wound on 180-mm reel ■ Packing unit: 3000 pcs./reel Please read Cautions and warnings and Important notes at the end of this document. 2 09/19 SMT inductors, SIMID series B82498F3*001 SIMID 0805-F3 Dimensional drawing and layout recommendation A B C 1.5 r0.2 3.2 r0.4 1.0 r0.1 Dimensions in mm Taping and packing Blister tape Reel Dimensions in mm Please read Cautions and warnings and Important notes at the end of this document. 3 09/19 SMT inductors, SIMID series B82498F3*001 SIMID 0805-F3 Technical data and measuring conditions Rated inductance LR Measured with impedance analyzer Agilent E4991A or equivalent at frequency fL, 0.1 V, +20 °C Q factor Qmin Measured with impedance analyzer Agilent E4991A or equivalent at frequency fQ, +20 °C Rated temperature TR +105 °C Rated current IR Maximum permissible DC with inductance decrease 'L/L0 d 10% and temperature increase of d 20 K at rated temperature Self-resonance frequency fres,min Measured with network analyzer Agilent E8362B and/or Agilent E4991A or equivalent, +20 °C DC resistance Rmax Measured at +20 °C Solderability (lead-free) Sn95.5Ag3.8Cu0.7: +(245 r5) °C, (5 r0.3) s Wetting of soldering area t 90% (based on IEC 60068-2-58) Resistance to soldering heat +260 qC, 40 s (as referenced in JEDEC J-STD 020D) Climatic category 55/125/56 (to IEC 60068-1) Storage conditions Mounted: 55 °C … +125 °C Packaged: 25 °C … +40 °C, d 75% RH Weight Approx. 10 mg Please read Cautions and warnings and Important notes at the end of this document. 4 09/19 SMT inductors, SIMID series B82498F3*001 SIMID 0805-F3 Characteristics and ordering codes LR Tolerance nH 2.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 fL Qmin MHz r10% r2% r5% ^ ^ ^ K G J fQ IR Rmax fres,min MHz mA : MHz Ordering code 1) 250 50 1500 1000 0.03 9000 B82498F3279K001 250 250 250 250 50 50 50 50 1000 1000 1000 500 900 800 700 700 0.04 0.05 0.09 0.09 7000 6000 5000 5000 B82498F3569K001 B82498F3689K001 B82498F3829K001 B82498F3100+001 250 250 250 50 50 60 500 500 500 700 650 700 0.09 0.13 0.08 4000 3300 3300 B82498F3120+001 B82498F3150+001 B82498F3180+001 250 250 250 60 60 65 500 500 500 700 700 600 0.08 0.09 0.11 2500 2500 2200 B82498F3220+001 B82498F3270+001 B82498F3330+001 250 200 200 65 65 60 500 500 500 600 600 600 0.12 0.13 0.14 2100 2000 1700 B82498F3390+001 B82498F3470+001 B82498F3560+001 200 150 150 60 60 55 500 500 500 500 500 450 0.18 0.19 0.28 1600 1500 1350 B82498F3680+001 B82498F3820+001 B82498F3101+001 150 100 100 50 45 45 250 250 250 440 400 340 0.31 0.42 0.53 1250 1150 1050 B82498F3121+001 B82498F3151+001 B82498F3181+001 100 100 100 45 45 45 250 250 250 320 270 220 0.70 1.0 1.5 950 900 800 B82498F3221+001 B82498F3271+001 B82498F3331+001 100 50 25 40 30 23 250 100 50 210 190 230 1.6 1.9 1.3 700 650 400 B82498F3391+001 B82498F3471+001 B82498F3561+001 25 25 23 23 50 50 190 180 1.7 1.9 300 300 B82498F3681+001 B82498F3821+001 1) Replace the + by the code letter for the required inductance tolerance. Please read Cautions and warnings and Important notes at the end of this document. 5 09/19 SMT inductors, SIMID series B82498F3*001 SIMID 0805-F3 Impedance |Z| vs. frequency f measured with impedance analyzer Agilent E4991A, typical values at +20 °C Q factor versus frequency f measured with impedance analyzer Agilent E4991A, typical values at +20 °C Inductance L versus DC load current IDC measured with RF LCR meter Agilent 4285A, typical values at +20 °C Current derating Iop/IR versus ambient temperature TA (rated temperature TR = +105 °C) Please read Cautions and warnings and Important notes at the end of this document. 6 09/19 Cautions and warnings ■ Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. – Particular attention should be paid to the derating curves given there. – The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. ■ If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. ■ The following points must be observed if the components are potted in customer applications: – Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. – It is necessary to check whether the potting material used attacks or destroys the wire, wire insulation, plastics or glue. – The effect of the potting material can change the high-frequency behaviour of the components. – Many coating materials have a negative effect (chemically and mechanically) on the winding wires, insulation materials and connecting points. Customers are always obligated to determine whether and to what extent their coating materials influence the component. Customers are responsible and bear all risk for the use of the coating material. TDK Electronics does not assume any liability for failures of our components that are caused by the coating material. ■ Ceramics / ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. ■ Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. Display of ordering codes for TDK Electronics products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes. Please read Cautions and warnings and Important notes at the end of this document. 7 09/19 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply. 8 09/19 Important notes 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. Release 2018-10 9 09/19