X1G0038510015

INFORMATION TG-5035CG-17N 26MHz Model : SPEC. No. : DATE : A11-864-0S Mar. 21. 2012 EPSON TOYOCOM CORPORATION 421-8 Hino, Hino-shi Tokyo 191-8501, Japan INTRODUCTION 1. The contents is subject to change without notice. Please exchange the specification sheets regarding the product’s warranty. 2. This sheet is not intended to guarantee or provide an approval of implementation of industrial patents. 3. We have prepared this sheet as carefully as possible. If you find it incomplete or unsatisfactory in any respect, We would welcome your comments. SPECIFICATIONS This product is compliant with RoHS Directive. This Product supplied (and any technical information furnished, if any) by Epson Toyocom Corporation shall not be used for the development and manufacture of weapon of mass destruction or for other military purposes. Making available such products and technology to any third party who may use such products or technologies for the said purposes are also prohibited. This product listed here is designed as components or parts for electronics equipment in general consumer use. We do not expect that any of these products would be incorporated or otherwise used as a component or part for the equipment, which requires an extra high reliability, such as satellite, rocket and other space systems, and medical equipment, the functional purpose of which is to keep life. Model The product No. of this crystal oscillator unit is X1G003851001500. The model is TG-5035CG-17N (TCXO) Contents Item No. Item Page [1] Characteristics 2 [2] Absolute maximum ratings 2 [3] Operating range 2 [4] Frequency characteristics 3 [5] Electrical characteristics 3 [6] Test circuit 4 [7] Environmental and mechanical characteristics 5 [8] Dimensions and marking layout 6 [9] Recommendable patterning 7 [ 10 ] Handling Precautions 8 1 [ 1 ] Characteristics  Lead Free Reflowable and ultra small SMD(2.5  2.0  0.9 mm).  Using the heat-resisting type AT cut quartz crystal allows almost the same temperature soldering as universal SMD IC.  Operating supply voltage: VCC 1: 1.80 V / VCC 2: 2.80 V. [ 2 ] Absolute maximum ratings Parameter Supply voltage Storage temperature range Symbol Value Unit VCC-GND -0.3 to 4.5 V T_STG -40 to +85 C Symbol Min. Value Typ. Max. 1.70 1.80 1.90 Note [ 3 ] Operating range Parameter VCC1 Power voltage Unit VCC1=1.8 V  0.1 V V VCC2=2.8 V  10 % VCC2 2.52 2.80 3.08 Power voltage GND 0.0 0.0 0.0 V Operating temperature range T_use -40 +25 +85 C Load_R 9.0 10.0 11.0 kΩ Load_C 9 10 11 pF CC 0.01 Output load DC-cut capacitor Note F DC-cut capacitor is not included in our TCXO. Please insert DC-cut capacitor(0.01uF Min.) in output line. 2 [ 4 ] Frequency characteristics 1) Output frequency 2) Frequency characteristics 26.000000 MHz ( Condition : VCC = 1.8 / 2.8 V, GND = 0.0 V, Load 10 kΩ // 10 pF, T_use =+25 C ) Parameter Frequency tolerance Symbol Value f_tol(OSC)  2.0  10 Max. T_use =+25 C  2 C After 2times Reflow fo-Tc  0.5  10 Max. -6  3.0  10 Max. T_use =- 30 C to +85 C T_use =- 40 C to - 30 C (Based on frequency at +25 C) -  0.6  10 Max. Temp.ramped over operating range. Frequency measured before and after at +25 C fo-Load  0.1  10 Max. Load : 10 kΩ // 10 pF,  10 % each fo-Vcc  0.1  10 Max. VCC 1 = 1.80 V  0.1 V VCC 2= 2.80 V  10 % Note -6 -6 Frequency / temperature characteristics Hysteresis Frequency / Load coefficient Frequency / voltage coefficient Frequency slope vs. Temp. -6 -6 -6  0.05  10 / C Max. -6 - 20 to +65 C / every 2 C  0.10  10 / C Max. - 30 to +85 C / every 2 C  0.35  10 / C Max. - 40 to +85 C / every 2 C -6 - -6  1.0  10 Max. T_use =+25 C first year  1.5  10 Max. T_use =+25 C 2 years  2.5  10 Max. T_use =+25 C 5 years -6 -6 Frequency aging f_age -6 *1,*2  5.0  10 Max. T_use =+25 C 10 years *1 Include initial frequency tolerance and frequency deviation after reflow cycles. *2 Measurement of frequency deviation is made 1h after reflow soldering. -6 [ 5 ] Electrical characteristics ( Condition : VCC = 1.80 V, GND = 0.0 V, Load 10 kΩ // 10 pF, T_use =+25 C ) Parameter Value Symbol Unit Min. Typ. Max. Note Current consumption ICC - - 1.50 mA Output level VPP 0.80 - - V Peak to peak voltage SYM 40 60 % GND level Symmetry SSB Phase noise Harmonics Start up time - - -50 Offset:1 Hz - - -80 Offset:10 Hz - - -105 - - -130 - - -148 Offset:10 kHz - - -150 Offset:100 kHz - - - -8 tOSC - - 2.0 L(f) 3 dBc /Hz Offset:100 Hz Offset:1 kHz T_use =-30 C to +80 C Until frequency has been reached within +/-0.5 ppm of final freqency. ms Until output signal has been reached min90% of final amp. dBc [ 6 ] Test circuit 1) Output Load 0.01 F VCC OUT NC GND By-pass Capacitor Supply Voltage Load : 10 kΩ Load : 10 pF 0.01 F 2) Current consumption A 0.01 F VCC OUT NC GND By-pass Capacitor Supply Voltage Test Point Load : 10 kΩ Load : 10 pF 0.01 F 3) Conditions 1. Oscilloscope: Impedance Min. 1 MΩ Input capacitance Max. 10 pF Band width Min. 300 MHz Impossible to measure both frequency and wave form at the same time.(In case of using oscilloscope's amplifier output, possible to measure both at the same time.) 2. CL includes probe capacitance. 3. A capacitor (By-pass:0.01 F) is placed between VCC and GND,and closely to TCXO. 4. Use the current meter whose internal impedance value is small. 5. Power Supply Impedance of power supply should be as lowest as possible. 6. GND should apply one point earth. 4 [ 7 ] Environmental and mechanical characteristics (The company evaluation condition. we evaluate it by the following examination item and examination condition.) Value *1 Test method No. Item Freq. Tolerance Electrical -6 [110 ] *2 characteristics 1 High temp. storage *3 ± 2.0 +85 °C  1 000 h 2 Low temp. storage *3 ± 2.0 -40 °C  1 000 h ± 2.0 +85 ± 2 °C × 85 ± 5 %RH × 1 000 h 3 4 High temperature with Humidity Temp. cycle *3 -40 °C to +85 °C ± 2.0 (30 min  100 cycle/each) Resistance to 5 Soldering heat (Reflow ± 1.0 6 Reflow furnace with the condition 2 times Satisfy Item characteristics) output level after Drop Free drop from 750 mm height on a hard test ± 2.0 wooden board for 3 times. (Board is thickness more than 30 mm) 10 Hz to 55 Hz 7 Vibration 55 Hz to 500 Hz acceleration 98 m/s ± 1.0 (variable frequency) 0.75 mm 2 10 Hz  500 Hz  10 Hz 15 min./cycle 6 h(2 h  3 directions) 8 ESD (MM) ± 1.0 200pF 0Ω 200V. Discharge 3 pulses 9 ESD (HBM) ± 1.0 100pF 1.5kΩ 2000V. Discharge 3 pulses 10 Solderability Terminals must be 95 % covered with Dip termination into solder bath at +235 °C fresh solder for 5 s (Using Rosin Flux) Notes 1.*1 each test is independent. 2.*2 measuring 2 h to 24 h later leaving in room temperature after each test. 3.*3 Pre conditionings 1. reflow 2 times 2. Initial value shall be after 24 h at room temperature. Infrared-reflow Pre heating temperature : +170 °C Heating temperature : +220 °C Peak temperature must not exceed +260 °C Pre heating time : 100 s Heating time : 35 s T (Temperature) +260 C . +220 C +170 C 35 s 100 s t (time) 5 [ 8 ] Dimensions And Marking Layout W #4 #3 L VCC #4 (3) (5) GJ MARKING ● (1) #1 N.C. #1 (4) (2) OUT #3 (1) 1Pin Mark (2) Arbitrary marking area (3) Location code (4) TCXO Model ID ｢GJ｣ (5) TCXO Lot No. #2 (3 figure) GND #2 ［TOP VIEW］ Marking Material K H Ceramics(base) Au coated nickel(terminal) Fe-Ni-Co(lid) ［SIDE VIEW］ B G CONNECTION #1 N.C./GND TP GND #2 #4 Vcc TP OUT #3 C A F D E BOTTOM VIEW ［BOTTOM VIEW］ (unit : mm) Dim. Min. Typ. Max. Dim. Min. Typ. Max. W 2.45 2.50 2.65 D 0.40 0.50 0.60 L 1.95 2.00 2.15 E 1.35 1.50 1.65 H 0.70 0.80 0.90 F --- C0.2 --- A 1.35 1.50 1.65 G --- R0.15 --- B 1.95 2.10 2.25 K --- 0.45 --- C 0.50 0.60 0.70 6 [ 9 ] Recommendable patterning For actual design work, please consider optimum condition together with mounting density, reliability of soldering and mount ability etc. Do not design any patterns except GND on the shaded area. Soldering position Cby (ex. 0.01μF) Resist 0.80 Output 1.40 1.00 Vcc Vcont N.C./GND GND 2.10 Unit: mm 7 [ 10 ] Handling precautions 1. Static discharge This device is made with CMOS IC. Please take precautions to prevent damage against electrical static discharge. 2. Power fluctuations We recommend placing a 0.1 F capacitor between VCC and GND to obtain stable operation and protect against power line ripple. VCC and GND pattern shall be biggest as possible. 3. Power supply line EPSON cannot recommend to put filtering element into power line so as to reduce noise. Oscillator might be unstable oscillation because high frequency impedance of power line becomes higher. When use filtering element, please verify electrical construction and or element's spec. 4. Power on EPSON doesn’t recommend to power on from intermediate electric voltage or extreme fast power on. Those powering conditions may cause no oscillation or abnormal oscillation. 5. Power line ripple Power line ripple level must be kept less than 200 mVpp. 6. Output line As a long output line may cause irregular output, please take care to design that output line is as shortest possible, and also keeps high level signal source away from this device. 7. Layout of TCXO in P.C.B. Please keep distance in TCXO from Another High Level signal line. 8. Shock reliability This device contains a quartz crystal, so please do not give too much shock or vibration. We recommend storing of devices under normal temperature and humidity to keep the specification. 9. Automatic insertion An automatic insertion is available. However, the internal quartz crystal might be damaged in case that too much shock or vibration is given by machine condition. Be sure to check your machine conditioning in advance. 10. Ultrasonic cleaning Ultrasonic cleaners can be used on TCXO Series, however, since the oscillator must be damaged under some conditions, please exercise in advance. 11. Storage We recommend storing products at +15 ℃ to +35 ℃ and 25 %RH to 85 %RH. 12. Vibration When some vibration or periodic mechanical shock will be added from piezoelectric sounder, piezoelectric buzzer and from like that to the oscillator, the phenomena such as a frequency drift or swing level change may exist during the time facing such vibration. Of cause our oscillator has designed to minimize such problems, however please take care to design the layout as follows to avoid such problems. (1) To mount a sounder or vibrator on the separated circuit board. (2) When mounted on a same circuit board, to keep the distance as far as possible between a oscillator and vibrator to put some cushion between a vibrator and a circuit board to put some slit on the portion between a vibrator and a oscillator. (3) When you want to process electrical tests, it is advised that the circuit should be enclosed in a enclosure because the vibration affects will be changed from the result of a circuit board itself. 8 TAPING SPECIFICATION Ⅰ．Application This standard will apply to 2.5×2.0 Ceramic package. Spec：CG package Ⅱ．Contents Item No. Item Page 〔1〕 Taping specification 1 to 2 〔2〕 Inner carton 3 〔3〕 Shipping carton 〔4〕 Marking 〔5〕 Quantity 〔6〕 Storage environment 〔7〕 Handling 4 P. 1 〔1〕 Taping specification Subject to EIA-481& EIAJ EDX-7602, IEC 60286, JIS C-0806 (1) Tape dimensions 4.00.1 φ1.0+0.2/-0 4.00.1 1.150.1 0.250.05 2.80.1 2.00.1 8.00.2 +0.1 -0 3.50.1 2.30.1 Unit : mm (2) Reel dimensions Material of the reel : PS 11.41.0 φ180.0 φ13.00.2 9.00.3 φ60.0 φ1.5 1.750.1 Material of the carrier tape : PS 2.0±0.5 Unit : mm P. 2 (3) Packing ①Tape & reel Tape reel Label Top tape Carrier tape #1 Vc/N.C. #4 Vcc Marking GND #2 OUT #3 Marking Marking Marking Marking User direction of feed ②Start & end point End Top tape Start Empty pocket Empty pocket Item Tape leader Tape trailer Tape leader User direction of feed Tape trailer Empty space Top tape Min. 200 mm Empty pocket Min. 150 mm Top tape Min. 50 mm Empty pocket Min. 150 mm Top tape P. 3 〔2〕 Inner carton a) Packing to alumi laminate bag The reel is packed in the vacuum with the alumi laminate bag. Sealing Alumi laminate bag Label Desiccant b) Packing to inner carton Label 〔3〕 Shipping carton Taping Label P. 4 〔4〕 Marking (1) Reel marking ・Reel marking shall consist of : 1) Parts name 2) Quantity 3) Manufacturing date or symbol 4) Manufacturer’s name or symbol 5) Others (if necessary) (2) Inner carton marking ・Same as reel marking. (3) Shipping carton marking ・Shipping carton marking shall consist of : 1) Parts name 2) Quantity 〔5〕 Quantity ・Max : 2000 pcs/reel Min : 500 pcs/reel 〔6〕 Storage environment (1) To storage the reel at 15 C to 35 C, 25 %RH to 85 %RH of humidity. (2) To open the packing just before using. (3) Not to expose the sun. (4) Not to storage with some erosive chemicals. (5) Nothing is allowed to put on the reel or carton to prevent mechanical damage. 〔7〕 Handling ・To handle with care to prevent the damage of tape, reel and products. Structure diagram. TG-5035CG ① ③ ② ④ ⑤ ⑨ ⑧ ⑦ ⑥ LIST Name of part Specification 1 XTAL adhesives Ag paste 2 XTAL chip AT cut 3 Lid Fe – Ni – Co 4 Seam ring Kovar ＋ Ni ,Au 5 Base Ceramic PKG 6 Terminal Au coated , Ni 7 IC CMOS 8 FC bump Au 9 UF Potting resin 10 TCE11-CO-074_02 MGR. Y.Shishido CHK. ENG. A.Kakumae RELIABILITY TEST DATA Product Name : TG-50xxCG series The Company evaluation condition We evaluate environmental and mechanical characteristics by the following test condition . OUT10-E24-30M TEST FAIL VALUE *1 D f / f *2 Qty Qty Electrical No. ITEM TEST CONDITIONS -6 characteristics [1 × 10 ] [n] [n] *3 High temperature 0 22 1 +85 oC × 1 000 h storage ± 2.0 *3 Low temperature 2 22 0 -40 oC × 1 000 h storage ± 2.0 *3 High Temperature 0 22 3 +85 ± 2 oC × 85 ± 5 %RH × 1 000 h with Humidity ± 2.0 *3 -40 oC ⇔ +85 oC 0 22 4 Temperature cycle ± 2.0 30 min at each temp. 1000 cycles 5 Resistance to soldering heat Convection reflow soldering furnace (3 times) 150g dummy jig (Epson Toyocom Standard) drop from 1500 mm height on the concrete 6 directions 3 times. 10 Hz to 55 Hz amplitude 0.75 mm 55 Hz to 500 Hz acceleration 98 m/s2 10 Hz → 500 Hz → 10 Hz 15 min / cycle 6 h ( 2 h × 3 directions ) 22 0 22 0 ± 2.0 22 0 ± 1.0 ± 2.0 Satisfy output level after test 6 Drop 7 Vibration 8 ESD (MM) 200pF 0Ω 200V , Discharge 3 pulses ± 1.0 22 0 9 ESD (HBM) 100pF 1.5kΩ 2000V , Discharge 3 pulses ± 1.0 22 0 11 0 10 Solderability Dip termination into solder bath at +235 oC ± 5 oC for 5 s (Using Rosin Flux) Termination must be covered with fresh solder more than 95 % of dip area. Notes 1. *1 Each test done independently. 2. *2 Measuring 2 h to 24 h later leaving in room temperature after each test. 3. *3 Initial value shall be measured after 24 h storage at room temperature Pre-treatment    Pre-treatment : Bake (+125 ℃ × 24 h) →Moisture soak (+85 ℃ × 60 % × 168 h) →reflow (3 times) QD Business Unit Production Management Div. Qualification Data signature Product Name : TG-50xxCG series 1. High temp. storage 2. Low temp. storage 3. Temp. humidity storage +85 oC × 1 000 h -40 oC × 1 000 h +85 oC × 85 %RH × 1 000 h 3.0 3.0 2.0 2.0 2.0 1.0 0.0 [ 1 × 10-6 ] 3.0 [ 1 × 10-6 ] [ 1 × 10-6 ] df / f 1.0 0.0 -1.0 -1.0 -2.0 -2.0 -2.0 -3.0 -3.0 -3.0 10 20 0 30 10 [ pcs. ] 20 0 30 6. Drop 1.0 2.0 0.0 -1.0 3.0 2.0 [ 1 × 10-6 ] 3.0 [ 1 × 10-6 ] 2.0 1.0 0.0 -3.0 10 20 -2.0 -3.0 -3.0 0 [ pcs. ] 7. Vibration 10 Hz to 55 Hz amplitude 0.75 mm 2.0 1.0 0.0 10 [ pcs. ] 20 30 0 10 [ pcs. ] 20 8. ESD (MM) 9. ESD (HBM) 200pF 0Ω 200V 100pF 1.5kΩ 2000V 3.0 3.0 2.0 2.0 [ 1 × 10-6 ] [ 1 × 10-6 ] 3.0 0.0 -2.0 30 55 Hz to 500 Hz acceleration 98 m/s2 15 min / cycle 6 h ( 2 h × 3 directions ) 1.0 -1.0 -1.0 -2.0 30 1500 mm × 6 times For convention reflow soldering furnace (3 times) 3.0 20 [ pcs. ] 5. Resistance to soldering heat -40 oC ⇔ +85 oC 1000 cycles 0 10 [ pcs. ] 4. Temp. cycle [ 1 × 10-6 ] 0.0 -1.0 0 [ 1 × 10-6 ] 1.0 1.0 0.0 30 1.0 0.0 -1.0 -1.0 -2.0 -2.0 -3.0 -3.0 -1.0 -2.0 -3.0 0 10 [ pcs. ] Qualification Data 20 30 0 10 20 [ pcs. ] 30 0 10 20 [ pcs. ] 30