BRPG1211C

Product Guide Product 1211C Series Bi-Color Ultra Compact SMT LED s Features • Superbright, compact bicolor package • 1.6mm (L) x 1.5mm (W) x 0.7mm (H) s Applications • Mobile devices (cellular telephone, PDAs, pagers) • Telecommunications s Outline Dimensions Unit: mm Tolerances + 0.1 s Electro-Optical Characteristics Part No. Material Emitted Lens Color Color Red (BR) Yellow-Green (PY) Red (BR) Green (PG) Red (BR) Pure Green (BG) Milky White (Ta=25°C) Wavelength Peak λp TYP. Dominant λd TYP. Spectral Line Half Width ∆λ TYP. IF Luminous Intensity IV MIN. TYP. IF Forward Voltage V TYP. MAX. F Reverse Viewing Current IR Angle IF MAX. VR (2 θ 1/2) GaAIAs BRPY1211C GaP GaAIAs BRPG1211C GaP GaAlAs BRBG1211C GaP 7.0 11.7 20 7.0 11.7 20 7.0 11.7 20 4.5 1.7 6.4 2.4 20 20 mA 7.0 11.7 20 660 570 660 560 660 555 647 572 647 567 647 558 nm 30 30 30 30 30 30 20 20 20 20 20 20 mA 1.7 2.1 1.7 2.1 1.7 2.1 V 2.3 2.8 2.3 2.8 2.3 2.8 20 20 20 20 20 20 mA 100 100 100 100 100 100 µA 4 4 4 4 4 4 V 170° 150° 170° 150° 170° 150° Deg. Units mcd s Absolute Maximum Ratings Red (BR) Yellow-Green (PY) Red (BR) Green (PG) Red (BR) Pure Green (BG) (Ta=25°C) Item Symbol Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Pd IF IFM VR Topr Tstg ∆IF BRPY 70 25 60 4 BRPG 70 25 60 4 -30 to +85 -40 to +100 0.36 (DC) 0.86 (Pulse) Units BRBG 70 25 60 4 mW mA mA V °C °C mA/°C * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. s Taping Specifications 4+0.1 1.75 + 0.1 s Operation Current Derating Chart (DC) (0.2) φ 1.5+0.1 0 (1.7) (φ 0.6) Center Hole 4 +0.1 2+0.05 3.5 + 0.05 Quantity on tape: 4,000 pieces per reel (0.9) 2+0.5 φ 21+0.8 8+0.2 Direction to pull +1 φ 60 -0 φ 13+0.2 BRPY, BRPG, BRBG (1.8) 1.8 φ 13+0.2 9+0.3 11.4+1 +0 φ 180 3 s Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. • Reflow Soldering: °C Operation Heating 240 Temperature rise: 5°C/sec. Cooling: —5°C/sec. LED Surface Temperature s Spatial Distribution 150 120 Pre-heating 2. Cleaning: • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PG1211C-0301 ~ 0 60 to 120 sec. 5 sec. max Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555 Website: www.stanley-electric.com