BAT18...
Silicon RF Switching Diode
• Low-loss VHF / UHF switch above 10 MHz
• PIN diode with low forward resistance
• Pb-free (RoHS compliant) package
BAT18-04
BAT18-05
!
,
!
,
,
,
Type
BAT18-04
BAT18-05
Package
SOT23
SOT23
Configuration
series
common cathode
LS(nH)
1.8
1.8
Marking
AUs
ASs
Maximum Ratings at T A = 25°C, unless otherwise specified
Parameter
Symbol
Diode reverse voltage
VR
35
V
Forward current
IF
100
mA
Junction temperature
Tj
150
°C
Operating temperature range
Top
-55 ... 125
Storage temperature
Tstg
-55 ... 150
Value
Unit
Thermal Resistance
Parameter
Symbol
Value
Unit
Junction - soldering point1)
RthJS
≤ 290
K/W
BAT18-04, BAT18-05
1For
calculation of RthJA please refer to Application Note Thermal Resistance
1
2011-06-14
BAT18...
Electrical Characteristics at T A = 25°C, unless otherwise specified
Parameter
Symbol
Values
min.
typ.
Unit
max.
DC Characteristics
Reverse current
IR
nA
VR = 20 V
-
-
20
VR = 20 V, TA = 60 °C
-
-
200
VF
-
0.92
1.2
CT
-
0.75
1
pF
rf
-
0.4
0.7
Ω
τ rr
-
120
-
ns
WI
-
3
-
µm
Forward voltage
V
IF = 100 mA
AC Characteristics
Diode capacitance
VR = 20 V, f = 1 MHz
Forward resistance
IF = 5 mA, f = 100 MHz
Charge carrier life time
IF = 10 mA, IR = 6 mA, measured at IR = 3 mA ,
RL = 100 Ω
I-region width
2
2011-06-14
BAT18...
Diode capacitance CT = ƒ (VR )
Forward resistance rf = ƒ (IF)
f = 1MHz
f = 100MHz
CT
2.0
pF
1.8
BAT 18...
EHD07019
10 1
rf
BAT 18...
EHD07020
Ω
1.6
1.4
1.2
10 0
1.0
0.8
0.6
0.4
0.2
0.0
0
10
20
V
10 -1
10 -1
30
10 0
10 1
mA
10 2
ΙF
VR
3
2011-06-14
Package SOT23
BAT18...
0.4 +0.1
-0.05
1)
2
0.08...0.1
C
0.95
1.3 ±0.1
1
2.4 ±0.15
3
0.1 MAX.
10˚ MAX.
B
1 ±0.1
10˚ MAX.
2.9 ±0.1
0.15 MIN.
Package Outline
A
5
0...8˚
1.9
0.2
0.25 M B C
M
A
1) Lead width can be 0.6 max. in dambar area
Foot Print
0.8
0.9
1.3
0.9
0.8
1.2
Marking Layout (Example)
Manufacturer
EH s
2005, June
Date code (YM)
Pin 1
BCW66
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
8
2.13
2.65
0.9
Pin 1
1.15
3.15
4
2011-06-14
BAT18...
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office ().
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
5
2011-06-14
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