TLE6251DSXUMA2

Data Sheet, Rev. 3.1, Aug. 2007 TLE6251DS High Speed CAN-Transceiver with Bus wake-up Automotive Power Edition 2007-08-20 Published by Infineon Technologies AG 81726 Munich, Germany © 2005 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. High Speed CAN-Transceiver with Bus wake-up TLE6251DS Features • • • • • • • • • • • • • • • CAN data transmission rate up to 1 Mbaud Compatible to ISO/DIS 11898 Supports 12 V and 24 V automotive applications Low power mode with remote wake-up via CAN bus Wake signaling by RxD change No BUS load in stand-by mode Wide common mode range for electromagnetic immunity (EMI) Digital inputs compatible to 3.3 and 5 V logic devices CAN short circuit proof to ground, battery and VCC Split termination to stabilize the recessive level TxD time-out function Overtemperature protection Protected against automotive transients Green Product (RoHS compliant) AEC Qualified Description The CAN-transceiver TLE6251DS is a monolithic integrated circuit in a PG-DSO-8 package for high speed differential mode data transmission (up to 1 Mbaud) and reception in automotive and industrial applications. It works as an interface between the CAN protocol controller and the physical bus lines compatible to ISO/DIS 11898. As a successor to the first generation of HS CAN (TLE6250), the TLE6251DS is designed to provide an excellent passive behavior when the transceiver is switched off (mixed networks, terminal 15/30 applications) and a remote wake-up capability via CAN bus in low power mode. This supports networks with partially un-powered nodes. The TLE6251DS has two operation modes, the normal and the stand-by mode. These modes can be chosen by the STB pin. If the TLE6251DS is in stand-by mode and a message on the bus is Type Package TLE6251DS PG-DSO-8 Data Sheet 3 Rev. 3.1, 2007-08-20 TLE6251DS detected, the TLE6251DS changes the level at the RxD pin corresponding to the bus signal (wake-up flag). The TLE6251DS is also designed to withstand the severe conditions of automotive applications and to support 12 V and 24 V applications. The IC is based on the Smart Power Technology SPT® which allows bipolar and CMOS control circuitry in accordance with DMOS power devices existing on the same monolithic circuit. Pin Configuration and Definitions T L E6251 D S T xD 1 8 ST B GN D 2 7 C AN H VCC 3 6 C AN L R xD 4 5 SPLIT AEP03389.VSD Figure 1 Pin Configuration (top view) Table 1 Pin Definitions and Functions Pin No. Symbol Function 1 TxD CAN transmit data input; 20 kΩ pull-up, LOW in dominant state 2 GND Ground 3 VCC 5 V supply input; block to GND with 100 nF ceramic capacitor 4 RxD CAN receive data output; LOW in dominant state 5 SPLIT Split termination output; to support the recessive voltage level of the bus lines 6 CANL Low line input; LOW in dominant state 7 CANH High line output; HIGH in dominant state 8 STB Mode control input; internal pull-up, see Figure 3 Data Sheet 4 Rev. 3.1, 2007-08-20 TLE6251DS Functional Block Diagram TLE6251DS VCC 3 Wake-Up Logic 8 Mode Control Logic STB VCC CANH CANL 7 6 Driver Output Stage Temp.Protection 1 + timeout TxD = Receiver MUX SPLIT GND 4 RxD 5 2 AEB03388.VSD Figure 2 Data Sheet Functional Block Diagram 5 Rev. 3.1, 2007-08-20 TLE6251DS Application Information The TLE6251DS has two operation modes, the normal and the standby mode. These modes can be controlled with the STB pin (see Figure 3, Table 2). The STB pin has an implemented pullup, so if there is no signal applied to STB or STB = HIGH, the standby mode is activated. To transfer the TLE6251DS into the normal mode, STB has to be switched to LOW. Normal STB = 0 Stand-By STB = 1 AEA03391.VSD Figure 3 Mode State Diagram Table 2 Truth Table Mode STB Normal low Stand by 1) high Event RxD BUS Termination VCC/2 bus dominant low bus recessive high wake-up via CAN bus detected low/high1) no wake-up detected high GND Signal at RxD changes corresponding to the bus signal during stand by mode. See Figure 6 Normal Mode This mode is designed for the normal data transmission/reception within the HS-CAN network. Data Sheet 6 Rev. 3.1, 2007-08-20 TLE6251DS Transmission The signal from the µC is applied to the TxD input of the TLE6251DS. Now the bus driver switches the CANH/L output stages to transfer this input signal to the CAN bus lines. TxD Time-out Feature If the TxD signal is dominant for a time t > tTxD the TxD time-out function deactivates the transmission of the signal at the bus. This is realized to prevent the bus from being blocked permanently dominant due to an error. The transmission is released again, after a rising edge at TxD has been detected. Reduced Electromagnetic Emission The bus driver has an implemented control to reduce the electromagnetic emission (EME). This is achieved by controlling the symmetry of the slope, resp. of CANH and CANL. Overtemperature The driver stages are protected against overtemperature. Exceeding the shutdown temperature results in deactivation of the driving stages at CANH/L. To avoid a bit failure after cooling down, the signals can be transmitted again only after a dominant to recessive edge at TxD. Figure 4 shows the way how the transmission stage is deactivated and activated again. First an over temperature condition causes the transmission stage to deactivate. After the over temperature condition is no longer present, the transmission is only possible after the TxD signal has changed to recessive level. Data Sheet 7 Rev. 3.1, 2007-08-20 TLE6251DS Failure Overtemp VCC Overtemperature GND t TxD VCC GND t BUS VDIFF (CANH-CANL) R D R t AET03394.VSD Figure 4 Release of the Transmission after Overtemperature Reception The analog CAN bus signals are converted into a digital signal at RxD via the differential input receiver. The RxD signal is switched to RxD output pin via the multiplexer (MUX), see Figure 2. In normal mode the split pin is used to stabilize the recessive common mode signal. Standby Mode The standby mode is designed to switch the TLE6251DS into a low power mode with minimum current consumption. The driving stages and the receiver are deactivated. Only the relevant circuitry to guarantee a correct handling of the CAN bus wake-up is still active. This wake-up receiver is also designed to show an excellent immunity against electromagnetic noise (EMI). Change into Standby Mode during CAN Bus Failure It is possible to change from normal mode into the standby mode if the bus is dominant due to a bus failure without setting the RxD wake flag to LOW. The advantage is, that the TLE6251DS can be kept in the standby mode even if a bus failure occurs. Figure 5 shows this mechanism in detail. During a bus network failure, the bus might be dominant. Normal communication is not possible until the failure is removed. To reduce the current consumption, it makes sense to switch over to standby mode. This is possible with the Data Sheet 8 Rev. 3.1, 2007-08-20 TLE6251DS TLE6251DS. If the dominant signal switches back to recessive level, e.g. failure removed, a wake-up via CAN bus (recessive to dominant signal detected) is possible. BUS VDIFF (CANH-CANL) VCC D R D t STB (Mode) VCC Normal Mode (STB = LOW) Standby Mode (STB = HIGH) RxD tWU1 tWU2 t VCC t AET03393.VSD Figure 5 Go-To Standby Mode during Bus Dominant Condition Wake-up via CAN Message During standby mode, a dominant CAN message on the bus longer than the filtering time t > tWU1, leads to the activation of the wake-up. The wake-up during standby mode is signaled with the RxD output pin. A dominant signal longer t > tWU1 on the CAN bus switches the RxD level to LOW, with a following recessive signal on the CAN bus longer t > tWU2 the RxD level is switched to high, see Figure 6. The µC is able to detect this change at RxD and switch the transceiver into the normal mode. Data Sheet 9 Rev. 3.1, 2007-08-20 TLE6251DS VCAN CANH VCC VCC/2 CANL t BUS VDIFF (CANH-CANL) Recessive to Dominant VDIFF(d) VDIFF(d) VRxD tWU2 tWU1 VCC VDIFF(d) VDIFF(d) t 0.8 x VCC 0.2 x VCC GND t AET03395_TO1.VSD Figure 6 Wake-up behavior Split Circuit The split circuitry is activated during normal mode and deactivated (SPLIT pin floating) during standby mode. The SPLIT pin is used to stabilize the recessive common mode signal in normal mode. This is realized with a stabilized voltage of 0.5 VCC at SPLIT. A correct application of the SPLIT pin is shown in Figure 7. The split termination for the left and right node is realized with two 60 Ω resistances and one 10 nF capacitor. The center node in this example is a stub node and the recommended value for the split resistances is 1.5 kΩ. Data Sheet 10 Rev. 3.1, 2007-08-20 TLE6251DS C AN H C AN H T LE6251 G/D S 60 Ω Split Term ination SPLIT 10 nF T LE6251 G/D S 60 Ω C AN Bus Split T erm ination 60 Ω 60 Ω SPLIT 10 nF C AN L C AN L 10 nF Split Term ination at Stub 1.5 kΩ C AN H 1.5 kΩ SPLIT C AN L TL E6251 G/D S AEA 03390.VSD Figure 7 Application of the SPLIT Pin for Normal Nodes and one Stub Node Other Features Fail Safe If the device is supplied but there is no signal at the digital inputs, the TxD and STB have an internal pull-up path, to prevent the transceiver to switch into the normal mode or send a dominant signal on the bus. Un-supplied Node The CANH/CANL pins remain high ohmic, if the transceiver is un-supplied. Data Sheet 11 Rev. 3.1, 2007-08-20 TLE6251DS Table 3 Absolute Maximum Ratings Parameter Symbol Limit Values Unit Remarks Min. Max. VCC VCANH/L -0.3 5.5 V – -32 40 V – CAN bus differential voltage CANH, CANL, SPLIT VCAN diff -40 40 V CANH - CANL < |40 V| CANH - SPLIT < |40 V| CANL - SPLIT < |40 V| Input voltage at SPLIT VSPLIT VI -27 40 V – -0.3 VCC V 0 V < VCC < 5.5 V Electrostatic discharge voltage at CANH, CANL, SPLIT vs. GND VESD -6 6 kV human body model (100 pF via 1.5 kΩ) Electrostatic discharge voltage VESD -2 2 kV human body model (100 pF via 1.5 kΩ) Tj -40 150 °C – Voltages Supply voltage CAN bus voltage (CANH, CANL) Logic voltages at STB, TxD, RxD Temperatures Storage temperature Note: Maximum ratings are absolute ratings; exceeding any one of these values may cause irreversible damage to the integrated circuit. Data Sheet 12 Rev. 3.1, 2007-08-20 TLE6251DS Table 4 Operating Range Parameter Symbol Limit Values Min. Supply voltage Junction temperature Unit Remarks Max. VCC Tj 4.75 5.25 V – -40 150 °C – Rthj-a – 185 K/W 1) 150 190 °C – – 10 K – Thermal Resistances Junction ambient Thermal Shutdown (junction temperature) Thermal shutdown temperature Thermal shutdown hyst. 1) TjsD ∆T Calculation of the junction temperature Tj = Tamb + P × Rthj-a Data Sheet 13 Rev. 3.1, 2007-08-20 TLE6251DS Table 5 Electrical Characteristics 4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Unit Remarks Min. Typ. Max. ICC – 6 10 ICC – ICC,stb – 20 30 µA stand-by mode; TxD = high HIGH level output current IRD,H – -4 -2 mA VRD = 0.8 × VCC – -100 – µA stand-by mode LOW level output current IRD,L ISC,RxD 2 4 – mA VRD = 0.2 × VCC – 15 20 mA – HIGH level input voltage threshold VTD,H 2.0 – – V recessive state LOW level input voltage threshold VTD,L – – 0.8 V dominant state TxD pull-up resistance RTD VTD hys 10 20 40 kΩ – – 200 – mV – HIGH level input voltage threshold VSTB,H 2.0 – – V normal mode LOW level input voltage threshold VSTB,L – – 0.8 V receive-only mode STB pull-up resistance RSTB VSTB hys 10 20 40 kΩ – – 200 – mV – Current Consumption Current consumption Current consumption Current consumption mA recessive state; VTxD = VCC 45 70 mA dominant state; VTxD = 0 V Receiver Output RxD Short circuit current Transmission Input TxD TxD input hysteresis Stand By Input (pin STB) STB input hysteresis Data Sheet 14 Rev. 3.1, 2007-08-20 TLE6251DS Table 5 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Unit Remarks Min. Typ. Max. VSPLIT 0.3 × 0.5 × 0.7 × VSPLIT 0.45 × 0.5 × 0.55× V VCC VCC VCC Leakage current ISPLIT -5 0 5 µA standby mode; -22 V < VSPLIT < 35 V SPLIT output resistance RSPLIT – 600 – Ω – Differential receiver threshold voltage, normal mode Vdiff,rdN Vdiff,drN – 0.8 0.9 V recessive to dominant 0.5 0.6 – V dominant to recessive Differential receiver threshold, low power mode Vdiff,rdLP Vdiff,drLP 0.9 1.15 V recessive to dominant V dominant to recessive Split Termination Output (pin SPLIT) Split output voltage VCC VCC V VCC normal mode; -500 µA < ISPLIT < 500 µA normal mode; no Load Bus Receiver 0.4 0.8 Common Mode Range CMR -12 – 12 V VCC = 5 V Differential receiver hysteresis Vdiff,hys – 200 – mV – CANH, CANL input resistance Ri 10 20 30 kΩ recessive state 20 40 60 kΩ recessive state 2.5 3.0 V VTxD = VCC; Differential input resistance Rdiff Bus Transmitter CANL/CANH recessive output voltage VCANL/H 2.0 CANH, CANL recessive output voltage difference Vdiff -500 – 50 mV CANL dominant output voltage VCANL 0.5 – 2.25 V CANH dominant output voltage VCANH 2.75 – 4.5 V Data Sheet no load VTxD = VCC; no load 15 VTxD = 0 V; VCC = 5 V VTxD = 0 V; VCC = 5 V Rev. 3.1, 2007-08-20 TLE6251DS Table 5 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Unit Remarks Min. Typ. Max. 1.5 – 3.0 V VTxD = 0 V; VCC = 5 V CANL short circuit current ICANLsc 50 80 200 mA CANH short circuit current ICANHsc -200 -80 -50 mA - - -5 µA VCANLshort = 18 V VCANHshort = 0 V VCC = 0 V; 0 V < VCANH,L < 5 V CANH, CANL dominant output voltage difference Vdiff = VCANH - VCANL Leakage current Vdiff ICANH,L,lk Dynamic CAN-Transceiver Characteristics Propagation delay TxD-to-RxD LOW (recessive to dominant) td(L),TR – 150 255 ns Propagation delay TxD-to-RxD HIGH (dominant to recessive) td(H),TR – 150 255 ns td(L),T Propagation delay TxD LOW to bus dominant – 50 120 ns Propagation delay td(H),T TxD HIGH to bus recessive – 50 120 ns Propagation delay td(L),R bus dominant to RxD LOW – 100 135 ns Propagation delay td(H),R bus recessive to RxD HIGH – 100 135 ns Min. dominant time for bus tWU1 wake-up signal (RxD high to low) 0.75 3 5 µs Data Sheet 16 CL = 47 pF; RL = 60 Ω; VCC = 5 V; CRxD = 15 pF CL = 47 pF; RL = 60 Ω; VCC = 5 V; CRxD = 15 pF CL = 47 pF; RL = 60 Ω; VCC = 5 V CL = 47 pF; RL = 60 Ω; VCC = 5 V CL = 47 pF; RL = 60 Ω; VCC = 5 V; CRxD = 15 pF CL = 47 pF; RL = 60 Ω; VCC = 5 V; CRxD = 15 pF tWU1 = td(L),R + tWU see Figure 6 Rev. 3.1, 2007-08-20 TLE6251DS Table 5 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Min. recessive time for bus tWU2 wake-up signal (RxD low to high) TxD permanent dominant disable time Data Sheet tTxD Limit Values Min. Typ. Max. 0.75 3 5 0.3 – 17 1.0 Unit Remarks µs tWU2 = td(H),R + tWU ms – see Figure 6 Rev. 3.1, 2007-08-20 TLE6251DS Diagrams STB 7 TxD CANH SPLIT 47 pF 8 1 5 60 Ω RxD 6 4 15 pF CANL GND VCC 2 3 5V 100 nF AEA03392.VSD Figure 8 Data Sheet Test Circuits for Dynamic Characteristics 18 Rev. 3.1, 2007-08-20 TLE6251DS VTxD VµC GND VDIFF td(L), T td(H), T t VDIFF(d) VDIFF(r) VRxD td(L), R t td(H), R VµC 0.8VµC 0.2VµC GND td(L), TR td(H), TR t AET02926 Figure 9 Data Sheet Timing Diagrams for Dynamic Characteristics 19 Rev. 3.1, 2007-08-20 TLE6251DS Application 4 .7 nF 60 Ω 1) VS 60 Ω TL E6251 G 10 k Ω 9 V Bat C AN Bus WK EN N ST B N ER R 51 µH 13 1) 12 11 10 C AN H R xD C AN L T xD SPLIT V µC 6 14 8 µP w ith On C hip C AN M odule 4 1 e.g . C164 C C167 C 5 100 nF VS 100 7 IN H nF GN D VCC 3 VQ 1 IN H e.g. T LE 4476 (3.3/5 V) or TLE 4471 TLE 4276 TLE 4271 100 nF VI GN D 100 nF 2 22 + µF 100 nF GN D VQ 2 5 V + 22 µF + 22 µF EC U TL E6251 D S 51 µH 7 1) 6 5 C AN H ST B C AN L R xD SPLIT T xD GN D V CC 8 µP w ith On C hip C AN M odule 4 1 e.g . C164 C C167 C 3 100 nF 2 100 nF GN D e. g. T LE 4270 60 Ω VI 60 Ω 4.7 nF 1) 22 + µF 100 nF Data Sheet + 22 µF EC U 1) Optional, according to the car m anufacturer requirem ents Figure 10 5V VQ GN D AEA 03387.VSD Application Circuit 20 Rev. 3.1, 2007-08-20 TLE6251DS 0.1 2) 0.41+0.1 -0.06 0.2 8 5 1 4 5 -0.2 1) M 0.19 +0.06 C B 8 MAX. 1.27 0.35 x 45˚ 4 -0.2 1) 1.75 MAX. 0.175 ±0.07 (1.45) Package Outlines 0.64 ±0.25 6 ±0.2 A B 8x 0.2 M C 8x A Index Marking 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Lead width can be 0.61 max. in dambar area GPS01181 Figure 11 PG-DSO-8 (PG-DSO-8-16 Plastic Dual Small Outline) Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Dimensions in mm SMD = Surface Mounted Device Data Sheet 21 Rev. 3.1, 2007-08-20 TLE6251DS Revision History Version Date Changes Rev. 3.1 2007-08-20 RoHS-compliant version of the TLE6251DS • • • • • Data Sheet All pages: Infineon logo updated Page 3: “added AEC qualified” and “RoHS” logo, “Green Product (RoHS compliant)” and “AEC qualified” statement added to feature list, package name changed to RoHS compliant versions, package picture updated, ordering code removed Page 21: Change package drawing to GPS01181 Package name changed to RoHS compliant versions, “Green Product” description added added Revision History updated Legal Disclaimer 22 Rev. 3.1, 2007-08-20