TLF80511TCATMA2

TLF80511 Low Dropout Linear Fixed Voltage Regulator TLF80511TC Data Sheet Rev. 1.01, 2016-06-21 Automotive Power Low Dropout Linear Fixed Voltage Regulator TLF80511V50 1 TLF80511 Overview Features • • • • • • • • • • • • • Output Voltage 5 V Output Voltage Precision ± 2 % Output Current up to 400 mA Ultra Low Current Consumption 38 µA Very Low Dropout Voltage: 100 mV at 100 mA Output Current Extended Operating Range Starting at 3.3 V Small Output Capacitor 1 µF Output Current Limitation Overtemperature Shutdown Suitable for Use in Automotive Electronics Wide Temperature Range from -40 °C up to 150 °C Green Product (RoHS compliant) AEC Qualified PG-TO263-3 Description The TLF80511 is a linear low dropout voltage regulator for load currents up to 400 mA. An input voltage of up to 40 V is regulated to VQ,nom = 5 V with ±2 % precision. The TLF80511 with a typical quiescent current of 38 µA, is the ideal solution for systems requiring very low operating currents, such as those permanently connected to a battery. It features a very low dropout voltage of 100 mV, when the output current is less than 100 mA. In addition, the dropout region begins at input voltages of 3.3 V (extended operating range). This makes the TLF80511 suitable to supply automotive systems. In addition, the TLF80511’s new fast regulation concept requires only a single, 1 µF output capacitor to maintain stable regulation. The device is designed for the harsh environment of automotive applications. Therefore standard features like output current limitation and overtemperature shutdown are implemented and protect the device against failures like output short circuit to GND, over-current and over-temperatures. The TLF80511 can be also used in all other applications requiring a stabilized 5 V supply voltage. Type Package Marking TLF80511TC PG-TO263-3 TLF80511 Data Sheet 2 Rev. 1.01, 2016-06-21 TLF80511 Block Diagram 2 Block Diagram I Q Current Limitation Bandgap Reference Temperature Shutdown GND Figure 1 Data Sheet Block Diagram 3 Rev. 1.01, 2016-06-21 TLF80511 Pin Configuration 3 Pin Configuration 3.1 Pin Assignment PG-TO263-3 GND 1 2 3 I GND Q Figure 2 Pin Configuration 3.2 Pin Definitions and Functions PG-TO263-3 Pin Symbol Function 1 I Input for compensating line influences, a capacitor to GND close to the IC terminals is recommended 2 GND Ground 3 Q Output block to GND with a capacitor close to the IC terminals, respecting the values given for its capacitance CQ and ESR in the table “Functional Range” on Page 6 Tab GND Heat Slug connect to heatsink area; connect with GND on PCB Data Sheet 4 Rev. 1.01, 2016-06-21 TLF80511 General Product Characteristics 4 General Product Characteristics 4.1 Absolute Maximum Ratings Absolute Maximum Ratings 1) -40 °C ≤ Tj ≤ 150 °C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Min. Max. Unit Conditions Input I 4.1.1 Voltage VI -0.3 45 V – Voltage VQ -0.3 7 V – Tj Tstg -40 150 °C – -50 150 °C – VESD,HBM -4 4 kV Human Body Model (HBM)2) VESD,CDM -1.5 1.5 kV Charge Device Model (CDM)3) Output Q 4.1.2 Temperature 4.1.3 Junction Temperature 4.1.4 Storage Temperature ESD Absorption 4.1.5 ESD Absorption 4.1.6 1) Not subject to production test, specified by design. 2) ESD HBM Test according AEC-Q100-002 - JESD22-A114 (1.5kOhm, 100pF) 3) ESD CDM Test according ESDA STM5.3.1 Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. Data Sheet 5 Rev. 1.01, 2016-06-21 TLF80511 General Product Characteristics 4.2 Pos. 4.2.1 Functional Range Parameter Symbol Input Voltage Range for Normal Operation Limit Values VI Min. Max. VQ,nom + Vdr 40 VI,ext 3.3 40 4.2.3 Output Capacitor’s Requirements CQ 1 – for Stability ESR(CQ) – 5 4.2.4 Junction Temperature Tj -40 150 1) Between min. value and VQ,nom + Vdr: VQ = VI - Vdr. Below min. value: VQ = 0 V 4.2.2 Extended Input Voltage Range Unit Conditions V – V –1) µF –2) Ω –3) °C – 2) the minimum output capacitance requirement is applicable for a worst case capacitance tolerance of 30% 3) relevant ESR value at f = 10 kHz Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. 4.3 Thermal Resistance Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to www.jedec.org. Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. – 4 – K/W – – 22 – K/W 2) 4.3.3 – 65 – K/W footprint only3) 4.3.4 – 39 – K/W 300 mm2 heatsink area on PCB3) 4.3.5 – 33 – K/W 600 mm2 heatsink area on PCB3) Package Versions PG-TO263-3 4.3.1 4.3.2 Junction to Case1) Junction to Ambient 1) RthJC RthJA 1) Not subject to production test, specified by design 2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer. 3) Specified RthJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product (Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu). Data Sheet 6 Rev. 1.01, 2016-06-21 TLF80511 Block Description and Electrical Characteristics 5 Block Description and Electrical Characteristics 5.1 Voltage Regulation The output voltage VQ is divided by a resistor network. This fractional voltage is compared to an internal voltage reference and drives the pass transistor accordingly. The control loop stability depends on the output capacitor CQ, the load current, the chip temperature and the internal circuit design. To ensure stable operation, the output capacitor’s capacitance and its equivalent series resistor ESR requirements given in Table 4.2 “Functional Range” on Page 6 must be maintained. For details see the typical performance graph “Stability Region: Equivalent Serial Resistor ESR versus Output Current IQ” on Page 12. Since the output capacitor is used to buffer load steps, it should be sized according to the application’s needs. An input capacitor CI is not required for stability, but is recommended to compensate line fluctuations. An additional reverse polarity protection diode and a combination of several capacitors for filtering should be used. Connect the capacitors close to the regulator terminals. Whenever the load current exceeds the specified limit, e.g. in case of a short circuit, the output current is limited and the output voltage decreases. The overtemperature shutdown circuit prevents the IC from immediate destruction under fault conditions (e.g. output continuously short-circuited) by switching off the power stage. After the chip has cooled, the regulator restarts. This oscillatory thermal behaviour causes the junction temperature to exceed the 150° C maximum and significantly reducing the IC’s life. Supply II I Q Regulated Output Voltage IQ Current Limitation CI Bandgap Reference VI Figure 3 Data Sheet LOAD VQ ESR CQ Temperature Shutdown ApplicationDiagram.vsd C GND Block Diagram Voltage Regulation 7 Rev. 1.01, 2016-06-21 TLF80511 Block Description and Electrical Characteristics Electrical Characteristics Voltage Regulator 5 V version VI = 13.5 V, -40 °C ≤ Tj ≤ 150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. 5.1.1 Output Voltage Precision VQ 4.9 5.0 5.1 V 0.05 mA < IQ < 400 mA 6 V < VI < 28 V 5.1.2 Output Voltage Precision VQ 4.9 5.0 5.1 V 0.05 mA < IQ < 200 mA 5.5 V < VI < 40 V 5.1.3 Output Current Limitation IQ,max 401 |ΔVQ,load| – 600 900 mA 0 V < VQ < 4.8 V 5.1.4 Load Regulation steady-state 20 50 mV IQ = 0.05 mA to 400 mA VI = 6 V 5.1.5 Line Regulation steady-state |ΔVQ,line| 10 30 mV 5.1.6 Dropout Voltage1) Vdr 5.1.7 Power Supply Ripple Rejection2) PSRR – 55 – dB 5.1.8 Overtemperature Shutdown Threshold Tj,sd 151 175 200 °C VI = 8 V to 32 V IQ = 5 mA IQ = 250 mA IQ = 100 mA fripple = 100 Hz Vripple = 0.5 Vpp Tj increasing2) 5.1.9 Overtemperature Shutdown Threshold Hysteresis Tj,sdh – 15 – K Tj decreasing2) Vdr = VI - VQ – – 250 500 mV – 100 200 mV 1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5V 2) Not subject to production test, specified by design Data Sheet 8 Rev. 1.01, 2016-06-21 TLF80511 Block Description and Electrical Characteristics 5.2 Current Consumption Electrical Characteristics Current Consumption VI = 13.5 V, -40 °C ≤ Tj ≤ 150 °C, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol 5.2.1 Current Consumption Iq = II - IQ Iq Limit Values Unit Conditions IQ = 0.05 mA Tj < 25 °C IQ = 0.05 mA Tj < 125 °C IQ = 400 mA Tj < 125 °C1) Min. Typ. Max. – 38 46 µA 5.2.2 – – 75 µA 5.2.3 – 67 80 µA 1) Not subject to production test, specified by design. Data Sheet 9 Rev. 1.01, 2016-06-21 TLF80511 Block Description and Electrical Characteristics 5.3 Typical Performance Characteristics Voltage Regulator Current Consumption Iq versus Output Current IQ Dropout Voltage Vdr versus Junction Temperature Tj 400 VI = 13.5 V Tj = 25 °C 58 350 IQ = 250 mA 52 300 250 VDR [mV] Iq [µA] 46 40 200 IQ = 100 mA 150 34 100 28 50 22 0 100 200 300 IQ = 10 mA 0 400 -40 0 IQ [mA] 40 80 120 160 Tj [°C] Dropout Voltage Vdr versus Output Current IQ Output Voltage VQ versus Junction Temperature Tj 600 5,20 VI = 13.5 V IQ = 200 mA 5,15 500 5,10 Tj = 125 °C 400 300 VQ [V] VDR [mV] 5,05 Tj = 25 °C 5,00 4,95 200 4,90 100 4,85 4,80 0 0 100 200 300 -40 400 40 80 120 160 Tj [°C] IQ [mA] Data Sheet 0 10 Rev. 1.01, 2016-06-21 TLF80511 Block Description and Electrical Characteristics Output Voltage ΔVQ versus Input Voltage ΔVI Output Voltage ΔVQ versus Output Current ΔIQ 2 8 IQ = 5 mA VI = 13.5 V Tj = 25 °C 6 0 Tj = -40 °C Tj = 150 °C 4 -2 Tj = 25 °C 2 Δ VQ [mV] Δ VQ [mV] -4 Tj = -40 °C -6 0 -2 -8 -4 -10 -6 -12 -8 0 100 200 300 400 0 10 20 ΔIQ [mA] 30 40 Δ VI [V] Maximum Output Current IQ versus Input Voltage VI Current Consumption Iq versus Input Voltage VI 100 700 VQ= 4.8 V RLOAD = 100 Ω 90 600 80 Tj = 150 °C 500 Tj = -40 °C 60 400 Iq [µA] IQ,max [mA] Tj = 150 °C 70 Tj = 25 °C 300 50 Tj = 25 °C 40 30 200 Tj = -40 °C 20 100 10 0 0 0 10 20 30 40 0 20 30 40 VI [V] VI [V] Data Sheet 10 11 Rev. 1.01, 2016-06-21 TLF80511 Block Description and Electrical Characteristics Stability Region: Equivalent Serial Resistor ESR versus Output Current IQ Power Supply Ripple Rejection versus Frequency 70 100 IQ = 10 mA CQ = 1 µF VI = 13.5 V Vripple = 0.5 Vpp Tj = 25 °C 60 CQ = 1 µF V I = 6..28 V 40 ESR(CQ) [Ω ] PSRR [dB] Unstable Region 10 50 30 1 Stable Region 20 0,1 10 0 0,01 0,1 1 10 100 0,01 1000 0 f [kHz] 100 200 300 400 IQ [mA] Output Voltage VQ versus Input Voltage VI 6 IQ = 100 mA Tj = 25°C 5 VQ [V] 4 3 2 1 0 0 2 4 6 VI [V] Data Sheet 12 Rev. 1.01, 2016-06-21 TLF80511 Package Outlines 6 Package Outlines 4.4 10 ±0.2 1.27 ±0.1 B 0.1 A 8.5 1) 0.05 2.4 2.7 ±0.3 4.7 ±0.5 7.55 1) 9.25 ±0.2 (15) 1 ±0.3 0...0.3 0...0.15 0.75 ±0.1 0.5 ±0.1 1.05 8˚ MAX. 2.54 5.08 0.25 M A B 1) Typical All metal surfaces: tin plated, except area of cut. Metal surface min. x=7.25, y=6.9 Figure 4 Data Sheet 0.1 B GPT09362 PG-TO263-3 13 Rev. 1.01, 2016-06-21 TLF80511 Revision History 7 Revision History Revision Date Changes 1.01 2016-06-21 Editorial change: corrected page number Updated disclaimer 1.0 2012-06-15 Data Sheet - Initial Version Data Sheet 14 Rev. 1.01, 2016-06-21 Please read the Important Notice and Warnings at the end of this document Trademarks of Infineon Technologies AG µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™, DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, GaNpowIR™, HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OPTIGA™, OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID FLASH™, SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™. 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