SC105

Bulletin I0503J 12/99 SC105.....5. Series SCHOTTKY DIE 105 x 125 mils a c 0.35 ± 0.01 (0.14 ± 0.0004) NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION: (INCH). C A D 3. DIMENSIONS AND TOLERANCES: a = 3.18 + 0, - 0.05 (0.125 + 0, - 0.002) b = 2.67 + 0, - 0.05 (0.105 + 0, - 0.002) c = 3.02 + 0, - 0.003 (0.119 + 0, - 0.0001) d = 2.51 + 0, - 0.003 (0.099 + 0, - 0.0001) Ø = 0.7 ± 0.1 (0.03 ± 0.004) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) D = Reject Ink Dot (only on non-conforming dies) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade b d Ø 40 (1.57) Wafer flat alligned with side b of the die Ø 125 (4.92) NOT TO SCALE NOTE: 10 mils die thickness is available on specific request only. Contact factory for information. www.irf.com 1 SC105.....5. Series Bulletin I0503J 12/99 Electrical Characteristics Device # SC105R015x5x SC105S020x5x SC105S030x5x SC105S045x5x SC105S060x5x SC105H045x5x SC105H100x5x SC105H150x5x TJ Max. (°C) 125 125 150 150 150 175 175 175 VR (V) 15 20 30 45 60 45 100 150 220 150 110 35 12 15 Typ. I R @ 25°C (µA) 3000 Typ. IR @ 125°C (mA) Max. VF @ IF (V) n.a. contact factory n.a. contact factory 100 75 60 10 7 7 0.49 @ 15A 0.54 @ 15A 0.60 @ 15A 0.62 @ 15A 0.86 @ 15A 1.00 @ 15A TO-220 TO-247 TO-247 TO-220 TO-247 TO-220 Package Style Mechanical Data Device # SC105xxxxA5x SC105xxxxS5x Bondable Solderable -Ti 2 kÅ Metal Thickness Front Metal Al/Si 30 kÅ Ni 6 kÅ -Ag 35 kÅ Cr 1 kÅ Cr 1 kÅ Metal Thickness Back Metal Ni 4 kÅ Ni 4 kÅ Ag 6 kÅ Ag 6 kÅ Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination. Shelf life for parts stored in above condition is 2 years. If the storage is done in normal atmosphere shelf life is reduced to six months. Packaging Device # SC105xxxxx5B SC105xxxxx5R SC105xxxxx5 P SC105xxxxx5F Description Minimum Order Quantity Wafer in Sale Package 1150 3000 1150 1150 Inked Probed Unsawn Wafer (Wafer in Box) Probed Die in Tape & Reel Probed Die in Waffle Pack Inked Probed Sawn Wafer on Film 2 www.irf.com SC105.....5. Series Bulletin I0503J 12/99 Ordering Information Table Device Code SC 1 1 2 3 4 5 6 7 Schottky Die Chip Dimension in Mils 105 2 H 3 100 4 S 5 5 6 B 7 H = 830 Process Process (see Electrical Characteristics Table) Voltage code: Code = V RRM Chip surface metallization (see Mechanical Data Table) Wafer Diameter in inches Packaging (see Packaging Table) R = OR'ing Process S = Standard Process Wafer on Film STEEL FRAME www.irf.com 3 SC105.....5. Series Bulletin I0503J 12/99 Wafer in Box ROUND CONTAINER TYVEK DISK FOAM DISK Die in Waffle Pack CHIP TRAY POCKET 4 www.irf.com SC105.....5. Series Bulletin I0503J 12/99 Tape and Reel REEL FRAME BARE DIE CARRIER TAPE WORLD HEADQUARTERS: EUROPEAN HEADQUARTERS: IR CANADA: IR GERMANY: IR ITALY: IR FAR EAST: IR SOUTHEAST ASIA: IR TAIWAN: http://www.irf.com 233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332. Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408. 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801. Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933. Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220. K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086. 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630. 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936. Data and specifications subject to change without notice. Fax-On-Demand: +44 1883 733420 www.irf.com 5