M3253503E2A473KZMB

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Overview The KEMET MIL-PRF-32535 X7R surface mount capacitors are designed, tested and screened to meet demanding high reliability defense and aerospace applications. MIL-PRF-32535 is Defense Logistics Agency's (DLA) first capacitor specification for defense and aerospace that capitalizes on industry leading base metal electrode (BME) technology. Qualified under performance specification, MIL-PRF-32535 and QPL listed, this series meets or exceeds the requirements outlined by DLA and is currently available in M (standard reliability) and T (high reliability) product levels. Driven by the demand for higher capacitance and smaller case size MLCCs in high reliability applications, KEMET’s MIL-PRF-32535 X7R provides over an 55-fold increase in capacitance over MIL-PRF-55681 and MIL-PRF-123, allowing for reduced board space and continuing the trend for miniaturization. In addition to being the first BME X7R dielectric qualified for use in defense and aerospace applications, MIL-PRF-32535 is the first DLA specification to recognize a flexible termination option. KEMET's flexible termination utilizes a pliable and conductive silver epoxy between the base metal and nickel barrier layers of the termination system. The addition of this epoxy layer inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks, which can result in a low IR or short circuit failures. Benefits • Patented BME technology • Qualified per MIL-PRF-32535 (QPL) • Standard reliability (M Level) • High reliability (T Level) • Flexible termination option available • EIA 0402, 0603, 0805, 1206, 1210, 1812, 2220 case sizes • DC voltage ratings of 4 V, 6.3 V, 10 V, 16 V, 25 V, 50 V, and 100 V • Capacitance offerings ranging from 39 pF up to 10 uF • Available capacitance tolerances of ±5%, ±10% and 20% • Non-polar device, minimizing installation concerns Applications • Decoupling • Bypass • Filtering • Transient voltage suppression Built Into Tomorrow © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) MIL-PRF-32535 Ordering Information M32535 04 E2 Z MIL Prefix Slash Sheet Characteristic/ Dielectric Rated Voltage (VDC) 02 = 0402 03 = 0603 04 = 0805 05 = 1206 06 = 1210 07 = 1812 08 = 2220 E2 = X7R V=4 W = 6.3 X = 10 Y = 16 Z = 25 A = 50 B = 100 103 K Capacitance Code Capacitance (pF) Tolerance Two significant digits and number of zeros. J = ±5% K = ±10% M = ±20% Z M B Termination1, 2, 3, 4, 5 Product Level Electrode D = Sn/Pb solder dipped G = Nickel gold-plating R = Flexible termination with solder plating V = Flexible termination with nickel gold-plating Z = Sn/Pb solder plated M = M Level T = T Level B = BME Termination options D, R, and V are not available in EIA 0402 case size. Termination option D is not available in EIA 0603 case size. 3 Termination options D, G, and Z are not available in EIA 1812 case size. 4 Termination options D, G and Z are not available for 100 V. 5 Termination options D, G and Z are not available in EIA 2220 case size for 50 V. 1 2 KEMET Part Number Equivalent (For Reference Only) (Do not use this ordering code if a QPL MIL-SPEC part type is required. Please order using MIL-SPEC ordering code. Details regarding MIL-PRF-32535 QPL ordering information is outlined above.) C 0805 K 104 J 3 R M L - Ceramic Case Size (L" x W") Specification/ Series Capacitance Code (pF) Capacitance Tolerance2 Rated Voltage (VDC) Dielectric Product Level Termination Finish Packaging/ Grade (C-Spec) 0402 0603 0805 1206 1210 1812 2220 K= MIL-PRF-32535 Two significant digits and number of zeros. M = M Level standard termination N = M Level flexible termination T = T Level standard termination V = T Level flexible termination L = Sn/Pb solder plated H = Sn/Pb solder dipped G = Nickel gold-plating See "Packaging C-Spec Ordering Options Table" J = ±5% K = ±10% M = ±20% 7=4 9 = 6.3 8 = 10 4 = 16 3 = 25 5 = 50 1 = 100 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com R = X7R C1096_MIL-PRF-32535_X7R • 8/26/2021 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Packaging C-Spec Ordering Options Table Packaging Type1 Packaging/Grade Ordering Code (C-Spec) Standard Packaging (Waffle Tray) 7" Tape & Reel Not required (blank) Contact Sales Default packaging with no C-Spec is “Waffle Tray,” and is recommended for order quantities of less than 250 pieces. See Waffle Tray packaging information section for additional details. 1 See Tape & Reel Packaging information section of the datasheet for additional details. 1 Dimensions per MIL-PRF-32535 – Inches (Millimeters) L W B T S EIA Size Code Metric Size Code 0402 1005 0603 1608 08051 2012 12062 3216 12102 3225 18122 4532 22202 5650 L Length W Width T Thickness B Bandwidth 0.040+0.006/−0.004 (1.02+0.15/−0.10) 0.063+0.008/−0.006 (1.60+0.2/−0.15) 0.079+0.012/−0.01 (2.01+0.3/−0.25) 0.126+0.012/−0.01 (3.20+0.3/−0.25) 0.126+0.012/−0.01 (3.20+0.3/−0.25) 0.178±0.012 (4.52±0.30) 0.224±0.016 (5.69±0.41) 0.020+0.005/−0.004 (0.51+0.13/−0.10) 0.032+0.008/−0.006 (0.81+0.2/−0.15) 0.050+0.012/−0.01 (1.27+0.3/−0.25) 0.063+0.012/−0.01 (1.60+0.3/−0.25) 0.098+0.012/−0.010 (2.49+0.3/−0.25) 0.126±0.012 (3.20±0.30) 0.197±0.016 (5.00±0.41) 0.025 (0.64) 0.040 (1.02) 0.062 (1.57) 0.071 (1.8) 0.110 (2.79) 0.110 (2.79) 0.110 (2.79) 0.004 (0.100) Minimum 0.016 ±0.008 (0.41±0.20) 0.020±0.010 (0.51±0.25) 0.020±0.014 (0.51±0.36) 0.020±0.014 (0.51±0.36) 0.024±0.018 (0.61±0.46) 0.025±0.018 (0.64±0.46) Maximum Part Weight (mg)3 Mounting Technique 1.6 Solder reflow only 6.3 20 Solder wave or solder reflow 57 108 216 Solder reflow only 430 For EIA 0805 solder dipped termination finish, add 0.020 (0.51) to the positive length tolerance and 0.015 (0.38) to the positive width and thickness tolerance. 2 For EIA 1206, 1210, 1812 and 2220 solder dipped termination finishes, add 0.025 (0.64) to the positive length tolerance and 0.015 (0.38) to the positive width and thickness tolerance. 3 Maximum Part Weight represents the maximum weight in the given case size for all voltages. 1 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Environmental Compliance These devices are RoHS compliant only if ordered with gold (Au) termination finish. Electrical Parameters/Characteristics Item Parameters/Characteristics Operating temperature range Capacitance change with reference to +25°C and 0 VDC applied (TCC) Aging rate (maximum % capacitance loss/decade hour) Dielectric Withstanding Voltage (DWV) 1 −55°C to +125°C ±15% 3% 250% of rated voltage (5 ±1 seconds and charge/discharge not exceeding 50 mA) Maximum Allowable DF (%) 2 3 Dissipation Factor (DF) maximum limit at 25°C Insulation Resistance (IR) minimum limit at 25°C Rated Voltage (VDC) 4 6.3 10 16 25 ≥ 50 7.5 7.5 5.0 3.5 3.5 2.5 Rated voltage < 25 V 500 MΩ µF or 100 GΩ, whichever is less Rated voltage ≥ 25 V 1,000 MΩ µF or 100 GΩ, whichever is less (Rated voltage applied for 120 seconds maximum at 25°C) DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 2 Capacitance and dissipation factor (DF) measured under the following conditions: 1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF 1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF 3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as automatic level control (ALC). The ALC feature should be switched to "ON." 1 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Table 1A – Capacitance Range/Selection Waterfall (0402 – 0805 Case Sizes) 1 A V W X Y Z A B Voltage Code (KEMET) 7 9 8 4 3 5 7 9 8 4 3 5 7 9 8 4 3 5 1 Rated Voltage (VDC) 10 16 25 50 4 6.3 10 16 25 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • •1 •1 •1 •1 •1 •1 •1 •1 •1 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • •1 Rated Voltage 10 16 25 50 100 • • • • • • • • • • • • • • • • • • • • • • • • • • • • 6.3 • • • • • • • • • • • • • • • • • • • • • • • • • • • • 4 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • 50 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • 25 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • 16 • • • • • • • • • • • • • • • • • • • • • • • • • • • • 10 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • 6.3 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • 4 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • 50 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • 25 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • Product Availability 16 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M 10 Cap Code K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K 6.3 Capacitance J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J 100 Z 50 Y 25 X 16 W 10 V 6.3 A 4 Z 50 Y 4 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 513 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 0805 X Capacitance Tolerance 39 pF 47 pF 56 pF 68 pF 82 pF 100 pF 120 pF 150 pF 180 pF 220 pF 270 pF 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33000 pF 39,000 pF 47,000 pF 51,000 pF 56,000 pF 68,000 pF 82,000 pF 100,000 pF 120,000 pF 150,000 pF 180,000 pF 220,000 pF 270,000 pF 330,000 pF 390,000 pF 470,000 pF 560,000 pF 680,000 pF 820,000 pF 1,000,000 pF 0603 W 6.3 Cap Capacitance Code 0402 V 4 Case Size Voltage Code (MIL) Voltage Code Case Size 7 9 8 4 3 5 7 9 8 4 3 5 7 9 8 4 0805 3 5 1 0402 0603 Only available with flexible termination. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Table 1B – Capacitance Range/Selection Waterfall (1206 – 1210 Case Sizes) Z A B Voltage Code (KEMET) 7 9 8 4 3 5 1 7 9 8 4 3 5 1 Rated Voltage (VDC) 16 25 50 100 4 6.3 Capacitance Tolerance • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • •1 •1 4 3 5 1 Product Availability •1 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • •1 Voltage Code 7 9 8 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • 10 • 6.3 • 4 • 100 • 50 • 25 • Rated Voltage Case Size 1 M M M M M M M M M M M M M M M M M M M M 16 K K K K K K K K K K K K K K K K K K K K 10 Cap Code J J J J J J J J J J J J J J J J J J J J 6.3 Capacitance 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 4 82,000 pF 100,000 pF 120,000 pF 150,000 pF 180,000 pF 220,000 pF 270,000 pF 330,000 pF 390,000 pF 470,000 pF 560,000 pF 680,000 pF 820,000 pF 1,000,000 pF 1,200,000 pF 1,500,000 pF 1,800,000 pF 2,200,000 pF 2,700,000 pF 3,300,000 pF 100 Y 100 X 50 W 50 V 25 B 25 A 16 Z 16 Y 10 X 10 1210 W 6.3 Capacitance Cap Code 1206 V 4 Case Size Voltage Code (MIL) 4 3 5 1 7 9 8 1206 •1 •1 •1 •1 •1 1210 Only available with flexible termination. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Table 1C – Capacitance Range/Selection Waterfall (1812 – 2220 Case Sizes) 4 3 5 Rated Voltage (VDC) 4 50 8 1 • 1 • 1 • 1 • 1 • •1 •1 • • • • • •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 •1 Rated Voltage 50 9 25 7 25 1 16 5 16 3 10 4 10 8 6.3 9 6.3 7 4 Voltage Code (KEMET) 100 A 50 Z 25 Y 25 X 16 W 16 V 10 B 10 A 6.3 Z 6.3 Y 4 X 100 2220 W 4 Capacitance Cap Code 1812 V 50 Case Size Voltage Code (MIL) Voltage Code 7 9 8 4 3 5 1 7 9 8 4 3 5 Capacitance Tolerance 100,000 pF 120,000 pF 150,000 pF 180000 pF 220,000 pF 270,000 pF 330,000 pF 390,000 pF 470,000 pF 560,000 pF 680,000 pF 820,000 pF 1,000,000 pF 1,200,000 pF 1,500,000 pF 1,800,000 pF 2,200,000 pF 2,700,000 pF 3,300,000 pF 3,900,000 pF 4,700,000 pF 5,600,000 pF 6,800,000 pF 8,200,000 pF 10,000,000 pF 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 565 685 825 106 Capacitance Cap Code J J J J J J J J J J J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K K K K K K K K K K K Case Size 1 M M M M M M M M M M M M M M M M M M M M M M M M M Product Availability 1812 2220 Only available with flexible termination. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Table 2 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0402 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 Density Level A: For low-density product applications. It is recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. It provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations, the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC-7351). Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X C C V2 Grid Placement Courtyard © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR, or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/ J–STD–020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature minimum (TSmin) Temperature maximum (TSmax) Termination Finish TP SnPb 100°C 150°C Time (ts) from TSmin to TSmax 60 – 120 seconds Ramp-up rate (TL to TP) 3°C/second maximum Liquidous temperature (TL) 183°C Time above liquidous (tL) 60 – 150 seconds Peak temperature (TP) 235°C Time within 5°C of maximum peak temperature (tP) 20 seconds maximum Ramp-down rate (TP to TL) 6°C/second maximum Time 25°C to peak temperature 6 minutes maximum TL Temperature Profile Feature tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Table 3 – Performance & Reliability: Test Methods and Conditions Inspection Nondestructive internal examination (pre-termination) Visual examination (post-termination) Thermal shock Nondestructive internal examination (case sizes ≥ 0805 only) Voltage conditioning Visual and mechanical inspection Destructive physical analysis (DPA) Solderability (solder dipped and solder plated terminations only) Wire bond strength (gold-plated terminations only) Thermal shock Life Temperature humidity bias (load humidity) Voltage - temperature limits/temperature characteristic Dielectric breakdown voltage (UVBD) Board flex Shear stress Resistance to soldering heat Test Method MIL-PRF-32535 M-Level In-Process Inspection MIL-PRF-32535 Not required Method 4.6.1 MIL-PRF-32535 Not required Method 4.6.2 Group A Inspection MIL-PRF-32535 Not required Method 4.6.3 MIL-PRF-32535 Not required Method 4.6.1 MIL-PRF-32535 Yes (100%) Method 4.6.3 MIL-PRF-32535 Yes (per inspection lot) Method 4.6.2 MIL-PRF-32535 Not required Method 4.6.8 MIL-PRF-32535 Yes (per inspection lot) Method 4.6.11 MIL-PRF-32535 Yes (per inspection lot) Method 4.6.12 Group B Inspection MIL-PRF-32535 Yes (periodic) Method 4.6.3 MIL-PRF-32535 Yes (periodic) Method 4.6.16 MIL-PRF-32535 Yes (periodic) Method 4.6.15 MIL-PRF-32535 Yes (periodic) Method 4.6.14 MIL-PRF-32535 Yes (periodic) Method 4.6.17 Group C Inspection MIL-PRF-32535 Yes (periodic) Method 4.6.9 MIL-PRF-32535 Yes (periodic) Method 4.6.10 MIL-PRF-32535 Yes (periodic) Method 4.6.13 MIL-PRF-32535 T-Level Yes (100%) Yes (100%) Yes (100%) Yes (100%) Yes (100%) Yes (production lot sample) Yes (production lot sample) Yes (production lot sample) Yes (production lot sample) Yes (production lot sample) Yes (production lot sample) Yes (production lot sample) Yes (production lot sample) Yes (production lot sample) Yes (periodic) Yes (periodic) Yes (periodic) Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts. The atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years upon receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Construction Standard Termination Detailed Cross Section Termination Finish* Dielectric Material (BaTi3) Dielectric Material Barrier Layer (BaTi3) (Ni) End Termination/ External Electrode (Cu) Inner Electrodes End Termination/ (Ni) External Electrode (Cu) Barrier Layer (Ni) *Termination Finishes: Inner Electrodes (Ni) Termination Finish* Solder Dipped Solder Plated SnPb - 3% Pb Minimum SnPb - 3% Pb Minimum Gold (Au) Flexible Termination Detailed Cross Section Dielectric Material (BaTi3) End Termination/ External Electrode (Cu) Epoxy Layer (Ag) Dielectric Material (BaTi3) Barrier Layer (Ni) Termination Finish* Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Epoxy Layer (Ag) *Termination Finishes: Solder Plated SnPb - 3% Pb Minimum Inner Electrodes (Ni) Gold (Au) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Barrier Layer (Ni) Termination Finish* C1096_MIL-PRF-32535_X7R • 8/26/2021 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Capacitor Marking: KEMET MIL-PRF-32535 ceramic capacitors will be marked in accordance with the military specification on case sizes ≥ 0805. Case sizes below 0805 will not be marked. Two sides of the ceramic body will be laser marked with a “K̄ ” to identify KEMET, followed by two characters to identify the capacitance value. 2-Digit Capacitance Code KEMET ID The marking appears in legible contrast. Illustrated below is an example of an MLCC with laser the marking of “K̄ A5”, which designates a KEMET device with the rated capacitance of 100 nF. Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral Alpha Character 9 0 1 2 3 A 0.1 1.0 10 100 1,000 10,000 B 0.11 1.1 11 110 1,100 11,000 C 0.12 1.2 12 120 1,200 12,000 D 0.13 1.3 13 130 1,300 E 0.15 1.5 15 150 1,500 4 5 6 7 8 100,000 1,000,000 10,000,000 100,000,000 110,000 1,100,000 11,000,000 110,000,000 120,000 1,200,000 12,000,000 120,000,000 13,000 130,000 1,300,000 13,000,000 130,000,000 15,000 150,000 1,500,000 15,000,000 150,000,000 160,000,000 Capacitance (pF) F 0.16 1.6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.2 2.0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 2.2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.3 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 3.3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 3.6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 3.9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 4.3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 470,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 5.6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 6.2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 6.8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 8.2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 2.5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 3.5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.4 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 4.5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.5 5.0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.6 6.0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.7 7.0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.8 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.9 9.0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8 and 12 mm tape on 7" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. Bar code label Anti-static reel ® Embossed plastic* or punched paper carrier. ET KEM Sprocket holes Embossment or punched cavity 8 mm or 12 mm carrier tape 180 mm (7.00") Anti-static cover tape (0.10 mm (0.004") maximum thickness) *EIA 0402 and 0603 case sizes available on punched paper carrier only. Table 4 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) EIA Case Size Tape size (W)* Embossed Plastic Punched Paper 7" Reel 7" Reel Pitch (P1)* Pitch (P1)* 0402 8 2 0603 8 4 0805 8 4 4 1206 – 1210 8 4 4 ≥ 1812 12 8 *Refer to Figures 1 and 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 and 7 for tolerance specifications. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 P0 (10 pitches cumulative tolerance on tape ±0.2 mm) A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity ØD1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 5 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 D1 Minimum Note 1 8 mm 1.5 +0.10/−0.0 (0.059 +0.004/−0.0) 1.0 (0.039) E1 P0 P2 1.75±0.10 4.0±0.10 2.0±0.05 (0.069±0.004) (0.157±0.004) (0.079±0.002) 1.5 (0.059) 12 mm R S Minimum T Reference 1 Note 3 Maximum Note 2 25.0 (0.984) 0.600 (0.024) 0.600 (0.024) T1 Maximum 0.100 (0.004) 30 (1.181) Variable Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm Pitch Single (4 mm) Single (4 mm) and Double (8 mm) B1 Maximum Note 4 E2 Minimum 4.35 (0.171) 6.25 (0.246) 3.5±0.05 4.0±0.10 (0.138±0.002) (0.157±0.004) 2.5 (0.098) 8.3 (0.327) 8.2 (0.323) 10.25 (0.404) 5.5±0.05 8.0±0.10 (0.217±0.002) (0.315±0.004) 4.6 (0.181) 12.3 (0.484) F P1 T2 W Maximum Maximum A0,B0 and K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment location and the hole location shall be applied independent of each other. 2. The tape with or without components, shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for a tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) The component does not protrude above the top surface of the carrier tape. (b) The component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) Rotation of the component is limited to 20° maximum for 8 and 12 mm tapes; 10° maximum for 16 mm tapes (see Figure 3). (d) Lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape; to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) See addendum in EIA Document 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo (10 pitches cumulative tolerance on tape ±0.2 mm) A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 6 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum R Reference Note 2 8 mm 1.5 + 0.10/−0.0 (0.059 + 0.004/−0.0) 1.75±0.10 (0.069±0.004) 4.0±0.10 (0.157±0.004) 2.0±0.05 (0.079±0.002) 0.100 (0.004) 0.75 (0.030) 25.0 (0.984) T Maximum W Maximum A0 and B0 Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum 6.25 (0.246) F 3.5±0.05 (0.138±0.002) P1 2.0±0.05 (0.079±0.002) 4.0±0.10 (0.157±0.004) 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) ° s Tape Width (mm) 8,12 16 – 56 72 – 200 Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum Maximum Rotation ( 20 10 5 ° S) Figure 5 – Bending Radius 16 mm Tape 1.0 mm maximum 1.0 mm maximum Embossed Carrier Punched Carrier R © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Bending Radius R C1096_MIL-PRF-32535_X7R • 8/26/2021 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 7 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm A B Minimum C D Minimum 178±0.20 (7.008±0.008) or 330±0.20 (13.000±0.008) 1.5 (0.059) 13.0 + 0.5/−0.2 (0.521 + 0.02/−0.008) 20.2 (0.795) Variable Dimensions — Millimeters (Inches) Tape Size 8 mm 12 mm N Minimum See Note 2, Tables 2–3 50 (1.969) W1 W2 Maximum 8.4 + 1.5/−0.0 (0.331 + 0.059/−0.0) 14.4 (0.567) 12.4 + 2.0/−0.0 (0.488 + 0.078/−0.0) 18.4 (0.724) © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com W3 Shall accomadate tape width without interference C1096_MIL-PRF-32535_X7R • 8/26/2021 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Waffle Tray Packaging Information – 2" x 2" w/ Static Protection Figure 9 – Waffle Tray Dimensions – Inches (Millimeters) M 0.10 (2.54) X 45° M3 M1 Y M2 X X A Z 0.156 +0.002/-0.003 (3.962 +0.051/-0.076) 2.000 ±0.004 SQ (50.800 ±0.102 SQ) 0.098 (2.489) 0.086 (2.184) 90° 0.004 (0.102) 1.800 ±0.004 SQ (45.720 ±0.102 SQ) 1.812 ±0.004 SQ (46.025 ±0.102 SQ) STANDARD RIB MATRIX © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 19 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) Table 8A – Waffle Tray Dimensions – Inches Case Size EIA (in) 0402 0603 0805 12061,2 12061,3 1210 1812 2220 Metric (mm) 1005 1608 2012 3216 3216 3225 4532 5650 2" x 2" Waffle Tray Dimensions – Inches M ±0.003 0.175 0.175 0.232 0.194 0.250 0.217 0.271 0.318 M1 ±0.003 0.153 0.153 0.186 0.228 0.250 0.244 0.285 0.362 M2 ±0.002 0.077 0.077 0.181 0.193 0.375 0.215 0.286 0.424 M3 ±0.002 0.110 0.110 0.171 0.124 0.167 0.174 0.243 0.34 X ±0.002 0.073 0.073 0.062 0.067 0.100 0.110 0.150 0.24 Y ±0.002 0.042 0.042 0.092 0.130 0.200 0.145 0.200 0.32 Z ±0.003 0.041 0.041 0.036 0.065 0.070 0.080 0.075 0.032 A° ±1/2° 7 7 10 5 5 5 5 5 MATRIX (X x Y) 16 X 23 16 X 23 10 X 10 14 X 9 10 X 5 10 X 8 7X6 5X4 Packaging Quantity (pcs/unit packaging) 368 368 100 126 50 80 42 20 Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. Contact KEMET Sales for Waffle Tray quantities for specified part number. 2 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25 mm (0.049 inches). 3 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25 mm (0.049 inches). 1 Table 8B – Waffle Tray Dimensions – Millimeters Case Size EIA (in) 0402 0603 0805 12061,2 12061,3 1210 1812 2220 Metric (mm) 1005 1608 2012 3216 3216 3225 4532 5650 2" x 2" Waffle Tray Dimensions – Millimeters M ±0.08 4.45 4.45 5.89 4.93 6.35 5.51 6.88 8.08 M1 ±0.08 3.89 3.89 4.72 5.79 6.35 6.20 7.24 9.19 M2 ±0.05 1.96 1.96 4.60 4.90 9.53 5.46 7.26 10.77 M3 ±0.05 2.79 2.79 4.34 3.15 4.24 4.42 6.17 8.64 X ±0.05 1.85 1.85 1.57 1.70 2.54 2.79 3.81 6.10 Y ±0.05 1.07 1.07 2.34 3.30 5.08 3.68 5.08 8.13 Z ±0.08 1.04 1.04 0.91 1.65 1.78 2.03 1.91 0.81 A° ±1/2° 7 7 10 5 5 5 5 5 Packaging Quantity MATRIX (pcs/unit (X x Y) packaging) 16 X 23 16 X 23 10 X 10 14 X 9 10 X 5 10 X 8 7X6 5X4 368 368 100 126 50 80 42 20 Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. Contact KEMET Sales for Waffle Tray quantities for specified part number. 2 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25 mm (0.049 inches). 3 Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25 mm (0.049 inches). 1 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 20 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Reliability Surface Mount Capacitors, MIL-PRF-32535, 4 – 100 VDC (X7R Dielectric) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1096_MIL-PRF-32535_X7R • 8/26/2021 21