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MX27C1000TI-15

MX27C1000TI-15

  • 厂商:

    MCNIX(旺宏电子)

  • 封装:

  • 描述:

    MX27C1000TI-15 - 1M-BIT [128K x 8] CMOS EPROM - Macronix International

  • 数据手册
  • 价格&库存
MX27C1000TI-15 数据手册
INDEX MX27C1000/1001 1M-BIT [128K x 8] CMOS EPROM FEATURES • • • • • • 128K x 8 organization Single +5V power supply +12.5V programming voltage Fast access time: 45/55/70/90/100/120/150 ns Totally static operation Completely TTL compatible • Operating current: 30mA • Standby current: 100uA • Package type: 32 pin ceramic DIP, plastic DIP 32 pin SOP 32 pin PLCC 32 pin TSOP GENERAL DESCRIPTION The MX27C1000/1001 is a 5V only, 1M-bit, ultraviolet Erasable Programmable Read Only Memory. It is organized as 128K words by 8 bits per word, operates from a single + 5 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM programmers may be used. The MX27C1000/ 1001 supports an intelligent fast programming algorithm which can result in programming time of less than thirty seconds. This EPROM is packaged in industry standard 32 pin dual-in-line packages, 32 lead PLCC , 32 lead SOP , and 32 lead TSOP packages. PIN CONFIGURATIONS CDIP/PDIP/SOP VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC PGM NC A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3 CDIP/PDIP/SOP(MX27C1001) VPP OE A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC PGM NC A14 A13 A8 A9 A11 A16 A10 CE Q7 Q6 Q5 Q4 Q3 MX27C1000 PLCC PGM VCC VPP A12 A15 A16 NC TSOP(MX27C1000) A11 A9 A8 A13 A14 NC PGM VCC VPP A16 A15 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 A3 A7 A6 A5 A4 A3 A2 A1 A0 Q0 5 4 1 32 30 29 A14 A13 A8 A9 9 MX27C1000 25 A11 OE A10 CE MX27C1000 13 14 Q1 Q2 GND 17 Q3 Q4 Q5 21 20 Q6 Q7 MX27C1001 P/N: PM0234 1 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 BLOCK DIAGRAM CE PGM OE CONTROL LOGIC OUTPUT BUFFERS Q0~Q17 PIN DESCRIPTION SYMBOL A0~A16 Q0~Q7 PIN NAME Address Input Data Input/Output Chip Enable Input Output Enable Input Programmable Enable Input Program Supply Voltage No Internal Connection Power Supply Pin (+5V) Ground Pin . . A0~A16 ADDRESS INPUTS . . . . . . VCC GND Y-DECODER . . . . . . . . CE Y-SELECT OE 1M BIT CELL MAXTRIX PGM VPP NC VCC X-DECODER VPP GND FUNCTIONAL DESCRIPTION THE ERASURE OF THE MX27C1000/1001 The MX27C1000/1001 is erased by exposing the chip to an ultraviolet light source. A dosage of 15 W seconds/ cm2 is required to completely erase a MX27C1000/1001 This dosage can be obtained by exposure to an ultraviolet lamp - wavelength of 2537 Angstroms (A) - with intensity of 12,000 uW/cm2 for 15 to 20 minutes. The MX27C1000/ 1001 should be directly under and about one inch from the source and all filters should be removed from the UV light source prior to erasure. It is important to note that the MX27C1000/1001, and similar devices, will be cleared for all bits of their programmed states with light sources having wavelengths shorter than 4000 A Although erasure times will be much longer than that with UV sources at 2537A nevertheless the exposure to fluorescent light and sunlight will eventually erase the MX27C1000/1001 and exposure to them should be prevented to realize maximum system reliability. If used in such an environment, the package window should be covered by an opaque label or substance. THE PROGRAMMING OF THE MX27C1000/1001 When the MX27C1000/1001 is delivered, or it is erased, the chip has all 1M bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27C1000 through the procedure of programming. For programming, the data to be programmed is applied with 8 bits in parallel to the data pins. Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 01.uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device. FAST PROGRAMMING The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the PGM input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%. P/N: PM0234 2 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 PROGRAM INHIBIT MODE Programming of multiple MX27C1000/1001s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C1000/1001 may be common. A TTL low-level program pulse applied to an MX27C1000/1001 CE input with VPP = 12.5 ± 0.5 V and PGM LOW will program that MX27C1000/1001. A highlevel CE input inhibits the other MX27C1000/1001s from being programmed. PROGRAM VERIFY MODE Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE and CE at VIL, PGM at VIH, and VPP at its programming voltage. AUTO IDENTIFY MODE The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5° ambient temperature range C that is required when programming the MX27C1000/ 1001. To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C1000/1001, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (DQ7) defined as the parity bit. READ MODE The MX27C1000/1001 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate To accommodate multiple memory connections, a twoline control function is provided to allow for: 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. SYSTEM CONSIDERATIONS During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tQE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tQE. STANDBY MODE The MX27C1000/1001 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27C1000/1001 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. TWO-LINE OUTPUT CONTROL FUNCTION P/N: PM0234 3 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 MODE SELECT TABLE PINS MODE Read Output Disable Standby (TTL) Standby (CMOS) Program Program Verify Program Inhibit Manufacturer Code(3) CE VIL VIL VIH VCC±0.3V VIL VIL VIH VIL OE VIL VIH X X VIH VIL X VIL VIL VIL PGM X X X X VIL VIH X X X X A0 X X X X X X X VIL VIH VIH A9 X X X X X X X VH VH VH VPP VCC VCC VCC VCC VPP VPP VPP VCC VCC VCC OUTPUTS DOUT High Z High Z High Z DIN DOUT High Z C2H 0EH 0FH Device Code(27C1000)(3) VIL Device Code(27C1001)(3) VIL NOTES: 1. VH = 12.0 V ± 0.5 V 2. X = Either VIH or VIL 3. A1 - A8 = A10 - A16 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming. P/N: PM0234 4 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 FIGURE 1. FAST PROGRAMMING FLOW CHART START ADDRESS = FIRST LOCATION VCC = 6.25V VPP = 12.75V X=0 PROGRAM ONE 100us PULSE INTERACTIVE SECTION INCREMENT X YES X = 25? NO FAIL VERIFY BYTE ? PASS NO INCREMENT ADDRESS LAST ADDRESS FAIL YES VCC = VPP = 5.25V VERIFY SECTION VERIFY ALL BYTES ? FAIL DEVICE FAILED PASS DEVICE PASSED P/N: PM0234 5 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 SWITCHING TEST CIRCUITS DEVICE UNDER TEST 1.8K ohm +5V CL 6.2K ohm DIODES = IN3064 OR EQUIVALENT CL = 100 pF including jig capacitance(30pF for 45/44/70 ns parts) SWITCHING TEST WAVEFORMS 2.0V AC driving levels 2.0V TEST POINTS 0.8V OUTPUT 0.8V INPUT AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade. Input pulse rise and fall times are < 10ns. AC driving levels 1.5V TEST POINTS OUTPUT 1.5V INPUT AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. (2) For MX27C1000-45, MX27C1000/1001-55, MX27C1000/1001-70. P/N: PM0234 6 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 ABSOLUTE MAXIMUM RATINGS RATING Ambient Operating Temperature Storage Temperature Applied Input Voltage Applied Output Voltage VCC to Ground Potential A9 & Vpp VALUE -40oC to 85oC -65oC to 125oC -0.5V to 7.0V -0.5V to VCC + 0.5V -0.5V to 7.0V -0.5V to 13.5V NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. NOTICE: Specifications contained within the following tables are subject to change. DC/AC Operating Conditions for Read Operation MX27C1000/1001 -45* Operating Temperature Commercial 0°C to 70°C Industrial 5V ± 5% 5V ± 10% -55 0° to 70°C C -70 0° to 70°C C -90 0°C to 70° C -10 0° to 70°C C -12 0°C to 70° C -15 0° to 70°C C -40° to 85°C -40°C to 85°C -40° to 85°C -40°C to 85°C -40° to 85°C C C C 5V ± 10% 5V ±10% 5V ± 10% 5V ± 10% 5V ± 10% Vcc Power Supply *Note:45ns for MX27C1000 only DC CHARACTERISTICS SYMBOL VOH VOL VIH VIL ILI ILO ICC3 ICC2 ICC1 IPP PARAMETER Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current VCC Power-Down Current VCC Standby Current VCC Active Current VPP Supply Current Read 2.0 -0.2 -10 -10 MIN. 2.4 0.4 VCC + 0.5 0.8 10 10 100 1.5 30 10 MAX. UNIT V V V V uA uA uA mA mA uA VIN = 0 to 5.5V VOUT = 0 to 5.5V CE = VCC ± 0.3V CE = VIH CE = VIL, f=5MHz, Iout = 0mA CE = VIL, VPP = 5.5V CONDITIONS IOH = -0.4mA IOL = 2.1mA CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only) SYMBOL CIN COUT Vpp PARAMETER Input Capacitance Output Capacitance VPP Capacitance MIN. 8 8 18 MAX. 12 12 25 UNIT pF pF pF CONDITIONS VIN = 0V VOUT = 0V VPP = 0V P/N: PM0234 7 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 AC CHARACTERISTICS 27C1000 -45 SYMBOL tACC tCE tOE tDF tOH PARAMETER Address to Output Delay Chip Enable to Output Delay Output Enable to Output Delay OE High to Output Float, MIN. MAX. 45 45 25 17 27C1000/1001 -55 MIN. MAX. 55 55 30 20 MIN. 27C1000/1001 -70 MAX. 70 70 35 20 UNIT ns ns ns ns ns CONDITIONS CE = OE = VIL OE = VIL CE = VIL 0 0 0 0 0 or CE High to Output Float Output Hold from Address, 0 CE or OE which ever occurred first 27C1000/1001 27C1000/1001 -90 SYMBOL tACC tCE tOE tDF tOH PARAMETER Address to Output Delay Chip Enable to Output Delay Output Enable to Output Delay OE High to Output Float, MIN. MAX. 90 90 40 25 -10 MIN. MAX. 100 100 45 30 27C1000/1001 27C1000/1001 -12 MIN. MAX. 120 120 50 35 MIN. -15 MAX. 150 150 65 50 UNIT ns ns ns ns ns CONDITIONS CE = OE = VIL OE = VIL CE = VIL 0 0 0 0 0 0 0 or CE High to Output Float Output Hold from Address, 0 CE or OE which ever occurred first DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL VOH VOL VIH VIL ILI VH ICC3 IPP2 PARAMETER Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current A9 Auto Select Voltage VCC Supply Current (Program & Verify) VPP Supply Current(Program) 2.0 -0.3 -10 11.5 MIN. 2.4 0.4 VCC + 0.5 0.8 10 12.5 50 30 MAX. UNIT V V V V uA V mA mA CE = PGM = VIL, OE = VIH VCC1 VPP1 Fast Programming Supply Voltage Fast Programming Voltage 6.00 12.5 6.50 13.0 V V VIN = 0 to 5.5V CONDITIONS IOH = -0.40mA IOL = 2.1mA P/N: PM0234 8 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL tAS tOES tDS tAH tDH tDFP tVPS tPW tVCS tCES tOE PARAMETER Address Setup Time OE Setup Time Data Setup Time Address Hold Time Data Hold Time Output Enable to Output Float Delay VPP Setup Time PGM Program Pulse Width VCC Setup Time CE Setup Time Data valid from OE MIN. 2.0 2.0 2.0 0 2.0 0 2.0 95 2.0 2.0 150 105 130 MAX. UNIT us us us us us ns us us us us ns CONDITIONS WAVEFORMS READ CYCLE ADDRESS INPUTS tACC DATA ADDRESS CE tCE OE tDF DATA OUT tOE VALID DATA tOH P/N: PM0234 9 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 FAST PROGRAMMING ALGORITHM WAVEFORMS PROGRAM VIH PROGRAM VERIFY Addresses VIL tAS Hi-z DATA IN STABLE DATA OUT VALID tAH DATA tDS VPP1 tDH tDFP VPP VCC tVPS VCC1 VCC tVCS VCC VIH CE VIL tCES VIH PGM VIL tPW VIH tOES tOE Max OE VIL P/N: PM0234 10 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 ORDERING INFORMATION CERAMIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING CURRENT MAX.(mA) MX27C1000DC-45 MX27C1000DC-55 MX27C1001DC-55 MX27C1001DC-70 MX27C1001DC-90 MX27C1001DC-10 MX27C1001DC-12 MX27C1001DC-15 45 55 55 70 90 100 120 150 30 30 30 30 30 30 30 30 STANDBY CURRENT MAX.(uA) 100 100 100 100 100 100 100 100 OPERATING TEMPERATURE 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C -40°C to 85° C 32 Pin DIP 32 Pin DIP 32 Pin DIP 32 Pin DIP 32 Pin DIP 32 Pin DIP 32 Pin DIP 32 PIn DIP PACKAGE P/N: PM0234 11 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 PLASTIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING CURRENT MAX.(mA) MX27C1000PC-45 MX27C1000MC-45 MX27C1000QC-45 MX27C1000TC-45 MX27C1000PC-55 MX27C1000MC-55 MX27C1000QC-55 MX27C1000TC-55 MX27C1001MC-55 MX27C1001PC-55 MX27C1000PC-70 MX27C1000MC-70 MX27C1000QC-70 MX27C1000TC-70 MX27C1001MC-70 MX27C1001PC-70 MX27C1000PC-90 MX27C1000MC-90 MX27C1000QC-90 MX27C1000TC-90 MX27C1001MC-90 MX27C1001PC-90 MX27C1000PC-10 MX27C1000MC-10 MX27C1000QC-10 MX27C1000TC-10 MX27C1001MC-10 MX27C1001PC-10 MX27C1000PC-12 MX27C1000MC-12 MX27C1000QC-12 MX27C1000TC-12 MX27C1001MC-12 MX27C1001PC-12 MX27C1000PC-15 MX27C1000MC-15 MX27C1000QC-15 MX27C1000TC-15 MX27C1001MC-15 MX27C1001PC-15 45 45 45 45 55 55 55 55 55 55 70 70 70 70 70 70 90 90 90 90 90 90 100 100 100 100 100 100 120 120 120 120 120 120 150 150 150 150 150 150 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY CURRENT MAX.(uA) 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 OPERATING TEMPERATURE 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 0° t0 70° C C 32 PIN DIP 32 Pin SOP 32 Pin PLCC 32 Pin TSOP 32 Pin DIP 32 Pin SOP 32 Pin PLCC 32 Pin TSOP 32 Pin SOP 32 Pin DIP 32 Pin DIP 32 Pin SOP 32 Pin PLCC 32 Pin TSOP 32 Pin SOP 32 Pin DIP 32 Pin DIP 32 Pin SOP 32 Pin PLCC 32 Pin TSOP 32 Pin SOP 32 Pin DIP 32 Pin DIP 32 Pin SOP 32 Pin PLCC 32 Pin TSOP 32 Pin SOP 32 Pin DIP 32 Pin DIP 32 Pin SOP 32 Pin PLCC 32 Pin TSOP 32 Pin SOP 32 Pin DIP 32 Pin DIP 32 Pin SOP 32 Pin PLCC 32 Pin TSOP 32 Pin SOP 32 Pin DIP PACKAGE P/N: PM0234 12 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 ORDER INFORMATION(CONTINUED) PLASTIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING CURRENT MAX.(mA) MX27C1000PI-70 MX27C1000MI-70 MX27C1000QI-70 MX27C1000TI-70 MX27C1000PI-90 MX27C1000MI-90 MX27C1000QI-90 MX27C1000TI-90 MX27C1000PI-12 MX27C1000MI-12 MX27C1000QI-12 MX27C1000TI-12 MX27C1000PI-15 MX27C1000MI-12 MX27C1000QI-15 MX27C1000TI-15 70 70 70 70 90 90 90 90 120 120 120 120 150 120 150 150 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY CURRENT MAX.(uA) 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 OPERATING TEMPERATURE -40 ° t0 85°C C -40° t0 85°C C -40° t0 85°C C -40° t0 85°C C -40 ° t0 85°C C -40° t0 85°C C -40° t0 85°C C -40° t0 85°C C -40 ° t0 85°C C -40° t0 85°C C -40° t0 85°C C -40° t0 85°C C -40 ° t0 85°C C -40° t0 85°C C -40° t0 85°C C -40° t0 85°C C 32 Pin DIP 32 Pin SOP 32 Pin PLCC 32 Pin TSOP 32 Pin DIP 32 Pin SOP 32 Pin PLCC 32 Pin TSOP 32 Pin DIP 32 Pin SOP 32 Pin PLCC 32 Pin TSOP 32 Pin SOP 32 Pin SOP 32 Pin PLCC 32 Pin TSOP PACKAG P/N: PM0234 13 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 PACKAGE INFORMATION 32-PIN CERDIP(MSI) WITH WINDOW (600mil) ITEM A B C D E F G H I J K L M N NOTE: MILLIMETERS 42.26 max. 1.90 ± .38 2.54 [TP] .46 [REF] 38.07 1.42 [REF] 3.43 ± .38 .96 ± .43 4.06 5.00 15.58 ± .13 13.20 ± .38 .25 [REF] ø8.12 INCHES 1.665 max. .075 ± .015 .100 [TP] .018 [REF] 1.500 .056 [REF] .135 ± .015 .038 ± .017 .160 .203 .614 ± .005 .520 ± .015 .010 [REF] ø.320 F D E C B M 0.15¡ HG I J 1 A 16 K L 32 N 17 Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. 32-PIN PLASTIC DIP(600 mil) ITEM A B C D E F G H I J K L M NOTE: MILLIMETERS 42.13 max. 1.90 [REF] 2.54 [TP] .46 [Typ.] 38.07 1.27 [Typ.] 3.30 ± .25 .51 [REF] 3.94 ± .25 5.33 max. 15.22 ± .25 13.97 ± .25 .25 [Typ.] INCHES 1.660 max. .075 [REF] .100 [TP] .018 [Typ.] 1.500 .050 [Typ.] .130 ± .010 .020 [REF] .155 ± .010 .210 max. .600 ± .010 .550 ± .010 .010 [Typ.] F D E C H G I J 1 A 16 K L 32 17 Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. B M 0~15¡ P/N: PM0234 14 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 PACKAGE INFORMATION(Continued) 32-PIN PLASTIC SOP (450 mil) ITEM A B C D E F G H I J K L NOTE: MILLIMETERS 20.95 max. 1.00 [REF] 1.27 [TP] .40 [Typ.] .05 min. 3.05 max. 2.69 ± .13 14.12 ± .25 11.30 ± .13 1.42 .20 [Typ.] .79 INCHES .825 max. .039 [REF] .050 [TP] .016 [Typ.] .002 min. .120 max. .106 ± .005 .556 ± .010 .445 ± .005 .056 .008 [Typ.] .031 32 17 1 A 16 H I J G F K E Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. D C B L 32-PIN PLASTIC LEADED CHIP CARRIER (PLCC) A ITEM A B C D E F G H I J K L M N NOTE: MILLIMETERS 12.44 ± .13 11.50 ± .13 14.04 ± .13 14.98 ± .13 1.93 3.30 ± .25 2.03 ± .13 .51 ± .13 1.27 [Typ.] .71[REF] .46 [REF] 10.40/12.94 (W) (L) .89 R .25 (TYP.) INCHES .490 ± .005 .453 ± .005 .553 ± .005 .590 ± .005 .076 .130 ± .010 .080 ± .005 .020 ± .005 .050 [Typ.] .028[REF] .018 [REF] .410/.510 (W) (L) .035 R .010 (TYP.) F G 13 14 9 5 4 B 1 32 30 29 25 C D 21 20 E N 17 Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. H I K L M J P/N: PM0234 15 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 PACKAGE INFORMATION 32-PIN PLASTIC TSOP ITEM A B C D E F G H I J K L M N O NOTE: MILLIMETERS 20.0 ± .20 18.40 ± .10 8.20 max. 0.15 [Typ.] .80 [Typ.] .20 ± .10 .30 ± .10 .50 [Typ.] .45 max. 0 ~ .20 1.00 ± .10 1.27 max. .50 19.00 0~5 INCHES .078 ± .006 .724 ± .004 .323 max. .006 [Typ.] .031 [Typ.] .008 ± .004 .012 ± .004 .020 [Typ.] .018 max. 0 ~ .008 .039 ± .004 .050 max. .020 .748 .500 D E F G H I J K L M O N C A B Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at a maximum material condition. P/N: PM0234 16 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 Revision History Revision No. 5.0 Description 1) Reduce operating current change from 40mA to 30mA. 2) Eliminate Interactive Programming Mode. 3) Add 27C1001 pin configuration. IPP 100uA --> 10uA Change TSOP Orientation 27C1000CDIP 70/90/100/120/150ns speed grades deleted from ordering information. Date 5/28/1997 5.1 5.2 5.3 8/08/1997 4/09/1998 5/07/1998 P/N: PM0234 17 REV. 5.3, MAY 07, 1998 INDEX MX27C1000/1001 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-8888 FAX:+886-3-578-8887 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-747-2309 FAX:+65-748-4090 TAIPEI OFFICE: TEL:+886-3-509-3300 FAX:+886-3-509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice. 18
MX27C1000TI-15 价格&库存

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