0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
LX5553LU

LX5553LU

  • 厂商:

    MICROSEMI(美高森美)

  • 封装:

  • 描述:

    LX5553LU - 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier, LNA & SP3T Switch -...

  • 数据手册
  • 价格&库存
LX5553LU 数据手册
LX5553 TM ® 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier, LNA & SP3T Switch P RODUCTION D ATA S HEET KEY FEATURES DESCRIPTION LX5553 is a high-integration, highperformance WLAN front-end module (FEM) for 802.11b/g/n and other applications in the 2.4-2.5GHz frequency range. LX5553 integrates an advanced InGaP/GaAs Heterojunction Bipolar Transistor (HBT) power amplifier with on chip impedance matching, a fully matched low noise amplifier based on InGaAs Enhancement mode pseudo-morphic high electron mobility transistor (EpHEMT) technology, and a Depletion mode pHEMT (D-pHEMT) singlepole triple-throw (SP3T) switch, all into a single package with 3x3mm footprint. LX5553 provides capability of sharing a single antenna between WLAN and Bluetooth systems through the SP3T switch. The Tx path of LX5553 features a two-stage monolithic microwave integrated circuit (MMIC) power amplifier with active bias circuitry, on-chip output power detector, and 50 input/output matching inside the package. With 3.6V supply voltage and 82mA bias current, the Tx path provides about 25dB power gain, and +17dBm linear output power, with EVM (
LX5553LU 价格&库存

很抱歉,暂时无法提供与“LX5553LU”相匹配的价格&库存,您可以联系我们找货

免费人工找货