5047545100

9 7 8 5 6 4 3 2 1 注記 NOTES E 引き出し方向 PULL OUT DIRECTION E 1. 製品詳細寸法については図面5047541000を参照下さい。 REEL �⌀80� REFER TO THE 5047541000 ABOUT DIMENSIONS IN DETAIL. 2. 梱包数量：5000個/リール NUMBER OF CONNECTORS：5000 PCS/REEL 3. リードテープ長さ LEAD TAPE LENGTH トップテープ接着部（空エンボス） 100MIN. ⌀380±2 PULL OUT DIRECTION D トップテープリーダー部 TOP TAPE LEADER PART 　 D TOP TAPE BONDED PART. (EMPTY) 引き出し方向 400MIN. 部品挿入部 COMPONENT SUPPLIER 　 末端部（空部） TAIL PART (EMPTY) 160MIN. “C” 4. 材料 MATERIAL 　　キャリアテープ(CARRIER TAPE)　：　ポリスチレン(POLYSTYRENE) 　　トップテープ(TOP TAPE) : PET, PE, PEF 　　リール(REEL) : ポリスチレン(PS)リサイクル材含む 　　　　　　　　　　　　　POLYSTYRENE(PS)RECYCLE MATERIAL CONTAINED 5. ELV及びRoHS適合品 ELV AND RoHS COMPLIANCT 2±0.5 B±1 C C � 2� 0°) B (12 �22� �⌀10� B �⌀21� �⌀13� 2016/07/05 2016/07/07 2016/07/07 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION GENERAL TOLERANCES (UNLESS SPECIFIED) RELEASE STATUS FORMAT: tb-prod-A3 REVISION: F DATE: 2015/11/16 9 P1 RELEASE DATE 07.07.2016 8 B 08:34:58 7 6 5 REV EC NO: DRWN: CHK'D: APPR: A 106328 YCHEN128 YKOBAYASHI02 TKUSUHARA01 REVISED ANGULAR TOL ± 1.0 ° 4 PLACES ± 0.03 3 PLACES ± 0.03 2 PLACES ± 0.05 1 PLACE ± 0.1 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE MM 10:1 DRWN BY DATE 2016/03/18 AYOSHII01 DATE CHK'D BY 2016/03/31 YKOBAYASHI02 APPR BY A DATE TKUSUHARA01 DRAWING SIZE 0.3 FPC CONN. B/F LA75 SERIES TAPING PKG 2016/03/31 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 504754 SEE CHART DOCUMENT NUMBER DOC TYPE DOC PART SHEET NUMBER 5047540000 3 CUSTOMER 2 PSD 1 OF 2 000 1 9 7 8 8 ±0.1 (PITCH) (3.75) (0.9) 引き出し方向 E 5 6 PULL OUT DIRECTION 4 Y 3 2 1 E T (3.1) 0.2 ±0.1 1.5 +0.1 0 32mm幅テープ 　 32mm WIDTH TAPE 24mm幅テープ 24mm WIDTH TAPE (R 0.75) DETAIL T エンボスポケット中心 32±0.3 (A) CENTER OF POCKET 16mm WIDTH TAPE D ±0.3 16mm幅テープ 20.0 17.0 14.0 13.4 12.8 12.2 11.5 25.4 11.6 11.0 9.2 8.0 6.5 6.2 7.5 17.4 4.9 4.3 3.7 28.4 14.2 33.4 24±0.3 -- 16±0.3 -- (C) E C 1.75 ±0.1 (0.3) (1.84) B D 　 D ⌀ 1.5 +0.1 0 (2) 4 ±0.1 Y 累積ピッチ 40±0.2 ACCUMULATIVE PITCH ：40±0.2 SECTION Y-Y Eキャリアテープ幅 EMBOSSED TAPE WIDTH D B C 504754-6100 504754-5100 504754-4100 504754-3900 504754-3700 504754-3500 504754-3300 504754-3100 504754-2500 504754-2100 504754-1600 504754-1500 504754-1100 504754-0900 504754-0700 61 51 41 39 37 35 33 31 25 21 16 15 11 9 7 オーダー番号 ORDER NO. 極数 CIRCUITS A C B 2016/07/05 2016/07/07 2016/07/07 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION GENERAL TOLERANCES (UNLESS SPECIFIED) REVISED RELEASE STATUS FORMAT: master-tb-prod-A3 REVISION: F DATE: 2015/11/16 9 P1 RELEASE DATE 07.07.2016 8 B 08:34:58 7 6 5 REV EC NO: DRWN: CHK'D: APPR: A 106328 YCHEN128 YKOBAYASHI02 TKUSUHARA01 ANGULAR TOL ± 1.0 ° 4 PLACES ± 0.03 3 PLACES ± 0.03 2 PLACES ± 0.05 1 PLACE ± 0.1 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE MM 10:1 DRWN BY DATE 2016/03/18 AYOSHII01 DATE CHK'D BY 2016/03/31 YKOBAYASHI02 APPR BY A DATE TKUSUHARA01 DRAWING SIZE 0.3 FPC CONN. B/F LA75 SERIES TAPING PKG 2016/03/31 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 504754 SEE CHART DOCUMENT NUMBER DOC TYPE DOC PART SHEET NUMBER 5047540000 3 CUSTOMER 2 PSD 2 OF 2 000 1 7 8 (0.05) 9 5 6 3 (0.34) (TAIL) (1.25) (INSERT DEPTH) ロックターミナル(15：1) LOCK TERMINAL (1.25) (INSERT DEPTH) (0.45) (CONTACT) (0.34) (TAIL) (1.05) (CONTACT) (0.05) 奇数端子（15：1） ODD TERMINAL MXJ 偶数端子（15：1） EVEN TERMINAL (ACTUATOR OPEN) 0.3 C HOUSHING ASSY OF 16 CKTS 0.4 ±0.1 (B) (0.33) (TAIL) �1.47� (0.75) 2A CIRCUIT No.16 EVEN-TERMINAL CIRCUIT No.1 ODD-TERMINAL A MXJ 2A (3.3) B 0.15 0.75 2017/02/17 2017/02/20 2017/02/20 2A 2A ISO VIEW(REFERENCE) RELEASE STATUS FORMAT: tb-prod-A3 REVISION: F DATE: 2015/11/16 9 P1 RELEASE DATE 20.02.2017 8 08:26:02 ISO VIEW(REFERENCE) (ACTUATOR CLOSED) 7 EC NO: DRWN: CHK'D: APPR: 推奨ピックアップエリア�15：1� RECOMMENDED PICK UP AREA (ACTUATOR OPENED) 6 C 5 REV 0.3×(N-1)+1.6 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 1.0 ° J REVISED MX J 113640 YCHEN128 YKOBAYASHI02 TKUSUHARA01 (PICK UP AREA) MX (PICK UP AREA) A 1 18.5 15.5 12.5 11.9 11.3 10.7 10.1 9.5 7.7 6.5 5.0 4.7 3.5 2.9 2.3 17.4 14.4 11.4 10.8 10.2 9.6 9.0 8.4 6.6 5.4 4.2 3.6 2.4 1.8 1.2 19.3 16.3 13.3 12.7 12.1 11.5 10.9 10.3 8.5 7.3 5.8 5.5 4.3 3.7 3.1 18.0 15.0 12.0 11.4 10.8 10.2 9.6 9.0 7.2 6.0 4.5 4.2 3.0 2.4 1.8 19.8 16.8 13.8 13.2 12.6 12.0 11.4 10.8 9.0 7.8 6.3 6.0 4.8 4.2 3.6 E D C B A 504754-6100 504754-5100 504754-4100 504754-3900 504754-3700 504754-3500 504754-3300 504754-3100 504754-2500 504754-2100 504754-1600 504754-1500 504754-1100 504754-0900 504754-0700 EMBOSSED PACKAGE E D 61 51 41 39 37 35 33 31 25 21 16 15 11 9 7 C B CIRCUITS オーダー番号：ORDER NO. CONNECTOR SERIES 504754-**09 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION (ACTUATOR CLOSED) �0.1� 1.4 3 2 注記 NOTES: 1.材質 MATERIAL ハウジング: 液晶ポリマー(LCP)、黒色、ガラス充填、UL94 V-0 HOUSING: LIQUID CRYSTAR POLYMER, BLACK, GLASS FILLED, UL94 V-0 アクチュエータ: ポリアミド樹脂(PA)、灰色、ガラス充填、UL94 HB ACTUATOR: POLYAMIDE, GRAY, GLASS FILLED, UL94 HB 奇数ターミナル: 銅合金（t＝0.10） ODD TERMINAL: COPPER ALLOY(t=0.10) 偶数ターミナル: 銅合金（t＝0.10） EVEN TERMINAL: COPPER ALLOY(t=0.10) ロックターミナル：銅合金（t＝0.10） LOCK TERMINAL：COPPER ALLOY(t=0.10) 2.めっき仕様 PLATING 奇数／偶数ターミナル ODD/EVEN TERMINAL 接点部: 部分金めっき(0.1µm以上) CONTACT AREA: SEPARATED GOLD PLATING (0.1 MICROMETER MINIMUM) 半田付け部: 部分金めっき 　 SOLDER TAIL AREA: SEPARATED GOLD PLATING 下地: ニッケルめっき(1.0µm以上) UNDERPLATE: NICKEL PLATING(1.0 MICROMETER MINIMUM) ロックターミナル LOCK TERMINAL 半田付け部: 部分金めっき SOLDER TAIL AREA: SEPARATED GOLD PLATING 下地: ニッケルめっき(1.0µm以上) UNDERPLATE：NICKEL PLATING(1.0 MICROMETER MINIMUM) 3.平坦度は、0.1mm以下とする。 TAILS' COPLANARITY TO BE 0.1 MAXIMUM. 4.ELV及びRoHS適合品 ELV AND RoHS COMPLIANT (D) E D 4 4 PLACES ± 0.03 3 PLACES ± 0.03 2 PLACES ± 0.05 1 PLACE ± 0.1 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE MM 20:1 DRWN BY DATE 2016/03/18 AYOSHII01 2016/03/31 YKOBAYASHI02 APPR BY A DATE TKUSUHARA01 DRAWING SIZE 0.3 FPC LA75 SERIES ASSY DATE CHK'D BY 2016/03/31 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 504754 SEE SHEET 1 DOCUMENT NUMBER DOC TYPE DOC PART SHEET NUMBER 5047541000 3 CUSTOMER 2 PSD 1 OF 3 000 1 5 コネクタ位置 CONNECTOR POSITION (0.1) 8 0.2 ±0.02 0.2 MAX. 0.3 +0.04 -0.03 D ±0.03 B 適合金メッキFPC推奨寸法 仕上がり厚さ : 0.2±0.03 APPLICABLE FPC WITH GOLD PLATING RECOMMENDED DIMENSION THICKNESS :0.2±0.03 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 1.0 ° C 08:26:02 6 0.25 ±0.02 (PITCH) FOR ODD CKT ASSY 7 D 0.6 ±0.02 奇数極ASSY用 打抜き方向は導体側から補強板側を推奨致します。 RECOMMENDED PUNCHER DIRECTION: FROM CONDUCTOR SIDE TO STIFFENER FILM SIDE. 20.02.2017 TYP.(2) 0.1 MAX. 5 REV 注記 APERTURE RATE 　　　　　　　　　　　　　: 80% NOTE 1. 必ず基板に実装してからアクチュエ-タを操作して下さい. PLEASE OPERATE THE ACTUATOR AFTER MOUNTING ON FPC構成推奨仕様 THE SUBSTRATE. STRUCTURE OF FPC 2. FPCについて ABOUT FPC 補強フィルム材質はポリイミドを推奨します。べースフィルムは25μmを推奨します。 接着剤は熱硬化接着剤を推奨します。 尚、接着剤の接点部への付着は導通不良の原因になりますので、染み出しが無い様、お願い致します。 RECOMMENDED STIFFENER MATERIAL: POLYIMIDE RECOMMENDED BASE FILM THICKNESS: 25 MICROMETER RECOMMENDED ADHESIVE: THERMOSETTING ADHESIVE NOTE: PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND BECAUSE THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE CAUSES THE DEFECT IN ELECTRICAL CONTINUITY. RELEASE DATE R 0.2 MAX. 0.1 MAX. 0.95 ±0.05 0.75 ±0.1 1.35 ±0.1 1.45 ±0.15 0.3 +0.04 -0.03 C 2017/02/17 2017/02/20 2017/02/20 推奨開口率 　　　　　　：80% 9 0.3 +0.04 -0.03 TYP.(8) REVISED RECOMMENDED METAL MASK THICKNESS : 0.1mm P1 E (PITCH) 113640 YCHEN128 YKOBAYASHI02 TKUSUHARA01 �B� RECOMMENDED P.C.BOARD PATTERN LAYOUT RELEASE STATUS 0.65 ±0.07 0.6 ±0.02 EC NO: DRWN: CHK'D: APPR: 0.22 ±0.03 推奨基板レイアウト FORMAT: master-tb-prod-A3 REVISION: F DATE: 2015/11/16 B ±0.03 カバーレイ：ポリイミド (25μm) COVER FILM: POLYIMIDE(25μm) 0.4 ±0.03 推奨メタルマスク厚さ：0.1mm A 0.65 ±0.07 R 0.2 MAX. 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部：銅箔 (35μm) COPPER FOIL (35μm) 熱硬化接着剤 THERMOSETTING ADHESIVE (PITCH) �0.9� B 0.4 ±0.05 0.6 ±0.03 補強板：ポリイミド REINFORCE BOARD: POLYIMIDE 熱硬化接着剤 THERMOSETTING ADHESIVE ベースフィルム：ポリイミド(25μm) BASE FILM: POLYIMIDE(25μm) 0.54 ±0.03 D E ±0.05 0.55 ±0.03 3.15 ±0.03 めっき：金めっき (0.1μm以上) 下地ソフトニッケルめっき (1-5μm) 0.3 ±0.03 0.4 ±0.05 0.15 MAX. (PITCH) 1 C ±0.05 仕上がり厚さ THICKNESS PLATING: GOLD PLATING(0.1μmMIN.) SOFT NICKEL UNDERPLATE (1-5μm) 0.53 ±0.03 0.6 ±0.02 C 2 0.2±0.03 0.22 ±0.03 E 3 3 ±0.5 (補強板) （STIFFENER BOARD） (D) 4 2 ±0.3 6 0.5MIN. 7 8 0.65 ±0.1 9 4 PLACES ± 0.03 3 PLACES ± 0.03 2 PLACES ± 0.05 1 PLACE ± 0.1 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE MM 20:1 DRWN BY DATE 2016/03/18 AYOSHII01 2016/03/31 YKOBAYASHI02 APPR BY A DATE TKUSUHARA01 DRAWING SIZE 0.3 FPC LA75 SERIES ASSY DATE CHK'D BY 2016/03/31 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 504754 SEE SHEET 1 DOCUMENT NUMBER DOC TYPE DOC PART SHEET NUMBER 5047541000 3 CUSTOMER 2 PSD 2 OF 3 000 1 7 5 6 4 3 2 1 0.2 ±0.03 上接触用パターン 仕上がり厚さ THICKNESS �0.9� FPC PATTERN 0.3 ±0.03 コネクタ位置 CONNECTOR POSITION D E C ±0.05 0.4 ±0.05 E ±0.05 0.4 ±0.05 0.65 ±0.07 B ±0.03 0.65 ±0.07 0.6 ±0.02 FPC構成推奨仕様 RECOMMENDED METAL MASK THICKNESS : 0.1mm C STRUCTURE OF FPC 　　　　推奨開口率　　　　　：80%　　　　　 APERTURE RATE 　　　　　　　　　　　　　: 80% 0.1 MAX. 注記 0.2 MAX. 適合金メッキFPC推奨寸法 NOTE 0.6 ±0.02 0.25 ±0.02 1. 必ず基板に実装してからアクチュエ-タを操作して下さい. (PITCH) 仕上がり厚さ：0.2±0.03 PLEASE OPERATE THE ACTUATOR AFTER MOUNTING ON 下接触用パターン 0.2 ±0.02 APPLICABLE FPC WITH GOLD PLATING 0.3 +0.03 -0.04 THE SUBSTRATE. FPC PATTERN RECOMMENDED DIMENSION 2. FPCについて ± 0.03 OF BOTTOM CONTACT D THICKNESS : 0.2±0.03 ABOUT FPC THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 補強フィルム材質はポリイミドを推奨します。べースフィルムは25μmを推奨します。 DIMENSION UNITS SCALE 接着剤は熱硬化接着剤を推奨します。 GENERAL TOLERANCES 尚、接着剤の接点部への付着は導通不良の原因になりますので、染み出しが無い様、お願い致します。 MM 20:1 (UNLESS SPECIFIED) RECOMMENDED STIFFENER MATERIAL: POLYIMIDE DRWN BY DATE RECOMMENDED BASE FILM THICKNESS: 25 MICROMETER ANGULAR TOL ± 1.0 ° 2016/03/18 AYOSHII01 RECOMMENDED ADHESIVE: THERMOSETTING ADHESIVE ± 0.03 4 PLACES 0.3 FPC LA75 SERIES ASSY NOTE: PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE DATE CHK'D BY ± 0.03 3 PLACES ON ADHEREND BECAUSE THERE IS A 2016/03/31 YKOBAYASHI02 POSSIBILITY THAT THE EXTRA ADHESIVE CAUSES ± 0.05 2 PLACES APPR BY DATE THE DEFECT IN ELECTRICAL CONTINUITY. PRODUCT CUSTOMER DRAWING B FOR 16 CKT ASSY 打抜き方向は導体側から補強板側を推奨致します。 RECOMMENDED PUNCHER DIRECTION: FROM CONDUCTOR SIDE TO STIFFENER FILM SIDE. 9 P1 RELEASE DATE 20.02.2017 8 C 08:26:02 7 6 5 REV RELEASE STATUS FORMAT: master-tb-prod-A3 REVISION: F DATE: 2015/11/16 113640 YCHEN128 YKOBAYASHI02 TKUSUHARA01 16極ASSY用 EC NO: DRWN: CHK'D: APPR: A REVISED 2017/02/17 2017/02/20 2017/02/20 B TYP.(8) 0.5 MIN 　　　　推奨メタルマスク厚さ：0.1mm　 　　 R 0.2 MAX. 0.15 MAX. RECOMMENDED P.C.BOARD PATTERN LAYOUT 0.75 ±0.1 0.65 ±0.1 推奨基板レイアウト 1.35 ±0.1 �B� 1.45 ±0.15 �0.9� C 0.1 MAX. (PITCH) TYP.(2) 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部：銅箔 (35μm) COPPER FOIL (35μm) 熱硬化接着剤 THERMOSETTING ADHESIVE カバーレイ：ポリイミド(25μm) COVER FILM: POLYIMIDE(25μm) 0.22 ±0.03 0.4 ±0.03 熱硬化接着剤 THERMOSETTING ADHESIVE ベースフィルム：ポリイミド (25μm) BASE FILM: POLYIMIDE(25μm) (PITCH) 補強板：ポリイミド REINFORCE BOARD: POLYIMIDE 0.6 ±0.03 �0.1� 0.54 ±0.03 R 0.2 MAX. D 0.3 +0.04 -0.03 0.55 ±0.03 (PITCH) PLATING: GOLD PLATING(0.1μmMIN.) SOFT NICKEL UNDERPLATE (1-5μm) 0.4 ±0.03 3.15 ±0.03 E 0.6 ±0.02 OF UPPER CONTACT めっき：金めっき (0.1μm以上) 下地ソフトニッケルめっき(1-5μm) 0.53 ±0.03 0.22 ±0.03 （STIFFENER BOARD） �D� 3 ±0.5 （補強板） �1.2� 2 ±0.3 8 0.95 ±0.03 9 1 PLACE ± 0.1 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 TKUSUHARA01 DRAWING SIZE 2016/03/31 THIRD ANGLE PROJECTION A3 SERIES MATERIAL NUMBER 504754 SEE SHEET 1 DOCUMENT NUMBER DOC TYPE DOC PART SHEET NUMBER 5047541000 3 CUSTOMER 2 PSD 3 OF 3 000 1 A