C02E.pdf
Nov.27,2017
Chip Multilayer Ceramic Capacitors
for General
2018
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Safety Standard Certified Chip Multilayer Ceramic Capacitors for General Purpose / IEC60384-14 Class X2
GA3 Series Type GB
GR3
WEB
GR4
GRJ
IEC60384-14 X2 Class Certified Product
WEB
GJM
International Standard (IEC60384-14) certified product.
Please down load Safety Standard Certification (Type GB: X2) from here.
oSwitching Power Supply - Class 1 Equipment
GA2
C10
C8
C9
GA3
GB
C3
C1
C7
Controller
GA3
GD
C6
C2
GQM
Can be used as a Class X2 capacitor.
C5
Application
No.
Recommend
MLCC Type
X Cap
Type: GB
Y Cap
Type: GF
Primary - Secondary Coupling
Type: GF×2
LLL
C1
GA3
GF
C4
C2
LLA
C3
C4
LLM
C5
C7
C3
C3
C8
NFM
C9
LLR
oSwitching Power Supply - Class 2 Equipment
Controller
C4
No.
C1
C2
Application
X Cap
Y Cap
C3
C4
Primary - Secondary Coupling
Recommend
MLCC Type
Type: GB
Type: GF×2
KR3
C6
GMA
C5
GMD
C2
C2
KRM
C1
!Caution
/Notice
2
GR7
Features
1
C02E.pdf
Nov.27,2017
GRM
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
189
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
3
GR3
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Realized large capacitance value and small size while maintaining high withstand voltages by the
multilayer structure.
Internal Electrodes
GRJ
Ceramic
Ni/Sn Plated Layer
4
Compared with conventional lead type capacitors, this product realized great reductions in size and
height, with a volume of 1/10 or less, and height of 1/4 or less.
5
This product is only for reflow soldering.
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
LLR
LLM
LLA
LLL
GA3
GF
GA3
GD
GA3
GB
GA2
GQM
GJM
GR7
GR4
Foundation Electrode Layer
190
Specifications
Size (mm)
Rated Voltage
5.7×5.0mm
e
g
e
250Vac
Capacitance
10000pF to 56000pF
Main Applications
AC-DC power supply
This catalog contains only a portion of the product lineup.
Please refer to the capacitor search tool on the Murata Web site for details.
T
L
W
C02E.pdf
Nov.27,2017
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Part Number List
GR3
GA3 Series Type GB High Dielectric Constant Type
C02E.pdf
Nov.27,2017
5.7×5.0mm
Rated
TC
Voltage Code
Cap.
Tol.
Part Number
p*
GRJ
T
max.
GRM
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
1.5mm 250Vac X7R 10000pF ±10% GA355QR7GB103KW01# p192
GR4
15000pF ±10% GA355QR7GB153KW01# p192
2.0mm 250Vac X7R 22000pF ±10% GA355DR7GB223KW01# p192
2.5mm 250Vac X7R 33000pF ±10% GA355ER7GB333KW01# p192
GR7
47000pF ±10% GA355ER7GB473KW01# p192
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
LLR
LLM
LLA
LLL
GA3
GF
GA3
GD
GA3
GB
GA2
GQM
GJM
2.9mm 250Vac X7R 56000pF ±10% GA355XR7GB563KW06# p192
*: Refers to the page of the “Specifications and Test Methods”.
Part number # indicates the package specification code.
191
C02E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
1
No
Item
Specification
Appearance
No defects or abnormalities.
Visual inspection.
2
Dimension
Within the specified dimensions.
Using calipers and micrometers.
3
Voltage Proof
No defects or abnormalities.
Measurement Point: Between the terminations
Test Voltage: DC1075V
Applied Time: 60±1s
Charge/discharge current: 50mA max.
Measurement Point: Between the terminations
Measurement Voltage: DC500±50V
Charging Time: 60±5s
Measurement Temperature: Room Temperature
4
Insulation Resistance (I.R.)
6000MΩ or more
5
Capacitance
Shown in Rated value.
6
Dissipation Factor (D.F.)
0.025 max.
GA2
R7: Within ±15% (-55 to +125°C)
GA3
GB
7
Temperature
Characteristics
of Capacitance
GA3
GD
GA3
GF
8
Appearance
No defects or abnormalities.
Capacitance
Within the specified initial value.
D.F.
Within the specified initial value.
Vibration
LLL
LLA
Step
1
2
3
4
5
Temperature (°C)
Reference Temp. ±2
Min. Operating Temp. ±3
Reference Temp. ±2
Max. Operating Temp. ±3
Reference Temp. ±2
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h. at room condition*.
9
95% of the terminations is to be soldered evenly and
continuously.
Solderability
LLM
LLR
NFM
Measurement Temperature: Room Temperature
Measurement Frequency: 1.0±0.1kHz
Measurement Voltage: AC1.0±0.2V (r.m.s.)
The capacitance change should be measured after 5 minutes at
each specified temp. stage.
Capacitance value as a reference is the value in step 3.
Resistance
to
10
Soldering
Heat
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±10%
I.R.
1000MΩ or more
Voltage
Proof
No defects.
KRM
KR3
Test Method (Ref. Standard: JIS C 5101, IEC60384)
1
Solder the capacitor on the test substrate A shown in
“Complement of Test Method”.
Kind of Vibration: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude: 1.5mm
This motion should be applied for a period of 2h in each 3
mutually perpendicular directions (total of 6h).
Test Method: Solder bath method
Flux: Solution of rosin ethanol 25 (wt)%
Preheat: 80 to 120°C for 10 to 30s
Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.: 245±5°C
Immersion time: 2±0.5s
Immersing in speed: 25±2.5mm/s.
Test Method: Solder bath method
Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.: 260±5°C
Immersion time: 10±1s
Immersing in speed: 25±2.5mm/s.
Exposure Time: 24±2h at room condition*.
Preheat: GA355 size: 100 to 120°C for 1min and 170 to 200°C
for 1min
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
Solder the capacitor on the test substrate A shown in
“Complement of Test Method”.
11
Adhesive Strength
of Termination
No removal of the terminations or other defect should
occur.
10N, 10±1s
Applied Direction: In parallel with the test substrate and
vertical with the capacitor side.
GMA
!Caution
/Notice
GMD
192
Nov.27,2017
GA3 Series Type GB Specifications and Test Methods (1)
GQM
GJM
GR7
GR4
GRJ
GR3
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
12
Substrate
Bending Test
No defects or abnormalities.
Solder the capacitor on the test substrate B shown in
“Complement of Test Method”.
Then apply the force in the direction shown in “Test Method of
Substrate Bending Test” of “Complement of Test Method”.
Flexure: 1mm
Holding Time: 5±1s
Soldering Method: Reflow soldering
* Room Condition: Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmosphere pressure: 86 to 106kPa
Continued on the following page.
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Nov.27,2017
GRM
GA3 Series Type GB Specifications and Test Methods (1)
3000MΩ or more
Step
Temp. (°C)
Time (min)
1
Min. Operating Temp. +0/-3
30±3
2
Room Temp.
2 to 3
3
Max. Operating Temp. +3/-0
30±3
4
Room Temp.
2 to 3
Voltage
Proof
No defects.
Exposure Time: 24±2h at room condition*.
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
Appearance
No defects or abnormalities.
Capacitance
Change
Within±15%
Fix the capacitor to the supporting test substrate B (glass epoxy
board) shown in “Complement of Test Method”.
Before this test, the test shown in the following is performed.
• No.11 Adhesive Strength of Termination (apply force: 5N)
• No.12 Substrate Bending Test
Test Temperature: 40±2°C
Test Humidity: 90 to 95%RH
Test Time: 500+24/-0h
Applied Voltage: Rated voltage
Exposure Time: 24±2h at room condition*.
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
High
D.F.
Temperature
I.R.
14 High
Humidity
(Steady)
Voltage
Proof
0.05 max.
3000MΩ or more
No defects.
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±20%
D.F.
0.05 max.
I.R.
3000MΩ or more
Fix the capacitor to the supporting test substrate B (glass epoxy
board) shown in “Complement of Test Method”.
Before this test, the test shown in the following is performed.
• No.11 Adhesive Strength of Termination (apply force: 5N)
• No.12 Substrate Bending Test
Next, Impulse Voltage test is performed.
Each individual capacitor shall be subjected to a 2.5kV Impulse
(the voltage value means zero to peak) for 3 times.
Then the capacitors are applied to life test.
GRJ
GR4
Temperature I.R.
13 Sudden
Change
GR7
0.05 max.
GJM
D.F.
GQM
Within±15%
Fix the capacitor to the supporting test substrate A (glass epoxy
board) shown in “Complement of Test Method”.
Perform the 5 cycles according to the four heat treatments
shown in the following table.
GA2
No defects or abnormalities.
Capacitance
Change
GA3
GB
Appearance
Test Method (Ref. Standard: JIS C 5101, IEC60384)
GA3
GD
Specification
GA3
GF
Item
LLL
No
GR3
Continued from the preceding page.
Voltage
Proof
No defects.
LLM
t
T
T1
T2
Apply voltage as Table for 1000h at 125+2/-0°C , relative
humidity 50% max.
Applied Voltage
AC312.5V (r.m.s.), except that once each hour the
voltage is increased to AC1000V (r.m.s.) for 0.1s.
Exposure Time: 24±2h at room condition*.
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
LLR
15 Durability
Front time (T1) = 1.2µs=1.67T
Time to half-value (T2) = 50µs
NFM
30
0
KRM
50
LLA
100 (%)
90
GMA
GMD
!Caution
/Notice
Continued on the following page.
KR3
* Room Condition: Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmosphere pressure: 86 to 106kPa
193
C02E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.27,2017
GA3 Series Type GB Specifications and Test Methods (1)
No
Item
Specification
GR7
GR4
GRJ
GR3
Continued from the preceding page.
16 Passive Flammability
The burning time shall not be exceeded the time 30s.
The tissue paper shall not ignite.
Test Method (Ref. Standard: JIS C 5101, IEC60384)
The capacitor under test shall be held in the flame in the
position which best promotes burning.
Each specimen shall only be exposed once to the flame.
Time of exposure to flame: 30s
Length of flame: 12±1mm
Gas burner: Length 35mm min.
Inside dia: 0.5±0.1mm
Outside dia: 0.9mm max.
Gas: Butane gas purity 95% min.
Test Specimen
Approximately 8mm
Flame
200±5mm
45°
GJM
Buner
GQM
Tissue Paper
Wood Board of Approximately 10mm in Thickness
GA3
GB
GA2
The specimens shall be individually wrapped in at least one but
more than two complete layers of cheesecloth.
The specimens shall be subjected to 20 discharges.
The interval between successive discharges shall be 5s.
The UAC shall be maintained for 2min after the last discharge.
S1
F
L1
R
L2
Ui
GA3
GD
S2
C1
U-
C2
L3
C3
Cx
S3
Ct
L4
Tr
GA3
GF
Oscilloscope
The cheesecloth shall not be on fire.
Ux
2.5kV
LLR
LLM
LLA
LLL
17 Active Flammability
C1,C2: Filter capacitor 1µF±10%
C3: Capacitor 0.033µF±5%
L1 to L4: Rod coa choke 1.5mH±20%, 16A
R: Resistor 100Ω±2% Cx < 0.068µF
Ct: Tank capacitor 3µF±5% 10kV Cx <
= 1µF
U-: UR±5%
UR: Rated voltage
Cx: Capacitor under test
F: Slow-blow fuse, rated 16A
Ut: Voltage to which the tank capacitor Ct is charged
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
time
194
Ut
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GRM
GA3 Series Type GB Specifications and Test Methods (1)
C02E.pdf
Nov.27,2017
Continued from the preceding page.
GR3
Complement of Test Method
(1) Test Substrate A
• Land Dimensions
Chip Capacitor
Part Number
Land
Solder Resist
GQM
• Material: Glass Epoxy Board
• Thickness: 1.6mm
• Thickness of Copper Foil: 0.035mm
(2) Test Substrate B
a
Part Number
40
Dimension of Pattern (mm)
b
c
d
8.0
5.6
1.0
(ø4.5)
1.6
GA3
GD
b
Copper Foil
Solder Resist
(in mm)
GA3
GF
• Material: Glass Epoxy Board
• Thickness of Copper Foil: 0.035mm
2. Test Method of Substrate Bending Test
(a) Support State
a: ±2 gap between support stand center and test stand
LLA
Pressure Stick
Support Stand
(in mm)
b: ±5 gap between support stand center and test stand center
Support Stand
L
KRM
F
R5
KR3
Pressure Stick
NFM
• Material of Test Stand and Pressure Stick
The material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized.
• Pressurizing Speed
The pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value.
LLM
(in mm)
GMA
Test Stand
45±2
b
Support Stand (ø5)
45±2
Test Substrate B
20
Capacitor
50 min.
a
LLR
Test Substrate B
LLL
(b) Test State
GMD
100
!Caution
/Notice
d
c
GA355
a
4.5
GA2
b
GA3
GB
a
c
5.6
GJM
c
GA355
Dimension (mm)
b
8.0
a
4.5
GR7
GR4
GRJ
1. Test Substrate
The test substrate should be Substrate A or Substrate B as described in “Specifications and Test Methods”.
The specimen should be soldered by the conditions as described below.
Soldering Method: Reflow soldering
Solder: Sn-3.0Ag-0.5Cu
195
C02E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GA3 Series Type GD
GR4
Features
1
International Standard (IEC60384-14) certified product.
Please down load Safety Standard Certification (Type GD) from here.
GJM
GR7
WEB
UL60950-1 Certified Product
GQM
2
WEB
Can be uesd for UL60950-1 devices.
GA2
C5
GA3
GB
oDAA Modem - Transformer Less
C1
C1
C5
Tel
Line
GA3
GD
Bus
C7
GA3
GF
C2
Application
C5
Lighting Surge Absorption
C6
Noise Immunity
C7
D/A Isolation Barrier
LLL
C4
3
C6
Realized large capacitance value and small size while maintaining high withstand voltages by the
multilayer structure.
Internal Electrodes
LLR
Ceramic
Ni/Sn Plated Layer
NFM
KRM
KR3
GMA
Type: GD / GF
GND
4
This product is only for reflow soldering.
Specifications
Size (mm)
!Caution
/Notice
GMD
Recommend
MLCC Type
C3
LLM
LLA
No.
Foundation Electrode Layer
196
Nov.27,2017
Safety Standard Certified Chip Multilayer Ceramic Capacitors for General Purpose / Acquired certifications of UL60950-1
GRJ
GR3
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Rated Voltage
Capacitance
Main Applications
4.5×2.0mm to 4.5×3.2mm
e
g
e
250Vac
T
10pF to 4700pF
Modem
This catalog contains only a portion of the product lineup.
Please refer to the capacitor search tool on the Murata Web site for details.
L
W
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Part Number List
GR3
GA3 Series Type GD Temperature Compensating Type
C02E.pdf
Nov.27,2017
4.5×2.0mm
10pF
±5%
GA342A1XGD100JW31# p199
12pF
±5%
GA342A1XGD120JW31# p199
15pF
±5%
GA342A1XGD150JW31# p199
18pF
±5%
GA342A1XGD180JW31# p199
22pF
±5%
GA342A1XGD220JW31# p199
27pF
±5%
GA342A1XGD270JW31# p199
33pF
±5%
GA342A1XGD330JW31# p199
39pF
±5%
GA342A1XGD390JW31# p199
47pF
±5%
GA342A1XGD470JW31# p199
56pF
±5%
GA342A1XGD560JW31# p199
68pF
±5%
GA342A1XGD680JW31# p199
82pF
±5%
GA342A1XGD820JW31# p199
GRJ
p*
GR4
Part Number
GR7
SL
Tol.
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
LLR
LLM
LLA
LLL
GA3
GF
GA3
GD
GA3
GB
GA2
1.0mm 250Vac
Cap.
GJM
Rated
TC
Voltage Code
GQM
T
max.
GRM
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
*: Refers to the page of the “Specifications and Test Methods”.
Part number # indicates the package specification code.
197
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GRM
4.5×2.0mm
GRJ
GA3 Series Type GD High Dielectric Constant Type
GR3
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
T
max.
Rated
TC
Voltage Code
Tol.
Part Number
Part Number List
p*
100pF
±10% GA342QR7GD101KW01# p203
150pF
±10% GA342QR7GD151KW01# p203
220pF
±10% GA342QR7GD221KW01# p203
330pF
±10% GA342QR7GD331KW01# p203
470pF
±10% GA342QR7GD471KW01# p203
680pF
±10% GA342QR7GD681KW01# p203
1000pF
±10% GA342QR7GD102KW01# p203
1500pF
±10% GA342QR7GD152KW01# p203
4.5×3.2mm
T
max.
Rated
TC
Voltage Code
Cap.
Tol.
Part Number
p*
1.5mm 250Vac X7R 1800pF
±10% GA343QR7GD182KW01# p203
2200pF
±10% GA343QR7GD222KW01# p203
2.0mm 250Vac X7R 4700pF
±10% GA343DR7GD472KW01# p203
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
LLR
LLM
LLA
LLL
GA3
GF
GA3
GD
GA3
GB
GA2
GQM
GJM
GR7
GR4
1.5mm 250Vac X7R
Cap.
C02E.pdf
Nov.27,2017
198
*: Refers to the page of the “Specifications and Test Methods”.
Part number # indicates the package specification code.
C02E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Measurement Point: Between the terminations
Measurement Voltage: DC500±50V
Charging Time: 60±5s
Measurement Temperature: Room Temperature
6
Capacitance
Shown in Rated value.
Q
C>
= 30pF: 1000 or more
C < 30pF: 400+20C or more
C: Nominal Capacitance (pF)
7
Measurement Temperature: Room Temperature
Measurement Frequency: 1.0±0.1MHz
Measurement Voltage: AC1.0±0.2V (r.m.s.)
The capacitance change should be measured after 5 minutes at
each specified temp. stage.
Capacitance value as a reference is the value in step 3.
8
Temperature
Characteristics
of Capacitance
1X: +350 to -1000 ppm/°C
(Temp.Range:+20 to +85°C)
Step
1
2
3
4
5
Temperature (°C)
Reference Temp. ±2
Min. Operating Temp. ±3
Reference Temp. ±2
Max. Operating Temp. ±3
Reference Temp. ±2
However, the capacitance shall be measured at even 85°C
between step 3 and step 4.
9
Appearance
No defects or abnormalities.
Capacitance
Within the specified initial value.
Q
Within the specified initial value.
Vibration
95% of the terminations is to be soldered evenly and
continuously.
10 Solderability
Resistance
to
11
Soldering
Heat
Appearance
No defects or abnormalities.
Capacitance
Change
Within±2.5% or ±0.25pF (Whichever is larger)
I.R.
1000MΩ or more
Voltage
Proof
No defects.
Solder the capacitor on the test substrate A shown in
“Complement of Test Method”.
Kind of Vibration: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude: 1.5mm
This motion should be applied for a period of 2h in each 3
mutually perpendicular directions (total of 6h).
Test Method: Solder bath method
Flux: Solution of rosin ethanol 25 (wt)%
Preheat: 80 to 120°C for 10 to 30s
Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.: 245±5°C
Immersion time: 2±0.5s
Immersing in speed: 25±2.5mm/s.
Test Method: Solder bath method
Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.: 260±5°C
Immersion time: 10±1s
Immersing in speed: 25±2.5mm/s.
Exposure Time: 24±2h at room condition*.
Preheat: GA342 size: 100 to 120°C for 1min
and 170 to 200°C for 1min
Solder the capacitor on the test substrate A shown in
“Complement of Test Method”.
12
Adhesive Strength
of Termination
No removal of the terminations or other defect should
occur.
Substrate
Bending Test
No defects or abnormalities.
GR3
10N, 10±1s
Applied Direction: In parallel with the test substrate and
vertical with the capacitor side.
13
GRJ
6000MΩ or more
GR4
Insulation Resistance (I.R.)
GR7
5
GJM
Impulse Voltage
10 impulse of alternating polarity is subjected. (5 impulse for
each polarity)
The interval between impulse is 60s.
Applied Voltage: 2.5kVo-p
GQM
4
No self healing break downs or flash-overs have taken
place in the capacitor.
GA2
Measurement Point: Between the terminations
Test Voltage: AC1500V (r.m.s.)
Applied Time: 60±1s
Charge/discharge current: 50mA max.
GA3
GB
No defects or abnormalities.
GA3
GD
Voltage Proof
GA3
GF
3
LLL
Using calipers and micrometers.
LLA
Visual inspection.
Within the specified dimensions.
LLM
No defects or abnormalities.
Dimension
LLR
Appearance
2
NFM
1
KRM
Test Method (Ref. Standard: JIS C 5101, IEC60384)
KR3
Specification
Solder the capacitor on the test substrate B shown in
“Complement of Test Method”.
Then apply the force in the direction shown in “Test Method of
Substrate Bending Test” of “Complement of Test Method”.
Flexure: 1mm
Holding Time: 5±1s
Soldering Method: Reflow soldering
GMA
Item
GMD
No
GRM
GA3 Series Type GD Specifications and Test Methods (1)
!Caution
/Notice
1
Nov.27,2017
* Room Condition: Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmosphere pressure: 86 to 106kPa
Continued on the following page.
199
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Nov.27,2017
GA3 Series Type GD Specifications and Test Methods (1)
No
GJM
GA3
GD
GA3
GB
GA2
GQM
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±2.5% or ±0.25pF (Whichever is larger)
Within the specified initial value.
3000MΩ or more
Voltage
Proof
No defects.
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±5.0% or ±0.5pF (Whichever is larger)
High
Temperature
15 High
Q
Humidity
(Steady)
I.R.
GA3
GF
LLL
Specification
C>
= 30pF: 350 or more
C < 30pF: 275+5/2C or more
C: Nominal Capacitance (pF)
3000MΩ or more
Voltage
Proof
No defects.
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±3.0% or ±0.3pF (Whichever is larger)
Q
C>
= 30pF: 350 or more
C < 30pF: 275+5/2C or more
C: Nominal Capacitance (pF)
I.R.
3000MΩ or more
Fix the capacitor to the supporting test substrate A (glass epoxy
board) shown in “Complement of Test Method”
Perform the 5 cycles according to the four heat treatments
shown in the following table.
Step
Temp. (°C)
Time (min)
1
Min. Operating Temp. +0/-3
30±3
2
Room Temp.
2 to 3
3
Max. Operating Temp. +3/-0
30±3
4
Room Temp.
2 to 3
Fix the capacitor to the supporting test substrate B (glass epoxy
board) shown in “Complement of Test Method”.
Before this test, the test shown in the following is performed.
• No.12 Adhesive Strength of Termination (apply force: 5N)
• No.13 Substrate Bending Test
Test Temperature: 40±2°C
Test Humidity: 90 to 95%RH
Test Time: 500+24/-0h.
Applied Voltage: Rated voltage
Exposure Time:24±2h at room condition*.
Fix the capacitor to the supporting test substrate B (glass epoxy
board) shown in “Complement of Test Method”.
Before this test, the test shown in the following is performed.
• No.12 Adhesive Strength of Termination (apply force: 5N)
• No.13 Substrate Bending Test
Next, Impulse Voltage test is performed.
Each individual capacitor shall be subjected to a 2.5kV Impulse
(the voltage value means zero to peak) for 3 times.
Then the capacitors are applied to life test.
100 (%)
90
50
16 Durability
30
0
Voltage
Proof
t
T
T1
No defects.
Front time (T1) = 1.2µs=1.67T
Time to half-value (T2) = 50µs
T2
Apply voltage as Table for 1000h at 125+2/-0°C , relative
humidity 50% max.
Applied voltage
AC425V (r.m.s.), except that once each hour the voltage
is increased to AC1000V (r.m.s.) for 0.1s.
NFM
LLR
Exposure Time: 24±2h at room condition*.
KRM
KR3
GMA
Test Method (Ref. Standard: JIS C 5101, IEC60384)
Exposure Time: 24±2h at room condition*.
LLM
LLA
Item
Temperature Q
14 Sudden
I.R.
Change
GR7
GR4
GRJ
GR3
Continued from the preceding page.
17 Passive Flammability
The burning time shall not be exceeded the time 30s.
The tissue paper shall not ignite.
The capacitor under test shall be held in the flame in the
position which best promotes burning.
Each specimen shall only be exposed once to the flame.
Time of exposure to flame: 30s
Length of flame: 12±1mm
Gas burner: Length 35mm min.
Inside dia: 0.5±0.1mm
Outside dia: 0.9mm max.
Gas: Butane gas purity 95% min.
Test Specimen
Approximately 8mm
Buner
Flame
200±5mm
45°
!Caution
/Notice
GMD
Tissue Paper
200
Wood Board of Approximately 10mm in Thickness
* Room Condition: Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmosphere pressure: 86 to 106kPa
Continued on the following page.
C02E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.27,2017
GRM
GA3 Series Type GD Specifications and Test Methods (1)
R
L4
Tr
Oscilloscope
GA3
GB
Ux
2.5kV
GA3
GD
The cheesecloth shall not be on fire.
time
GA3
GF
18 Active Flammability
C1, C2: Filter capacitor 1µF±10%
C3: Capacitor 0.033µF±5%
L1 to L4: Rod coa choke 1.5mH±20%, 16A
R: Resistor 100Ω±2% Cx < 0.068µF
Ct: Tank capacitor 3µF±5% 10kV Cx <
= 1µF
U-: UR±5%
UR: Rated voltage
Cx: Capacitor under test
F: Slow-blow fuse, rated 16A
Ut: Voltage to which the tank capacitor Ct is charged
Ut
GR7
S3
Ct
GJM
Cx
LLL
L3
C3
LLA
C2
LLM
C1
U-
LLR
S2
GQM
Ui
GA2
L2
NFM
L1
KRM
F
KR3
S1
GR4
The specimens shall be individually wrapped in at least one but
more than two complete layers of cheesecloth.
The specimens shall be subjected to 20 discharges.
The interval between successive discharges shall be 5s.
The UAC shall be maintained for 2min after the last discharge.
GRJ
Test Method (Ref. Standard: JIS C 5101, IEC60384)
GMA
Specification
GMD
Item
!Caution
/Notice
No
GR3
Continued from the preceding page.
201
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GA3 Series Type GD Specifications and Test Methods (1)
1. Test Substrate
The test substrate should be Substrate A or Substrate B as described in “Specifications and Test Methods”.
The specimen should be soldered by the conditions as described below.
Soldering Method: Reflow soldering
Solder: Sn-3.0Ag-0.5Cu
(1) Test Substrate A
• Land Dimensions
GR7
Chip Capacitor
Part Number
Land
a
• Material: Glass Epoxy Board
• Thickness: 1.6mm
• Thickness of Copper Foil: 0.035mm
(2) Test Substrate B
a
40
d
c
GA342
b
Dimension of Pattern (mm)
b
c
d
7.0
2.4
1.0
1.6
Copper Foil
100
Solder Resist
(in mm)
• Material: Glass Epoxy Board
• Thickness of Copper Foil: 0.035mm
2. Test Method of Substrate Bending Test
(a) Support State
(b) Test State
Test Substrate B
a
45±2
Test Stand
45±2
Test Substrate B
20
Capacitor
50 min.
LLA
a
3.5
(ø4.5)
LLL
GA3
GF
Part Number
Support Stand (ø5)
(in mm)
Pressure Stick
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
LLR
LLM
Support Stand
202
c
2.4
Solder Resist
b
GA3
GD
GA3
GB
GA2
GQM
GJM
c
GA342
Dimension (mm)
b
7.0
a
3.5
b
GR4
GRJ
GR3
Continued from the preceding page.
Complement of Test Method
a: ±2 gap between support stand center and test stand
(in mm)
b: ±5 gap between support stand center and test stand center
• Material of Test Stand and Pressure Stick
The material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized.
• Pressurizing Speed
The pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value.
Pressure Stick
F
R5
Support Stand
L
C02E.pdf
Nov.27,2017
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Measurement Point: Between the terminations
Measurement Voltage: DC500±50V
Charging Time: 60±5s
Measurement Temperature: Room Temperature
6
Capacitance
Shown in Rated value.
7
Dissipation Factor (D.F.)
0.025 max.
Measurement Temperature: Room Temperature
Measurement Frequency: 1.0±0.1kHz
Measurement Voltage: AC1.0±0.2V (r.m.s.)
The capacitance change should be measured after 5 minutes at
each specified temp. stage.
Capacitance value as a reference is the value in step 3.
8
Temperature
Characteristics
of Capacitance
R7: Within ±15% (-55 to +125°C)
Step
1
2
3
4
5
Temperature (°C)
Reference Temp. ±2
Min. Operating Temp. ±3
Reference Temp. ±2
Max. Operating Temp. ±3
Reference Temp. ±2
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
9
Appearance
No defects or abnormalities.
Capacitance
Within the specified initial value.
D.F.
Within the specified initial value.
Vibration
95% of the terminations is to be soldered evenly and
continuously.
10 Solderability
11
Resistance
to
Soldering
Heat
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±10%
I.R.
1000MΩ or more
Voltage
Proof
No defects.
Solder the capacitor on the test substrate A shown in
“Complement of Test Method”.
Kind of Vibration: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude: 1.5mm
This motion should be applied for a period of 2h in each 3
mutually perpendicular directions (total of 6h).
Test Method: Solder bath method
Flux: Solution of rosin ethanol 25 (wt)%
Preheat: 80 to 120°C for 10 to 30s
Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.: 245±5°C
Immersion time: 2±0.5s
Immersing in speed: 25±2.5mm/s.
Test Method: Solder bath method
Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.: 260±5°C
Immersion time: 10±1s
Immersing in speed: 25±2.5mm/s.
Exposure Time: 24±2h at room condition*.
Preheat: GA342/43 size: 100 to 120°C for 1min
and 170 to 200°C for 1min
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
Solder the capacitor on the test substrate A shown in
“Complement of Test Method”.
12
Adhesive Strength
of Termination
No removal of the terminations or other defect should
occur.
10N, 10±1s
Applied Direction: In parallel with the test substrate and
vertical with the capacitor side.
* Room Condition: Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmosphere pressure: 86 to 106kPa
Continued on the following page.
GR3
GRJ
6000MΩ or more
GR4
Insulation Resistance (I.R.)
GR7
5
GJM
Impulse Voltage
10 impulse of alternating polarity is subjected. (5 impulse for
each polarity)
The interval between impulse is 60s.
Applied Voltage: 2.5kVo-p
GQM
4
No self healing break downs or flash-overs have taken
place in the capacitor.
GA2
Measurement Point: Between the terminations
Test Voltage: AC1500V (r.m.s.)
Applied Time: 60±1s
Charge/discharge current: 50mA max.
GA3
GB
No defects or abnormalities.
GA3
GD
Voltage Proof
GA3
GF
3
LLL
Using calipers and micrometers.
LLA
Visual inspection.
Within the specified dimensions.
LLM
No defects or abnormalities.
Dimension
LLR
Appearance
2
NFM
1
KRM
Test Method (Ref. Standard: JIS C 5101, IEC60384)
KR3
Specification
GMA
Item
GMD
No
GRM
GA3 Series Type GD Specifications and Test Methods (2)
!Caution
/Notice
2
C02E.pdf
Nov.27,2017
203
C02E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.27,2017
GA3 Series Type GD Specifications and Test Methods (2)
No
13
Item
Substrate
Bending Test
Specification
Test Method (Ref. Standard: JIS C 5101, IEC60384)
Solder the capacitor on the test substrate B shown in
“Complement of Test Method”.
Then apply the force in the direction shown in “Test Method of
Substrate Bending Test” of “Complement of Test Method”
Flexure: 1mm
Holding Time: 5±1s
Soldering Method: Reflow soldering
No defects or abnormalities.
GA2
GA3
GB
GA3
GD
No defects or abnormalities.
Capacitance
Change
Within±15%
D.F.
0.05 max.
Step
Temp. (°C)
Time (min)
Min. Operating Temp. +0/-3
1
30±3
Room Temp.
2
2 to 3
Max. Operating Temp. +3/-0
3
30±3
Room Temp.
4
2 to 3
3000MΩ or more
No defects.
Exposure Time: 24±2h at room condition*.
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
Appearance
No defects or abnormalities.
Capacitance
Change
Within±15%
Fix the capacitor to the supporting test substrate B (glass epoxy
board) shown in “Complement of Test Method”.
Before this test, the test shown in the following is performed.
• No.12 Adhesive Strength of Termination (apply force: 5N)
• No.13 Substrate Bending Test
Test Temperature: 40±2°C
Test Humidity: 90 to 95%RH
Test Time: 500+24/-0h
Applied Voltage: Rated voltage
Exposure Time: 24±2h at room condition*.
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
0.05 max.
3000MΩ or more
No defects.
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±20%
D.F.
0.05 max.
I.R.
3000MΩ or more
Fix the capacitor to the supporting test substrate B (glass epoxy
board) shown in “Complement of Test Method”.
Before this test, the test shown in the following is performed.
• No.12 Adhesive Strength of Termination (apply force: 5N)
• No.13 Substrate Bending Test
Next, Impulse Voltage test is performed.
Each individual capacitor shall be subjected to a 2.5kV Impulse
(the voltage value means zero to peak) for 3 times.
Then the capacitors are applied to life test.
LLM
LLA
Fix the capacitor to the supporting test substrate A (glass epoxy
board) shown in “Complement of Test Method”.
Perform the 5 cycles according to the four heat treatments
shown in the following table.
Voltage
Proof
High
D.F.
Temperature
I.R.
15 High
Humidity
(Steady)
Voltage
Proof
LLL
GA3
GF
Appearance
Temperature I.R.
14 Sudden
Change
GQM
GJM
GR7
GR4
GRJ
GR3
Continued from the preceding page.
LLR
100 (%)
90
50
GMA
KR3
KRM
NFM
16 Durability
0
30
t
T
T1
Voltage
Proof
No defects.
Front time (T1) = 1.2µs=1.67T
Time to half-value (T2) = 50µs
T2
Apply voltage as Table for 1000h at 125+2/-0°C , relative
humidity 50% max.
Applied Voltage
AC425V (r.m.s.), except that once each hour the voltage
is increased to AC1000V (r.m.s.) for 0.1s.
Exposure Time: 24±2h at room condition*.
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
!Caution
/Notice
GMD
* Room Condition: Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmosphere pressure: 86 to 106kPa
204
Continued on the following page.
C02E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.27,2017
GRM
GA3 Series Type GD Specifications and Test Methods (2)
17 Passive Flammability
Specification
The burning time shall not be exceeded the time 30s.
The tissue paper shall not ignite.
Test Method (Ref. Standard: JIS C 5101, IEC60384)
GRJ
The capacitor under test shall be held in the flame in the
position which best promotes burning.
Each specimen shall only be exposed once to the flame.
Time of exposure to flame: 30s
Length of flame: 12±1mm
Gas burner: Length 35mm min.
Inside dia: 0.5±0.1mm
Outside dia: 0.9mm max.
Gas: Butane gas purity 95% min.
GR4
Item
GR7
No
GR3
Continued from the preceding page.
Test Specimen
Approximately 8mm
GJM
Flame
200±5mm
45°
The specimens shall be individually wrapped in at least one but
more than two complete layers of cheesecloth.
The specimens shall be subjected to 20 discharges.
The interval between successive discharges shall be 5s.
The UAC shall be maintained for 2min after the last discharge.
S1
F
L1
R
L2
Ui
S2
C1
U-
C2
L3
C3
Cx
S3
Ct
L4
Tr
Ut
GA3
GB
Wood Board of Approximately 10mm in Thickness
GA2
GQM
Tissue Paper
GA3
GD
Buner
LLL
LLA
LLM
Ux
LLR
2.5kV
GMA
KR3
KRM
NFM
time
GMD
The cheesecloth shall not be on fire.
!Caution
/Notice
18 Active Flammability
C1, C2: Filter capacitor 1µF±10%
C3: Capacitor 0.033µF±5%
L1 to L4: Rod coa choke 1.5mH±20%, 16A
R: Resistor 100Ω±2% Cx < 0.068µF
Ct: Tank capacitor 3µF±5% 10kV Cx <
= 1µF
U-: UR±5%
UR: Rated voltage
Cx: Capacitor under test
F: Slow-blow fuse, rated 16A
Ut: Voltage to which the tank capacitor Ct is charged
GA3
GF
Oscilloscope
205
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GA3 Series Type GD Specifications and Test Methods (2)
1. Test Substrate
The test substrate should be Substrate A or Substrate B as described in “Specifications and Test Methods”.
The specimen should be soldered by the conditions as described below.
Soldering Method: Reflow soldering
Solder: Sn-3.0Ag-0.5Cu
(1) Test Substrate A
• Land Dimensions
GR7
Chip Capacitor
Part Number
Land
a
• Material: Glass Epoxy Board
• Thickness: 1.6mm
• Thickness of Copper Foil: 0.035mm
(2) Test Substrate B
a
40
d
c
GA342
GA343
(ø4.5)
b
Dimension of Pattern (mm)
b
c
d
7.0
2.4
1.0
7.0
3.7
1.0
1.6
Solder Resist
(in mm)
• Material: Glass Epoxy Board
• Thickness of Copper Foil: 0.035mm
2. Test Method of Substrate Bending Test
(a) Support State
(b) Test State
Test Substrate B
a
45±2
Test Stand
45±2
Test Substrate B
20
Capacitor
50 min.
LLA
a
3.5
3.5
Copper Foil
100
LLL
GA3
GF
Part Number
Support Stand (ø5)
(in mm)
Pressure Stick
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
LLR
LLM
Support Stand
206
c
2.4
3.7
Solder Resist
b
GA3
GD
GA3
GB
GA2
GQM
GJM
c
GA342
GA343
Dimension (mm)
b
7.0
7.0
a
3.5
3.5
b
GR4
GRJ
GR3
Continued from the preceding page.
Complement of Test Method
a: ±2 gap between support stand center and test stand
(in mm)
b: ±5 gap between support stand center and test stand center
• Material of Test Stand and Pressure Stick
The material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized.
• Pressurizing Speed
The pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value.
Pressure Stick
F
R5
Support Stand
L
C02E.pdf
Nov.27,2017
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Nov.27,2017
Safety Standard Certified Chip Multilayer Ceramic Capacitors for General Purpose / Acquired certifications of IEC60384-14 Class X1/Y2 and UL60950-1
Size 4.5x2.0mm: This product is applicable only for the instruments certified by
EN/IEC60950-1
Size 5.7x2.8mm or 5.7x5.0mm: This product is applicable as X or Y capacitor
Please down load Safety Standard Certification (Type GF: X1/Y2) from here.
GQM
Can be used as a Class Y2 capacitor.
C8
C9
C3
GA3
GB
C10
GA2
oSwitching Power Supply - Class 1 Equipment
C6
C7
Controller
GA3
GF
C5
C4
Recommend
MLCC Type
X Cap
Type: GB
Y Cap
Type: GF
Primary - Secondary Coupling
Type: GF×2
C1
LLL
Application
No.
GA3
GD
C1
C2
C3
LLA
C2
LLR
C5
LLM
C4
oSwitching Power Supply - Class 2 Equipment
C7
C8
C5
C6
Controller
C4
No.
C1
C2
Application
X Cap
Y Cap
C3
C4
Primary - Secondary Coupling
Recommend
MLCC Type
Type: GB
Type: GF×2
KR3
C2
C2
KRM
C1
GMA
C3
C3
NFM
C9
GMD
2
WEB
GJM
International Standard (IEC60384-14) certified product.
!Caution
/Notice
1
GR7
Features
GRJ
GR3
WEB
GR4
GA3 Series Type GF
GRM
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
207
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
3
GR3
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Realized large capacitance value and small size while maintaining high withstand voltages by the
multilayer structure.
Internal Electrodes
GRJ
Ceramic
Ni/Sn Plated Layer
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
LLR
LLM
LLA
LLL
GA3
GF
GA3
GD
GA3
GB
GA2
GQM
GJM
GR7
GR4
Foundation Electrode Layer
208
4
This product is only for reflow soldering.
Specifications
Size (mm)
Rated Voltage
Capacitance
Main Applications
4.5×2.0mm to 5.7×5.0mm
e
g
e
250Vac
T
10pF to 4700pF
AC-DC power supply
This catalog contains only a portion of the product lineup.
Please refer to the capacitor search tool on the Murata Web site for details.
L
W
C02E.pdf
Nov.27,2017
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Part Number List
GR3
GA3 Series Type GF Temperature Compensating Type
C02E.pdf
Nov.27,2017
4.5×2.0mm
10pF
±5%
GA342A1XGF100JW31# p211
12pF
±5%
GA342A1XGF120JW31# p211
15pF
±5%
GA342A1XGF150JW31# p211
18pF
±5%
GA342A1XGF180JW31# p211
22pF
±5%
GA342A1XGF220JW31# p211
27pF
±5%
GA342A1XGF270JW31# p211
33pF
±5%
GA342A1XGF330JW31# p211
39pF
±5%
GA342A1XGF390JW31# p211
47pF
±5%
GA342A1XGF470JW31# p211
56pF
±5%
GA342A1XGF560JW31# p211
68pF
±5%
GA342A1XGF680JW31# p211
82pF
±5%
GA342A1XGF820JW31# p211
GRJ
p*
GR4
Part Number
GR7
SL
Tol.
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
LLR
LLM
LLA
LLL
GA3
GF
GA3
GD
GA3
GB
GA2
1.0mm 250Vac
Cap.
GJM
Rated
TC
Voltage Code
GQM
T
max.
GRM
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
*: Refers to the page of the “Specifications and Test Methods”.
Part number # indicates the package specification code.
209
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GRM
4.5×2.0mm
GRJ
GA3 Series Type GF High Dielectric Constant Type
GR3
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
T
max.
Rated
TC
Voltage Code
2.2mm 250Vac X7R
Tol.
Part Number
Part Number List
p*
100pF
±10% GA342QR7GF101KW01# p215
150pF
±10% GA342QR7GF151KW01# p215
470pF
±10% GA342QR7GF471KW01# p215
680pF
±10% GA342QR7GF681KW01# p215
220pF
±10% GA342DR7GF221KW02# p215
330pF
±10% GA342DR7GF331KW02# p215
1000pF
±10% GA342DR7GF102KW02# p215
GJM
GR7
GR4
1.5mm 250Vac X7R
Cap.
C02E.pdf
Nov.27,2017
T
max.
Rated
TC
Voltage Code
1.5mm 250Vac X7R
Cap.
Tol.
Part Number
p*
100pF
±10% GA352QR7GF101KW31# p215
150pF
±10% GA352QR7GF151KW31# p215
220pF
±10% GA352QR7GF221KW31# p215
330pF
±10% GA352QR7GF331KW31# p215
470pF
±10% GA352QR7GF471KW01# p215
680pF
±10% GA352QR7GF681KW01# p215
1000pF
±10% GA352QR7GF102KW01# p215
1500pF
±10% GA352QR7GF152KW01# p215
5.7×5.0mm
T
max.
Rated
TC
Voltage Code
Cap.
Tol.
Part Number
p*
1.5mm 250Vac X7R 1800pF
±10% GA355QR7GF182KW01# p215
2200pF
±10% GA355QR7GF222KW01# p215
3300pF
±10% GA355QR7GF332KW01# p215
2.0mm 250Vac X7R 4700pF
±10% GA355DR7GF472KW01# p215
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
LLR
LLM
LLA
LLL
GA3
GF
GA3
GD
GA3
GB
GA2
GQM
5.7×2.8mm
210
*: Refers to the page of the “Specifications and Test Methods”.
Part number # indicates the package specification code.
C02E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Measurement Point: Between the terminations
Measurement Voltage: DC500±50V
Charging Time: 60±5s
Measurement Temperature: Room Temperature
6
Capacitance
Shown in Rated value.
Q
C>
= 30pF: 1000 or more
C < 30pF: 400+20C or more
C: Nominal Capacitance (pF)
7
Measurement Temperature: Room Temperature
Measurement Frequency: 1.0±0.1MHz
Measurement Voltage: AC1.0±0.2V (r.m.s.)
The capacitance change should be measured after 5 minutes at
each specified temp. stage.
Capacitance value as a reference is the value in step 3.
8
Temperature
Characteristics
of Capacitance
1X: +350 to -1000 ppm/°C
(Temp.Range:+20 to +85°C)
Step
1
2
3
4
5
Temperature (°C)
Reference Temp. ±2
Min. Operating Temp. ±3
Reference Temp. ±2
Max. Operating Temp. ±3
Reference Temp. ±2
However, the capacitance shall be measured at even 85°C
between step 3 and step 4.
9
Appearance
No defects or abnormalities.
Capacitance
Within the specified initial value.
Q
Within the specified initial value.
Vibration
95% of the terminations is to be soldered evenly and
continuously.
10 Solderability
Resistance
to
11
Soldering
Heat
Appearance
No defects or abnormalities.
Capacitance
Change
Within±2.5% or ±0.25pF (Whichever is larger)
I.R.
1000MΩ or more
Voltage
Proof
No defects.
Solder the capacitor on the test substrate A shown in
“Complement of Test Method”.
Kind of Vibration: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude: 1.5mm
This motion should be applied for a period of 2h in each 3
mutually perpendicular directions (total of 6h).
Test Method: Solder bath method
Flux: Solution of rosin ethanol 25 (wt)%
Preheat: 80 to 120°C for 10 to 30s
Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.: 245±5°C
Immersion time: 2±0.5s
Immersing in speed: 25±2.5mm/s.
Test Method: Solder bath method
Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.: 260±5°C
Immersion time: 10±1s
Immersing in speed: 25±2.5mm/s.
Exposure Time: 24±2h at room condition*.
Preheat: GA342 size: 100 to 120°C for 1min
and 170 to 200°C for 1min
Solder the capacitor on the test substrate A shown in
“Complement of Test Method”.
12
Adhesive Strength
of Termination
No removal of the terminations or other defect should
occur.
Substrate
Bending Test
No defects or abnormalities.
GR3
10N, 10±1s
Applied Direction: In parallel with the test substrate and
vertical with the capacitor side.
13
GRJ
6000MΩ or more
GR4
Insulation Resistance (I.R.)
GR7
5
GJM
Impulse Voltage
10 impulse of alternating polarity is subjected. (5 impulse for
each polarity)
The interval between impulse is 60s.
Applied Voltage: 2.5kVo-p
GQM
4
No self healing break downs or flash-overs have taken
place in the capacitor.
GA2
Measurement Point: Between the terminations
Test Voltage: AC2000V (r.m.s.)
Applied Time: 60±1s
Charge/discharge current: 50mA max.
GA3
GB
No defects or abnormalities.
GA3
GD
Voltage Proof
GA3
GF
3
LLL
Using calipers and micrometers.
LLA
Visual inspection.
Within the specified dimensions.
LLM
No defects or abnormalities.
Dimension
LLR
Appearance
2
NFM
1
KRM
Test Method (Ref. Standard: JIS C 5101, IEC60384)
KR3
Specification
Solder the capacitor on the test substrate B shown in
“Complement of Test Method”.
Then apply the force in the direction shown in “Test Method of
Substrate Bending Test” of “Complement of Test Method”.
Flexure: 1mm
Holding Time: 5±1s
Soldering Method: Reflow soldering
GMA
Item
GMD
No
GRM
GA3 Series Type GF Specifications and Test Methods (1)
!Caution
/Notice
1
Nov.27,2017
* Room Condition: Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmosphere pressure: 86 to 106kPa
Continued on the following page.
211
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Nov.27,2017
GA3 Series Type GF Specifications and Test Methods (1)
No
GJM
GA3
GD
GA3
GB
GA2
GQM
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±2.5% or ±0.25pF (Whichever is larger)
Within the specified initial value.
3000MΩ or more
Voltage
Proof
No defects.
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±5.0% or ±0.5pF (Whichever is larger)
High
Temperature
15 High
Q
Humidity
(Steady)
I.R.
GA3
GF
LLL
Specification
C>
= 30pF: 350 or more
C < 30pF: 275+5/2C or more
C: Nominal Capacitance (pF)
3000MΩ or more
Voltage
Proof
No defects.
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±3.0% or ±0.3pF (Whichever is larger)
Q
C>
= 30pF: 350 or more
C < 30pF: 275+5/2C or more
C: Nominal Capacitance (pF)
I.R.
3000MΩ or more
Step
Temp. (°C)
Time (min)
1
Min. Operating Temp. +0/-3
30±3
2
Room Temp.
2 to 3
3
Max. Operating Temp. +3/-0
30±3
4
Room Temp.
2 to 3
Fix the capacitor to the supporting test substrate B (glass epoxy
board) shown in “Complement of Test Method”.
Before this test, the test shown in the following is performed.
• No.12 Adhesive Strength of Termination (apply force: 5N)
• No.13 Substrate Bending test
Test Temperature: 40±2°C
Test Humidity: 90 to 95%RH
Test Time: 500+24/-0h
Applied Voltage: Rated voltage
Exposure Time: 24±2h at room condition*.
Fix the capacitor to the supporting test substrate B (glass epoxy
board) shown in “Complement of Test Method”.
Before this test, the test shown in the following is performed.
• No.12 Adhesive Strength of Termination (apply force: 5N)
• No.13 Substrate Bending test
Next, Impulse Voltage test is performed.
Each individual capacitor shall be subjected to a 5kV Impulse
(the voltage value means zero to peak) for 3 times.
Then the capacitors are applied to life test.
50
16 Durability
30
0
Voltage
Proof
No defects.
t
T
T1
Front time (T1) = 1.2µs=1.67T
Time to half-value (T2) = 50µs
T2
Apply voltage as Table for 1000h at 125+2/-0°C , relative
humidity 50% max.
Applied voltage
AC425V (r.m.s.), except that once each hour the voltage
is increased to AC1000V (r.m.s.) for 0.1s.
NFM
LLR
Exposure Time: 24±2h at room condition*.
KRM
KR3
Fix the capacitor to the supporting test substrate A (glass epoxy
board) shown in “Complement of Test Method”.
Perform the 5 cycles according to the four heat treatments
shown in the following table.
100 (%)
90
17 Passive Flammability
GMA
Test Method (Ref. Standard: JIS C 5101, IEC60384)
Exposure Time: 24±2h at room condition*.
LLM
LLA
Item
Temperature Q
14 Sudden
I.R.
Change
GR7
GR4
GRJ
GR3
Continued from the preceding page.
The burning time shall not be exceeded the time 30s.
The tissue paper shall not ignite.
The capacitor under test shall be held in the flame in the
position which best promotes burning.
Each specimen shall only be exposed once to the flame.
Time of exposure to flame: 30s
Length of flame: 12±1mm
Gas burner: Length 35mm min.
Inside dia: 0.5±0.1mm
Outside dia: 0.9mm max.
Gas: Butane gas purity 95% min.
Test Specimen
Approximately 8mm
Buner
Flame
200±5mm
45°
!Caution
/Notice
GMD
Tissue Paper
212
Wood Board of Approximately 10mm in Thickness
* Room Condition: Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmosphere pressure: 86 to 106kPa
Continued on the following page.
C02E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.27,2017
GRM
GA3 Series Type GF Specifications and Test Methods (1)
R
L4
Tr
Oscilloscope
GA3
GB
Ux
2.5kV
GA3
GD
The cheesecloth shall not be on fire.
time
GA3
GF
18 Active Flammability
C1, C2: Filter capacitor 1µF±10%
C3: Capacitor 0.033µF±5%
L1 to L4: Rod coa choke 1.5mH±20%, 16A
R: Resistor 100Ω±2% Cx < 0.068µF
Ct: Tank capacitor 3µF±5% 10kV Cx <
= 1µF
U-: UR±5%
UR: Rated voltage
Cx: Capacitor under test
F: Slow-blow fuse, rated 16A
Ut: Voltage to which the tank capacitor Ct is charged
Ut
GR7
S3
Ct
GJM
Cx
LLL
L3
C3
LLA
C2
LLM
C1
U-
LLR
S2
GQM
Ui
GA2
L2
NFM
L1
KRM
F
KR3
S1
GR4
The specimens shall be individually wrapped in at least one but
more than two complete layers of cheesecloth.
The specimens shall be subjected to 20 discharges.
The interval between successive discharges shall be 5s.
The UAC shall be maintained for 2min after the last discharge.
GRJ
Test Method (Ref. Standard: JIS C 5101, IEC60384)
GMA
Specification
GMD
Item
!Caution
/Notice
No
GR3
Continued from the preceding page.
213
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GA3 Series Type GF Specifications and Test Methods (1)
1. Test Substrate
The test substrate should be Substrate A or Substrate B as described in “Specifications and Test Methods”.
The specimen should be soldered by the conditions as described below.
Soldering Method: Reflow soldering
Solder: Sn-3.0Ag-0.5Cu
(1) Test Substrate A
• Land Dimensions
GR7
Chip Capacitor
Part Number
Land
a
• Material: Glass Epoxy Board
• Thickness: 1.6mm
• Thickness of Copper Foil: 0.035mm
(2) Test Substrate B
a
40
d
c
GA342
b
Dimension of Pattern (mm)
b
c
d
7.0
2.4
1.0
1.6
Copper Foil
100
Solder Resist
(in mm)
• Material: Glass Epoxy Board
• Thickness of Copper Foil: 0.035mm
2. Test Method of Substrate Bending Test
(a) Support State
(b) Test State
Test Substrate B
a
45±2
Test Stand
45±2
Test Substrate B
20
Capacitor
50 min.
LLA
a
3.5
(ø4.5)
LLL
GA3
GF
Part Number
Support Stand (ø5)
(in mm)
Pressure Stick
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
LLR
LLM
Support Stand
214
c
2.4
Solder Resist
b
GA3
GD
GA3
GB
GA2
GQM
GJM
c
GA342
Dimension (mm)
b
7.0
a
3.5
b
GR4
GRJ
GR3
Continued from the preceding page.
Complement of Test Method
a: ±2 gap between support stand center and test stand
(in mm)
b: ±5 gap between support stand center and test stand center
• Material of Test Stand and Pressure Stick
The material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized.
• Pressurizing Speed
The pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value.
Pressure Stick
F
R5
Support Stand
L
C02E.pdf
Nov.27,2017
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
5
Insulation Resistance (I.R.)
6000MΩ or more
6
Capacitance
Shown in Rated value.
7
Dissipation Factor (D.F.)
0.025 max.
Measurement Temperature: Room Temperature
Measurement Frequency: 1.0±0.1kHz
Measurement Voltage: AC1.0±0.2V (r.m.s.)
The capacitance change should be measured after 5 minutes at
each specified temp. stage.
Capacitance value as a reference is the value in step 3.
8
Temperature
Characteristics
of Capacitance
R7: Within ±15% (-55 to +125°C)
Step
1
2
3
4
5
Temperature (°C)
Reference Temp. ±2
Min. Operating Temp. ±3
Reference Temp. ±2
Max. Operating Temp. ±3
Reference Temp. ±2
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
9
Appearance
No defects or abnormalities.
Capacitance
Within the specified initial value.
D.F.
Within the specified initial value.
Vibration
95% of the terminations is to be soldered evenly and
continuously.
10 Solderability
11
Resistance
to
Soldering
Heat
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±10%
I.R.
1000MΩ or more
Voltage
Proof
No defects.
Solder the capacitor on the test substrate A shown in
“Complement of Test Method”.
Kind of Vibration: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude: 1.5mm
This motion should be applied for a period of 2h in each 3
mutually perpendicular directions (total of 6h).
Test Method: Solder bath method
Flux: Solution of rosin ethanol 25 (wt)%
Preheat: 80 to 120°C for 10 to 30s
Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.: 245±5°C
Immersion time: 2±0.5s
Immersing in speed: 25±2.5mm/s.
Test Method: Solder bath method
Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.: 260±5°C
Immersion time: 10±1s
Immersing in speed: 25±2.5mm/s.
Exposure Time: 24±2h at room condition*.
Preheat: GA342/52/55 size: 100 to 120°C for 1min
and 170 to 200°C for 1min
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
Solder the capacitor on the test substrate A shown in
“Complement of Test Method”.
12
Adhesive Strength of
Termination
No removal of the terminations or other defect should
occur.
GR3
GRJ
GR4
GR7
Measurement Point: Between the terminations
Measurement Voltage: DC500±50V
Charging Time: 60±5s
Charge/discharge current: 50mA max.
Measurement Temperature: Room Temperature
4
GJM
10 impulse of alternating polarity is subjected. (5 impulse for
each polarity)
The interval between impulse is 60s.
Applied Voltage: 2.5kVo-p
GQM
Impulse Voltage
No self healing break downs or flash-overs have taken
place in the capacitor.
GA2
Measurement Point: Between the terminations
Test Voltage: AC2000V (r.m.s.)
Applied Time: 60±1s
Charge/discharge current: 50mA max.
GA3
GB
No defects or abnormalities.
GA3
GD
Voltage Proof
GA3
GF
3
LLL
Using calipers and micrometers.
LLA
Visual inspection.
Within the specified dimensions.
LLM
No defects or abnormalities.
Dimension
LLR
Appearance
2
NFM
1
KRM
Test Method (Ref. Standard: JIS C 5101, IEC60384)
KR3
Specification
GMA
Item
10N, 10±1s
Applied Direction: In parallel with the test substrate and
vertical with the capacitor side.
* Room Condition: Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmosphere pressure: 86 to 106kPa
Continued on the following page.
GMD
No
GRM
GA3 Series Type GF Specifications and Test Methods (2)
!Caution
/Notice
2
C02E.pdf
Nov.27,2017
215
C02E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.27,2017
GA3 Series Type GF Specifications and Test Methods (2)
No
13
Item
Substrate
Bending Test
Specification
No defects or abnormalities.
GA2
GA3
GB
GA3
GD
No defects or abnormalities.
Capacitance
Change
Within±15%
D.F.
0.05 max.
Solder the capacitor on the test substrate B shown in
“Complement of Test Method”.
Then apply the force in the direction shown in “Test Method of
Substrate Bending Test” of “Complement of Test Method”.
Flexure: 1mm
Holding Time: 5±1s
Soldering Method: Reflow soldering
Fix the capacitor to the supporting test substrate A (glass epoxy
board) shown in “Complement of Test Method”.
Perform the 5 cycles according to the four heat treatments
shown in the following table.
Step
Temp. (°C)
Time (min)
1
Min. Operating Temp. +0/-3
30±3
2
Room Temp.
2 to 3
3
Max. Operating Temp. +3/-0
30±3
4
Room Temp.
2 to 3
No defects.
Exposure Time: 24±2h at room condition*.
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
Appearance
No defects or abnormalities.
Capacitance
Change
Within±15%
Fix the capacitor to the supporting test substrate B (glass epoxy
board) shown in “Complement of Test Method”.
Before this test, the test shown in the following is performed.
• No.12 Adhesive Strength of Termination (apply force: 5N)
• No.13 Substrate Bending Test
Test Temperature: 40±2°C
Test Humidity: 90 to 95%RH
Test Time: 500+24/-0h
Applied Voltage: Rated voltage
Exposure Time: 24±2h at room condition*.
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
0.05 max.
3000MΩ or more
No defects.
Appearance
No defects or abnormalities.
Capacitance
Change
Within ±20%
D.F.
0.05 max.
I.R.
3000MΩ or more
LLM
LLA
3000MΩ or more
Test Method (Ref. Standard: JIS C 5101, IEC60384)
Voltage
Proof
High
D.F.
Temperature
I.R.
15 High
Humidity
(Steady)
Voltage
Proof
LLL
GA3
GF
Appearance
Temperature I.R.
14 Sudden
Change
GQM
GJM
GR7
GR4
GRJ
GR3
Continued from the preceding page.
Fix the capacitor to the supporting test substrate B (glass epoxy
board) shown in “Complement of Test Method”.
Before this test, the test shown in the following is performed.
• No.12 Adhesive Strength of Termination (apply force: 5N)
• No.13 Substrate Bending Test
Next, Impulse Voltage test is performed.
Each individual capacitor shall be subjected to a 5kV Impulse
(the voltage value means zero to peak) for 3 times.
Then the capacitors are applied to life test.
LLR
100 (%)
90
50
30
0
GMA
KR3
KRM
NFM
16 Durability
t
T
T1
Voltage
Proof
No defects.
Front time (T1) = 1.2µs=1.67T
Time to half-value (T2) = 50µs
T2
Apply voltage as Table for 1000h at 125+2/-0°C, relative
humidity 50% max.
Applied Voltage
AC425V (r.m.s.), except that once each hour the voltage
is increased to AC1000V (r.m.s.) for 0.1s.
Exposure Time: 24±2h at room condition*.
• Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h±5min and
then let sit for 24±2h at room condition*.
!Caution
/Notice
GMD
* Room Condition: Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmosphere pressure: 86 to 106kPa
216
Continued on the following page.
C02E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.27,2017
GRM
GA3 Series Type GF Specifications and Test Methods (2)
17 Passive Flammability
Specification
The burning time shall not be exceeded the time 30s.
The tissue paper shall not ignite.
Test Method (Ref. Standard: JIS C 5101, IEC60384)
GRJ
The capacitor under test shall be held in the flame in the
position which best promotes burning.
Each specimen shall only be exposed once to the flame.
Time of exposure to flame: 30s
Length of flame: 12±1mm
Gas burner: Length 35mm min.
Inside dia: 0.5±0.1mm
Outside dia: 0.9mm max.
Gas: Butane gas purity 95% min.
GR4
Item
GR7
No
GR3
Continued from the preceding page.
Test Specimen
Approximately 8mm
GJM
Flame
200±5mm
45°
The specimens shall be individually wrapped in at least one but
more than two complete layers of cheesecloth.
The specimens shall be subjected to 20 discharges.
The interval between successive discharges shall be 5s.
The UAC shall be maintained for 2min after the last discharge.
S1
F
L1
R
L2
Ui
S2
C1
U-
C2
L3
C3
Cx
S3
Ct
L4
Tr
Ut
GA3
GB
Wood Board of Approximately 10mm in Thickness
GA2
GQM
Tissue Paper
GA3
GD
Buner
LLL
LLA
LLM
Ux
LLR
2.5kV
GMA
KR3
KRM
NFM
time
GMD
The cheesecloth shall not be on fire.
!Caution
/Notice
18 Active Flammability
C1, C2: Filter capacitor 1µF±10%
C3: Capacitor 0.033µF±5%
L1 to L4: Rod coa choke 1.5mH±20%, 16A
R: Resistor 100Ω±2% Cx < 0.068µF
Ct: Tank capacitor 3µF±5% 10kV Cx <
= 1µF
U-: UR±5%
UR: Rated voltage
Cx: Capacitor under test
F: Slow-blow fuse, rated 16A
Ut: Voltage to which the tank capacitor Ct is charged
GA3
GF
Oscilloscope
217
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
GRM
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GA3 Series Type GF Specifications and Test Methods (2)
1. Test Substrate
The test substrate should be Substrate A or Substrate B as described in “Specifications and Test Methods”.
The specimen should be soldered by the conditions as described below.
Soldering Method: Reflow soldering
Solder: Sn-3.0Ag-0.5Cu
(1) Test Substrate A
• Land Dimensions
GR7
Chip Capacitor
Part Number
Land
a
• Material: Glass Epoxy Board
• Thickness: 1.6mm
• Thickness of Copper Foil: 0.035mm
(2) Test Substrate B
a
40
d
c
GA342
GA352
GA355
(ø4.5)
b
Dimension of Pattern (mm)
b
c
d
7.0
2.4
1.0
8.0
3.2
1.0
8.0
5.6
1.0
1.6
Solder Resist
(in mm)
• Material: Glass Epoxy Board
• Thickness of Copper Foil: 0.035mm
2. Test Method of Substrate Bending Test
(a) Support State
(b) Test State
Test Substrate B
a
45±2
Test Stand
45±2
Test Substrate B
20
Capacitor
50 min.
LLA
a
3.5
4.5
4.5
Copper Foil
100
LLL
GA3
GF
Part Number
Support Stand (ø5)
(in mm)
Pressure Stick
!Caution
/Notice
GMD
GMA
KR3
KRM
NFM
LLR
LLM
Support Stand
218
c
2.4
3.2
5.6
Solder Resist
b
GA3
GD
GA3
GB
GA2
GQM
GJM
c
GA342
GA352
GA355
Dimension (mm)
b
7.0
8.0
8.0
a
3.5
4.5
4.5
b
GR4
GRJ
GR3
Continued from the preceding page.
Complement of Test Method
a: ±2 gap between support stand center and test stand
(in mm)
b: ±5 gap between support stand center and test stand center
• Material of Test Stand and Pressure Stick
The material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized.
• Pressurizing Speed
The pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value.
Pressure Stick
F
R5
Support Stand
L
C02E.pdf
Nov.27,2017
Mouser Electronics
Authorized Distributor
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GA342D1XGF220JY02L GA342DR7GD102KW02L GA342DR7GD151KW02L GA342QR7GD101KW01L
GA342QR7GD102KW01L GA342QR7GD152KW01L GA342QR7GD681KW01L GA343QR7GD182KW01L
GA352DR7GF102KW01L GA352DR7GF681KW01L GA352QR7GF152KW01L GA352QR7GF471KW01L
GA352QR7GF681KW01L GA355DR7GB103KY02L GA355DR7GB153KY02L GA355DR7GB223KY02L
GA355DR7GF472KW01L GA355X7RGB333KY06L GA355XR7GB333KY06L GA342QR7GD151KW01L
GA355QR7GF222KW01L GA342QR7GD471KW01L GA342D1XGF180JY02L GA342D1XGF390JY02L
GA355QR7GF332KW01L GA342QR7GF151KW01L GA342QR7GD221KW01L GA343QR7GD222KW01L
GA352QR7GF102KW01L GA342D1XGF680JY02L GA342QR7GF101KW01L GA342DR7GF331KW02L
GA343DR7GD472KW01L GA342D1XGF470JY02L GA342DR7GF221KW02L GA342D1XGF150JY02L
GA342D1XGF100JY02L GA342D1XGF560JY02L GA342D1XGF270JY02L GA355QR7GF182KW01L
GA342D1XGF820JY02L GA342QR7GD331KW01L GA342D1XGF120JY02L GA342A1XGD270JW31L
GA342A1XGD330JW31L GA342A1XGD390JW31L GA342A1XGD470JW31L GA342A1XGD560JW31L
GA342A1XGD680JW31L GA342A1XGD820JW31L GA342D1XGD100JY02L GA342D1XGD120JY02L
GA342D1XGD150JY02L GA342D1XGD180JY02L GA342D1XGD220JY02L GA342A1XGF270JW31L
GA342A1XGF390JW31L GA342A1XGF470JW31L GA342A1XGF560JW31L GA342A1XGF680JW31L
GA342A1XGF820JW31L GA342D1XGD330JY02L GA355DR7GB223KW01L GA355ER7GB333KW01L
GA355ER7GB473KW01L GA355XR7GB563KW06L GA342A1XGF330JW31L GA342DR7GF102KW02L
GA342QR7GF471KW01L GA342QR7GF681KW01L GA355QR7GB103KW01L GA355QR7GB153KW01L
GA352QR7GF221KW31L GA352QR7GF331KW31K GA352QR7GF151KW31K GA352QR7GF331KW31L
GA352QR7GF151KW31L GA352QR7GF221KW31K GA352QR7GF101KW31K GA352QR7GF101KW31L
GA355QR7GF222KW01K GA355QR7GF332KW01K GA343DR7GD472KW01K GA355XR7GB563KW06K
GA342A1XGF120JW31L GA342A1XGD220JW31L GA342A1XGF100JW31L GA342A1XGF150JW31L
GA342A1XGF220JW31L GA342A1XGD150JW31L GA342A1XGD100JW31L GA342A1XGD180JW31L
GA342A1XGD120JW31L GA342A1XGF180JW31L
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