LQG15HS1N8B02D

Reference Only Spec No. JELF243B-0010S-01 P.1/11 CHIP COIL (CHIP INDUCTORS) LQG15HS□□□□02D REFERENCE SPECIFICATION 1. Scope This reference specification applies to LQG15HS_02 series, for Chip Coil (Chip Inductors). 2. Part Numbering (ex) LQ G 15 H S 1N0 S 0 2 Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode (L×W) and Characteristics D Packaging D:Taping *B:BULK *Bulk packing (B) also available 3. Rating ・Operating Temperature Range ・Storage Temperature Range Customer Part Number MURATA Part Number LQG15HS1N0B02D LQG15HS1N0C02D LQG15HS1N0S02D LQG15HS1N1B02D LQG15HS1N1C02D LQG15HS1N1S02D LQG15HS1N2B02D LQG15HS1N2C02D LQG15HS1N2S02D LQG15HS1N3B02D LQG15HS1N3C02D LQG15HS1N3S02D LQG15HS1N5B02D LQG15HS1N5C02D LQG15HS1N5S02D LQG15HS1N6B02D LQG15HS1N6C02D LQG15HS1N6S02D LQG15HS1N8B02D LQG15HS1N8C02D LQG15HS1N8S02D LQG15HS2N0B02D LQG15HS2N0C02D LQG15HS2N0S02D LQG15HS2N2B02D LQG15HS2N2C02D LQG15HS2N2S02D LQG15HS2N4B02D LQG15HS2N4C02D LQG15HS2N4S02D LQG15HS2N7B02D LQG15HS2N7C02D LQG15HS2N7S02D LQG15HS3N0B02D LQG15HS3N0C02D LQG15HS3N0S02D LQG15HS3N3B02D LQG15HS3N3C02D LQG15HS3N3S02D LQG15HS3N6B02D LQG15HS3N6C02D LQG15HS3N6S02D –55°C to +125°C –55°C to +125°C Inductance Tolerance (nH) Q (min.) DC Resistance (Ω max. ) 1.0 Self Resonant Frequency (MHz min. ) Rated Current (mA) 10000 1.1 1.2 0.07 1000 0.08 950 1.3 1.5 1.6 1.8 2.0 B:±0.1nH C:±0.2nH S:±0.3nH 8 6000 0.09 900 2.4 0.11 850 2.7 0.12 2.2 800 3.0 0.125 3.3 3.6 MURATA MFG.CO., LTD 0.14 750 Reference Only Spec No. JELF243B-0010S-01 Customer Part Number P.2/11 MURATA Part Number LQG15HS3N9B02D LQG15HS3N9C02D LQG15HS3N9S02D LQG15HS4N3B02D LQG15HS4N3C02D LQG15HS4N3S02D LQG15HS4N7B02D LQG15HS4N7C02D LQG15HS4N7S02D LQG15HS5N1B02D LQG15HS5N1C02D LQG15HS5N1S02D LQG15HS5N6B02D LQG15HS5N6C02D LQG15HS5N6S02D LQG15HS6N2B02D LQG15HS6N2C02D LQG15HS6N2S02D LQG15HS6N8G02D LQG15HS6N8H02D LQG15HS6N8J02D LQG15HS7N5G02D LQG15HS7N5H02D LQG15HS7N5J02D LQG15HS8N2G02D LQG15HS8N2H02D LQG15HS8N2J02D LQG15HS9N1G02D LQG15HS9N1H02D LQG15HS9N1J02D LQG15HS10NG02D LQG15HS10NH02D LQG15HS10NJ02D LQG15HS12NG02D LQG15HS12NH02D LQG15HS12NJ02D LQG15HS15NG02D LQG15HS15NH02D LQG15HS15NJ02D LQG15HS18NG02D LQG15HS18NH02D LQG15HS18NJ02D LQG15HS22NG02D LQG15HS22NH02D LQG15HS22NJ02D LQG15HS27NG02D LQG15HS27NH02D LQG15HS27NJ02D LQG15HS33NG02D LQG15HS33NH02D LQG15HS33NJ02D LQG15HS39NG02D LQG15HS39NH02D LQG15HS39NJ02D Inductance Tolerance (nH) Q (min.) DC Resistance (Ω max. ) Self Resonant Frequency (MHz min. ) Rated Current (mA) 3.9 0.14 4.3 4.7 5.1 750 6000 0.16 B:±0.1nH C:±0.2nH S:±0.3nH 700 5300 0.18 650 5.6 6.2 0.20 4500 600 6.8 0.22 7.5 4200 0.24 8.2 550 3700 8 9.1 0.26 3400 500 10 12 0.28 3000 0.32 2500 450 18 0.36 2200 400 22 0.42 1900 27 0.46 1700 33 0.58 1600 39 0.65 1200 15 G:±2% H:±3% J:±5% MURATA MFG.CO., LTD 350 300 Reference Only Spec No. JELF243B-0010S-01 P.3/11 Customer Part Number MURATA Part Number LQG15HS47NG02D LQG15HS47NH02D LQG15HS47NJ02D LQG15HS56NG02D LQG15HS56NH02D LQG15HS56NJ02D LQG15HS68NG02D LQG15HS68NH02D LQG15HS68NJ02D LQG15HS82NG02D LQG15HS82NH02D LQG15HS82NJ02D LQG15HSR10G02D LQG15HSR10H02D LQG15HSR10J02D LQG15HSR12G02D LQG15HSR12H02D LQG15HSR12J02D LQG15HSR15G02D LQG15HSR15H02D LQG15HSR15J02D LQG15HSR18G02D LQG15HSR18H02D LQG15HSR18J02D LQG15HSR22G02D LQG15HSR22H02D LQG15HSR22J02D LQG15HSR27G02D LQG15HSR27H02D LQG15HSR27J02D DC Resistance (Ω max. ) Self Resonant Frequency (MHz min. ) Rated Current (mA) 47 0.72 1000 300 56 0.82 800 250 68 0.92 800 250 82 1.20 700 Inductance Tolerance (nH) 100 G:±2% H:±3% J:±5% Q (min.) 1.25 8 200 600 120 1.30 150 2.99 550 150 180 3.38 500 220 3.77 450 120 270 4.94 400 110 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Humidity Atmospheric Pressure : 86kPa to 106 kPa 5. Appearance and Dimensions Polarity Marking Electrode 0.5±0.05 1.0±0.05 0.5±0.05 0.5±0.0.5 0.25±0.1 ■Unit Mass (Typical value) 0.001g (in mm) MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0010S-01 P.4/11 6. Electrical Performance No. 6.1 6.2 Item Inductance Q Specification Inductance shall meet item 3. Q shall meet item 3. Test Method Measuring Equipment: KEYSIGHT E4991A or equivalent Measuring Frequency: 100MHz Measuring Condition: Test signal level/ about 0dBm Electrode spaces / 0.5mm Electricallength/ 10mm Weight/about 1N to 5N Measuring Fixture: KEYSIGHT 16197A Position coil under test as shown in below and contact coil with each terminal by adding weight. Polarity marking should be a topside,and polarity marking should be in the direction of the fixture for position of chip coil. Polarity Marking 0.5mm 11.5mm 6.3 6.4 6.5 DC Resistance Self Resonant Frequency (S.R.F) Rated Current DC Resistance shall meet item 3. S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. Measuring Method: the endnote [Electrical Performance:Measuring Method of Inductance/ Q] Measuring Equipment: Digital multi meter Measuring Equipment: KEYSIGHT 8753C or equivalent The rated current is applied. 7. Mechanical Performance No. 7.1 Item Shear Test Specification Chip coil shall not be damaged after tested as test method. Test Method Substrate: Glass-epoxy substrate Land 0.5 (in mm) 0.55 0.4 0.55 Force: 5N Hold Duration: 5s±1s Applied Direction: Parallel to PCB Chip Coil F Substrate 7.2 Bending Test Chip coil shall not be damaged after tested as test method. Substrate: Glass-epoxy substrate (100mm×40mm×0.8mm) Speed of Applying Force: 1mm / s Deflection: 2mm Hold Duration: 30s Pressure jig R340 F Deflection 45 MURATA MFG.CO., LTD 45 Product (in mm) Reference Only Spec No. JELF243B-0010S-01 P.5/11 No. 7.3 Item Vibration Specification Appearance: No damage Inductance Change: within ±10% 7.4 Solderability The wetting area of the electrode shall be at least 90% covered with new solder coating. 7.5 Resistance to Soldering Heat Appearance: No damage Inductance Chang e: within ±10% Test Method Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1 min Total Amplitude: 1.5mm Testing Time: A period of 2 hours in each of 3 mutually perpendicular directions. Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C / 60s to 90s Solder Temperature: 240°C±5°C Immersion Time: 3s±1s Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C / 1 min to 2 min Solder Temperature: 270°C±5°C Immersion Time: 10s±1s Then measured after exposure in the room condition for 24h±2h. 8. Environmental Performance It shall be soldered on the substrate. No. Item Specification 8.1 Humidity Appearance: No damage Inductance Change: within ±10% 8.2 Heat Life 8.3 Humidity Load 8.4 Temperature Cycle Test Method Temperature: 40°C±2°C Humidity: 90%(RH) to 95%(RH) Time: 1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Temperature: 125°C±2°C Current: Rated Current (See the 3.) Time: 1000h (+48h, -0h) Then measured after exposure in the room condition for 24h±2h. Temperature: 40°C±2°C Humidity: 90%(RH) to 95%(RH) Current: Rated Current (See the 3.) Time: 1000h (+48h, -0h) Then measured after exposure in the room condition for 24h±2h. 1 cycle: 1 step: -55°C (+0°C, -3°C) / 30 min±3 min 2 step: Ordinary temp. / 2 min to 3 min 3 step: +125°C (+3°C, -0°C) / 30 min±3 min 4 step: Ordinary temp. / 2 min to 3 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. 9. Specification of Packaging 4.0±0.1 0.1 φ1.5± 0 1.12±0.04 0.62±0.04 Direction of feed MURATA MFG.CO., LTD 8.0±0.2 2.0±0.05 2.0±0.05 3.5±0.05 Polarity marking 1.75±0.1 9.1 Appearance and Dimensions of paper tape (8mm-wide) 0.8max. (in mm) Reference Only Spec No. JELF243B-0010S-01 P.6/11 9.2 Specification of Taping (1) Packing quantity (standard quantity) 10,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Top tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength Top tape Bottom tape 5N min. 9.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 300mm / min 0.1N to 0.6N (minimum value is typical) 165 to 180 degree Top tape F Bottom tape Base tape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. 2.0±0.5 Trailer 160 min. Leader Label 190 min. Empty tape 210 min. Top tape  13.0±0.2 +1  60 -0  21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 +0  180 -3 (in mm) 9.6 Marking for reel Customer part number, MURATA part number, Inspection number (1), RoHS marking (2), Quantity etc ･･･ 1) □□ OOOO  (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2), Quantity, etc ･･･ MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0010S-01 P.7/11 9.8. Specification of Outer Case Label H  D W ・・ Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5 ※ Above Outer Case size is typical. It depends on a quantity of an order. 10. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability (5) Medical equipment requirements to the applications listed in the above 11. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. Please check the mounting condition before using. Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 11.1 Land pattern designing Chip Coil c Land Solder Resist a b c 0.4 1.2 0.5 a (in mm) b 11.2 Flux, Solder ・Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste : 100μm to 150μm. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0010S-01 P.8/11 11.3 Reflow soldering conditions ・Inductance value may be changed a little due to the amount of solder. So, the chip coil shall be soldered by reflow so that the solder volume can be controlled. ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. ・Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C, 90s±30s above 220°C, 30s～60s above 230°C, 60s max. 245°C±3°C 260°C, 10s 2 times 2 times 11.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre-heating Tip temperature Soldering iron output Tip diameter Soldering time Time 150°C, 1 min 350°C max. 80W max. φ3mm max. 3(+1, -0)s 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・Solder shall be used not to be exceed the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable t 1/3T≦t≦T T：thickness of product MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0010S-01 P.9/11 11.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways direction (Length:a＜b) to the mechanical stress. b 〈 Poor example 〉 〈 Good example 〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Perforation Stress Level A > D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommend 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0010S-01 P.10/11 11.8 Resin coating The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 11.9 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.10 Storage and Handing Requirements (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C to 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ・Products should be stored under the airtight packaged condition. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12．! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0010S-01 P.11/11 (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I2 I1 Zm A B C D Test Head Test fixture V1 I1 = Zx V2 V1 A B C D V2 I2 Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. Zm= V1 I1 ， Zx= V2 I2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx=  β= B / D =Zsm-(1-Yom Zsm)Zss 1-ZmΓ Γ= C / A =Yom Zsm:measured impedance of short chip Zss:residual impedance of short chip (0nH) Yom:measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Lx :Inductance of chip coil Im(Zx) Im(Zx) Lx= Qx= 2πf ， Re(Zx) Qx:Q of chip coil f :Measuring frequency MURATA MFG.CO., LTD