Spec No.: JELF243B_9110F-01
P1/13
CHIP COILS (CHIP INDUCTORS) LQG15HZ□□□□02□
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to chip coils (chip inductors) LQG15HZ_02 series for automotive electronics based on
AEC-Q200 except for power trains and safeties.
2. Part Numbering
(Ex.)
LQ
G
15
Product Structure Dimension
ID
(L × W)
H
Z
1N0
S
0
2
Application Category Inductance Tolerance Performance Electrode
and
specification
characteristic
*B: Bulk packing is also available.
D
Packaging
D: taping
*B: bulk
3. Part Number and Rating
Operating temperature range
Storage temperature range
-55°C to +125°C
-55°C to +125°C
Inductance
Customer
Part number
Murata
Part number
Nominal
value
(nH)
Tolerance
Q
(Min.)
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)
ESD
Rank
1C:1kV
LQG15HZ1N0B02D
1.0
B: ±0.1 nH
8
0.07
10000
1000
1C
LQG15HZ1N0C02D
1.0
C: ±0.2 nH
8
0.07
10000
1000
1C
LQG15HZ1N0S02D
1.0
S: ±0.3 nH
8
0.07
10000
1000
1C
LQG15HZ1N1B02D
1.1
B: ±0.1 nH
8
0.07
6000
1000
1C
LQG15HZ1N1C02D
1.1
C: ±0.2 nH
8
0.07
6000
1000
1C
LQG15HZ1N1S02D
1.1
S: ±0.3 nH
8
0.07
6000
1000
1C
LQG15HZ1N2B02D
1.2
B: ±0.1 nH
8
0.07
6000
1000
1C
LQG15HZ1N2C02D
1.2
C: ±0.2 nH
8
0.07
6000
1000
1C
LQG15HZ1N2S02D
1.2
S: ±0.3 nH
8
0.07
6000
1000
1C
LQG15HZ1N3B02D
1.3
B: ±0.1 nH
8
0.07
6000
1000
1C
LQG15HZ1N3C02D
1.3
C: ±0.2 nH
8
0.07
6000
1000
1C
LQG15HZ1N3S02D
1.3
S: ±0.3 nH
8
0.07
6000
1000
1C
LQG15HZ1N5B02D
1.5
B: ±0.1 nH
8
0.07
6000
1000
1C
LQG15HZ1N5C02D
1.5
C: ±0.2 nH
8
0.07
6000
1000
1C
LQG15HZ1N5S02D
1.5
S: ±0.3 nH
8
0.07
6000
1000
1C
LQG15HZ1N6B02D
1.6
B: ±0.1 nH
8
0.07
6000
1000
1C
LQG15HZ1N6C02D
1.6
C: ±0.2 nH
8
0.07
6000
1000
1C
LQG15HZ1N6S02D
1.6
S: ±0.3 nH
8
0.07
6000
1000
1C
LQG15HZ1N8B02D
1.8
B: ±0.1 nH
8
0.08
6000
950
1C
LQG15HZ1N8C02D
1.8
C: ±0.2 nH
8
0.08
6000
950
1C
LQG15HZ1N8S02D
1.8
S: ±0.3 nH
8
0.08
6000
950
1C
LQG15HZ2N0B02D
2.0
B: ±0.1 nH
8
0.09
6000
900
1C
LQG15HZ2N0C02D
2.0
C: ±0.2 nH
8
0.09
6000
900
1C
LQG15HZ2N0S02D
2.0
S: ±0.3 nH
8
0.09
6000
900
1C
LQG15HZ2N2B02D
2.2
B: ±0.1 nH
8
0.09
6000
900
1C
LQG15HZ2N2C02D
2.2
C: ±0.2 nH
8
0.09
6000
900
1C
LQG15HZ2N2S02D
2.2
S: ±0.3 nH
8
0.09
6000
900
1C
LQG15HZ2N4B02D
2.4
B: ±0.1 nH
8
0.11
6000
850
1C
LQG15HZ2N4C02D
2.4
C: ±0.2 nH
8
0.11
6000
850
1C
MURATA MFG CO., LTD
Spec No.: JELF243B_9110F-01
P2/13
Inductance
Customer
Part number
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)
ESD
Rank
1C:1kV
8
0.11
6000
850
1C
8
0.12
6000
800
1C
Murata
Part number
Nominal
value
(nH)
Tolerance
Q
(Min.)
LQG15HZ2N4S02D
2.4
S: ±0.3 nH
LQG15HZ2N7B02D
2.7
B: ±0.1 nH
LQG15HZ2N7C02D
2.7
C: ±0.2 nH
8
0.12
6000
800
1C
LQG15HZ2N7S02D
2.7
S: ±0.3 nH
8
0.12
6000
800
1C
LQG15HZ3N0B02D
3.0
B: ±0.1 nH
8
0.125
6000
800
1C
LQG15HZ3N0C02D
3.0
C: ±0.2 nH
8
0.125
6000
800
1C
LQG15HZ3N0S02D
3.0
S: ±0.3 nH
8
0.125
6000
800
1C
LQG15HZ3N3B02D
3.3
B: ±0.1 nH
8
0.125
6000
800
1C
LQG15HZ3N3C02D
3.3
C: ±0.2 nH
8
0.125
6000
800
1C
LQG15HZ3N3S02D
3.3
S: ±0.3 nH
8
0.125
6000
800
1C
LQG15HZ3N6B02D
3.6
B: ±0.1 nH
8
0.14
6000
750
1C
LQG15HZ3N6C02D
3.6
C: ±0.2 nH
8
0.14
6000
750
1C
LQG15HZ3N6S02D
3.6
S: ±0.3 nH
8
0.14
6000
750
1C
LQG15HZ3N9B02D
3.9
B: ±0.1 nH
8
0.14
6000
750
1C
LQG15HZ3N9C02D
3.9
C: ±0.2 nH
8
0.14
6000
750
1C
LQG15HZ3N9S02D
3.9
S: ±0.3 nH
8
0.14
6000
750
1C
LQG15HZ4N3B02D
4.3
B: ±0.1 nH
8
0.14
6000
750
1C
LQG15HZ4N3C02D
4.3
C: ±0.2 nH
8
0.14
6000
750
1C
LQG15HZ4N3S02D
4.3
S: ±0.3 nH
8
0.14
6000
750
1C
LQG15HZ4N7B02D
4.7
B: ±0.1 nH
8
0.16
6000
700
1C
LQG15HZ4N7C02D
4.7
C: ±0.2 nH
8
0.16
6000
700
1C
LQG15HZ4N7S02D
4.7
S: ±0.3 nH
8
0.16
6000
700
1C
LQG15HZ5N1B02D
5.1
B: ±0.1 nH
8
0.18
5300
650
1C
LQG15HZ5N1C02D
5.1
C: ±0.2 nH
8
0.18
5300
650
1C
LQG15HZ5N1S02D
5.1
S: ±0.3 nH
8
0.18
5300
650
1C
LQG15HZ5N6B02D
5.6
B: ±0.1 nH
8
0.18
4500
650
1C
LQG15HZ5N6C02D
5.6
C: ±0.2 nH
8
0.18
4500
650
1C
LQG15HZ5N6S02D
5.6
S: ±0.3 nH
8
0.18
4500
650
1C
LQG15HZ6N2B02D
6.2
B: ±0.1 nH
8
0.20
4500
600
1C
LQG15HZ6N2C02D
6.2
C: ±0.2 nH
8
0.20
4500
600
1C
LQG15HZ6N2S02D
6.2
S: ±0.3 nH
8
0.20
4500
600
1C
LQG15HZ6N8G02D
6.8
G: ±2%
8
0.22
4500
600
1C
LQG15HZ6N8H02D
6.8
H: ±3%
8
0.22
4500
600
1C
LQG15HZ6N8J02D
6.8
J: ±5%
8
0.22
4500
600
1C
LQG15HZ7N5G02D
7.5
G: ±2%
8
0.24
4200
550
1C
LQG15HZ7N5H02D
7.5
H: ±3%
8
0.24
4200
550
1C
LQG15HZ7N5J02D
7.5
J: ±5%
8
0.24
4200
550
1C
LQG15HZ8N2G02D
8.2
G: ±2%
8
0.24
3700
550
1C
LQG15HZ8N2H02D
8.2
H: ±3%
8
0.24
3700
550
1C
LQG15HZ8N2J02D
8.2
J: ±5%
8
0.24
3700
550
1C
LQG15HZ9N1G02D
9.1
G: ±2%
8
0.26
3400
500
1C
LQG15HZ9N1H02D
9.1
H: ±3%
8
0.26
3400
500
1C
LQG15HZ9N1J02D
9.1
J: ±5%
8
0.26
3400
500
1C
LQG15HZ10NG02D
10
G: ±2%
8
0.26
3400
500
1C
LQG15HZ10NH02D
10
H: ±3%
8
0.26
3400
500
1C
MURATA MFG CO., LTD
Spec No.: JELF243B_9110F-01
P3/13
Inductance
Customer
Part number
Murata
Part number
Nominal
value
(nH)
Tolerance
Q
(Min.)
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)
ESD
Rank
1C:1kV
LQG15HZ10NJ02D
10
J: ±5%
8
0.26
3400
500
1C
LQG15HZ12NG02D
12
G: ±2%
8
0.28
3000
500
1C
LQG15HZ12NH02D
12
H: ±3%
8
0.28
3000
500
1C
LQG15HZ12NJ02D
12
J: ±5%
8
0.28
3000
500
1C
LQG15HZ15NG02D
15
G: ±2%
8
0.32
2500
450
1C
LQG15HZ15NH02D
15
H: ±3%
8
0.32
2500
450
1C
LQG15HZ15NJ02D
15
J: ±5%
8
0.32
2500
450
1C
LQG15HZ18NG02D
18
G: ±2%
8
0.36
2200
400
1C
LQG15HZ18NH02D
18
H: ±3%
8
0.36
2200
400
1C
LQG15HZ18NJ02D
18
J: ±5%
8
0.36
2200
400
1C
LQG15HZ22NG02D
22
G: ±2%
8
0.42
1900
350
1C
LQG15HZ22NH02D
22
H: ±3%
8
0.42
1900
350
1C
LQG15HZ22NJ02D
22
J: ±5%
8
0.42
1900
350
1C
LQG15HZ27NG02D
27
G: ±2%
8
0.46
1700
350
1C
LQG15HZ27NH02D
27
H: ±3%
8
0.46
1700
350
1C
LQG15HZ27NJ02D
27
J: ±5%
8
0.46
1700
350
1C
LQG15HZ33NG02D
33
G: ±2%
8
0.58
1600
350
1C
LQG15HZ33NH02D
33
H: ±3%
8
0.58
1600
350
1C
LQG15HZ33NJ02D
33
J: ±5%
8
0.58
1600
350
1C
LQG15HZ39NG02D
39
G: ±2%
8
0.65
1200
300
1C
LQG15HZ39NH02D
39
H: ±3%
8
0.65
1200
300
1C
LQG15HZ39NJ02D
39
J: ±5%
8
0.65
1200
300
1C
LQG15HZ47NG02D
47
G: ±2%
8
0.72
1000
300
1C
LQG15HZ47NH02D
47
H: ±3%
8
0.72
1000
300
1C
LQG15HZ47NJ02D
47
J: ±5%
8
0.72
1000
300
1C
LQG15HZ56NG02D
56
G: ±2%
8
0.82
800
250
1C
LQG15HZ56NH02D
56
H: ±3%
8
0.82
800
250
1C
LQG15HZ56NJ02D
56
J: ±5%
8
0.82
800
250
1C
LQG15HZ68NG02D
68
G: ±2%
8
0.92
800
250
1C
LQG15HZ68NH02D
68
H: ±3%
8
0.92
800
250
1C
LQG15HZ68NJ02D
68
J: ±5%
8
0.92
800
250
1C
LQG15HZ82NG02D
82
G: ±2%
8
1.20
700
200
1C
LQG15HZ82NH02D
82
H: ±3%
8
1.20
700
200
1C
LQG15HZ82NJ02D
82
J: ±5%
8
1.20
700
200
1C
LQG15HZR10G02D
100
G: ±2%
8
1.25
600
200
1C
LQG15HZR10H02D
100
H: ±3%
8
1.25
600
200
1C
LQG15HZR10J02D
100
J: ±5%
8
1.25
600
200
1C
LQG15HZR12G02D
120
G: ±2%
8
1.30
600
200
1C
LQG15HZR12H02D
120
H: ±3%
8
1.30
600
200
1C
LQG15HZR12J02D
120
J: ±5%
8
1.30
600
200
1C
LQG15HZR15G02D
150
G: ±2%
8
2.99
550
150
1C
LQG15HZR15H02D
150
H: ±3%
8
2.99
550
150
1C
LQG15HZR15J02D
150
J: ±5%
8
2.99
550
150
1C
LQG15HZR18G02D
180
G: ±2%
8
3.38
500
150
1C
LQG15HZR18H02D
180
H: ±3%
8
3.38
500
150
1C
MURATA MFG CO., LTD
Spec No.: JELF243B_9110F-01
P4/13
Inductance
Customer
Part number
Tolerance
Q
(Min.)
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)
ESD
Rank
1C:1kV
180
J: ±5%
8
3.38
500
150
1C
220
G: ±2%
8
3.77
450
120
1C
LQG15HZR22H02D
220
H: ±3%
8
3.77
450
120
1C
LQG15HZR22J02D
220
J: ±5%
8
3.77
450
120
1C
LQG15HZR27G02D
270
G: ±2%
8
4.94
400
110
1C
LQG15HZR27H02D
270
H: ±3%
8
4.94
400
110
1C
LQG15HZR27J02D
270
J: ±5%
8
4.94
400
110
1C
Murata
Part number
Nominal
value
(nH)
LQG15HZR18J02D
LQG15HZR22G02D
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Appearance and Dimensions
Unit mass (typical value): 0.001 g
6. Marking
MURATA MFG CO., LTD
Spec No.: JELF243B_9110F-01
P5/13
7. Electrical Performance
No.
Item
7.1 Inductance
7.2 Q
7.3 DC resistance
7.4 Self-resonant
frequency
7.5 Rated current
Specification
Meet chapter 3 ratings.
Meet chapter 3 ratings.
Meet chapter 3 ratings.
Meet chapter 3 ratings.
Product temperature rise: 25°C max.
Test method
Measuring equipment: Keysight E4991A or the
equivalent
Measuring frequency: 100 MHz
Measuring conditions:
Measurement signal level: Approx. 0 dBm
Measurement terminal distance: 0.5 mm
Electrical length: 10 mm
Weight: Approx. 1 N to 5 N
Measuring fixture: Keysight 16197A
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
Measuring method: see "Electrical performance:
Measuring method for inductance/Q" in the Appendix.
Measuring equipment: digital multimeter
Measuring equipment: Keysight 8753C or the
equivalent
Apply the rated current specified in chapter 3.
8. AEC-Q200 Requirement
8.1 Performance [based on table 5 for magnetics (inductors/transformer) AEC-Q200 Rev. D issued June 1,
2010]
AEC-Q200
No.
3
Stress
High
temperature
exposure
Murata specification/deviation
Test method
1000 h at 125°C
Set for 24 h at room condition, then
measured.
Meet table A after testing.
Table A
Appearance
Inductance change rate (at 100 MHz)
4
Temperature
cycling
1000 cycles
-40°C to +125°C
Set for 24 h at room condition, then
measured.
7
Biased humidity 1000 h at 85°C, 85% (RH). Unpowered.
Set for 24 h at room condition, then
measured.
Meet table A after testing.
8
Operational life
Apply 125°C 1000 h
Set for 24 h at room condition, then
measured.
Meet table A after testing.
Meet table A after testing.
9
External visual
Visual inspection
No abnormalities
10
Physical
dimension
Meet chapter 5, "Appearance and
Dimensions".
No defects
12
Resistance to
solvents
Per MIL-STD-202
Method 215
Not applicable
MURATA MFG CO., LTD
No damage
Within ±10%
Spec No.: JELF243B_9110F-01
P6/13
AEC-Q200
Murata specification/deviation
No.
Stress
Test method
13
Mechanical
shock
Per MIL-STD-202
Method 213
Condition C:
100 g’s (0.98 N), 6 ms, half sine, 12.3
ft/s
Meet table A after testing.
14
Vibration
5 g's (0.049 N) for 20 min, 12 cycles
each of 3 orientations
Test from 10 Hz to 2000 Hz
Meet table A after testing.
15
Resistance to
soldering heat
No-heating
Solder temperature
260°C±5°C
Immersion time 10 s
Pre-heating: 150°C±10°C, 60 s to 90 s
Meet table A after testing.
17
ESD
Per AEC-Q200-002
ESD rank: Refer to chapter 3 ratings.
Meet table A after testing.
18
Solderbility
Per J-STD-002
Method b: not applicable
90% of the terminations is to be soldered.
19
Electrical
Measured: inductance
characterization
20
Flammability
Per UL-94
Not applicable
21
Board flex
Epoxy-PCB (1.6 mm)
Deflection 2 mm (min.)
Holding time 60 s
Meet table B after testing.
Table B
Appearance
No defects
DC resistance change rate
22
Terminal
strength
Per AEC-Q200-006
A force of 17.7 N for 60 s
No damage
Within ±10%
Murata deviation request: 5 N
No defects
9. Specification of Packaging
9.1 Appearance and dimensions of tape (8 mm width/paper tape)
A
0.62±0.04
B
1.12±0.04
t
0.8 max.
(in mm)
MURATA MFG CO., LTD
Spec No.: JELF243B_9110F-01
P7/13
9.2 Taping specifications
Packing quantity
(Standard quantity)
10000 pcs/reel
Packing method
The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom
tape when the cavities of the carrier tape are punched type).
Feed hole position
The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
Joint
The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are
seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Break down force of tape
Cover tape (or top tape)
5 N min.
Bottom tape (only when the cavities of the carrier tape are punched
type)
5 N min.
9.4 Peeling off force of tape
Speed of peeling off
Peeling off force
300 mm/min
0.1 N to 0.6 N (The lower limit is for typical value.)
9.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
9.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
○○○○
(2) Date
First digit: year/last digit of year
(1)
(2)
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHSY
()
(2) Murata classification number
(1)
(2)
MURATA MFG CO., LTD
Spec No.: JELF243B_9110F-01
P8/13
9.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
9.8 Specification of outer box
Dimensions of outer box
(mm)
Label
H
D
H
186
93
5
* Above outer box size is typical. It depends on a
quantity of an order.
D
W
10.
W
186
Standard reel quantity
in outer box (reel)
Caution
10.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea
(4) Power plant
equipment
control equipment
(5) Medical equipment
(6) Transportation equipment (7) Traffic signal
(8) Disaster/crime
(trains, ships, etc.)
equipment
prevention
equipment
(9) Data-processing
(10) Applications of similar complexity and/or
equipment
reliability requirements to the applications listed in
the above
10.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
10.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
10.4 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the
abnormal function or the failure of our product.
11. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
11.1. Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering:
a
0.4
b
1.2
c
0.5
(in mm)
MURATA MFG CO., LTD
Spec No.: JELF243B_9110F-01
P9/13
11.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
11.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
150°C to 180°C/90 s±30 s
Heating
Above 220°C/30 s to 60 s
Above 230°C/60 s max.
245°C±3°C
260°C/10 s
2 times
2 times
Peak temperature
Number of reflow cycles
11.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
Pre-heating
150°C/approx. 1 min
Tip temperature of soldering iron
350°C max.
Power consumption of soldering iron
80 W max.
Tip diameter of soldering iron
Soldering time
Number of reworking operations
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal
shock.
MURATA MFG CO., LTD
Spec No.: JELF243B_9110F-01
P10/13
11.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
11.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
〈 Poor example〉
〈 Good example〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D*1
(2) Add slits in the board separation part.
A>B
(3) Keep the mounting position of the component away from the
board separation surface.
A>C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
MURATA MFG CO., LTD
Spec No.: JELF243B_9110F-01
P11/13
11.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item
Requirement
Power
Time
20 W/L max.
5 min max.
Frequency
28 kHz to 40 kHz
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
11.9 Storage and transportation
Storage period
Use the product within 6 months after delivery.
If you do not use the product for more than 6 months, check solderability before using it.
Storage conditions
• The products shall be stored in a room not subject to rapid changes in temperature and
humidity. The recommended temperature range is -10°C to +40°C. The recommended relative
humidity range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the
poor solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
11.10 Resin coating (including moisture-proof coating)
When the product is coated/molded with resin, its electrical characteristics may change.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc.
Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading
to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
11.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,
misalignment, or damage to the product.
MURATA MFG CO., LTD
Spec No.: JELF243B_9110F-01
P12/13
11.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
11.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,
resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that
the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating
temperature for the product.
12． !
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD
Spec No.: JELF243B_9110F-01
P13/13
Appendix
Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is
included in the rating table.)
Perform measurement using the method described below. (Perform correction for the error deriving from the measuring
terminal.)
(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole
terminal as shown in the figure below.
(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using
the respective current and voltage for input/output.
Zm=
V1
I1
Zx=
V2
I2
(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.
Zx=α
Zm-β
1-ZmΓ
Here,
α = D/A = 1
β = B/D = Zsm - (1 - Yom Zsm) Zss
Γ = C/A = Yom
Zsm: measured impedance of short chip
Zss: residual impedance of short chip (0 nH)
Yom: measured admittance when measuring
terminal is open
(4) Calculate inductance Lx and Qx using the equations shown below.
Im(Zx)
Lx: inductance of chip coil
Lx=
2πf
Qx: Q of chip coil
Im(Zx)
Qx=
f: measuring frequency
Re(Zx)
MURATA MFG CO., LTD
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