LQH32NH5R6J23L

SpecNo.JELF243A-9146E-01 Reference Only P1/9 CHIP COIL（CHIP INDUCTORS）LQH32NH□□□□23L Murata Standard Reference Specification【AEC-Q200】 1. Scope This reference specification applies to Wire Wound Chip Coil (Chip Inductors) LQH32NH Series for Automotive Electronics based on AEC-Q200. 2. Part Numbering (ex) LQ H 32 N H 1R0 M 2 3 L Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and L:Taping Characteristics 3. Rating -40 to +125°C -40 to +125°C ・Operating Temperature Range. ・Storage Temperature Range. Customer’s Part Number MURATA Part Number Inductance Q (min.) DC Resistance Tolerance (%) Self Resonant Frequency (MHz min.) Rated Current (mA) (H) Tolerance (%) LQH32NH1R0M23L 1.0 M:±20 0.06 100 780 LQH32NH1R2J23L 1.2 0.07 90 720 LQH32NH1R5J23L 1.5 0.08 85 675 LQH32NH1R8J23L 1.8 0.09 80 635 LQH32NH2R2J23L 2.2 0.097 75 610 LQH32NH2R7J23L 2.7 0.15 70 495 LQH32NH3R3J23L 3.3 0.20 65 425 LQH32NH3R9J23L 3.9 0.14 60 510 LQH32NH4R7J23L 4.7 0.21 55 420 LQH32NH5R6J23L 5.6 0.32 50 335 LQH32NH6R8J23L 6.8 0.36 45 315 LQH32NH8R2J23L 8.2 0.40 40 300 LQH32NH100J23L 10 0.34 35 325 30 25 () LQH32NH120J23L 12 0.50 LQH32NH150J23L 15 0.50 LQH32NH180J23L 18 LQH32NH220J23L 22 LQH32NH270J23L 27 LQH32NH330J23L 33 1.14 LQH32NH390J23L 39 1.27 16 170 LQH32NH470J23L 47 1.46 15 155 LQH32NH560J23L 56 2.00 13 130 LQH32NH680J23L 68 2.25 12 125 3.25 11 100 35 0.64 0.74 J:± 5 25 1.00 ± 20 82 LQH32NH101J23L 100 3.65 LQH32NH121J23L 120 4.20 LQH32NH151J23L 150 4.85 8.0 LQH32NH181J23L 180 7.60 6.0 LQH32NH221J23L 220 8.45 5.5 LQH32NH271J23L 270 9.70 LQH32NH331J23L 330 LQH32NH391J23L 390 11.0 50 12.4 LQH32NH471J23L 470 14.1 LQH32NH561J23L 560 14.6 MURATA MFG.CO., LTD 235 190 175 LQH32NH820J23L 40 270 220 20 10 95 85 80 60 55 5.0 4.0 ESD 5A : 8kV 50 45 40 5A Reference Only SpecNo.JELF243A-9146E-01 P2/9 4. Testing Conditions 《Unless otherwise specified》 Temperature : Ordinary Temperature (15 to 35°C) : Ordinary Humidity (25 to 85 %(RH)) Humidity 《In case of doubt》 Temperature Humidity Atmospheric Pressure : 20 ± 2°C : 60 to 70 %(RH) : 86 to 106 kPa 5. Appearance and Dimensions (No marking) No Marking. (in mm) ■Unit Mass (Typical value) 0.060 g 6. Electrical Performance No. 6.1 Item Inductance 6.2 Q 6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment：Digital multi meter 6.3 Self Resonant Frequency(S.R.F) Rated Current S.R.F shall meet item 3. Measuring Equipment：KEYSIGHT E4991A or equivalent Self temperaturer rise shall be limited to 20°C max. Inductance Change：within ± 10% The rated current is applied. 6.4 Specification Inductance shall meet item 3. Test Method Measuring Equipment：KEYSIGHT 4192A or equivalent Measuring Frequency：1MHz / 1.0 to 390μH 1kHz / 470 to 560μH Measuring Equipment：KEYSIGHT 4192A or equivalent Measuring Frequency：1MHz / 1.0 to 82μH 796kHz / 100 to 560μH 7. AEC-Q200 Requirement 7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 No Stress 3 High Temperature Exposure Murata Specification / Deviation Test Method 1000hours at 125 deg C Meet Table A after testing. Set for 24hours at room temperature, Table A then measured. Appearance No damage Inductance change 4 Temperature Cycling 1000cycles -40 deg C to + 125deg C Set for 24hours at room temperature,then measured. Meet Table A after testing. MURATA MFG.CO., LTD Within ±5% SpecNo.JELF243A-9146E-01 Reference Only AEC-Q200 P3/9 Murata Specification / Deviation No Stress 7 Biased Humidity Test Method 1000hours at 85 deg C, 85%RH unpowered.. 8 Operational Life Apply 125 deg C 1000 hours Meet Table A after testing. Set for 24hours at room temperature, then measured 9 External Visual Visual inspection 10 Physical Dimension Meet ITEM 5 (Style and Dimensions) No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 100g’s/6ms/Half sine Meet Table A after testing. 14 Vibration 5g's for 20 minutes, 12cycles eah of 3 orientations Test from 10-2000Hz. 12cycles each of 3 orientations Meet Table A after testing. 15 Resistance to Soldering Heat No-heating Solder temperature 260C+/-5 deg C Immersion time 10s Meet Table A after testing. 17 ESD Per AEC-Q200-002 ESD Rank: Refer to Item 3. Rating. No defects 18 Solderbility Per J-STD-002 Method B : Not Applicable 95% of the terminations is to be soldered. (Except exposed wire) 19 Electrical Characterization Measured : Inductance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding time Murata deviation request: 5s 22 Terminal Strength Meet Table A after testing. No abnormalities Per AEC-Q200-006 A force of 17.7N for 60s Meet Table B after testing. Table B Appearance No damage DC resistance change Within ±10% No defects MURATA MFG.CO., LTD SpecNo.JELF243A-9146E-01 Reference Only P4/9 8. Specification of Packaging 3.5±0.05 3.6±0.2 4.0±0.1 2.9±0.2 ( 0.2 ) ※The packing directions of the chip coil in taping are unified with the in/out positions of the lead wire. 8.0±0.2 ※ Lead- in/out wire +0.1  1.5 -0 1.75±0.1 8.1 Appearance and Dimensions of plastic tape 4.0±0.1 2.0±0.05 Direction of feed 2.1±0.1 (in mm) Dimension of the Cavity is measured at the bottom side. 8.2 Specification of Taping (1) Packing quantity (standard quantity) 2,000 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8.3 Pull Strength Embossed carrier tape 10N min. Cover tape 5N min. 8.4 Peeling off force of cover tape Speed of Peeling off 300mm/min Peeling off force 0.2 to 0.7N (minimum value is typical) 165 to 180 degree F Cover tape Plastic tape 8.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows. MURATA MFG.CO., LTD SpecNo.JELF243A-9146E-01 Reference Only P5/9 8.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･ 1) (1) Factory Code (2) Date □□ OOOO  (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 8.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) , Quantity, etc ･･･ 8.8 Specification of Outer Case Outer Case Dimensions (mm) Label H D W D H Standard Reel Quantity in Outer Case (Reel) 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order. W 9. Caution 9.1 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 9.2 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 9.3 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 9.4 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. MURATA MFG.CO., LTD Reference Only SpecNo.JELF243A-9146E-01 P6/9 10. Notice This product is designed for solder mounting. (Reflow soldering only) Please consult us in advance for applying other mounting method such as conductive adhesive. 10.1 Land pattern designing (Reflow Soldering) Recommended land pattern for reflow soldering is as follows: It has been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. Reflow Soldering 1.0 2.0 Solder Resist 5.5 Chip Coil Land 1.0 1.3 (in mm) 1.0 10.2 Flux, Solder Flux Solder ・Use rosin-based flux. ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder ・Standard thickness of solder paste : 100μm to 150μm Other flux (except above) Please contact us for details, then use. 10.3 Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard Profile Pre-heating Heating Peak temperature Cycle of reflow Limit Profile 150～180°C 、90s±30s above 220°C、30s～60s above 230°C、60s max. 245±3°C 260°C,10s 2 times 2time MURATA MFG.CO., LTD Reference Only SpecNo.JELF243A-9146E-01 P7/9 10.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3 (+1,-0)s Times 2 times Note：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 10.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable T t 1/3T≦t≦T (T: Lower flange thickness) 10.6 Product's location The following shall be considered when designing and laying out P.C.B.’s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ Products shall be located in the sideways direction to the mechanical stress. Electrode (Poor example) Electrode (Good example) (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the A > D*1 board separation surface. (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the A>C board separation surface. *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Electrode Perforation A C B Slit D Electrode MURATA MFG.CO., LTD SpecNo.JELF243A-9146E-01 Reference Only P8/9 (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Alternative cleaner ・Isopropyl alcohol (IPA) 2. Aqueous agent ・PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 10.8 Attention regarding product's heat generation Please pay special attention to the product’s heat generation such as beyond Operating Temperature range, mounting product in close proximity to other products that radiate heat and beyond the rated current. 10.9 Resin coating (moistureproof coating) Do not make any resin coating. The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. 10.10 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 10.11 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO., LTD SpecNo.JELF243A-9146E-01 Reference Only P9/9 10.12 Storage and Handling Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature : -10 ~ 40°C Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD