LQP03TG68NJ02D

Reference Only Spec No. JELF243C-0016H-01 CHIP COIL (CHIP INDUCTORS) LQP03TG□□□□02D P.1/12 Reference Specification 1.Scope This reference specification applies to LQP03TG_02 series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ P 03 T G Product ID Structure Dimension Applications Category (L×W) and Characteristics 0N1 B Inductance Tolerance 0 2 Features Electrode D Packaging D:Taping *B:Bulk *Bulk packing also available. (A product is put in the plastic bag under the taping conditions.) 3.Rating ・Operating Temperature Range. –55°C to +125°C (Ambient temperature: Rated current can be handled in this temperature range.) ・Storage Temperature Range. –55°C to +125°C Customer Part Number Inductance MURATA Part Number LQP03TG0N1B02D LQP03TG0N2B02D LQP03TG0N2C02D LQP03TG0N3B02D LQP03TG0N3C02D LQP03TG0N4B02D LQP03TG0N4C02D LQP03TG0N5B02D LQP03TG0N5C02D LQP03TG0N6B02D LQP03TG0N6C02D LQP03TG0N7B02D LQP03TG0N7C02D LQP03TG0N8B02D LQP03TG0N8C02D LQP03TG0N9B02D LQP03TG0N9C02D LQP03TG1N0B02D LQP03TG1N0C02D LQP03TG1N1B02D LQP03TG1N1C02D LQP03TG1N2B02D LQP03TG1N2C02D LQP03TG1N3B02D LQP03TG1N3C02D LQP03TG1N4B02D LQP03TG1N4C02D LQP03TG1N5B02D LQP03TG1N5C02D LQP03TG1N6B02D LQP03TG1N6C02D LQP03TG1N7B02D LQP03TG1N7C02D LQP03TG1N8B02D LQP03TG1N8C02D LQP03TG1N9B02D LQP03TG1N9C02D (nH) Tolerance 0.1 B:±0.1nH Q (min) DC Resistance (Ω max) Self Resonant Frequency (MHz) Min. *Typ. Rated Current (mA) 0.07 20000 0.2 - 0.3 0.4 850 0.08 0.5 11 0.6 18000 20000 0.7 0.10 750 0.12 700 0.8 12 0.9 1.0 1.1 B:±0.1nH C:±0.2nH 17000 1.2 18100 15000 0.15 1.3 1.4 1.5 18200 14000 17800 13500 16400 13000 16100 600 13 1.6 1.7 16400 0.20 1.9 MURATA MFG.CO., LTD 500 12500 1.8 0.25 15000 15900 450 Spec No. JELF243C-0016H-01 Customer Part Number Reference Only Inductance MURATA Part Number (nH) LQP03TG2N0B02D LQP03TG2N0C02D LQP03TG2N1B02D LQP03TG2N1C02D LQP03TG2N2B02D LQP03TG2N2C02D LQP03TG2N3B02D LQP03TG2N3C02D LQP03TG2N4B02D LQP03TG2N4C02D LQP03TG2N5B02D LQP03TG2N5C02D LQP03TG2N6B02D LQP03TG2N6C02D LQP03TG2N7B02D LQP03TG2N7C02D LQP03TG2N8B02D LQP03TG2N8C02D LQP03TG2N9B02D LQP03TG2N9C02D LQP03TG3N0B02D LQP03TG3N0C02D LQP03TG3N1B02D LQP03TG3N1C02D LQP03TG3N2B02D LQP03TG3N2C02D LQP03TG3N3B02D LQP03TG3N3C02D LQP03TG3N4B02D LQP03TG3N4C02D LQP03TG3N5B02D LQP03TG3N5C02D LQP03TG3N6B02D LQP03TG3N6C02D LQP03TG3N7B02D LQP03TG3N7C02D LQP03TG3N8B02D LQP03TG3N8C02D LQP03TG3N9B02D LQP03TG3N9C02D LQP03TG4N3H02D LQP03TG4N3J02D LQP03TG4N7H02D LQP03TG4N7J02D LQP03TG5N1H02D LQP03TG5N1J02D LQP03TG5N6H02D LQP03TG5N6J02D LQP03TG6N2H02D LQP03TG6N2J02D LQP03TG6N8H02D LQP03TG6N8J02D LQP03TG7N5H02D LQP03TG7N5J02D Tolerance Q (min) DC Resistance (Ω max) 2.0 P.2/12 Self Resonant Frequency (MHz) Min. *Typ. Rated Current (mA) 12500 14800 2.1 12000 2.2 14300 2.3 11500 14100 2.4 11000 13700 0.25 2.5 13800 11000 2.6 2.7 450 13900 13100 2.8 12200 2.9 3.0 B:±0.1nH C:±0.2nH 11500 13 9500 3.1 11800 0.32 3.2 11600 3.3 11200 3.4 10300 3.5 8000 3.6 400 10000 9400 0.35 350 3.7 7000 8600 3.8 3.9 8100 4.3 0.58 8000 300 6500 4.7 0.72 7800 250 5.1 5.6 H:±3％ J:±5％ 0.88 6.2 7400 1.15 6.8 7.5 MURATA MFG.CO., LTD 7500 6000 12 1.22 5400 6300 4800 5600 200 Spec No. JELF243C-0016H-01 Customer Part Number Reference Only Inductance MURATA Part Number (nH) LQP03TG8N2H02D LQP03TG8N2J02D LQP03TG9N1H02D LQP03TG9N1J02D LQP03TG10NH02D LQP03TG10NJ02D LQP03TG11NH02D LQP03TG11NJ02D LQP03TG12NH02D LQP03TG12NJ02D LQP03TG13NH02D LQP03TG13NJ02D LQP03TG15NH02D LQP03TG15NJ02D LQP03TG16NH02D LQP03TG16NJ02D LQP03TG18NH02D LQP03TG18NJ02D LQP03TG20NH02D LQP03TG20NJ02D LQP03TG22NH02D LQP03TG22NJ02D LQP03TG24NH02D LQP03TG24NJ02D LQP03TG27NH02D LQP03TG27NJ02D LQP03TG33NJ02D LQP03TG39NJ02D LQP03TG47NJ02D LQP03TG56NJ02D LQP03TG68NJ02D LQP03TG82NJ02D LQP03TGR10J02D LQP03TGR12J02D ＊Typical value is actual performance. Tolerance Q (min) DC Resistance (Ω max) 12 8.2 P.3/12 Self Resonant Frequency (MHz) Min. *Typ. 4800 6200 1.40 200 9.1 4500 5200 10 1.52 11 1.65 4100 4700 12 1.78 3700 4400 1.82 3400 3800 11 13 15 190 180 170 H:±3％ J:±5％ 1.90 3100 3600 16 2.03 2900 3300 18 2.28 2800 3200 2.57 2600 2900 22 2.85 2500 2900 24 3.17 2000 2400 27 3.65 1700 2200 4.25 4.60 5.20 5.60 6.25 7.15 8.05 8.75 1600 1500 1300 1200 1100 1000 900 800 20 Rated Current (mA) 9 160 140 120 33 39 47 56 68 82 100 120 7 J:±5％ 6 MURATA MFG.CO., LTD 2000 1700 1500 1400 1300 1200 1000 110 100 90 80 Spec No. JELF243C-0016H-01 Reference Only P.4/12 4. Testing Conditions 《Unless otherwise specified》 Temperature : Ordinary Temperature / 15°C to 35°C Humidity : Ordinary Humidity / 25%(RH) to 85 %(RH) 《In case of doubt》 Temperature : 20°C ± 2°C Humidity : 60%(RH) to 70 %(RH) Atmospheric Pressure : 86kPa to 106 kPa 5. Appearance and Dimensions (0.1nH to 0.5nH) (0.6nH to 120nH) ■Unit Mass (Typical value) 0.3±0.03 0.6±0.03 0.3±0.03 0.0002g 0.6±0.03 0.3±0.03 0.3±0.03 (in mm) 0.15±0.05 0.15±0.05 6. Marking Polarity Marking :white Coloring side Polarity Marking MURATA MFG.CO., LTD Spec No. JELF243C-0016H-01 Reference Only P.5/12 7.Electrical Performance No. 7.1 Item Inductance Specification Inductance shall meet item 3. 7.2 Q Q shall meet item 3. Test Method Measuring Equipment: KEYSIGHT E4991A or equivalent Measuring Frequency: (0.1nH～27nH) 500MHz (33nH~120nH) 300MHz Measuring Condition: Test signal level / about 0dBm Electrical length / 10mm Measuring Fixture: KEYSIGHT 16197A Position coil under test as shown in below and contact coil with each terminal by adding weight. Coloring side should be a topside, and should be in the direction of the fixture for position of chip coil. ↑ Polarity Marking 7.3 7.4 7.5 DC Resistance Self Resonant Frequency(S.R.F) Rated Current DC Resistance shall meet item 3. S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. Measuring Method:See P.12 Measuring Equipment:Digital multi meter Measuring Equipment: KEYSIGHT 8753C or equivalent The rated current is applied. MURATA MFG.CO., LTD Spec No. JELF243C-0016H-01 8.Mechanical Performance No. Item 8.1 Shear Test Reference Only Specification Chip coil shall not be damaged after tested as test method. P.6/12 Test Method Substrate:Glass-epoxy substrate Land 0.3 0.3 0.9 (in mm) Force:2N Hold Duration:5 s±1 s Applied Direction: Parallel to PCB. Chip coil F Substrate 8.2 Bending Test Chip coil shall not be damaged after tested as test method. Substrate:Glass-epoxy substrate (100mm×40mm×0.8mm) Speed of Applying Force:1mm /s Deflection:1mm Hold Duration:30 s Pressure jig R340 F Deflection 45 8.3 Vibration Appearance:No damage Inductance Change: within ±10% 8.4 Solderability The electrode shall be at least 90% covered with new solder coating. 8.5 Resistance to Soldering Heat Appearance:No damage Inductance Change: within ±10% 45 Product (in mm) Substrate: Glass-epoxy substrate Oscillation Frequency: 10Hz to 2000Hz to 10Hz for 20 min Total amplitude 1.5 mm or Acceleration 2 amplitude 196 m/s whichever is smaller. Testing Time: A period of 2h in each of 3 mutually perpendicular directions. Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:240°C±5°C Immersion Time:3s±1s Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:260°C±5°C Immersion Time:5s±1s Then measured after exposure in the room condition for 24h±2h. MURATA MFG.CO., LTD Spec No. JELF243C-0016H-01 9.Environmental Performance Reference Only It shall be soldered on the substrate. No. Item Specification 9.1 Heat Resistance Appearance:No damage Inductance Change: within ±10% 9.2 Cold Resistance 9.3 Humidity 9.4 Temperature Cycle P.7/12 Test Method Substrate: Glass-epoxy substrate Temperature:125°C Time:1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Substrate: Glass-epoxy substrate Temperature:-55°C Time:1000 h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Substrate: Glass-epoxy substrate Temperature:40°C±2°C Humidity:90%(RH) to 95%(RH) Time:1000 h(+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Substrate: Glass-epoxy substrate 1 cycle: 1 step: -55°C / 30min±3 min 2 step:Ordinary temp. / 10~15 min 3 step: 125°C / 30min±3 min 4 step: Ordinary temp. / 10~15 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. 10.Specification of Packaging 10.1 Appearance and Dimensions of paper tape (8mm-wide) 4.0±0.1 +0.1 φ1.5 -0 1.75±0.1 (0.67) Polarity Marking 8.0±0.2 2.0±0.05 3.5±0.05 2.0±0.05 （0.35） Direction of feed 0.55 max. (in mm) 10.2 Specification of Taping (1) Packing quantity (standard quantity) 15,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by cover tape. (3) Sprocket hole Sprocket hole shall be located on the left-hand side toward the direction of feed. (4) Spliced point Base tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater, and are not continuous. The Specified quantity per reel is kept. MURATA MFG.CO., LTD Reference Only Spec No. JELF243C-0016H-01 P.8/12 10.3 Pull Strength Cover tape 5N min 10.4 Peeling off force of cover tape Speed of Peeling off Cover tape 300mm/min 0.1N to 0.6N (minimum value is typical) Peeling off force F 165°to 180゜ Base tape 10.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. Trailer 160 min. 2.0±0.5 Leader Label 190 min. Empty tape 210 min. Cover tape φ 13.0±0.2 +1 φ 60 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 (in mm) +0 φ 180 -3 10.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1) , RoHS Marking (∗2), Quantity etc ･･･ □□ OOOO ××× ∗1) (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No. ∗2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 10.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,Quantity, etc ･･･ 10.8 Specification of Outer Case Label H D W Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG.CO., LTD Reference Only Spec No. JELF243C-0016H-01 P.9/12 11. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (2) Aerospace equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 12. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 12.1 Land pattern designing Chip Coil c Land a b c Solder resist 0.2~0.3 0.8~0.9 0.2~0.3 (in mm) a b 12.2 Flux, Solder ・ Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・ Use Sn-3.0Ag-0.5Cu solder. ・ Standard thickness of solder paste : 100μm~150μm. 12.3 Reflow soldering conditions ・ Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・ Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ・Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C 、90s±30s above 220°C､30s～60s above 230°C､60s max. 245°C±3°C 260°C,10s 2 times 2 times MURATA MFG.CO., LTD Reference Only Spec No. JELF243C-0016H-01 P.10/12 12.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre-heating Tip temperature Soldering iron output Tip diameter Soldering time Time 150°C,1 min 350°C max. 80W max. φ3mm max. 3(+1,-0)s 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 12.5 Solder Volume ･ Solder shall be used not to be exceeded the upper limits as shown below. Upper Limit Recommendable t 1/3T≦t≦T T : thickness of product Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 12.6 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length:ａ＜b) to the mechanical stress. 〈 Good example 〉 (2) Products location on P.C.B. separation Seam b C B D A Slit Products (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of A＞C＞B ≅ D. Length:a< b a 12.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. MURATA MFG.CO., LTD Spec No. JELF243C-0016H-01 Reference Only P.11/12 12.8 Resin coating When products are coated with resin, please contact us in advance. 12.9 Handling of a substrate (1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress on a chip is different depending on PCB material and structure. When the thermal expansion coefficient greatly differs between the board used for mounting and the chip, it will cause cracking of the chip due to the thermal expansion and contraction. The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other PCB material which has different thermal expansion coefficient from Glass-epoxy. When other PCB materials are considered, please be sure to evaluate by yourself. (2)After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress even from small bending or twisting. When the flexible PCB is considered, please be sure to evaluate by yourself. Bending Twisting 12.10 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C ~ 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 13．! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD Spec No. JELF243C-0016H-01 Reference Only P.12/12 (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I2 I1 A Zm B V2 V1 C Test Head Zx V1 = I1 D Test fixture A B C D V2 I2 Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. Zm= V1 I1 ， Zx= V2 I2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx= α 1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm:measured impedance of short chip Zss:residual impedance of short chip(0nH) Yom:measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Qx= Lx= 2πf ， Re(Zx) Lx :Inductance of chip coil Qx:Q of chip coil f :Measuring frequency MURATA MFG.CO., LTD