Reference Only
SpecNo.JELF243A-9114F-01
P.1/13
CHIP COIL (CHIP INDUCTORS) LQW15AN□□□□0ZD
Murata Standard Reference Specification 【AEC-Q200】
1. Scope
This Reference specification applies to LQW15AN_0ZD series, Chip coil (Chip Inductors) for automotive Electronics
based on AEC-Q200 except for Power train and Safety.
2. Part Numbering
(ex)
LQ
W
15
A
N
1N5
B
0
Z
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Application
(L×W)
and
Z:Automotive
Characteristics
Packaging
D:Taping
3. Rating
・Operating Temperature Range
・Storage Temperature Range.
Customer
Part Number
MURATA
Part Number
LQW15AN1N5B0ZD
LQW15AN1N5C0ZD
LQW15AN1N5D0ZD
LQW15AN1N6C0ZD
LQW15AN1N6D0ZD
LQW15AN1N7C0ZD
LQW15AN1N7D0ZD
LQW15AN1N8C0ZD
LQW15AN1N8D0ZD
LQW15AN2N4B0ZD
LQW15AN2N4C0ZD
LQW15AN2N4D0ZD
LQW15AN2N5B0ZD
LQW15AN2N5C0ZD
LQW15AN2N5D0ZD
LQW15AN2N6B0ZD
LQW15AN2N6C0ZD
LQW15AN2N6D0ZD
LQW15AN2N7B0ZD
LQW15AN2N7C0ZD
LQW15AN2N7D0ZD
LQW15AN2N8B0ZD
LQW15AN2N8C0ZD
LQW15AN2N8D0ZD
LQW15AN2N9B0ZD
LQW15AN2N9C0ZD
LQW15AN2N9D0ZD
LQW15AN3N0B0ZD
LQW15AN3N0C0ZD
LQW15AN3N0D0ZD
LQW15AN3N1B0ZD
LQW15AN3N1C0ZD
LQW15AN3N1D0ZD
LQW15AN3N2B0ZD
LQW15AN3N2C0ZD
LQW15AN3N2D0ZD
LQW15AN3N9B0ZD
LQW15AN3N9C0ZD
LQW15AN3N9D0ZD
–55°C ~ +125°C
–55°C ~ +125°C
Inductance
(∗1) refer to below
comment
(nH)
Tolerance
1.5
DC
Resistance
(∗1)
(Ω max.)
Self Resonant
Frequency (∗1)
(GHz min.)
Rated
Current
(mA)
0.03
18.0
1000
B:±0.1nH
C:±0.2nH
D:±0.5nH
1.6
1.7
Q (∗1)
(min.)
10
C:±0.2nH
D:±0.5nH
0.07
750
17
0.10
1.8
ESD
Rank
6:25kV
0.16
640
16
460
2.4
2.5
2.6
0.05
850
6
15.0
2.7
20
2.8
2.9
B:±0.1nH
C:±0.2nH
D:±0.5nH
0.07
750
0.13
570
3.0
3.1
14.0
3.2
15
0.17
3.9
25
0.07
MURATA MFG.CO.,LTD
500
10.0
750
SpecNo.JELF243A-9114F-01
Customer
Part Number
Reference Only
MURATA
Part Number
LQW15AN4N1B0ZD
LQW15AN4N1C0ZD
LQW15AN4N1D0ZD
LQW15AN4N3B0ZD
LQW15AN4N3C0ZD
LQW15AN4N3D0ZD
LQW15AN4N4B0ZD
LQW15AN4N4C0ZD
LQW15AN4N4D0ZD
LQW15AN4N5B0ZD
LQW15AN4N5C0ZD
LQW15AN4N5D0ZD
LQW15AN4N6B0ZD
LQW15AN4N6C0ZD
LQW15AN4N6D0ZD
LQW15AN4N7B0ZD
LQW15AN4N7C0ZD
LQW15AN4N7D0ZD
LQW15AN4N8B0ZD
LQW15AN4N8C0ZD
LQW15AN4N8D0ZD
LQW15AN4N9B0ZD
LQW15AN4N9C0ZD
LQW15AN4N9D0ZD
LQW15AN5N0B0ZD
LQW15AN5N0C0ZD
LQW15AN5N0D0ZD
LQW15AN5N1B0ZD
LQW15AN5N1C0ZD
LQW15AN5N1D0ZD
LQW15AN5N8B0ZD
LQW15AN5N8C0ZD
LQW15AN5N8D0ZD
LQW15AN6N2B0ZD
LQW15AN6N2C0ZD
LQW15AN6N2D0ZD
LQW15AN6N3B0ZD
LQW15AN6N3C0ZD
LQW15AN6N3D0ZD
LQW15AN6N4B0ZD
LQW15AN6N4C0ZD
LQW15AN6N4D0ZD
LQW15AN6N5B0ZD
LQW15AN6N5C0ZD
LQW15AN6N5D0ZD
LQW15AN6N6B0ZD
LQW15AN6N6C0ZD
LQW15AN6N6D0ZD
LQW15AN6N7B0ZD
LQW15AN6N7C0ZD
LQW15AN6N7D0ZD
LQW15AN6N8G0ZD
LQW15AN6N8H0ZD
LQW15AN6N8J0ZD
Inductance
(∗1) refer to below
comment
(nH)
Tolerance
Q (∗1)
(min.)
DC
Resistance
(∗1)
(Ω max.)
Self Resonant
Frequency (∗1)
(GHz min.)
P.2/13
Rated
Current
(mA)
ESD
Rank
6:25kV
4.1
10.0
4.3
4.4
4.5
0.07
750
4.6
4.7
4.8
8.0
4.9
5.0
B:±0.1nH
C:±0.2nH
D:±0.5nH
0.12
600
25
6
5.1
5.8
6.2
6.3
6.4
0.09
700
6.5
6.0
6.6
6.7
6.8
G:±2%
H:±3%
J:±5%
MURATA MFG.CO.,LTD
SpecNo.JELF243A-9114F-01
Customer
Part Number
Reference Only
MURATA
Part Number
LQW15AN6N9G0ZD
LQW15AN6N9H0ZD
LQW15AN6N9J0ZD
LQW15AN7N0G0ZD
LQW15AN7N0H0ZD
LQW15AN7N0J0ZD
LQW15AN7N1G0ZD
LQW15AN7N1H0ZD
LQW15AN7N1J0ZD
LQW15AN7N2G0ZD
LQW15AN7N2H0ZD
LQW15AN7N2J0ZD
LQW15AN7N3G0ZD
LQW15AN7N3H0ZD
LQW15AN7N3J0ZD
LQW15AN7N5G0ZD
LQW15AN7N5H0ZD
LQW15AN7N5J0ZD
LQW15AN8N2G0ZD
LQW15AN8N2H0ZD
LQW15AN8N2J0ZD
LQW15AN8N6G0ZD
LQW15AN8N6H0ZD
LQW15AN8N6J0ZD
LQW15AN8N7G0ZD
LQW15AN8N7H0ZD
LQW15AN8N7J0ZD
LQW15AN8N8G0ZD
LQW15AN8N8H0ZD
LQW15AN8N8J0ZD
LQW15AN8N9G0ZD
LQW15AN8N9H0ZD
LQW15AN8N9J0ZD
LQW15AN9N0G0ZD
LQW15AN9N0H0ZD
LQW15AN9N0J0ZD
LQW15AN9N1G0ZD
LQW15AN9N1H0ZD
LQW15AN9N1J0ZD
LQW15AN9N2G0ZD
LQW15AN9N2H0ZD
LQW15AN9N2J0ZD
LQW15AN9N3G0ZD
LQW15AN9N3H0ZD
LQW15AN9N3J0ZD
LQW15AN9N4G0ZD
LQW15AN9N4H0ZD
LQW15AN9N4J0ZD
LQW15AN9N5G0ZD
LQW15AN9N5H0ZD
LQW15AN9N5J0ZD
LQW15AN9N6G0ZD
LQW15AN9N6H0ZD
LQW15AN9N6J0ZD
Inductance
(∗1) refer to below
comment
(nH)
Tolerance
Q (∗1)
(min.)
P.3/13
DC
Resistance
(∗1)
(Ω max.)
Self Resonant
Frequency (∗1)
(GHz min.)
Rated
Current
(mA)
0.13
6.0
570
ESD
Rank
6:25kV
6.9
7.0
7.1
7.2
7.3
7.5
8.2
8.6
8.7
8.8
G:±2%
H:±3%
J:±5%
25
6
8.9
9.0
0.14
9.1
9.2
9.3
9.4
9.5
9.6
MURATA MFG.CO.,LTD
5.5
540
SpecNo.JELF243A-9114F-01
Customer
Part Number
Reference Only
MURATA
Part Number
LQW15AN9N7G0ZD
LQW15AN9N7H0ZD
LQW15AN9N7J0ZD
LQW15AN9N8G0ZD
LQW15AN9N8H0ZD
LQW15AN9N8J0ZD
LQW15AN9N9G0ZD
LQW15AN9N9H0ZD
LQW15AN9N9J0ZD
LQW15AN10NG0ZD
LQW15AN10NH0ZD
LQW15AN10NJ0ZD
LQW15AN11NG0ZD
LQW15AN11NH0ZD
LQW15AN11NJ0ZD
LQW15AN12NG0ZD
LQW15AN12NH0ZD
LQW15AN12NJ0ZD
LQW15AN13NG0ZD
LQW15AN13NH0ZD
LQW15AN13NJ0ZD
LQW15AN15NG0ZD
LQW15AN15NH0ZD
LQW15AN15NJ0ZD
LQW15AN16NG0ZD
LQW15AN16NH0ZD
LQW15AN16NJ0ZD
LQW15AN18NG0ZD
LQW15AN18NH0ZD
LQW15AN18NJ0ZD
LQW15AN19NG0ZD
LQW15AN19NH0ZD
LQW15AN19NJ0ZD
LQW15AN20NG0ZD
LQW15AN20NH0ZD
LQW15AN20NJ0ZD
LQW15AN22NG0ZD
LQW15AN22NH0ZD
LQW15AN22NJ0ZD
LQW15AN23NG0ZD
LQW15AN23NH0ZD
LQW15AN23NJ0ZD
LQW15AN24NG0ZD
LQW15AN24NH0ZD
LQW15AN24NJ0ZD
LQW15AN27NG0ZD
LQW15AN27NH0ZD
LQW15AN27NJ0ZD
LQW15AN30NG0ZD
LQW15AN30NH0ZD
LQW15AN30NJ0ZD
LQW15AN33NG0ZD
LQW15AN33NH0ZD
LQW15AN33NJ0ZD
Inductance
(∗1) refer to below
comment
(nH)
Tolerance
Q (∗1)
(min.)
DC
Resistance
(∗1)
(Ω max.)
Self Resonant
Frequency (∗1)
(GHz min.)
P.4/13
Rated
Current
(mA)
ESD
Rank
6:25kV
9.7
0.14
9.8
540
25
9.9
5.5
10
0.17
500
11
30
0.14
25
0.21
12
13
430
5.0
15
16
18
30
0.16
460
0.24
G:±2%
H:±3%
J:±5%
6
4.5
370
0.27
19
20
4.0
22
25
0.30
23
310
3.8
24
0.52
3.5
280
30
0.58
3.3
270
33
0.63
3.2
260
27
MURATA MFG.CO.,LTD
SpecNo.JELF243A-9114F-01
Customer
Part Number
Reference Only
MURATA
Part Number
LQW15AN36NG0ZD
LQW15AN36NH0ZD
LQW15AN36NJ0ZD
LQW15AN39NG0ZD
LQW15AN39NH0ZD
LQW15AN39NJ0ZD
LQW15AN40NG0ZD
LQW15AN40NH0ZD
LQW15AN40NJ0ZD
LQW15AN43NG0ZD
LQW15AN43NH0ZD
LQW15AN43NJ0ZD
LQW15AN47NG0ZD
LQW15AN47NH0ZD
LQW15AN47NJ0ZD
LQW15AN51NG0ZD
LQW15AN51NH0ZD
LQW15AN51NJ0ZD
LQW15AN56NG0ZD
LQW15AN56NH0ZD
LQW15AN56NJ0ZD
LQW15AN62NG0ZD
LQW15AN62NH0ZD
LQW15AN62NJ0ZD
LQW15AN68NG0ZD
LQW15AN68NJ0ZD
LQW15AN72NG0ZD
LQW15AN72NJ0ZD
LQW15AN75NG0ZD
LQW15AN75NJ0ZD
LQW15AN82NG0ZD
LQW15AN82NJ0ZD
LQW15AN91NG0ZD
LQW15AN91NJ0ZD
LQW15ANR10J0ZD
LQW15ANR12J0ZD
Inductance
(∗1) refer to below
comment
(nH)
Tolerance
Q (∗1)
(min.)
P.5/13
DC
Resistance
(∗1)
(Ω max.)
Self Resonant
Frequency (∗1)
(GHz min.)
Rated
Current
(mA)
0.63
3.1
260
0.70
3.0
250
36
ESD
Rank
6:25kV
39
40
43
47
G:±2%
H:±3%
J:±5%
25
2.9
1.08
51
210
2.85
6
56
1.17
2.8
200
62
1.82
2.6
145
68
1.96
140
2.5
72
75
G:±2%
J:±5%
2.10
20
135
2.4
82
2.24
2.3
130
91
2.38
2.1
125
2.52
2.66
1.5
1.0
120
110
100
120
J:±5%
(∗1)
4. Testing Conditions
《Unless otherwise specified》
Temperature ：Ordinary Temperature / 15°C to 35°C
Humidity
：Ordinary Humidity / 25%(RH) to 85%(RH)
《In case of doubt》
Temperature
：20°C±2°C
Humidity
：60%(RH) to 70%(RH)
Atmospheric Pressure ：86kPa to 106 kPa
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JELF243A-9114F-01
P.6/13
5. Appearance and Dimensions
1.0±0.1
∗Dimension of W
W
0.5±0.1
Inductance
W (in mm)
1N5～23N
0.6±0.1
24N～R12
0.5±0.1
0.1±0.05
■Unit mass (Typical value)
0.0008g
0.5±0.1
0.2±0.1
(in mm)
0.2±0.1
6.Electrical Performance
No.
6.1
Item
Inductance
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment：KEYSIGHT E4991A or equivalent
Measuring Frequency： 100MHz
250MHz / 1.5nH~ 43nH
200MHz / 47nH~ 68nH
150MHz / 72nH~120nH
Measuring Condition：Test signal level / about 0dBm
Electrical length / 0.94cm
Measuring Fixture：KEYSIGHT 16193A
Position coil under test as shown in below and contact coil
with each terminal by adding weight.
6.2
Q
Q shall meet item 3.
0.5mm
Measuring Method：See the endnote.
6.3
DC Resistance
DC Resistance shall meet item 3.
Measuring Equipment：Digital multi meter
6.4
Self Resonant
Frequency(S.R.F)
S.R.F shall meet item 3.
Measuring Equipment：KEYSIGHT N5230A or equivalent
6.5
Rated Current
Self temperature rise shall be
limited to 20°C max.
The rated current is applied.
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JELF243A-9114F-01
7. Q200 Requirement
7.1.Performance (based on Table 5 for Magnetics(Inductors / Transformer)
AEC-Q200 Rev.D issued June 1. 2010
AEC-Q200
Murata Specification / Deviation
No
Stress
Test Method
3 High
1000hours at 125 deg C
Meet Table A after testing.
Temperature
Set for 24hours at room
Table A
Exposure
temperature, then measured.
Appearance
No damage
Inductance change
(at 100MHz)
4 Temperature
Cycling
1000cycles
-40 deg C to +125 deg C
Set for 24hours at room
temperature,then
measured.
7 Biased Humidity
1000hours at 85 deg C, 85%RH Meet Table A after testing.
unpowered.
8 Operational Life
Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
Meet Table A after testing.
9 External Visual
Visual inspection
No abnormalities
Within ±5％
Meet Table A after testing.
10 Physical Dimension Meet ITEM 5
(Style and Dimensions)
No defects
12 Resistance
to Solvents
Per
MIL-STD-202
Method 215
Not Applicable
13 Mechanical Shock
Per MIL-STD-202
Method 213
Condition C：100g’s(0.98N),
6ms, Half sine, 12.3ft / s
Meet Table A after testing.
14 Vibration
5g's (0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.
Meet Table A after testing.
15 Resistance
to Soldering Heat
No-heating
Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating：150C + / -10 deg C, 60s to 90s
Meet Table A after testing.
17 ESD
Per AEC-Q200-002
ESD Rank：Refer to Item 3. Rating.
Meet Table A after testing
18 Solderbility
Per J-STD-002
Method b：Not Applicable
95% of the terminations is to be soldered.
(Except exposed wire)
19 Electrical
Characterization
Measured：Inductance
No defects
20 Flammability
Per UL-94
Not Applicable
MURATA MFG.CO.,LTD
P.7/13
Reference Only
SpecNo.JELF243A-9114F-01
AEC-Q200
No
Stress
21 Board Flex
Murata Specification / Deviation
Test Method
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
Holding time 60s
22 Terminal Strength
P.8/13
Meet Table B after testing.
Table B
Per AEC-Q200-006
A force of 17.7N
for 60s
Appearance
No damage
DC resistance change
Within ±10％
No defects
Murata Deviation Request：5N / 60s
8. Specification of Packaging
8.1 Appearance and Dimensions of paper tape (8mm-wide)
2.0±0.05
φ1.5±0.1
0
1.75±0.1
B
A
8.0±0.2
1.18±0.03
3.5±0.05
4.0±0.1
2.0±0.05
(in mm)
0.8 max.
Direction of feed
A∗ (mm)
B∗ (mm)
(Tolerance ±0.03)
(Tolerance ±0.03)
1N5, 2N4～2N8, 3N9～4N8, 5N8～6N8, 8N2～9N9, 11N, 12N, 15N
0.69
1.18
1N6～1N8, 2N9, 3N0, 3N1, 3N2, 4N9～5N1, 6N9-7N5, 10N, 13N,
16N～23N, R10, R12
0.66
1.18
24N～91N
0.64
Inductance
1.18
∗Typical value
8.2 Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by Cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The Specified quantity per reel is kept.
8.3 Pull Strength
Cover tape
5N min.
8.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
300mm/min
0.1N to 0.6N
(minimum value is typical)
165°to 180゜
F
Cover tape
Base tape
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JELF243A-9114F-01
P.9/13
8.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape (cover tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
160 min.
2.0±0.5
Leader
Label
190 min.
210 min.
Empty tape
Cover tape
φ 13.0±0.2
+1
φ 60 -0
φ 21.0±0.8
9.0 +1
-0
Direction of feed
(in mm)
13.0±1.4
+0
φ 180 -3
8.6 Marking for reel
Customer part number, MURATA part number, Inspection number (∗1), RoHS marking (∗2), Quantity etc ･･･
∗1)
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
：Year / Last digit of year
Second digit
：Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit ：Day
(3) Serial No.
∗2)
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
8.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,
Quantity, etc ･･･
8.8. Specification of Outer Case
Outer Case Dimensions (mm)
Label
H
D
W
9.
W
D
H
Standard Reel Quantity
in Outer Case (Reel)
186
186
93
5
∗ Above Outer Case size is typical. It depends on a quantity
of an order.
Caution
9.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
9.2 Caution (Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short /
open circuit of the product or falling off the product may be occurred.
9.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused
by the abnormal function or the failure of our product.
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JELF243A-9114F-01
P.10/13
10. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows：
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Chip Coil
Land
c
Solder resist
a
0.50
b
1.2
c
0.65
a
(in mm)
b
10.2 Flux, Solder
・Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste：100μm to 150μm.
10.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
・Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time. (s)
Standard Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
Limit Profile
150°C～180°C 、90s±30s
above 220°C､30s～60s
above 230°C､60s max.
245°C±3°C
260°C,10s
2 times
2 times
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JELF243A-9114F-01
P.11/13
10.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
Tip temperature
350°C max.
Soldering iron output
80W max.
Tip diameter
φ3mm max.
Soldering time
3 (+1,-0)s
Time
2 times
Note：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products
due to the thermal shock.
10.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
T
⇔
Upper Limit
Recommendable(t)
1/3T≦t≦T
T：thickness of product
10.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
a
Products shall be located in the sideways
direction (Length:a＜b) to the mechanical
stress.
b
〈 Poor example〉
〈 Good example〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from
the board separation surface.
A > C
Seam
b
A
C
B
D
Slit
> D ∗1
∗1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
Length:a< b
a
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
MURATA MFG.CO.,LTD
Screw Hole
Recommended
SpecNo.JELF243A-9114F-01
Reference Only
P.12/13
10.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at
the mounted products and P.C.B.
Power：20 W / l max.
Frequency：28kHz to 40kHz
Time：5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
10.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention
when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
10.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched
to the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
10.10 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the bottom of base
tape. In this case, please remove the support pin. The support pin may damage the components and break wire.
In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser recognition.
(There is no problem with the permeation and reflection type.)
10.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10.12 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature：-10°C to 40°C
：15% to 85% relative humidity No rapid change on temperature and humidity
Humidity
・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking
of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JELF243A-9114F-01
11.
P.13/13
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
< Electrical Performance：Measuring Method of Inductance / Q >
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
I2
I1
A
Zm
V1
Test Head
B
D
C
Test fixture
V2
Zx
V1
I1
=
A B
C D
V2
I2
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
Zm=
V1
I1
，
Zx=
V2
I2
(3) Thus,the relation between Zx and Zm is following;
Zx= α
Zm-β
1-ZmΓ
where, α= D / A =1
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm： measured impedance of short chip
Zss ： residual impedance of short chip (0.556nH)
Yom： measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Lx=
Im(Zx)
,
2πf
Qx =
Im(Zx)
Re(Zx)
Lx：Inductance of chip coil
Qx：Q of chip coil
f ：Measuring frequency
MURATA MFG.CO.,LTD
工商网监
湘ICP备2023018690号
