LQW18CN33NJ0ZD

Reference Only SpecNo.JELF243A-9145A-01 P.1/9 CHIP COIL (CHIP INDUCTORS) LQW18CN□□□□0ZD Murata Standard Reference Specification 【AEC-Q200】 1. Scope This reference specification applies to LQW18CN_0Z series, Chip coil (Chip Inductors) for automotive Electronics based on AEC-Q200 except for Power train and Safety. 2. Part Numbering (ex) LQ W 18 C N 4N9 D 0 Z D Product ID Structure Dimension Applications Category Inductance Tolerance Features Application (L×W) and Z:Automotive Characteristics Packaging D:Taping 3. Rating ・Operating Temperature Range (Ambient temperature；Self-temperature rise is not included) ・Storage Temperature Range. –40°C to +125°C Customer Part Number Tolerance DC Resistance (Ω max.) Self Resonant Frequency (MHz min.) Rated Current (mA) D:±0.5nH 0.015 2300 2600 0.025 2000 2200 0.035 1800 1700 0.045 1600 1500 Inductance MURATA Part Number (nH) LQW18CN4N9D0ZD 4.9 LQW18CN15NJ0ZD 15 LQW18CN33NJ0ZD 33 LQW18CN55NJ0ZD 55 LQW18CN85NJ0ZD 85 LQW18CNR10K0ZD 100 LQW18CNR12J0ZD –40°C to +125°C (∗) J:±5% 0.060 1380 1400 0.10 1260 1000 120 0.085 1200 1100 LQW18CNR16J0ZD 160 0.10 900 1000 LQW18CNR21J0ZD 210 0.15 720 800 LQW18CNR27J0ZD 270 0.16 660 750 LQW18CNR33J0ZD 330 0.25 600 630 LQW18CNR39J0ZD 390 0.28 570 620 LQW18CNR47J0ZD 470 0.45 555 500 LQW18CNR56J0ZD 560 0.48 540 450 LQW18CNR65J0ZD 650 0.52 510 430 K:±10% J:±5% (∗) As for LQW type, Rated Current is derated as following figure depending on the operating temperature. Current derating (%) Derating of Rated Current depend on Operating Temperature 100 50 0 0 85 Temperature (℃) . MURATA MFG.CO.,LTD 125 ESD Rank 5A:8kV 5A Reference Only SpecNo.JELF243A-9145A-01 P.2/9 4. Testing Conditions 《Unless otherwise specified》 Temperature ：Ordinary Temperature / 15°C to 35°C Humidity ：Ordinary Humidity / 25%(RH) to 85%(RH) 《In case of doubt》 Temperature ：20°C±2°C Humidity ：60%(RH) to 70%(RH) Atmospheric Pressure ：86kPa to 106 kPa 5. Appearance and Dimensions ■Unit Mass (Typical value) 0.004g 6. Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. Test Method Measuring Equipment：KEYSIGHT 4991A or equivalent Measuring Frequency： 10MHz Frequency when L value is 0μH Measuring Condition：Test signal level / about 0dBm Electrode spaces / 1.0mm Electrical length / 10mm Measuring Fixture：KEYSIGHT 16197A Position coil under test as shown in below and contact coil with each terminal by adding weight. 6.2 Self Resonant Frequency (S.R.F) 1.0mm Measuring Method：See the endnote. 6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment：Digital multi meter 6.4 Rated Current Self temperature rise shall be limited to 40°C max. The rated current is applied. MURATA MFG.CO.,LTD Reference Only SpecNo.JELF243A-9145A-01 7. Q200 Requirement 7.1.Performance (based on Table 5 for Magnetics(Inductors / Transformer) AEC-Q200 Rev.D issued June 1. 2010 AEC-Q200 Murata Specification / Deviation No Stress Test Method 3 High 1000hours at 125 deg C Meet Table A after testing. Temperature Set for 24hours at room Table A Exposure temperature, then measured. Appearance No damage Inductance change Within ±5% 4 Temperature Cycling 1000cycles -40 deg C to +125 deg C Set for 24hours at room temperature, then measured. Meet Table A after testing. 7 Biased Humidity 1000hours at 85 deg C, 85%R.H. unpowered. Meet Table A after testing. 8 Operational Life Apply 125 deg C 1000hours Set for 24hours at room temperature, then measured Meet Table A after testing. Apply derating of rated current. 9 External Visual Visual inspection No abnormalities 10 Physical Dimension Meet ITEM 5 (Style and Dimensions) No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Condition C：100g’s (0.98N), 6ms, Half sine, 12.3ft / s Meet Table A after testing. 14 Vibration 5g's (0.049N) for 20 minutes, 12cycles each of 3 orientations Test from 10-2000Hz. Meet Table A after testing. 15 Resistance to Soldering Heat No-heating Solder temperature 260C+/-5 deg C Immersion time 10s Pre-heating：150C + / -10 deg C, 60s to 90s 270C + / - 5 deg C Immersion time 5s Meet Table A after testing. 17 ESD Per AEC-Q200-002 ESD Rank：Refer to Item 3. Rating. Meet Table A after testing 18 Solderbility Per J-STD-002 Method b：Not Applicable 95% of the terminations is to be soldered. (Except exposed wire) 19 Electrical Characterization Measured：Inductance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB (1.6mm) Deflection 2mm (min) Holding time 60s Meet Table A after testing. 22 Terminal Strength Per AEC-Q200-006 A force of 17.7N for 60s Appearance No damage Murata Deviation Request：8N / 5s MURATA MFG.CO.,LTD P.3/9 Reference Only SpecNo.JELF243A-9145A-01 P.4/9 8. Specification of Packaging 8.1 Appearance and Dimensions of paper tape (8mm-wide, 2mm pitch) 0.1 1 .8 ±0 .0 6 8 .0 ±0 .2 1.75±0.1 φ 1.5± 0 3 .5 ±0 .0 5 4.0±0.1 2.0±0.05 4.0±0.1 (in mm) 1.0±0.06 Direction of feed 1.1 max. 8.2 Specification of Taping (1) Packing quantity (standard quantity) 4,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by Cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 8.3 Pull Strength Cover tape 5N min. 8.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 300mm/min 0.1N to 0.6N (minimum value is typical) F 165°to 180゜ Cover tape Base tape 8.5 Dimensions of Leader-tape,Trailer and Reel There shall be leader-tape (cover tape and empty tape) and trailer-tape (empty tape) as follows. 2.0±0.5 Trailer 160 min. Leader Label 190 min. 210 min. Empty tape Cover tape φ 13.0±0.2 +1 φ 60 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed (in mm) 13.0±1.4 +0 φ 180 -3 MURATA MFG.CO.,LTD Reference Only SpecNo.JELF243A-9145A-01 P.5/9 8.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･ ∗1) □□ OOOO XXX (1) (2) (3) (1) Factory Code (2) Date First digit ：Year / Last digit of year Second digit ：Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit ：Day (3) Serial No. ∗2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 8.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) , Quantity, etc ･･･ 8.8. Specification of Outer Case Outer Case Dimensions (mm) Label H D W 9. W D H Standard Reel Quantity in Outer Case (Reel) 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. Caution 9.1 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 9.2 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short / open circuit of the product or falling off the product may be occurred. 9.3 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. MURATA MFG.CO.,LTD Reference Only SpecNo.JELF243A-9145A-01 P.6/9 10. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10.1 Land pattern designing Recommended land patterns for reflow soldering are as follows： These have been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. 2.2 Chip Coil Pattern Solder resist Substrate 1.0 0.75 0.70 (in mm) 10.2 Flux, Solder ・Use rosin-based flux. Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine. Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste：50μm to 100μm. ・Please pay attention to solder paste's penetrating in order to avoid short circuit between the lines. 10.3 Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ・Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard Profile Pre-heating Heating Peak temperature Cycle of reflow Limit Profile 150°C～180°C 、90s±30s above 220°C､30s～60s above 230°C､60s max. 245°C±3°C 260°C,10s 2 times 2 times MURATA MFG.CO.,LTD Reference Only SpecNo.JELF243A-9145A-01 P.7/9 10.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3 (+1,-0)s Time 2 times Note：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 10.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable(t) T 1/3T≦t≦T T：thickness of product 10.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways direction (Length：a＜b) to the mechanical stress. b 〈 Poor example〉 〈 Good example〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D ∗1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Seam b A C B D Slit ∗1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Length:a< b a (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. MURATA MFG.CO.,LTD Screw Hole Recommended SpecNo.JELF243A-9145A-01 Reference Only P.8/9 10.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power：20 W / l max. Frequency：28kHz to 40kHz Time：5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 10.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 10.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 10.10 Notice of product handling at mounting In some mounting machines,when picking up components support pin pushes up the components from the bottom of base tape. In this case, please remove the support pin. The support pin may damage the components and break wire. In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser recognition. (There is no problem with the permeation and reflection type.) 10.11 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10.12 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C to 40°C ： 15% to 85% relative humidity No rapid change on temperature and humidity Humidity ・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. MURATA MFG.CO.,LTD Reference Only SpecNo.JELF243A-9145A-01 11. P.9/9 Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. < Electrical Performance:Measuring Method of Inductance/Q > (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I2 I1 A Zm V1 Test Head B D C Test fixture V2 Zx V1 I1 = A B C D V2 I2 Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. Zm= V1 I1 ， Zx= V2 I2 (3) Thus,the relation between Zx and Zm is following; Zx= α Zm-β 1-ZmΓ where, α= D / A =1 β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm ： measured impedance of short chip Zss ： residual impedance of short chip (0.771nH) Yom： measured admittance when opening the fixture (4) Lx shall be calculated with the following equation. Lx= Im(Zx) 2πf Lx： Inductance of chip coil f ： Measuring frequency MURATA MFG.CO.,LTD