Spec No.: JELF243A_0085K-01
P1/12
CHIP COILS (CHIP INDUCTORS) LQW2UAS□□□□00□ REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip coils (chip inductors) LQW2UAS_00 series for general electronic equipment.
2. Part Numbering
(Ex.)
LQ
W
2U
A
S
12N
G
0
0
L
Product Structure Dimension
ID
(L × W)
Application Category
Inductance
Tolerance Performance Electrode Packaging
and
specification L: taping
characteristic
*B: bulk
*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).
3. Part Number and Rating
Operating temperature range
-55°C to +125°C
Storage temperature range
-55°C to +125°C
Inductance
Customer
Part number
Murata
Part number
Nominal
value
(nH)
Q
(Min.)
Tolerance
LQW2UAS12NG00L
12
G: ±2%
50
LQW2UAS12NJ00L
12
J: ±5%
50
LQW2UAS18NG00L
18
G: ±2%
50
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)
0.09
3300
1000
0.09
3300
1000
0.11
2500
1000
LQW2UAS18NJ00L
18
J: ±5%
50
0.11
2500
1000
LQW2UAS22NF00L
22
F: ±1%
55
0.12
2400
1000
LQW2UAS22NG00L
22
G: ±2%
55
0.12
2400
1000
LQW2UAS22NJ00L
22
J: ±5%
55
0.12
2400
1000
LQW2UAS27NG00L
27
G: ±2%
55
0.13
1600
1000
LQW2UAS27NJ00L
27
J: ±5%
55
0.13
1600
1000
LQW2UAS33NF00L
33
F: ±1%
60
0.14
1600
1000
LQW2UAS33NG00L
33
G: ±2%
60
0.14
1600
1000
LQW2UAS33NJ00L
33
J: ±5%
60
0.14
1600
1000
LQW2UAS39NF00L
39
F: ±1%
60
0.15
1500
1000
LQW2UAS39NG00L
39
G: ±2%
60
0.15
1500
1000
LQW2UAS39NJ00L
39
J: ±5%
60
0.15
1500
1000
LQW2UAS47NF00L
47
F: ±1%
65
0.16
1500
1000
LQW2UAS47NG00L
47
G: ±2%
65
0.16
1500
1000
LQW2UAS47NJ00L
47
J: ±5%
65
0.16
1500
1000
LQW2UAS56NF00L
56
F: ±1%
65
0.18
1300
1000
LQW2UAS56NG00L
56
G: ±2%
65
0.18
1300
1000
LQW2UAS56NJ00L
56
J: ±5%
65
0.18
1300
1000
LQW2UAS68NF00L
68
F: ±1%
65
0.20
1300
1000
LQW2UAS68NG00L
68
G: ±2%
65
0.20
1300
1000
LQW2UAS68NJ00L
68
J: ±5%
65
0.20
1300
1000
LQW2UAS82NF00L
82
F: ±1%
60
0.22
1000
1000
LQW2UAS82NG00L
82
G: ±2%
60
0.22
1000
1000
LQW2UAS82NJ00L
82
J: ±5%
60
0.22
1000
1000
LQW2UASR10F00L
100
F: ±1%
60
0.56
1000
650
LQW2UASR10G00L
100
G: ±2%
60
0.56
1000
650
LQW2UASR10J00L
100
J: ±5%
60
0.56
1000
650
MURATA MFG CO., LTD
Spec No.: JELF243A_0085K-01
P2/12
Inductance
Customer
Part number
Tolerance
Q
(Min.)
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)
120
F: ±1%
60
0.63
950
650
120
G: ±2%
60
0.63
950
650
Murata
Part number
Nominal
value
(nH)
LQW2UASR12F00L
LQW2UASR12G00L
LQW2UASR12J00L
120
J: ±5%
60
0.63
950
650
LQW2UASR15F00L
150
F: ±1%
45
0.70
850
580
LQW2UASR15G00L
150
G: ±2%
45
0.70
850
580
LQW2UASR15J00L
150
J: ±5%
45
0.70
850
580
LQW2UASR18F00L
180
F: ±1%
45
0.77
750
620
LQW2UASR18G00L
180
G: ±2%
45
0.77
750
620
LQW2UASR18J00L
180
J: ±5%
45
0.77
750
620
LQW2UASR22F00L
220
F: ±1%
45
0.84
700
500
LQW2UASR22G00L
220
G: ±2%
45
0.84
700
500
LQW2UASR22J00L
220
J: ±5%
45
0.84
700
500
LQW2UASR27F00L
270
F: ±1%
45
0.91
600
500
LQW2UASR27G00L
270
G: ±2%
45
0.91
600
500
LQW2UASR27J00L
270
J: ±5%
45
0.91
600
500
LQW2UASR33F00L
330
F: ±1%
45
1.05
570
450
LQW2UASR33G00L
330
G: ±2%
45
1.05
570
450
LQW2UASR33J00L
330
J: ±5%
45
1.05
570
450
LQW2UASR39F00L
390
F: ±1%
45
1.12
500
470
LQW2UASR39G00L
390
G: ±2%
45
1.12
500
470
LQW2UASR39J00L
390
J: ±5%
45
1.12
500
470
LQW2UASR47F00L
470
F: ±1%
45
1.19
450
470
LQW2UASR47G00L
470
G: ±2%
45
1.19
450
470
LQW2UASR47J00L
470
J: ±5%
45
1.19
450
470
LQW2UASR56F00L
560
F: ±1%
45
1.33
415
400
LQW2UASR56G00L
560
G: ±2%
45
1.33
415
400
LQW2UASR56J00L
560
J: ±5%
45
1.33
415
400
LQW2UASR62F00L
620
F: ±1%
45
1.40
375
300
LQW2UASR62G00L
620
G: ±2%
45
1.40
375
300
LQW2UASR62J00L
620
J: ±5%
45
1.40
375
300
LQW2UASR68F00L
680
F: ±1%
45
1.47
375
400
LQW2UASR68G00L
680
G: ±2%
45
1.47
375
400
LQW2UASR68J00L
680
J: ±5%
45
1.47
375
400
LQW2UASR75F00L
750
F: ±1%
45
1.54
360
360
LQW2UASR75G00L
750
G: ±2%
45
1.54
360
360
LQW2UASR75J00L
750
J: ±5%
45
1.54
360
360
LQW2UASR82F00L
820
F: ±1%
45
1.61
350
400
LQW2UASR82G00L
820
G: ±2%
45
1.61
350
400
LQW2UASR82J00L
820
J: ±5%
45
1.61
350
400
LQW2UASR91F00L
910
F: ±1%
35
1.68
320
380
LQW2UASR91G00L
910
G: ±2%
35
1.68
320
380
LQW2UASR91J00L
910
J: ±5%
35
1.68
320
380
LQW2UAS1R0F00L
1000
F: ±1%
35
1.75
290
370
LQW2UAS1R0G00L
1000
G: ±2%
35
1.75
290
370
LQW2UAS1R0J00L
1000
J: ±5%
35
1.75
290
370
LQW2UAS1R2J00L
1200
J: ±5%
35
2.0
210
310
MURATA MFG CO., LTD
Spec No.: JELF243A_0085K-01
P3/12
Inductance
Customer
Part number
Tolerance
Q
(Min.)
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated
current
(mA)
1500
J: ±5%
28
2.3
120
330
LQW2UAS1R8J00L
1800
J: ±5%
28
2.6
140
300
LQW2UAS2R2J00L
2200
J: ±5%
28
2.8
130
280
LQW2UAS2R7J00L
2700
J: ±5%
22
3.2
110
290
LQW2UAS3R3J00L
3300
J: ±5%
22
3.4
90
290
LQW2UAS3R9J00L
3900
J: ±5%
20
3.6
70
260
LQW2UAS4R7J00L
4700
J: ±5%
20
4.0
60
260
Murata
Part number
Nominal
value
(nH)
LQW2UAS1R5J00L
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Appearance and Dimensions
Unit mass (typical value): 0.039 g
6. Marking
No marking.
MURATA MFG CO., LTD
Spec No.: JELF243A_0085K-01
P4/12
7. Electrical Performance
No.
Item
7.1
Inductance
Specification
Meet chapter 3 ratings.
Test method
Measuring equipment: Keysight E4991A or the
equivalent
Measuring frequency:
Inductance
50 MHz 12 nH to 82 nH
Q
25 MHz
100 nH to 1000 nH
7.9 MHz
1200 nH to 4700 nH
500 MHz 12 nH to 15 nH
350 MHz 18 nH to 120 nH
100 MHz 150 nH to 820 nH
50 MHz
7.2
Q
910 nH to 2200 nH
25 MHz 2700 nH to 4700 nH
Measuring conditions:
Measurement signal level: Approx. 0 dBm
Measurement terminal distance: 1.5 mm
Electrical length: 10.0 mm
Weight: Approx. 1 N to 3 N
Measuring fixture: Keysight 16197A
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
Meet chapter 3 ratings.
Measuring method: see "Electrical performance:
Measuring method for inductance/Q" in the chapter
"14. Appendix".
7.3
DC resistance
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
7.4
Self-resonant
frequency
Meet chapter 3 ratings.
Measuring equipment: Keysight N5230A or the
equivalent
7.5
Rated current
Product temperature rise: 40°C max.
Apply the rated current specified in chapter 3.
8. Mechanical Performance
No.
8.1
Item
Shear test
Specification
No significant mechanical damage or no
sign of electrode peeling off shall be
observed.
Test method
Test substrate: glass-epoxy substrate
Force application direction:
Applying force: 10 N
Holding time: 5 s±1 s
MURATA MFG CO., LTD
Spec No.: JELF243A_0085K-01
No.
P5/12
Item
Specification
Test method
8.2
Bending test
No significant mechanical damage or no
sign of electrode peeling off shall be
observed.
Test substrate: glass-epoxy substrate (100 mm × 40
mm × 1.0 mm)
Pressurizing speed: 1 mm/s
Deflection: 3 mm
Holding time: 5 s
8.3
Vibration
Appearance shall have no significant
mechanical damage.
Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for
approx. 15 min
Total amplitude: total amplitude of 3.0 mm or
acceleration amplitude of 196 m/s2, whichever is
smaller
Test time: 3 directions perpendicular to each other, 2 h
for each direction (6 h in total)
8.4
Solderability
90% or more of the outer electrode shall
be covered with new solder seamlessly.
Flux: immersed in ethanol solution [including an
activator with a chlorine conversion value of 0.06(wt)%]
with a rosin content of 25(wt)% for 5 s to 10 s.
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
8.5
Resistance to
soldering heat
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Flux: immersed in ethanol solution [including an
activator with a chlorine conversion value of 0.06(wt)%]
with a rosin content of 25(wt)% for 5 s to 10 s.
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 270°C±5°C
Immersion time: 10 s±1 s
Post-treatment: left at a room condition for 24 h±2 h
9. Environmental Performance
The product is soldered on a substrate for test.
No.
Item
Specification
Test method
9.1
Heat resistance
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Temperature: 125°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.2
Cold resistance
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Temperature: -55°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.3
Humidity
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Temperature: 85°C±2°C
Humidity: 85% (RH)
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.4
Temperature cycle Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±5%
Q change rate: within ±20%
Single cycle conditions:
Step 1: -55°C±2°C/30 min±3 min
Step 2: ordinary temperature/10 min to 15 min
Step 3: +125°C±2°C/30 min±3 min
Step 4: ordinary temperature/10 min to 15 min
Number of testing: 10 cycles
Post-treatment: left at a room condition for 24 h±2 h
MURATA MFG CO., LTD
Spec No.: JELF243A_0085K-01
P6/12
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/plastic tape)
A
2.7±0.1
B
2.8±0.1
t
2.15±0.1
t'
0.25±0.05
(in mm)
* The dimensions of the cavity are measured at its bottom.
10.2 Taping specifications
Packing quantity
(Standard quantity)
2000 pcs/reel
Packing method
The products are placed in embossed cavities of a plastic tape and sealed by a cover tape.
Feed hole position
The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user.
Joint
The plastic tape and the cover tape are seamless.
Number of missing
products
Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Break down force of cover tape
10 N min.
10.4 Peeling off force of cover tape
Speed of peeling off
300 mm/min
Peeling off force
165 to 180 degree
0.1 N to 0.6 N (The lower limit is for typical value.)
F
Cover tape
Plastic tape
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape. (See the diagram below.)
MURATA MFG CO., LTD
Spec No.: JELF243A_0085K-01
P7/12
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□
○○○○
(2) Date
First digit: year/last digit of year
(1)
(2)
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHSY
()
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Label
H
D
W
11.
Dimensions of outer box
(mm)
W
D
H
186
186
93
Standard reel quantity
in outer box (reel)
5
* Above outer box size is typical. It depends on a
quantity of an order.
Caution
Restricted
applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster/crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting
method, for example, using a conductive adhesive, please consult us beforehand.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land
dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional
shift. If you use other land pattern, consider it adequately.
(in mm)
Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.
MURATA MFG CO., LTD
Spec No.: JELF243A_0085K-01
P8/12
12.2 Flux and solder used
Flux
• Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C
max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
150°C to 180°C/90 s±30 s
Heating
Above 220°C/30 s to 60 s
Above 230°C/60 s max.
245°C±3°C
260°C/10 s
2 times
2 times
Peak temperature
Number of reflow cycles
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
Pre-heating
150°C/approx. 1 min
Tip temperature of soldering iron
350°C max.
Power consumption of soldering iron
80 W max.
Tip diameter of soldering iron
Soldering time
Number of reworking operations
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
12.5 Solder volume
Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
MURATA MFG CO., LTD
Spec No.: JELF243A_0085K-01
P9/12
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
〈 Poor example〉
〈 Good example〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D*1
(2) Add slits in the board separation part.
A>B
(3) Keep the mounting position of the component away from the
board separation surface.
A>C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG CO., LTD
Spec No.: JELF243A_0085K-01
P10/12
12.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item
Requirement
Power
Time
20 W/L max.
5 min max.
Frequency
28 kHz to 40 kHz
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
12.9 Storage and transportation
Storage period
Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions
• The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the
electrode, resulting in poor solderability or corrosion of the coil wire of the product.
• Do not keep products in bulk packaging. Doing so may cause collision between the products or
between the products and other products, resulting in core chipping or wire breakage.
• Do not place the products directly on the floor; they should be placed on a palette so that they are
not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
12.10 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Handling of product
• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
12.12 Handling with mounting equipment
With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape when
the product is sucked with the pick-up nozzle.
When using this type of equipment, detach the support pin to prevent the breaking of wire on the product.
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD
Spec No.: JELF243A_0085K-01
P11/12
14. Appendix
Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included
in the rating table.)
Perform measurement using the method described below. (Perform correction to ensure that the inductance value is
compatible with inductors of other manufacturers.)
(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole
terminal as shown in the figure below.
(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using
the respective current and voltage for input/output.
Zm=
V1
I1
Zx=
V2
I2
(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.
Zx=α
Zm-β
1-ZmΓ
Here,
α = D/A = 1
β = B/D = Zsm - (1 - Yom Zsm) Zss
Γ = C/A = Yom
Zsm: measured impedance when measuring terminal is shorted
Zss: residual impedance of short chip (= Equivalent series inductance X*1)
Yom: measured admittance when measuring terminal is open
*1 Important
X: In consideration of compatibility with other venders' products, Zss is defined as the correction value to fit
nominal inductance of other venders' products.
When calibrating the measurement, please input X value instead of the equivalent series inductance (ShortL) for
each L value.
Perform measurement of Q using the residual impedance 0.771 nH obtained through our conventional standard
measurement method.
(4) Calculate inductance Lx and Qx using the equations shown below.
Im (Zx)
Lx: inductance of chip coil
Lx=
2πf
Qx: Q of chip coil
Im (Zx)
Qx=
f: measuring frequency
Re (Zx)
MURATA MFG CO., LTD
Spec No.: JELF243A_0085K-01
P12/12
Table: Equivalent series inductance to fit nominal inductance of other venders' products
Inductance
Part number
LQW2UAS12N_00
X (nH)
Equivalent series Inductance
0.511
Measuring frequency
(MHz)
50
LQW2UAS18N_00
0.321
50
LQW2UAS22N_00
0.941
50
LQW2UAS27N_00
0.651
50
LQW2UAS33N_00
1.711
50
LQW2UAS39N_00
0.741
50
LQW2UAS47N_00
2.071
50
LQW2UAS56N_00
2.351
50
LQW2UAS68N_00
2.281
50
LQW2UAS82N_00
2.921
50
LQW2UASR10_00
3.351
25
LQW2UASR12_00
3.871
25
LQW2UASR15_00
4.371
25
LQW2UASR18_00
5.271
25
LQW2UASR22_00
3.271
25
LQW2UASR27_00
8.871
25
LQW2UASR33_00
12.771
25
LQW2UASR39_00
22.271
25
LQW2UASR47_00
20.971
25
LQW2UASR56_00
24.971
25
LQW2UASR62_00
28.371
25
LQW2UASR68_00
44.271
25
LQW2UASR75_00
35.371
25
LQW2UASR82_00
47.171
25
LQW2UASR91_00
56.371
25
LQW2UAS1R0_00
79.171
25
LQW2UAS1R2_00
15.771
7.9
LQW2UAS1R5_00
5.771
7.9
LQW2UAS1R8_00
6.771
7.9
LQW2UAS2R2_00
25.771
7.9
LQW2UAS2R7_00
63.771
7.9
LQW2UAS3R3_00
91.771
7.9
LQW2UAS3R9_00
67.771
7.9
LQW2UAS4R7_00
163.771
7.9
MURATA MFG CO., LTD
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