AXT220124

For board-to-board For board-to-FPC P35S Narrow pitch connectors (0.35mm pitch) FEATURES 1. Small size 0.35 mm pitch contributes to device miniaturization. Smaller compared to P4S (40 pins): Socket — 11% smaller, Header — 12% smaller 3. Greater flexibility in connector placement. Pattern wiring to the connector bottom is made possible with a molded covering on the undersurface of the connector. Soldering terminals at each corner Socket m 35 2. m m 6m 3. Socket Header 9.55 (40 pins) 3.60 Soldering terminals at each corner RoHS compliant Header Soldering terminals at each corner Insulation Insulation area area Connector bottom: Create any thru-hole and pattern wiring. Soldering terminals at each corner 4. Connectors for inspection available 8.73 (40 pins) 2.35 APPLICATIONS 2. Strong resistance to adverse environments! Utilizes “ ” construction for high contact reliability. Mobile devices, such as cellular phones, digital still cameras and digital video cameras. ORDERING INFORMATION AXT 1 2 4 1: Narrow Pitch Connector P35S (0.35 mm pitch) Socket 2: Narrow Pitch Connector P35S (0.35 mm pitch) Header Number of pins (2 digits) Mated height / 1: For mated height 1.5 mm Functions / 2: No pickup cover, without positioning bosses Surface treatment (Contact portion / Terminal portion) 4: Ni plating on base, Au plating on surface (for Ni barrier available) 4: Ni plating on base, Au plating on surface –1– ACCTB87E 201602-T Narrow pitch connectors P35S (0.35mm pitch) PRODUCT TYPES Mated height Number of pins 1.5mm 40 50 60 70 80 100 Part number Socket AXT140124 AXT150124 AXT160124 AXT170124 AXT180124 AXT100124 Packing Header AXT240124 AXT250124 AXT260124 AXT270124 AXT280124 AXT200124 Inner carton (1-reel) Outer carton 3,000 pieces 6,000 pieces Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units. For samples, please contact our sales office. SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Specifications 0.25A/pin contact (Max. 4 A at total pin contacts) 60V AC/DC Dielectric strength 150V AC for 1 min. Insulation resistance Min. 1,000MΩ (initial) Contact resistance Max. 100mΩ Composite insertion force Composite removal force Contact holding force (Socket contact) Ambient temperature Max. 0.981N/pin contact × pin contacts (initial) Min. 0.0588N/pin contact × pin contacts Soldering heat resistance Storage temperature Conditions — — Rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1mA. Using 250V DC megger (applied for 1 min.) Based on the contact resistance measurement method specified by JIS C 5402. Measuring the maximum force. As the contact is axially pull out. No icing or condensation. Min. 0.981N/pin contact –55°C to +85°C Max. peak temperature of 260°C (on the surface of the PC board around the connector terminals) 300°C within 5 sec. or 350°C within 3 sec. –55°C to +85°C (product only) –40°C to +50°C (emboss packing) Infrared reflow soldering Soldering iron No icing or condensation. Conformed to MIL-STD-202F, method 107G Environmental characteristics Lifetime characteristics Unit weight Thermal shock resistance (header and socket mated) 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 100mΩ Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) 120 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 100mΩ H2S resistance (header and socket mated) 48 hours, contact resistance max. 100mΩ Insertion and removal life 50 times Order Temperature (°C) 1 –55 −30 2 3 85 +30 4 –55 −30 Time (minutes) 30 Max. 5 30 Max. 5 Conformed to IEC60068-2-78 Temperature 40°C±2°C, humidity 90% to 95% R.H. Conformed to IEC60068-2-11 Temperature 35°C±2°C, saltwater concentration 5%±1% Temperature 40°C±2°C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/hours 50 pin contacts Socket: 0.06 g Header: 0.03 g 2. Material and surface treatment Part name Molded portion Contact and Post Material LCP resin (UL94V-0) Copper alloy Surface treatment — Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal) However, the area adjacent to the socket terminal is exposed to Ni on base. Soldering terminals portion; Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal) Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal) –2– ACCTB87E 201602-T Narrow pitch connectors P35S (0.35mm pitch) DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ 1. Socket (Mated height: 1.5mm) CAD Data A Terminal coplanarity 0.08 (Contact and soldering terminals) 1.45 0.70 (Suction face) 0.35±0.05 2.60 (0.50) 3.00 0.12±0.03 3.60 B±0.1 (0.66) Y (Note) 3.60 1.80 Dimension table (mm) 0.55 0.30±0.03 C±0.1 (0.90) Z (Note) General tolerance: ±0.2 Number of pins/ dimension 40 9.55 6.65 8.35 50 60 70 80 100 11.30 13.05 14.80 16.55 20.05 8.40 10.15 11.90 13.65 17.15 10.10 11.85 13.60 15.35 18.85 B C A B C 2. Header (Mated height: 1.5mm) CAD Data A 0.54 (Suction face) B±0.1 20 0.35±0.05 2.35 (0.45) 0. 25 2.35 1.45 R 0. 0.12±0.03 R R Terminal coplanarity 0.08 (Contact and soldering terminals) 1.24 0. 1.49 0.12±0.03 0.84 (0.33) Soldering terminals Soldering terminals 20 C±0.1 General tolerance: ±0.2 Dimension table (mm) Number of pins/ dimension 40 8.73 6.65 8.05 50 60 70 80 10.48 12.23 13.98 15.73 8.40 10.15 11.90 13.65 9.80 11.55 13.30 15.05 100 19.23 17.15 18.55 A Socket and Header are mated Header 1.50±0.15 Socket –3– ACCTB87E 201602-T Narrow pitch connectors P35S (0.35mm pitch) EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header) • Tape dimensions (Conforming to JIS C 0806:1990. However, some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II • Plastic reel dimensions (Conforming to EIAJ ET-7200B) C 1.75 2 8.0 1. 5 Top cover tape 1.75 4 Pull out direction Pull out direction 4 Label 380 dia. C Taping reel D±1 A±0.3 B A±0.3 2 Embossed carrier tape Embossed mounting-hole 8.0 1. 5 +0 0 .1 +0 0 .1 di di a. a. Dimension table (mm) Mated height Number of pins Type of taping A B C D Quantity per reel Common for socket and header: 1.5mm 40 to 70 72 to 100 Tape I Tape II 24.0 32.0 — 28.4 11.5 14.2 25.4 33.4 3,000 3,000 Connector orientation with respect to direction of progress of embossed tape Type Common for P35S Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. –4– ACCTB87E 201602-T Narrow pitch connectors P35S (0.35mm pitch) For board-to-board For board-to-FPC P35S Connectors for inspection usage (0.35mm pitch) m 35 m m 6m 2. 3. Socket Header FEATURES APPLICATIONS 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. Ideal for module unit inspection and equipment assembly inspection Note: Mating retention force cannot be warranted. Please avoid using for applications other than inspection. RoHS compliant TABLE OF PRODUCT TYPES ✩: Available for sale Product name P35S for inspection Number of pins 50 ✩ 40 ✩ 60 ✩ 70 ✩ 80 ✩ 100 ✩ Notes: 1. The pickup surface shape of the inspection sockets is different from that of the standard sockets. (For details, refer to the product specification diagram.) 2. Please inquire number of pins other than those shown above. 3. Please inquire us regarding availability. 4. Please keep the minimum order quantities no less than 50 pieces per lot. 5. Please inquire if further information is needed. PRODUCT TYPES Specifications Socket Part No. AXT1E∗∗26 Specifications Header Part No. AXT2E∗∗26 Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector. –5– ACCTB87E 201602-T Narrow pitch connectors P35S (0.35mm pitch) NOTES Socket (Mated height: 1.5mm) Header (Mated height: 1.5mm) 0.45±0.03 0.70±0.03 0.70±0.03 0.85±0.03 Max. 0.03 mm Max. 0.03 mm : Insulation area 0.35±0.01 0.18±0.01 0.35±0.01 0.18±0.01 (0.50) 1.75±0.01 2.75±0.01 Metal mask thickness: When 120 μm (Terminal portion opening area ratio: 60%) (Metal portion opening area ratio: 100%) 1.65±0.01 0.65±0.01 (0.50) Recommended metal mask pattern Metal mask thickness: When 120 μm (Terminal portion opening area ratio: 60%) (Metal portion opening area ratio: 100%) (0.53) 2.94±0.01 4.00±0.01 Recommended metal mask pattern 4.20±0.01 1.80±0.01 (1.20) 2. Keep the PC board warp no more than 0.03 mm in relation to the overall length of the connector 0.35±0.03 0.20±0.03 Max. 0.90 (0.75) 1.45±0.03 2.95±0.03 0.35±0.03 0.20±0.03 1.65±0.03 0.65±0.03 (0.50) Recommended PC board pattern (TOP VIEW) (0.80) 2.60±0.03 4.20±0.03 Recommended PC board pattern (TOP VIEW) 1.80±0.03 (1.20) 1. As shown below, excess force during insertion may result in damage to the connector or removal of the solder. Also, to prevent connector damage please confirm the correct position before mating connectors. 0.45±0.01 0.70±0.01 0.70±0.01 0.85±0.01 3. If extra resistance to shock caused by dropping is required, we recommend using P4. 4. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Please refer to the latest product specifications when designing your product. –6– ACCTB87E 201602-T For board-to-board/board-to-FPC Notes on Using Narrow pitch Connectors/ High Current Connectors About safety Remarks 1) Do not use these connectors beyond the specification sheets. The usage outside of specified rated current, dielectric strength, and environmental conditions and so on may cause circuitry damage via abnormal heating, smoke, and fire. 2) In order to avoid accidents, your thorough specification review is appreciated. Please contact us if your usage is out of the specifications. Otherwise, Panasonic Corporation cannot guarantee the quality and reliability. 3) Panasonic Corporation is consistently striving to improve quality and reliability. However, the fact remains that electrical components and devices generally cause failures at a given statistical probability. Furthermore, their durability varies with use environments or use conditions. In this respect, please check for actual electrical components and devices under actual conditions before use. Continued usage in a state of degraded condition may cause the deteriorated insulation, thus result in abnormal heat, smoke or firing. Please carry out safety design and periodic maintenance including redundancy design, design for fire spread prevention, and design for malfunction prevention so that no accidents resulting in injury or death, fire accidents, or social damage will be caused as a result of failure of the products or ending life of the products. Regarding the design of devices and PC board patterns 1) When using the board to board connectors, do not connect a pair of board with multiple connectors. Otherwise, misaligned connector positions may cause mating failure or product breakage. 2) With mounting equipment, there may be up to a ±0.2 to 0.3-mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) PC board Control the thicknesses of the coverlay and adhesive to prevent poor soldering. This connector has no stand-off. Therefore, minimize the thickness of the coverlay, etc. so as to prevent the occurrence of poor soldering. 6) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws Screw Connector Spacer PC board Spacer When connecting PC boards, take appropriate measures to prevent the connector from coming off. 7) When mounting connectors on a FPC board: • When the connector soldered to FPC is mated or unmated, solder detachment may occur by the force to the terminals. Connector handling is recommended in the condition when the reinforcing plate is attached to the backside of FPC where the connector is mounted. The external dimension of the reinforcing plate is recommended to be larger than the dimension of “PC board recommended process pattern” (extended dimension of one side is approximately 0.5 to 1.0 mm). The materials and thickness of the reinforcing plate are glass epoxy or polyimide (thickness 0.2 - 0.3 mm) or SUS (thickness 0.1 - 0.2 mm). • As this connector has temporary locking structure, the connector mating may be separated by the dropping impact depend on the size, weight or bending force of the FPC. Please consider the measures at usage to prevent the mating separation. 8) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the chucking force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. –1– 6) In case of dry condition, please note the occurrence of static electricity. The product may be adhered to the embossed carrier tape or the cover tape in dry condition. Recommended humidity is from 40%RH to 60%RH and please remove static electricity by ionizer in manufacturing process. ACCTB48E 201606-T Notes on Using Narrow pitch Connectors/High Current Connectors Regarding soldering Terminal Paste solder PC board foot pattern 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) The condition of solder or flux rise and wettability varies depending on the type of solder and flux. Solder and flux characteristics should be taken into consideration and also set the reflow temperature and oxygen level. 7) Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed. 8) Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact us before using a temperature profile other than that described below (e.g. lead-free solder). 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. Apply the solder wire here Upper limited (Solder heat resistance) Lower limited (Solder wettability) Terminal Temperature Peak temperature 260°C 230°C 180°C 150°C So ld iro erin n g ■ Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (Please refer to the specification for detail because the temperature setting differs by products.) 2) As for cream solder printing, screen printing is recommended. 3) When setting the screen opening area and PC board foot pattern area, refer the recommended PC board pattern and window size of metal mask on the specification sheet, and make sure that the size of board pattern and metal mask at the base of the terminals are not increased. 4) Please pay attentions not to provide too much solder. It makes miss mating because of interference at soldering portion when mating. Small angle as possible up to 45 degrees Peak temperature Preheating 220°C 200°C PC board 25 sec. 60 to 120 sec. 70 sec. Time For products other than the ones above, please refer to the latest product specifications. 9) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector before mounting. 10) Consult us when using a screenprinting thickness other than that recommended. ■ Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. Table A Product name Soldering iron temperature SMD type connectors 300°C within 5 sec. 350°C within 3 sec. Pattern 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) These connector is low profile type. If too much solder is supplied for hand soldering, It makes miss mating because of interference at soldering portion. Please pay attentions. ■ Solder reworking 1) Finish reworking in one operation. 2) In case of soldering rework of bridges. Don’t use supplementary solder flux. Doing so may cause contact problems by flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. Handling Single Components 1) Make sure not to drop or allow parts to fall from work bench. 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. Precautions for mating This product is designed with ease of handling. However, in order to prevent the deformation or damage of contacts and molding, take care and do not mate the connectors as shown right. Press-fitting while the mating inlets of the socket and header are not matched. Strongly pressed and twisted Tilted mating –2– ACCTB48E 201606-T Notes on Using Narrow pitch Connectors/High Current Connectors Cleaning flux from PC board There is no need to clean this product. If cleaning it, pay attention to the following points to prevent the negative effect to the product. 1) Keep the cleaning solvent clean and prevent the connector contacts from contamination. 2) Some cleaning solvents are strong and they may dissolve the molded part and characters, so pure water passed liquid solvent is recommended. Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components alreeady set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Product failures due to condensation are not covered by warranty. Other Notes 1) Do not remove or insert the electrified connector (in the state of carrying current or applying voltage). 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50piece units in the condition given right. Consult a sale representative for ordering sample units. Please refer to the latest product specifications when designing your product. Condition when delivered from manufacturing Reel Embossed tape amount required for the mounting Required number of products for sample production (Delivery can also be made on a reel by customer request.) (Unit 50 pcs.) –3– ACCTB48E 201606-T