PAN1026A
Bluetooth Basic Data Rate and Low Energy Module
Product Specification
Rev. 0.1
Wireless Modules
PAN1026A Bluetooth Module
New Features
Overview
The PAN1026A is a Class 2 Bluetooth 4.2 Basic
Data Rate and Low Energy module for easy
implementation of Bluetooth functionality into
various electronic devices.
•
•
•
Features
• Bluetooth 4.2 Basic Data Rate (BR) and Low
•
•
•
•
•
•
•
•
•
Energy (LE)
•
•
•
•
•
•
•
Embedded SPP profile
Embedded GATT profile
High-level API commands
Bluetooth 4.2 (LE) embedded GATT profile with
high-level API commands, compatible with
Toshiba reference BLE profiles
Operational temperature range -40 to +85 °C
Operational voltage 2.7 V to 3.6 V +/- 10 %
Power consumption Tx: 46 mA
Dimensions 15.6 x 8.7 x 1.9 mm
Increased (2.5 x) BLE data transfer rates through
extended MTU size (64 bytes to 160 bytes)
More complex BLE profiles possible through
extended GATT functionality
Data base pool, number of services and
characteristics, data flow control
Fast SPP classic connection/disconnection times
Interlaced inquiry/page scan & extended inquiry
response
Transmission (Tx) power control
Improved PER (peak-error-rate) for BLE traffic
Integration of BT 4.2 secure connecting feature
implementing ECDH technology
Bluetooth
•
•
•
•
GAP support for SPP
GAP Peripheral and Broadcast support for LE
GATT server and client mode support for LE
GAP Central and Observer not supported for LE
Output power 4 dBm
Interfaces
-88 dBm sensitivity
Integrated high speed crystal oscillator (26 MHz)
•
UART, GPIO (10 input/output pins), wake-up
control pins
Block Diagram
PAN1026A
Bluetooth 4.2 Module
Vcc 3.3 V
EEPROM
32 kbit
UART
Crystal
26 MHz
GPIOs
Chip
antenna
Host wake up
Toshiba
TC35661
Reset
32 kHz input
Wake up
Product Specification Rev. 0.1
LPF
Page 2
PAN1026A Bluetooth Module
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations. Panasonic
reserves the right to make changes as required at any time without notification. Please consult the most
recently issued Product Specification before initiating or completing a design.
© Panasonic Industrial Devices Europe GmbH 2017.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do
not disclose it to a third party.
All rights reserved.
This Product Specification does not lodge the claim to be complete and free of mistakes.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Product Specification and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation or
integration in another product to be sold by the customer,
Deviation or lapse in function of the Engineering Sample,
Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.
Product Specification Rev. 0.1
Page 3
PAN1026A Bluetooth Module
Table of Contents
1
2
3
4
5
6
7
About This Document......................................................................................................................... 5
1.1
Purpose and Audience .............................................................................................................. 5
1.2
Revision History ......................................................................................................................... 5
1.3
Use of Symbols ......................................................................................................................... 5
1.4
Related Documents ................................................................................................................... 5
Overview .............................................................................................................................................. 6
2.1
Block Diagram ........................................................................................................................... 7
2.2
Pin Configuration ....................................................................................................................... 8
2.3
UART Interface ........................................................................................................................ 10
2.4
Bluetooth Features .................................................................................................................. 10
Detailed Description ......................................................................................................................... 11
3.1
Dimensions .............................................................................................................................. 11
3.2
Footprint .................................................................................................................................. 12
3.3
Packaging ................................................................................................................................ 13
3.4
Case Marking .......................................................................................................................... 16
Specification ..................................................................................................................................... 17
4.1
Default Test Conditions ........................................................................................................... 17
4.2
Absolute Maximum Ratings ..................................................................................................... 17
4.3
Recommended Operating Conditions ...................................................................................... 18
4.4
Current Consumption............................................................................................................... 18
4.5
Bluetooth ................................................................................................................................. 19
4.6
Reliability Tests ....................................................................................................................... 19
4.7
Recommended Soldering Profile ............................................................................................. 20
Cautions ............................................................................................................................................ 21
5.1
Design Notes ........................................................................................................................... 21
5.2
Installation Notes ..................................................................................................................... 21
5.3
Usage Condition Notes ............................................................................................................ 22
5.4
Storage Notes .......................................................................................................................... 22
5.5
Safety Cautions ....................................................................................................................... 22
5.6
Other Cautions ........................................................................................................................ 23
5.7
Life Support Policy ................................................................................................................... 23
Regulatory and Certification Information ....................................................................................... 24
6.1
RoHS and REACH Declaration ............................................................................................... 24
6.2
Further Regulatory Information ................................................................................................ 24
Appendix ........................................................................................................................................... 25
7.1
Ordering Information ................................................................................................................ 25
7.2
Contact Details ........................................................................................................................ 26
Product Specification Rev. 0.1
Page 4
PAN1026A Bluetooth Module
1 About This Document
1 About This Document
1.1
Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic PAN1026A module. It is intended for hardware design,
application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to
as “the PAN1026A” or “the module” within this document.
1.2
1.3
Revision History
Revision
Date
Modifications/Remarks
0.1
23.03.2017
1st preliminary version.
Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product. Non-observance
can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates crossreferences within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4
Related Documents
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
Product Specification Rev. 0.1
Page 5
PAN1026A Bluetooth Module
2 Overview
2 Overview
The PAN1026A is based on Toshiba´s single-chip TC35661 Bluetooth semiconductor device
with an embedded Toshiba Bluetooth SIG certified stack. The PAN1026A is a highly integrated
Dual Mode Bluetooth controller that delivers high-speed operation at ultra-low power
consumption. An embedded SPP (Serial Port Profile of Bluetooth Classic) and a GATT (Generic
Attribute Profile of Bluetooth LE) stack are integrated. The module significantly reduces external
component count and power consumption in applications requiring support of Bluetooth 4.2
standards. EDR (Enhanced Data Rate) or Central Mode are not supported. Details about iAP
integration can be provided on request. The integrated EEPROM has a Panasonic
MAC address and it can be used to store link keys.
The module allows for serving both legacy Bluetooth Classic and Bluetooth Low Energy
connections with rapid connection and disconnection, needed by a wide range of applications,
all at a small form factor. Compared to the PAN1026, the PAN1026A has additional features for
secure connections via Bluetooth LE and it is fully backwards compatible. Next to increased low
energy transfer speed, transmission power can also be controlled.
The PAN1026A module is manufactured in a small 15.6 x 8.7 x 1.9 mm SMD package with a
shielded case and it is qualified according to the Bluetooth 2.1 and 4.2 standards.
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
Further information on the variants and versions 7.1 Ordering Information.
Product Specification Rev. 0.1
Page 6
PAN1026A Bluetooth Module
2 Overview
2.1
Block Diagram
PAN1026A
Bluetooth 4.2 Module
Vcc 3.3 V
EEPROM
32 kbit
UART
Crystal
26 MHz
GPIOs
Chip
antenna
Host wake up
Toshiba
TC35661
Reset
32 kHz input
LPF
Wake up
Total capacitor value:
6.7 µF +/-10 %
Total inductance:
2 NH +/-10 %
Total resistance:
220 KΩ +/-10 %
Product Specification Rev. 0.1
Page 7
PAN1026A Bluetooth Module
2 Overview
2.2
Pin Configuration
Pin Assignment
Top View
15.6 mm
5.0
1.2
2.4
F2
F3
F4
F5
F6
F7
F8
F9
E1
E2
E3
E4
E5
E6
E7
E8
E9
D1
D2
D3
D4
D5
D6
D7
D8
D9
C1
C2
C3
C4
C5
C6
C7
C8
C9
B1
B2
B3
B4
B5
B6
B7
B8
B9
A1
A2
A3
A4
A5
A6
A7
A8
A9
F11
F12
A11
A12
1.35
1.2
F1
8.70 mm
0.6
1.35
1.0
0.6
Pin Functions
No
Pin Name
Pin Type
Description
A1 GND
Ground Pin
Connect to ground
A2 NC
NC
Not connected, leave open
A3 Reset
Digital Input
Reset, active low
A4 VCC
Power
analog/digital power supply connection
A5 VCC
Power
analog/digital power supply connection
A6 VCC
Power
analog/digital power supply connection
A7 GND
Ground Pin
Connect to ground
A8 NC
NC
Not connected
A9 GND
Ground Pin
Connect to ground
A11 GND
Ground Pin
Connect to ground
A12 GND
Ground Pin
Connect to ground
Product Specification Rev. 0.1
GPIO No
Page 8
PAN1026A Bluetooth Module
2 Overview
No
Pin Name
GPIO No
Pin Type
Description
NC
Not connected, leave open
B4 NC
NC
Not connected, leave open
B5 NC
NC
Not connected, leave open
B6 NC
NC
Not connected, leave open
B7 NC
NC
Not connected, leave open
B8 NC
NC
Not connected, leave open
B9 NC
NC
Not connected, leave open
C4 NC
NC
Not connected, leave open
C5 NC
NC
Not connected, leave open
B1 NC
B2 BTS
GPIO 11
B3 BTA
GPIO 10
C1 CS0X
GPIO 17
C2 BTI
GPIO 13
C3 WIA
GPIO 12
C6 PCMCLK
GPIO 04
Digital I/O
PCM clock
C7 FSYNC
GPIO 05
Digital I/O
PCM synchronization
C8 GND
Ground Pin
Connect to ground
C9 GND
Ground Pin
Connect to ground
D1 CS1X
GPIO 18
D2 DIN
GPIO 16
D3 GPIO1
GPIO 01
Digital I/O
D4 GPIO0
Digital I/O
D5 NC
NC
Not connected, leave open
Digital Input
PCM In: Not supported
D7 GND
Ground Pin
Connect to ground
D8 GND
Ground Pin
Connect to ground
D9 ANT
RF-Signal
Antenna pin (not connected for standard version)
D6 PCMIN
GPIO 03
E1 SDA
GPIO 15
Digital I/O
I2C interface (only internal), connect to test pin
E2 SCL
GPIO 14
Digital I/O
I2C interface (only internal), connect to test pin
Ground Pin
Connect to ground
E3 GND
E4 USB
USB direct is not supported by the IC. Leave this
pin open.
E5 CLKREQ
Digital Output
Active high once crystal frequency is stable
E6 UART RXD
Digital Input
UART RXD
Product Specification Rev. 0.1
Page 9
PAN1026A Bluetooth Module
2 Overview
No
Pin Name
GPIO No
Pin Type
Description
GPIO 02
Digital Output
PCM Output: not supported
E8 GND
Ground Pin
Connect to ground
E9 GND
Ground Pin
Connect to ground
F1 GND
Ground Pin
Connect to ground
F2 EEPROM_WP
Digital Input
Internal EEPROM Write Protect (active high)
F3 GND
Ground Pin
Connect to ground
F4 GND
Ground Pin
Connect to ground
F5 UART CTS
Digital Input
UART CTS
F6 SLEEPCLK
Digital Input
Input clock for 32.768 KHz
F7 UARTTXD
Digital Output
UART TX
F8 UARTRTS
Digital Output
UART RTS
F9 GND
Ground Pin
Connect to ground
F11 GND
Ground Pin
Connect to ground
F12 GND
Ground Pin
Connect to ground
E7 PCMOUT
2.3
UART Interface
•
•
•
•
•
2.4
Full-duplex 4-wire data transfer: RX, TX, RTS, CTS
Programmable baud rate: 2 400 bps to 4.33 Mbps
Default baud rate: 115 200 bps
Data format: 8N1, LSB first
Error detection: Character timeout, Overrun error, Framing error
Bluetooth Features
•
•
•
•
•
•
Bluetooth 4.0 with SPP & GATT
GAP support for SPP
GATT server and client mode supported for LE
Class 2 TX power w/o external PA (improved link robustness)
Excellent link budget (up to 91 dB), enabling long-range applications
GAP peripheral support for LE
Product Specification Rev. 0.1
Page 10
PAN1026A Bluetooth Module
3 Detailed Description
3 Detailed Description
3.1
Dimensions
All dimensions are in millimeters.
No.
Item
Dimension
Tolerance
Remark
1 Width
8.70
± 0.20
2 Length
15.60
± 0.20
3 Height
1.80
Product Specification Rev. 0.1
± 0.20 With case
Page 11
PAN1026A Bluetooth Module
3 Detailed Description
3.2
Footprint
The outer dimensions have a tolerance of 0.3 mm.
Top View
15.6 mm
5.0
1.2
2.4
F2
F3
F4
F5
F6
F7
F8
F9
E1
E2
E3
E4
E5
E6
E7
E8
E9
D1
D2
D3
D4
D5
D6
D7
D8
D9
C1
C2
C3
C4
C5
C6
C7
C8
C9
B1
B2
B3
B4
B5
B6
B7
B8
B9
A1
A2
A3
A4
A5
A6
A7
A8
A9
F11
F12
A11
A12
1.35
1.2
F1
8.70 mm
0.6
1.35
1.0
0.6
Product Specification Rev. 0.1
Page 12
PAN1026A Bluetooth Module
3 Detailed Description
3.3
Packaging
The product is a mass production status product and will be delivered in the package described
below.
3.3.1
Tape Dimensions
3.3.2
Packing in Tape
Direction of unreeling (for customer)
trailer (empty)
1 x circumference /
hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch
Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Empty spaces in the component packed area shall be less than two per reel and those spaces
shall not be consecutive.
100730-PAN1720.vsd
The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
Product Specification Rev. 0.1
Page 13
PAN1026A Bluetooth Module
3 Detailed Description
3.3.3
Component Direction
3.3.4
Reel Dimension
Product Specification Rev. 0.1
Page 14
PAN1026A Bluetooth Module
3 Detailed Description
3.3.5
Package Label
Example
(1T)
(1P)
(2P)
(9D)
(Q)
(HW/SW)
3.3.6
Lot code
Customer order number, if applicable
Order number
Date code
Quantity
Hardware/software version
Total Package
Product Specification Rev. 0.1
Page 15
PAN1026A Bluetooth Module
3 Detailed Description
3.4
Case Marking
Example
1
2
3
4
5
6
7
8
9
Product Specification Rev. 0.1
MIC ID
Brand name
Hardware/software version
Order number
FCC ID
Lot code
Engineering Sample marking, if applicable
Marking for Pin 1
2D barcode, for internal usage only
Page 16
PAN1026A Bluetooth Module
4 Specification
4 Specification
All specifications are over temperature and process, unless indicated
otherwise.
4.1
Default Test Conditions
Temperature:
Humidity:
Supply Voltage:
4.2
25 ± 10 °C
40 to 85 % RH
3.3 V
Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
Symbol
Parameter
TSTOR
Storage
temperature
VESD
ESD
robustness
Condition
Min.
Typ.
-40
All pads, according to human
body model (HBM), JEDEC
STD 22, method A114
According to charged device
model (CDM), JEDEC STD 22,
method C101
PRF
RF input level
VDIG
Voltage on
any digital
pins
Product Specification Rev. 0.1
-0.3
Max.
Units
+125
°C
1 000
V
500
V
+10
dBm
VDD +
0.3
V
Page 17
PAN1026A Bluetooth Module
4 Specification
4.3
Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not even
momentarily or individually, as permanent damage to the module may result.
4.4
Symbol
Parameter
Condition
Min.
Typ.
TA
Ambient
operating
temperature
range
-40
VDD
3V3 Supply
voltage
2.7
Max.
Units
+85
°C
3.6
V
3.3
Current Consumption
The current consumption depends on the user scenario and on the setup and
timing in the power modes.
Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated.
Parameter
Condition
Idle Current
After reset was pulled down.
Connected
Peak Power
Sending DH5 packets. Max. output power.
62
mA
Connected
Peak Power
Sending DH3 packets. Max. output power.
61
mA
Connected
Peak Power
Sending DH1 packets. Max. output power.
55
mA
Sleep mode
activated
Sniff mode/not connected/BLE Advertising
Product Specification Rev. 0.1
Min.
Typ.
Max.
Units
mA
7.8
2
mA
Page 18
PAN1026A Bluetooth Module
4 Specification
4.5
Bluetooth
Parameter
Condition
Min.
Operation
frequency
range
Channel
spacing
Typ.
2 402
2 480
BT-Classic/BLE
Output Power Maximum setting, measured at dual ended 50
ohm.
Sensitivity
4.6
Max.
Symbol
Parameter
Condition
1
Spurious
emissions
Conducted measurement with a
50 Ω dual-ended load.
Complies with EN 300 328,
EN 300 440 class 2, FCC
CFR47, Part 15 and ARIB STDT-66.
Min.
Units
MHz
1/2
MHz
4
dBm
-88
dBm
Typ.
Max.