UPC393C

DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC393 LOW POWER DUAL COMPARATORS DESCRIPTION The µPC393 is a dual comparator which is designed to operate from a single power supply over a wide range of voltage. Operation from split power supplies is also possible and the power supply current drain is very low. Further advantage, the input common-mode voltage includes ground, even though operated from a single power supply voltage. FEATURES • Common-mode input voltage range includes V– • Wide supply voltage range 2 V to 32 V (Single) ± 1 V to ± 16 V (Split) • Low supply current • Open collector output EQUIVALENT CIRCUIT (1/2 Circuit) PIN CONFIGURATION (Top View) µ PC393C, 393G2 OUT1 1 8 V+ 7 OUT2 1 –+ V 100 µ A + Q1 – Q7 Q5 Q6 Q2 Q3 100 µ A + I I1 2 2 + – I N1 3 6 I I2 5 I N2 IN Q4 Q8 OUT V– 4 II µ PC393HA V– 1 V+ 1 –+ 2 OUT1 2 +– 5 V– 3 I I1 4 I N1 6 I N2 7 I I2 8 OUT 2 9 V+ ORDERING INFORAMTION Part Number Package 8-pin plastic DIP (300 mil) 8-pin plastic SOP (225 mil) 9-pin plastic slim SIP µPC393C µPC393G2 µPC393HA The information in this document is subject to change without notice. Document No. G11766EJ3V0DS00 (3rd edition) (Previous No. IC-1971) Date Published April 1997 N Printed in Japan The mark shows major revised points. © 1989 µPC393 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C) Parameter Voltage between V+ and V– Differential Input Voltage Input Voltage Output Voltage Power Dissipation C Package Note 2 Note 3 Note 4 Note 1 Symbol V+ – V – VID VI VO PT Ratings –0.3 to +36 ± 36 V– –0.3 to V– +36 V– –0.3 to V– +36 350 440 350 Indefinite TA Tstg –20 to +80 –55 to + 125 Unit V V V V mW mW mW sec °C °C G2 Package Note 5 HA Package Note 4 Output Short Circuit Duration Operating Ambient Temperature Storage Temperature Note 6 Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction independent of the magnitude of V+. Either input signal should not be allowed to go negative by more than 0.3 V. The normal operation will establish when any input is within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction independent of the magnitude of V+. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. 4. Thermal derating factor is –5.0 mW/°C when operating ambient temperature is higher than 55 °C. 5. Thermal derating factor is –4.4 mW/°C when operating ambient temperature is higher than 25 °C. 6. Short circuits from the output to V+ can cause destruction. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage (Split) Supply Voltage (V = GND) – Symbol V V ± MIN. ±1 +2 TYP. MAX. ± 16 +32 Unit V V + 2 µPC393 ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = 5 V, V– = GND) Parameter Input Offset Voltage Input Offset Current Input Bias Current Voltage Gain Supply Current Common Mode lnput Voltage Range Output Saturation Voltage Output Sink Current Output Leakage Current Response Time Symbol VIO IIO IB AV ICC VICM VOL IO SINK IO LEAK VIN (–) = 1 V, VIN (+) = 0 V, IO SINK = 4 mA VIN (–) = 1 V, VIN (+) = 0 V, VO ≤ 1.5 V VIN (+) = 1 V, VIN (–) = 0 V, VO = 5 V RL = 5.1 kΩ, VRL = 5 V 6 Conditions VO = 1.4 V, VREF = 1.4 V, RS = 0 Ω VO · · 1.4 V = VO · · 1.4 V = R L = 1 5 kΩ RL = ∞, IO = 0 A, Both Comparators 0 0.2 16 0.1 1.3 MIN. TYP. ±2 ±5 25 200 0.6 + MAX. ±5 ± 50 250 Unit mV nA nA V/mV 1 V –1.5 0.4 mA V V mA nA µs 3 µPC393 APPLICATION CIRCUIT EXAMPLE V+ VIN 2, 6 – RL 8 OUT 1, 7 3, 5 VREF + 4 VREF: V– to V+ –1.5 (V) COMPARATOR with HYSTERESIS CIRCUIT V+ VRL VIN – RL OUT + R2 VREF R1 • Threshold voltage · VTH (High) = VREF + · · VTH (Low) = VREF – · R1 (VRL – VREF) RL + R2 + R1 R1 (VREF – VOL) R1 + R2 (VRL > VREF > VOL) 4 µPC393 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25 °C, TYP.) POWER DISSIPATION RL = ∞ IO = 0A TA = 0 °C 0.8 TA = 25 °C SUPPLY CURRENT 500 PT - Total Dissipation - mW ICC - Supply Current - mA 393G2 400 393C, 393HA 300 1.0 200 0.6 TA = 70 °C 100 0.4 20 40 60 80 100 0 + 0 10 20 – 30 40 TA - Operating Ambient Temperature - °C V - Supply Voltage - V (V = GND) INPUT OFFSET VOLTAGE 3 V+ = +5 V V– = GND VIO - Input Offset Voltage - mV 2 IB - Input Bias Current - nA 40 50 INPUT BIAS CURRENT TA = 0 °C 1 0 30 TA = 25 °C –1 20 TA = 70 °C –2 –3 –40 –20 0 20 40 60 80 10 0 V+ 10 20 (V– 30 = GND) 40 TA - Operating Ambient Temperature - °C OUTPUT SATURATION VOLTAGE 10 VOL - Output Saturation Voltage - V - Supply Voltage - V 1 0.1 TA = 70 °C 0.01 TA = 25 °C TA = 0 °C 0.001 0.01 0.1 1 10 100 IO SINK - Output Sink Current - mA 5 µPC393 RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES I VO - Output Voltage - V 5.0 mV Input Overdrive 5 4 3 2 1 0 0 –50 –100 0 0.5 1.0 t - Time - µ s 1.5 2.0 TA = 25 °C 100 mV 20 mV VIN – + RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES II VO - Output Voltage - V 100 mV Input Overdrive 5 4 3 2 1 0 VIN 100 TA = 25 °C 50 0 0 0.5 1.0 t - Time - µ s 1.5 2.0 – + +5 V 5.1 kΩ VO 5 mV 20 mV 5.1 kΩ VO +5 V VIN - Input Voltage - mV 6 VIN - Input Voltage - mV µPC393 PACKAGE DRAWINGS 8PIN PLASTIC DIP (300 mil) 8 5 1 A I 4 K P L J H G F D N M C B M R NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. ITEM A B C D F G H I J K L M N P R MILLIMETERS 10.16 MAX. 1.27 MAX. 2.54 (T.P.) 0.50±0.10 1.4 MIN. 3.2±0.3 0.51 MIN. 4.31 MAX. 5.08 MAX. 7.62 (T.P.) 6.4 0.25 +0.10 –0.05 0.25 0.9 MIN. 0~15 ° INCHES 0.400 MAX. 0.050 MAX. 0.100 (T.P.) 0.020 +0.004 –0.005 0.055 MIN. 0.126±0.012 0.020 MIN. 0.170 MAX. 0.200 MAX. 0.300 (T.P.) 0.252 0.010 +0.004 –0.003 0.01 0.035 MIN. 0~15 ° P8C-100-300B,C-1 7 µPC393 8 PIN PLASTIC SOP (225 mil) 8 5 detail of lead end 1 A 4 G P H I J F K E B C D M M L N NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM A B C D E F G H I J K L M N P MILLIMETERS 5.37 MAX. 0.78 MAX. 1.27 (T.P.) 0.40 +0.10 –0.05 0.1±0.1 1.8 MAX. 1.49 6.5±0.3 4.4 1.1 0.15 +0.10 –0.05 0.6±0.2 0.12 0.10 ° 3 ° +7° –3 INCHES 0.212 MAX. 0.031 MAX. 0.050 (T.P.) 0.016 +0.004 –0.003 0.004±0.004 0.071 MAX. 0.059 0.256±0.012 0.173 0.043 0.006 +0.004 –0.002 0.024 +0.008 –0.009 0.005 0.004 ° 3 ° +7° –3 S8GM-50-225B-4 8 µPC393 9 PIN PLASTIC SLIM SIP A N M 1 9 Q Y C K H G M V U F Z J NOTE Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. ITEM A C F G H J K M N Q U V Y Z MILLIMETERS 22.86 MAX. 1.1 MIN. 0.5±0.1 0.25 2.54 1.27 MAX. 0.51 MIN. 5.08 MAX. 2.8±0.2 5.75 MAX. 1.5 MAX. 0.25 +0.10 –0.05 3.2±0.5 1.1 MIN. INCHES 0.900 MAX. 0.043 MIN. 0.02 +0.004 –0.005 0.010 0.100 0.050 MAX. 0.020 MIN. 0.200 MAX. 0.11+0.009 –0.008 0.227 MAX. 0.059 MAX. 0.01+0.004 –0.003 0.126±0.02 0.043 MIN. P9HA-254B-1 9 µPC393 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Type of surface mount device µPC393G2: 8-pin plastic SOP (225 mil) Process Infrared Ray Reflow Conditions Peak temperature: 230 °C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 1 time. Peak temperature: 215 °C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 1 time. Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). Pin temperature: 300 °C or below, Heat time: 3 seconds or less (Per each side of the device). Symbol IR30-00-1 Vapor Phase Soldering VP15-00-1 Wave Soldering WS60-00-1 Partial Heating Method – Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. Type of through-hold device µPC393C : 8-pin plastic DIP (300 mil) µPD393HA : 9-pin plastic slim SIP Process Wave Soldering (only to leads) Partial Heating Method Conditions Solder temperature: 260 °C or below, Flow time: 10 seconds or less. Pin temperature: 300 °C or below, Heat time: 3 seconds or less (per each lead.) Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 10 µPC393 REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL IC PACKAGE MANUAL GUIDE TO QUALITY ASSUARANCE FOR SEMICONDUCTOR DEVICES SEMICONDUCTORS SELECTION GUIDE NEC SEMICONDUCTOR DEVICE RELIABILITY/ QUALITY CONTROL SYSTEM - STANDARD LINEAR IC C11531E C10535E C10943X MEI-1202 X10679E IEI-1212 11 µPC393 [MEMO] The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 2