MC68MH360AI33L

Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc... Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square Junction to Ambient Thermal Resistance or Theta JA (RθJA) was measured per SEMI Test Method G38-87 at 1.5 watts in a horizontal configuration. The test board conforms to EIA/JESD 51-3; it is a single layer 115x102 mm board designed to test 0.5 mm pitch QFP packages from 208 to 304 leads. The trace width is 0.24 mm, trace thickness is 0.076 mm. Sample size was 5. Convection Natural 100 ft/min 200 400 800 Theta JA Average °C/watt 31.0 27.7 26.1 23.7 19.9 Standard Deviation °C/watt 0.08 0.18 0.1 0.34 0.11 Theta JA Ave + 3 Std. Dev. °C/watt 31.3 28.3 26.4 24.7 20.2 "Thermal resistance" from junction to a thermocouple on top center of case, previously titled Theta J-Ref (RθJR), was been renamed by the industry standard committee JEDEC JC15.1 as Ψ JT and defined in EIA/JESD51-2. It is a useful value to use to estimate junction temperature in steady state customer environments. Convection Natural 100 ft/min 200 400 800 Ψ JT Average °C/watt 1.9 2.3 2.5 3.1 3.9 Standard Deviation °C/watt 0.09 0.06 0.04 0.08 0.1 For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Junction to case thermal resistance, Theta JC (RθJC), was measured using the cold plate technique with the cold plate temperature used as the "case" temperature. The reference specifications are MIL-STD 883D, Method 1012.1 and SEMI G30-88. Sample size was 5. Freescale Semiconductor, Inc... Theta JC Average °C/watt 8.9 Standard Deviation °C/watt 0.07 Theta JC Ave + 3 Std. Dev. °C/watt 9.1 Junction to board thermal resistance Theta JB (RθJB) was measured using a cold plate technique with the cold plate in thermal contact with the bottom of the printed circuit board. The board temperature was measured with a thermocouple soldered to a center lead along one side of the package where the lead was soldered to the board. The measurement was taken using the 4 conductor layer printed circuit board described below. Sample size is 5. Theta JB Average °C/watt 18.8 Standard Deviation °C/watt 0.19 Theta JB Ave + 3 Std. Dev. °C/watt 19.4 Junction to Ambient Thermal Resistance (Theta JA) was also measured on a four layer test board. The test board was a 115x102 mm board designed to test 0.5 mm pitch QFP packages from 208 to 304 leads with two solid internal plane of 1 oz nominal thickness (0.033 mm thick). The trace pattern on the component side had a trace width of 0.231 mm, trace thickness of 0.0715 mm. Sample size was 5. Do Not Use this data without special footnote indicating that the results were measured on a board with two solid internal planes. Convection Theta JA Standard Theta JA Average Deviation Ave + 3 Std. Dev. °C/watt °C/watt °C/watt Natural 26.1 0.11 26.4 100 ft/min 23.8 0.13 24.2 200 22.8 0.13 23.2 400 21.3 0.19 21.9 800 18.6 0.16 19.1 SEMI specifications are available from Semiconductor Equipment and Materials International at (415) 964-5111. MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or 303-397-7956. For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... From Bennett Joiner Ruth Reinhardt Home Page: www.freescale.com email: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 (800) 521-6274 480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku Tokyo 153-0064, Japan 0120 191014 +81 2666 8080 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate, Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 (800) 441-2447 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor @hibbertgroup.com EMAIL RXMN60 RBDT20 Phone 512-933-7597 512-933-6407 FAX 512-933-6344 512-933-6344 RoHS-compliant and/or Pb- free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb- free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale.s Environmental Products program, go to http://www.freescale.com/epp. Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. For More Information On This Product, Go to: www.freescale.com