UBA2014
600 V driver IC for HF fluorescent lamps
Rev. 04 — 16 October 2008
Product data sheet
1. General description
The IC is a monolithic integrated circuit for driving electronically ballasted fluorescent
lamps, with mains voltages up to 277 V (RMS) (nominal value).
The circuit is made in a 650 V Bipolar CMOS DMOS (BCD) power-logic process.
It provides the drive function for the two discrete power MOSFETs.
Besides the drive function, the IC also includes the level-shift circuit, the oscillator
function, a lamp voltage monitor, a current control function, a timer function and
protections.
2. Features
n
n
n
n
n
n
n
n
n
Adjustable preheat time
Adjustable preheat current
Current controlled operating
Single ignition attempt
Adaptive non-overlap time control
Integrated high-voltage level-shift function
Power-down function
Protection against lamp failures or lamp removal
Capacitive mode protection
3. Applications
n The circuit topology enables a broad range of ballast applications at different mains
voltages for driving lamp types from T8, T5, PLC, T10, T12, PLL and PLT, for example.
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
4. Quick reference data
Table 1.
Quick reference data
VDD = 13 V; VFVDD − VSH = 13 V; Tamb = 25 °C; all voltages are referenced to GND; see test circuit of Figure 8; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Start-up state
VDD(stop)
oscillator stop supply
voltage
8.6
9.1
9.6
V
VDD(start)
oscillator start supply
voltage
12.4
13.0
13.6
V
IDD(start)
oscillator start-up supply
current
VDD < VDD(start)
-
170
200
µA
IHS < 30 µA
-
-
570
V
IL = 10 µA
2.86
2.95
3.04
V
High-voltage supply
high-side supply voltage
VHS
Reference voltage
reference voltage
VVREF
Voltage controlled oscillator
fmax
maximum bridge frequency
90
100
110
kHz
fmin
minimum bridge frequency
38.9
40.5
42.1
kHz
High-side output driver
Io(source)
output source current
VGH − VSH = 0 V
135
180
235
mA
Io(sink)
output sink current
VGH − VSH = 13 V
265
330
415
mA
0.57
0.60
0.63
V
Preheat current sensor
preheat voltage
Vph
Lamp voltage sensor
Vlamp(fail)
lamp fail voltage
0.77
0.81
0.85
V
Vlamp(max)
maximum lamp voltage
1.44
1.49
1.54
V
Average current sensor
Voffset
offset voltage
VCSP = VCSN = 0 V to 2.5 V
−2
0
+2
mV
gm
transconductance
f = 1 kHz
1900
3800
5700
µA/mV
tph
preheat time
CCT = 330 nF;
RIREF = 33 kΩ
1.6
1.8
2.0
s
VOL
LOW-level output voltage
-
1.4
-
V
VOH
HIGH-level output voltage
-
3.6
-
V
Preheat timer
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
UBA2014T
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
UBA2014P
DIP16
plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
2 of 19
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NXP Semiconductors
UBA2014_4
Product data sheet
6. Block diagram
VREF
VDD
7
14
3V
9
Vpd
SUPPLY
BOOTSTRAP
LEVEL
SHIFTER
reference
voltages
digital
FVDD
HS
DRIVER
10
11
supply (5 V)
LS
DRIVER
analog
UBA2014
6
GH
SH
GL
VDD(L)
GND
5
DRIVER
LOGIC
reset
COUNTER
1
8
LAMP
VOLTAGE
SENSOR
15
16
AVERAGE
CURRENT
SENSOR
I
Vlamp(fail)
V
Fig 1.
Block diagram
PCS
13
FREQUENCY
CONTROL
2
CF
LVS
CSW
CSP
CSN
UBA2014
3
Vlamp(max)
mgw579
IREF
ACM
600 V driver IV for HF fluorescent lamps
3 of 19
© NXP B.V. 2008. All rights reserved.
4
PCS
12
LOGIC
VOLTAGE
CONTROLLED
OSCILLATOR
REFERENCE
CURRENT
• reset state
• start-up state
• preheat state
• ignition state
• burn state
• hold state
• power-down state
LOGIC
Rev. 04 — 16 October 2008
LOGIC
CT
ANT/CMD
STATE LOGIC
PREHEAT TIMER
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
7. Pinning information
7.1 Pinning
CT
1
16 CSN
CT
1
16 CSN
CSW
2
15 CSP
CSW
2
15 CSP
CF
3
14 VREF
CF
3
14 VREF
IREF
4
13 LVS
IREF
4
GND
5
12 ACM
13 LVS
UBA2014P
UBA2014T
GND
5
12 ACM
GL
6
11 SH
GL
6
11 SH
VDD
7
10 GH
VDD
7
10 GH
PCS
8
PCS
8
9
FVDD
001aad405
Fig 2.
9
FVDD
001aad486
Pin configuration (SO16)
Fig 3.
Pin configuration (DIP16)
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
CT
1
preheat timer output
CSW
2
input of voltage controlled oscillator
CF
3
voltage controlled oscillator output
IREF
4
internal reference current input
GND
5
ground
GL
6
gate output for the low-side switch
VDD
7
low-voltage supply
PCS
8
preheat current sensor input
FVDD
9
floating supply voltage; supply for high-side switch
GH
10
gate output for the high-side switch
SH
11
source for the high-side switch
ACM
12
capacitive mode input
LVS
13
lamp voltage sensor input
VREF
14
reference voltage output
CSP
15
positive input for the average current sensor
CSN
16
negative input for the average current sensor
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
4 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
8. Functional description
8.1 Start-up state
Initial start-up can be achieved by charging the low-voltage supply capacitor C7
(see Figure 8) via an external start-up resistor. Start-up of the circuit is achieved under the
condition that both half bridge transistors TR1 and TR2 are non-conductive. The circuit
will be reset in the start-up state. If the low-voltage supply (VDD) reaches the value of
VDD(start) the circuit will start oscillating. A DC reset circuit is incorporated in the High-Side
(HS) driver. Below the lockout voltage at the FVDD pin the output voltage (VGH − VSH) is
zero. The voltages at pins CF and CT are zero during the start-up state.
8.2 Oscillation
The internal oscillator is a Voltage Controlled Oscillator (VCO) circuit which generates a
sawtooth waveform between the VCF(high) level and 0 V. The frequency of the sawtooth is
determined by capacitor CCF, resistor RIREF, and the voltage at pin CSW. The minimum
and maximum switching frequencies are determined by RIREF and CCF; their ratio is
internally fixed. The sawtooth frequency is twice the half bridge frequency. The UBA2014
brings the transistors TR1 and TR2 into conduction alternately with a duty cycle of
approximately 50 %. An overview of the oscillator signal and driver signals is illustrated in
Figure 4. The oscillator starts oscillating at fmax. During the first switching cycle the
Low-Side (LS) transistor is switched on. The first conducting time is made extra long to
enable the bootstrap capacitor to charge.
8.3 Adaptive non-overlap
The non-overlap time is realized with an Adaptive Non-overlap circuiT (ANT). By using an
adaptive non-overlap circuit, the application can determine the duration of the non-overlap
time and make it optimum for each frequency; see Figure 4. The non-overlap time is
determined by the slope of the half bridge voltage, and is detected by the signal across
resistor R16 which is connected directly to pin ACM. The minimum non-overlap time is
internally fixed. The maximum non-overlap time is internally fixed at approximately 25 %
of the bridge period time. An internal filter of 30 ns is included at the ACM pin to increase
the noise immunity.
8.4 Timing circuit
A timing circuit is included to determine the preheat time and the ignition time. The circuit
consists of a clock generator and a counter.
The preheat time is defined by CCT and RIREF and consists of 7 pulses at CCT; the
maximum ignition time is 1 pulse at CCT. The timing circuit starts operating after the
start-up state, as soon as the low supply voltage (VDD) has reached VDD(start) or when a
critical value of the lamp voltage (Vlamp(fail)) is exceeded. When the timer is not operating
CCT is discharged to 0 V at 1 mA.
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
5 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
8.5 Preheat state
After starting at fmax, the frequency decreases until the momentary value of the voltage
across sense resistor R14 reaches the internally fixed preheat voltage level (pin PCS). At
crossing the preheat voltage level, the output current of the
Preheat Current Sensor (PCS) circuit discharges the capacitor CCSW, thus raising the
frequency. The preheat time begins at the moment that the circuit starts oscillating. During
the preheat time the Average Current Sensor (ACS) circuit is disabled. An internal filter of
30 ns is included at pin PCS to increase the noise immunity.
8.6 Ignition state
After the preheat time the ignition state is entered and the frequency will sweep down due
to charging of the capacitor at pin CSW with an internally fixed current; see Figure 5.
During this continuous decrease in frequency, the circuit approaches the resonant
frequency of the load. This will cause a high voltage across the load, which normally
ignites the lamp. The ignition voltage of a lamp is designed above the Vlamp(fail) level. If the
lamp voltage exceeds the Vlamp(fail) level the ignition timer is started.
8.7 Burn state
If the lamp voltage does not exceed the Vlamp(max) level the voltage at pin CSW will
continue to increase until the clamp level at pin CSW is reached; see Figure 5. As a
consequence the frequency will decrease until the minimum frequency is reached.
When the frequency reaches its minimum level it is assumed that the lamp has ignited and
the circuit will enter the burn state. The ACS circuit will be enabled. As soon as the
averaged voltage across sense resistor R14, measured at pin CSN, reaches the reference
level at pin CSP, the average current sensor circuit will take over the control of the lamp
current. The average current through R14 is transferred to a voltage at the voltage
controlled oscillator and regulates the frequency and, as a result, the lamp current.
8.8 Lamp failure mode
8.8.1 During ignition state
If the lamp does not ignite, the voltage level increases. When the lamp voltage exceeds
the Vlamp(max) level, the voltage will be regulated at the Vlamp(max) level; see Figure 6.
When the Vlamp(fail) level is crossed the ignition timer has already started. If the voltage at
pin LVS is above the Vlamp(fail) level at the end of the ignition time the circuit stops
oscillating and is forced into the Power-down mode. The circuit will be reset only when the
supply voltage is powered down.
8.8.2 During burn state
If the lamp fails during normal operation, the voltage across the lamp will increase and the
lamp voltage will exceed the Vlamp(fail) level; see Figure 7. At that moment the ignition timer
is started. If the lamp voltage increases further it will reach the Vlamp(max) level. This forces
the circuit to reenter the ignition state and results in an attempt to re-ignite the lamp. If
during restart the lamp still fails, the voltage remains high until the end of the ignition time.
At the end of the ignition time the circuit stops oscillating and the circuit will enter the
Power-down mode.
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
6 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
8.9 Power-down mode
The Power-down mode will be entered if, at the end of the ignition time, the voltage at
pin LVS is above Vlamp(fail). In the Power-down mode the oscillator will be stopped and
both TR1 and TR2 will be non-conductive. The VDD supply is internally clamped. The
circuit is released from the Power-down mode by lowering the low-voltage supply below
VDD(reset).
8.10 Capacitive mode protection
The signal across R16 also gives information about the switching behavior of the half
bridge. If, after the preheat state, the voltage across the ACM resistor (R16) does not
exceed the VCMD level during the non-overlap time, the Capacitive Mode Detection (CMD)
circuit assumes that the circuit is in the capacitive mode of operation. As a consequence
the frequency will directly be increased to fmax. The frequency behavior is decoupled from
the voltage at pin CSW until CCSW has been discharged to zero.
8.11 Charge coupling
Due to parasitic capacitive coupling to the high voltage circuitry all pins are burdened with
a repetitive charge injection. Given the typical application the pins IREF and CF are
sensitive to this charge injection. For charge coupling of approximately 8 pC, a safe
functional operation of the IC is guaranteed, independent of the current level.
Charge coupling at current levels below 50 µA will not interfere with the accuracy of the
VCS, VPCS and VACM levels.
Charge coupling at current levels below 20 µA will not interfere with the accuracy of any
parameter.
8.12 Design equations
The following design equations are used to calculate the desired preheat time, the
maximum ignition time, and the minimum and the maximum switching frequency.
C CT
R IREF
t ph = 1.8 × ------------------------- × -------------------3–9
330 × 10
33 × 10
(1)
C CT
R IREF
t ign = 0.26 × ------------------------×
------------------–9
3
330 × 10
33 × 10
(2)
– 12
3
33 × 10
3 100 × 10
f min = 40.5 × 10 × ---------------------------- × -------------------C CF
R IREF
(3)
f max = 2.5 × f min
(4)
Start of ignition is defined as the moment at which the measured lamp voltage crosses the
Vlamp(fail) level; see Section 8.8.
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
7 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
mgw582
VCF
0
V(GH-SH)
0
VGL
0
Vhalfbridge
0
VACM
0
time
Fig 4.
Oscillator and driver signals
Vlamp
preheat state
ignition
state
burn state
Vlamp(max)
Vlamp(fail)
f min detection
Timer
on
off
time
Fig 5.
Normal ignition behavior
UBA2014_4
Product data sheet
mgw583
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
8 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
Vlamp
ignition
state
preheat state
power-down
state
Vlamp(max)
Vlamp(fail)
Timer
on
timer
ended
off
time
Fig 6.
mgw584
Failure mode during ignition
Vlamp
burn state
ignition
state
power-down
state
Vlamp(max)
Vlamp(fail)
Timer
on
timer
started
timer
ended
off
time
Fig 7.
Failure mode during burn
UBA2014_4
Product data sheet
mgw585
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
9 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to GND.
Symbol
Parameter
Conditions
Min
Max
Unit
VHS
high-side supply voltage
IHS < 30 µA; t < 1 s
-
600
V
-
570
V
VVDD
voltage at pin VDD
-
14
V
VACM
voltage at pin ACM
−5
+5
V
VPCS
voltage at pin PCS
−5
+5
V
IHS < 30 µA
VLVS
voltage at pin LVS
0
5
V
VCSP
voltage at pin CSP
0
5
V
VCSN
voltage at pin CSN
−0.3
+5
V
VCSW
voltage at pin CSW
0
5
V
Tamb
ambient temperature
−25
+80
°C
Tj
junction temperature
−25
+150
°C
Tstg
storage temperature
−55
+150
°C
Vesd
electrostatic discharge voltage
[1]
pins FVDD, GH and SH
[1]
−1000
+1000
V
pins CT, CSW, CF, IREF, GL, VDD,
PCS, CSN, CSP, VREF, LVS and ACM
[1]
−2500
+2500
V
In accordance with the human body model, i.e. equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
10. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from junction to ambient
in free air
Rth(j-pin)
Typ
Unit
SO16
100
K/W
DIP16
60
K/W
SO16
50
K/W
DIP16
30
K/W
thermal resistance from junction to pin
in free air
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
10 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
11. Characteristics
Table 6.
Characteristics
VDD = 13 V; VFVDD − VSH = 13 V; Tamb = 25 °C; all voltages referenced to GND; see test circuit of Figure 8; unless otherwise
specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Start-up state: pin VDD
VDD
supply voltage
TR1 = off; TR2 = off
-
-
6
V
VDD(reset)
reset supply voltage
TR1 = off; TR2 = off
4.5
5.5
7.0
V
VDD(stop)
oscillator stop supply voltage
8.6
9.1
9.6
V
VDD(start)
oscillator start supply voltage
12.4
13.0
13.6
V
VDD(hys)
start-stop hysteresis supply
voltage
3.5
3.9
4.4
V
VDD(clamp)
clamp supply voltage
Power-down mode
10
11
12
V
IDD(start)
start-up supply current
VDD < VDD(start)
-
170
200
µA
IDD(pd)
power-down supply current
VDD = 9 V
-
170
200
µA
IDD
supply current
fbridge = 40 kHz without gate
drive
-
1.5
2.2
mA
600 V at high-voltage pins
-
-
30
µA
High-voltage supply: pins GH, SH and FVDD
IL
latching current
Reference voltage: pin VREF
Vref
reference voltage
IL = 10 µA
2.86
2.95
3.04
V
∆VVREF
reference voltage stability
IL = 10 µA;
Tamb = 25 °C to 150 °C
-
−0.64
-
%
Isource
source current
1
-
-
mA
Isink
sink current
1
-
-
mA
Zo
output impedance
-
3.0
-
Ω
IL = 1 mA source
Current supply: pin IREF
VI
input voltage
-
2.5
-
V
II
input current
65
-
95
µA
2.7
3.0
3.3
V
2.8
3.1
3.4
V
Voltage controlled oscillator
Output: pin CSW
Vo
output control voltage
Vclamp
clamp voltage
burn state
Voltage controlled oscillator output: pin CF
fmax
maximum frequency
90
100
110
kHz
fmin
minimum frequency
38.9
40.5
42.1
kHz
∆fstab
frequency stability
Tamb = −20 °C to +80 °C
-
1.3
-
%
tstart
first output oscillator stroke time
-
50
-
µs
tno(min)
minimum non-overlap time
GH to GL
0.68
0.90
1.13
µs
0.75
1.00
1.25
µs
-
7.5
-
µs
-
2.5
-
V
GL to GH
tno(max)
maximum non-overlap time
fbridge = 40 kHz
VCF(high)
high-level oscillator output
voltage
f = fmin
UBA2014_4
Product data sheet
[1]
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
11 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
Table 6.
Characteristics …continued
VDD = 13 V; VFVDD − VSH = 13 V; Tamb = 25 °C; all voltages referenced to GND; see test circuit of Figure 8; unless otherwise
specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Io(start)
oscillator output start current
VCF = 1.5 V
3.8
4.5
5.2
µA
Io(min)
minimum oscillator output current VCF = 1.5 V
-
21
-
µA
Io(max)
maximum oscillator output
current
VCF = 1.5 V
-
54
-
µA
Output drivers
High-side driver output: pin GH
VOH
HIGH-level output voltage
Io = 10 mA
12.5
-
-
V
VOL
LOW-level output voltage
Io = 10 mA
-
-
0.5
V
Io(source)
output source current
VGH − VSH = 0 V
135
180
235
mA
Io(sink)
output sink current
VGH − VSH = 13 V
265
330
415
mA
Ron
on resistance
Io = 10 mA
32
39
45
Ω
Roff
off resistance
Io = 10 mA
16
21
26
Ω
Low-side driver output: pin GL
VOH
HIGH-level output voltage
Io = 10 mA
12.5
-
-
V
VOL
LOW-level output voltage
Io = 10 mA
-
-
0.5
V
Io(source)
output source current
VGL = 0
135
200
235
mA
Io(sink)
output sink current
VGL = 13 V
265
330
415
mA
Ron
on resistance
Io = 10 mA
32
39
45
Ω
Roff
off resistance
Io = 10 mA
16
21
26
Ω
2.8
3.5
4.2
V
DC level at
VGH − VSH = 13 V
-
35
-
µA
I = 5 mA
1.3
1.7
2.1
V
VPCS = 0.6 V
-
-
1
µA
0.57
0.60
0.63
V
Floating supply voltage: pin FVDD
VFVDD
lockout voltage
IFVDD
floating well supply current
Bootstrap diode
Vboot
bootstrap diode forward drop
voltage
Preheat current sensor
Input: pin PCS
Ii
input current
Vph
preheat voltage
Output: pin CSW
Io(source)
output source current
VCSW = 2.0 V
9.0
10
11
µA
Io(sink)
output sink current
VCSW = 2.0 V
-
10
-
µA
-
-
1
µA
Adaptive non-overlap and capacitive mode detection; pin ACM
Ii
input current
VACM = 0.6 V
VCMDP
positive capacitive mode
detection voltage
80
100
120
mV
VCMDN
negative capacitive mode
detection voltage
−68
−85
−102
mV
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
12 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
Table 6.
Characteristics …continued
VDD = 13 V; VFVDD − VSH = 13 V; Tamb = 25 °C; all voltages referenced to GND; see test circuit of Figure 8; unless otherwise
specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VLVS = 0.81 V
-
-
1
µA
0.77
0.81
0.85
V
119
144
169
mV
1.44
1.49
1.54
V
Lamp voltage sensor
Input: pin LVS
Ii
input current
Vlamp(fail)
lamp fail voltage
Vlamp(fail)(hys) lamp fail hysteresis voltage
Vlamp(max)
maximum lamp voltage
Output: pin CT
Io(sink)
output sink current
VCSW = 2.0 V
27
30
33
µA
Io(source)
ignition output source current
VCSW = 2.0 V
9.0
10
11
µA
Average current sensor
Input: pins CSP and CSN
Ii
input current
VCS = 0 V
-
-
1
µA
Voffset
offset voltage
VCSP = VCSN = 0 V to 2.5 V
−2
0
+2
mV
gm
transconductance
f = 1 kHz
1900
3800
5700
µA/mV
source and sink; VCSW = 2 V
85
95
105
µA
Output: pin CSW
output current
Io
Preheat timer; pin CT
tph
preheat time
CCT = 330 nF;
RIREF = 33 kΩ
1.6
1.8
2.0
s
tign
ignition time
CCT = 330 nF;
RIREF = 33 kΩ
-
0.32
-
s
Io
output current
VCT = 2.5 V
5.5
5.9
6.3
µA
VOL
LOW-level output voltage
-
1.4
-
V
VOH
HIGH-level output voltage
-
3.6
-
V
Vhys
hysteresis voltage
2.05
2.20
2.35
V
[1]
The maximum non-overlap time is determined by the level of the CF signal. If this signal exceeds a level of 1.25 V, the non-overlap will
end, resulting in a maximum non-overlap time of 7.5 µs at a bridge frequency of 40 kHz.
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
13 of 19
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NXP Semiconductors
UBA2014_4
Product data sheet
12. Application information
F1
1A
D1
BYD77D
9 FVDD
C5
100 nF
10 GH
BOOTSTRAP
HIGH SIDE
DRIVER
VDD 7
TR1
IRF820
R10
1 MΩ
R1
1 MΩ
L1
11 SH
1.9 mH
C6
1.2 nF
TR2
IRF820
6 GL
LOW SIDE
DRIVER
C10
5.6 nF
Rev. 04 — 16 October 2008
ADAPTIVE
NON-OVERLAP TIMING
AND CAPACITIVE
MODE DETECTOR
UBA2014
+
VDC
400 V
Z1
12 V
12 ACM
R16
1.5 Ω
CT 1
PREHEAT
TIMER
C7
330 nF
DIVIDER
8 PCS
LAMP
VOLTAGE
SENSOR
13 LVS
AVERAGE
CURRENT
SENSOR
5
3
2
14
IREF
GND
CF
CSW
VREF
R12
33 kΩ
C14
100 pF
C13
220 nF
+
C8
330 pF
47 Ω
R20
220 kΩ
16 CS N
R8
15 CS P
8.2 kΩ
C19
56 nF
R5
10 kΩ
D4
C17
6.8 nF
C22
8.2 nF
BYD77D
C2
12 nF
R14
1Ω
R3
220 kΩ
C3
1 nF
R2
8.2
kΩ
R18
180 kΩ
Test and application circuit
C20
68 nF
UBA2014
14 of 19
© NXP B.V. 2008. All rights reserved.
mgw586
Fig 8.
TLD36W
C23
100 nF
4
R4
1 MΩ
C15
330 nF
R13
150 Ω
−
C24
100 nF
R9
600 V driver IV for HF fluorescent lamps
VOLTAGE
CONTROLLED
OSCILLATOR
REFERENCE
CURRENT
PREHEAT
CURRENT
SENSOR
Lamp
DRIVER
CONTROL
SUPPLY
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
13. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
Fig 9.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Package outline SOT109-1 (SO16)
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
15 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
w M
(e 1)
b
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
2.2
inches
0.19
0.02
0.15
0.055
0.045
0.021
0.015
0.013
0.009
0.86
0.84
0.26
0.24
0.1
0.3
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT38-1
050G09
MO-001
SC-503-16
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 10. Package outline SOT38-1 (DIP16)
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
16 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
14. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
UBA2014_4
20081016
Product data sheet
-
UBA2014_3
Modifications:
•
•
Max value for VHS in Table 1 updated.
Max value for VHS in Table 4 updated.
UBA2014_3
20080815
Product data sheet
-
UBA2014_2
UBA2014_2
20050912
Product data sheet
-
UBA2014_1
UBA2014_1
20020516
Product specification
-
-
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
17 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
UBA2014_4
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 04 — 16 October 2008
18 of 19
UBA2014
NXP Semiconductors
600 V driver IV for HF fluorescent lamps
17. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.8.1
8.8.2
8.9
8.10
8.11
8.12
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Adaptive non-overlap . . . . . . . . . . . . . . . . . . . . 5
Timing circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Preheat state . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Burn state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Lamp failure mode . . . . . . . . . . . . . . . . . . . . . . 6
During ignition state . . . . . . . . . . . . . . . . . . . . . 6
During burn state . . . . . . . . . . . . . . . . . . . . . . . 6
Power-down mode . . . . . . . . . . . . . . . . . . . . . . 7
Capacitive mode protection . . . . . . . . . . . . . . . 7
Charge coupling . . . . . . . . . . . . . . . . . . . . . . . . 7
Design equations . . . . . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
Thermal characteristics. . . . . . . . . . . . . . . . . . 10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11
Application information. . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 October 2008
Document identifier: UBA2014_4
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