UJA1161T,118

UJA1161 Self-supplied high-speed CAN transceiver with Standby mode Rev. 2 — 17 April 2014 Product data sheet 1. General description The UJA1161 is a ‘self-supplied’ high-speed CAN transceiver integrating an ISO 11898-2/5 compliant HS-CAN transceiver and an internal 5 V CAN supply. The only supply input is a battery connection. The UJA1161 can be operated in a very low-current Standby mode with bus wake-up capability. The UJA1161 implements the standard CAN physical layer as defined in the current ISO11898 standard (-2 and -5). Pending the release of the updated version of ISO11898 including CAN FD, additional timing parameters defining loop delay symmetry are included. This implementation enables reliable communication in the CAN FD fast phase at data rates up to 2 Mbit/s. 2. Features and benefits 2.1 General  Self-supplied high-speed CAN transceiver  Loop delay symmetry timing enables reliable communication at data rates up to 2 Mbit/s in the CAN FD fast phase  ISO 11898-2 and ISO 11898-5 compliant  Autonomous bus biasing according to ISO 11898-6  Fully integrated 5 V supply (VBUF) for the CAN transmitter/receiver  VIO input allows for direct interfacing with 3.3 V to 5 V microcontrollers  Bus connections are truly floating when power pin BAT is off 2.2 Designed for automotive applications  8 kV ElectrStatic Discharge (ESD) protection, according to the Human Body Model (HBM) on the CAN bus pins  6 kV ESD protection, according to IEC 61000-4-2 on the CAN bus pins and on pin BAT  CAN bus pins short-circuit proof to 58 V  Battery and CAN bus pins are protected against automotive transients according to with ISO 7637-3  Very low quiescent current in Standby mode  Leadless HVSON14 package (3 mm  4.5 mm) with improved Automated Optical Inspection (AOI) capability  Dark green product (halogen free and Restriction of Hazardous Substances (RoHS) compliant) UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 2.3 Integrated supply voltage for the CAN transceiver (VBUF)  5 V nominal output; 2 % accuracy  Undervoltage detection at 90 % of nominal value  Excellent response with a 4.7 F ceramic output load capacitor 2.4 Power Management  Standby mode featuring very low supply current  Remote wake-up capability via standard CAN wake-up pattern 2.5 System control and diagnostic features  Mode control via STBN pin  Overtemperature shutdown  Transmit data (TXD) dominant time-out function 3. Ordering information Table 1. Ordering information Type number UJA1161TK UJA1161 Product data sheet Package Name Description Version HVSON14 plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3  4.5  0.85 mm SOT1086-2 All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 2 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 4. Block diagram 9,2  %$7 5;' 7;'  8-$ 9+6&$16833/WWWRVLOHQFH 6WDQGE\@25 9%8)9XYG%8)25 9,29XYG9,2 1RUPDO  9%8)!9XYG%8) 9,2!9XYG9,2 W!WWRVLOHQFH 6WDQGE\ &$12IIOLQH%LDV WUDQVPLWWHURII UHFHLYHURII 5;'ZDNHXS+,*+ &$1+&$1/WHUPLQDWHG WR9IURP9%$7  ZDNHXS25 1RUPDO 9%8)9XYG%8)25 9,29XYG9,2 1RUPDO  9%8)!9XYG%8) 9,2!9XYG9,2 IURPDOOPRGHV W!WWRVLOHQFH 6WDQGE\ 2II25 2YHUWHPS25 9%$79XYG&$1 &$12IIOLQH WUDQVPLWWHURII UHFHLYHURII 5;'ZDNHXS+,*+ &$1+&$1/WHUPLQDWHG WR*1' &$12II WUDQVPLWWHURII UHFHLYHURII 5;'ZDNHXS+,*+ &$1+&$1/IORDWLQJ OHDYLQJ 2II2YHUWHPS DDD Fig 4. CAN transceiver state machine 6.3.1.3 CAN Off mode The CAN transceiver is switched off completely with the bus lines floating when: • the UJA1161 switches to Off or Overtemp mode OR • VBAT falls below the CAN receiver undervoltage detection threshold, Vuvd(CAN) UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 9 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode It will be switched on again on entering CAN Offline mode when VBAT rises above the undervoltage recovery threshold (Vuvr(CAN)) and the UJA1161 is no longer in Off/Overtemp mode. CAN Off mode prevents reverse currents flowing from the bus when the battery supply to the UJA1161 is lost. 6.3.2 CAN standard wake-up The UJA1161 monitors the bus for a wake-up pattern when the CAN transceiver is in Offline mode. A filter at the receiver input prevents unwanted wake-up events occurring due to automotive transients or EMI. A dominant-recessive-dominant wake-up pattern must be transmitted on the CAN bus within the wake-up timeout time (tto(wake)) to pass the wake-up filter and trigger a wake-up event (see Figure 5; note that additional pulses may occur between the recessive/dominant phases). The recessive and dominant phases must last at least twake(busrec) and twake(busdom), respectively. Pin RXD is driven LOW when a valid CAN wake-up pattern is detected on the bus. dominant tdom ≥ twake(busdom) recessive dominant trec ≥ twake(busrec) tdom ≥ twake(busdom) twake < tto(wake) CAN wake-up 015aaa267 Fig 5. CAN wake-up timing 6.4 VIO supply pin Pin VIO should be connected to the microcontroller supply voltage. This will cause the signal levels on TXD, RXD, STBN and CTS to be adjusted to the I/O levels of the microcontroller, enabling direct interfacing without the need for glue logic. 6.5 CAN transceiver status pin (CTS) Pin CTS is driven HIGH to indicate to microcontroller that the transceiver is fully enabled and data can be transmitted and received via the TXD/RXD pins. Pin CTS is actively driven LOW: • while the transceiver is starting up (e.g. during a transition from Standby to Normal mode) or • if pin TXD is clamped LOW for t > tto(dom)TXD or • if an undervoltage is detected on VIO or BUF UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 10 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 6.6 CAN fail-safe features 6.6.1 TXD dominant timeout A TXD dominant time-out timer is started when pin TXD is forced LOW while the transceiver is in CAN Active Mode. If the LOW state on pin TXD persists for longer than the TXD dominant time-out time (tto(dom)TXD), the transmitter is disabled, releasing the bus lines to recessive state. This function prevents a hardware and/or software application failure from driving the bus lines to a permanent dominant state (blocking all network traffic). The TXD dominant time-out timer is reset when pin TXD goes HIGH. The TXD dominant time-out time also defines the minimum possible bit rate of 15 kbit/s. 6.6.2 Pull-up on TXD pin Pin TXD has an internal pull-up (towards VIO) to ensure a safe defined recessive driver state in case the pin is left floating. 6.6.3 Pull-down on STBN pin Pin STBN has an internal pull-down (to GND) to ensure the UJA1161 switches to Standby mode if STBN is left floating. 6.6.4 Loss of power at pin BAT A loss of power at pin BAT has no impact on the bus lines or on the microcontroller. No reverse currents flow from the bus. UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 11 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Vx voltage on pin x DC value V(CANH-CANL) voltage between pin CANH and pin CANL Vtrt transient voltage Min Max Unit pins BUF[1], VIO 0.2 +6 V pins TXD, RXD, STBN, CTS 0.2 VIO + 0.2 V pin BAT 0.2 +40 V pins CANH and CANL with respect to any other pin 58 +58 V 40 +40 V 150 +100 V 6 +6 kV 8 +8 kV 4 +4 kV 2 +2 kV 100 +100 V 750 +750 V 500 +500 V 40 +150 C 55 +175 C on pins [2] BAT via reverse polarity diode and capacitor to ground CANL, CANH: coupling via 1 nF capacitors VESD electrostatic discharge voltage IEC 61000-4-2 [3] on pins CANH and CANL; pin BAT with capacitor HBM on pins CANH, CANL [4] [5] on pin BAT on any other pin [6] MM on any pin CDM [7] on corner pins on any other pin Tvj virtual junction temperature Tstg storage temperature [8] [1] When the device is not powered up, IBUF(max) = 25 mA. [2] Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b. [3] ESD performance according to IEC 61000-4-2 (150 pF, 330 ) has been verified by an external test house for pins BAT, CANH and CANL; the result was equal to or better than 6 kV. [4] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 k). [5] Pins BUF and BAT connected to GND, emulating the application circuit. [6] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 H, 10 ). [7] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF). [8] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P  Rth(j-a), where Rth(j-a) is a fixed value used in the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 12 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 8. Thermal characteristics Table 5. Symbol Rth(vj-a) [1] Thermal characteristics Parameter Conditions [1] thermal resistance from virtual junction to ambient Typ Unit 60 K/W According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with two inner copper layers (thickness: 35 m) and thermal via array under the exposed pad connected to the first inner copper layer (thickness: 70 m). 9. Static characteristics Table 6. Static characteristics Tvj = 40 C to +150 C; VBAT = 4.5 V to 28 V; VIO = 2.85 V to 5.5 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supply; pin BAT Vth(det)pon power-on detection threshold voltage VBAT rising 4.2 - 4.55 V Vth(det)poff power-off detection threshold voltage VBAT falling 2.8 - 3 V Vuvr(CAN) CAN undervoltage recovery voltage VBAT rising 4.5 - 5 V Vuvd(CAN) CAN undervoltage detection voltage VBAT falling 4.2 - 4.55 V IBAT battery supply current Standby mode; CAN Offline mode; 40 C < Tvj < +85 C; VBAT = 7 V to 18 V - 58 81 A additional current in CAN Offline Bias mode; 40 C < Tvj < 85 C - 46 63 A Normal mode; CAN Active mode; CAN recessive; VTXD = VIO - 4 7.5 mA Normal mode; CAN Active mode; CAN dominant; VTXD = 0 V - 46 67 mA VBAT = 5.5 V to 18 V 4.9 5 5.1 V Voltage source; pin BUF VO output voltage Vuvd undervoltage detection voltage 4.5 - 4.75 V IO(sc) short-circuit output current 300 - 150 mA 2.7 - 2.85 V - 7.1 11 A Supply; pin VIO Vuvd undervoltage detection voltage II(VIO) input current on pin VIO Standby/Normal mode; 40 C < Tvj < 85 C Standby mode control input; pin STBN Vth(sw) switching threshold voltage 0.25VIO - 0.75VIO V Rpd pull-down resistance 40 60 80 k UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 13 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode Table 6. Static characteristics …continued Tvj = 40 C to +150 C; VBAT = 4.5 V to 28 V; VIO = 2.85 V to 5.5 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit CAN transmit data input; pin TXD Vth(sw) switching threshold voltage 0.25VIO - 0.75VIO V Rpu pull-up resistance 40 60 80 k CAN transmitter status; pin CTS IOH HIGH-level output current VCTS = VIO  0.4 V; transmitter on - - 4 mA IOL LOW-level output current VCTS = 0.4 V; transmitter off 4 - - mA CAN receive data output; pin RXD VOH HIGH-level output voltage IOH = 4 mA VIO  0.4 - - V VOL LOW-level output voltage IOL = 4 mA - - 0.4 V Rpu pull-up resistance CAN Offline mode 40 60 80 k 2.75 3.5 4.5 V 0.5 1.5 2.25 V 0.9VBUF - 1.1VBUF V High-speed CAN bus lines; pins CANH and CANL VO(dom) dominant output voltage CAN Active mode; VTXD = 0 V; VBAT > 5.5 V pin CANH pin CANL VTXsym transmitter voltage symmetry VTXsym = VCANH + VCANL; fTXD = 250 kHz; CSPLIT = 4.7 nF [1] [2] Vdom(TX)sym transmitter dominant voltage symmetry Vdom(TX)sym = VBUF  VCANH  VCANL; VBAT > 5.5 V 400 - +400 mV VO(dif)bus bus differential output voltage CAN Active mode (dominant); VTXD = 0 V; VBAT > 5.5 V; R(CANH-CANL) = 45  to 65  1.5 - 3.0 V CAN Active mode (recessive); CAN Offline mode; VTXD = VIO; R(CANH-CANL) = no load; VBAT > 5.5 V; Tvj < 150 C 50 - +50 mV CAN Active mode; VTXD = VIO; VBAT > 5.5 V; R(CANH-CANL) = no load 2 0.5VBUF 3 V CAN Offline mode; VBAT > 5.5 V; R(CANH-CANL) = no load 0.1 - +0.1 V CAN Offline Bias mode; R(CANH-CANL) = no load 2 2.5 3 V pin CANH; VCANH = 0 V 50 - - mA pin CANL; VCANL = 5 V - - 52 mA 3 - +3 mA VO(rec) IO(dom) IO(rec) recessive output voltage dominant output current recessive output current UJA1161 Product data sheet CAN Active mode; VTXD = 0 V; VBAT > 5.5 V VCANL = VCANH = 27 V to +32 V; VTXD = VIO All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 14 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode Table 6. Static characteristics …continued Tvj = 40 C to +150 C; VBAT = 4.5 V to 28 V; VIO = 2.85 V to 5.5 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Vth(RX)dif differential receiver threshold voltage CAN Active mode; VCANL = VCANH = 12 V to +12 V; VBAT > 5.5 V 0.5 0.7 0.9 V CAN Offline mode; VCANL = VCANH = 12 V to +12 V; VBAT > 5.5 V 0.4 0.7 1.15 V CAN Active mode; VCANL = VCANH = 12 V to +12 V; VBAT > 5.5 V 50 200 400 mV Vhys(RX)dif differential receiver hysteresis voltage Ri(cm) common-mode input resistance 9 15 28 k Ri input resistance deviation 1 - +1 % Ri(dif) differential input resistance Ci(cm) common-mode input capacitance [1] Ci(dif) differential input capacitance [1] ILI input leakage current VBAT = VBUF = 0 V or VBAT = VBUF = shorted to ground via 47 k; VCANH = VCANL = 5 V 19 30 52 k - - 20 pF - - 10 pF 5 - +5 A Temperature protection Tth(act)otp overtemperature protection activation threshold temperature 167 177 187 C Tth(rel)otp overtemperature protection release threshold temperature 127 137 147 C [1] Not tested in production; guaranteed by design. [2] The test circuit used to measure the bus output voltage symmetry (which includes CSPLIT) is shown in Figure 10. UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 15 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 10. Dynamic characteristics Table 7. Dynamic characteristics Tvj = 40 C to +150 C; VBAT = 4.5 V to 28 V; VIO = 2.85 V to 5.5 V; R(CANH-CANL) = 60 ; all voltages are defined with respect to ground; positive currents flow into the IC; typical values are given at VBAT = 13 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit from VBAT exceeding the power-on detection threshold until VBUF > 90 % undervoltage threshold; CBUF = 4.7 F - 2.8 4.7 ms 6 - 54 s 2.5 - 13.5 s - - 255 ns - - 350 ns Voltage sources; pins BUF and VIO tstartup start-up time td(uvd) undervoltage detection delay time Mode control: pin STBN tfltr(stb) standby filter time CAN transceiver timing; pins CANH, CANL, TXD and RXD td(TXD-RXD) RL = 60 ; CL = 100 pF; delay time from TXD to RXD 50 % VTXD to 50 % VRXD; CRXD = 15 pF; fTXD = 250 kHz RL = 120 ; CL = 200 pF; 50 % VTXD to 50 % VRXD; CRXD = 15 pF; fTXD = 250 kHz [1] td(TXD-busdom) delay time from TXD to bus dominant - 80 - ns td(TXD-busrec) delay time from TXD to bus recessive - 80 - ns CRXD = 15 pF - 105 - ns delay time from bus recessive to RXD CRXD = 15 pF - 120 - ns 400 - 550 ns td(busdom-RXD) delay time from bus dominant to RXD td(busrec-RXD) [2] tbit(RXD) bit time on pin RXD tbit(TXD) = 500 ns twake(busdom) bus dominant wake-up time first pulse (after first recessive) for wake-up on pins CANH and CANL; CAN Offline mode 0.5 - 3.0 s second pulse for wake-up on pins CANH and CANL 0.5 - 3.0 s first pulse for wake-up on pins CANH and CANL; CAN Offline mode 0.5 - 3.0 s second pulse (after first dominant) for wake-up on pins CANH and CANL 0.5 - 3.0 s twake(busrec) bus recessive wake-up time tto(wake) wake-up time-out time between first and second dominant pulses; CAN Offline mode 570 - 1200 s tto(dom)TXD TXD dominant time-out time CAN Active mode; VTXD = 0 V 2.7 - 3.3 ms tto(silence) bus silence time-out time recessive time measurement started in all CAN modes; RL = 120  0.95 - 1.17 s td(busact-bias) delay time from bus active to bias - - 200 s tstartup(CAN) CAN start-up time when switching to Active mode (CTS = HIGH) - - 220 s UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 16 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode [1] Guaranteed by design. [2] See Figure 7. +,*+ 7;' /2: &$1+ &$1/ GRPLQDQW 9 92GLIEXV 9 UHFHVVLYH +,*+ 5;' /2: WG7;'EXVGRP WG7;'EXVUHF WGEXVGRP5;' WG7;'5;' Fig 6. WGEXVUHF5;' WG7;'5;' DDD CAN transceiver timing diagram  7;'   [WELW7;' WELW7;'  5;'  WELW5;' DDD Fig 7. UJA1161 Product data sheet Loop delay symmetry timing diagram All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 17 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 11. Application information 11.1 Application diagram 9 %$7 —) 9,2 %$7   %8)     67%1 8-$ *1'   &$1+ 57  VWDQGDUG —&SRUWV 0,&52 &21752//(5   9&& &76  5;' 7;' 5;' 7;' 966 &$1/ 57  HJ Q) DDD (1) Actual capacitance value must be a least 1.76 F with 5 V DC offset (recommended capacitor value is 4.7 F) (2) For bus line end nodes, RT = 60  in order to support the ‘split termination concept’. For sub-nodes, an optional ‘weak’ termination of e.g. RT = 1.3 k can be used, if required by the OEM. Fig 8. Typical application using the UJA1161 UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 18 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 12. Test information %$7 5;' &$1+ 5/ 8-$ S) 7;' S) &$1/ *1' DDD Fig 9. Timing test circuit for CAN transceiver   %$7 7;' &$1+  ȍ 8-$ I N+]  5;' &63/,7 Q) &$1/  *1'  ȍ DDD Fig 10. Test circuit for measuring transceiver driver symmetry 12.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for integrated circuits, and is suitable for use in automotive applications. UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 19 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 13. Package outline +9621SODVWLFWKHUPDOHQKDQFHGYHU\WKLQVPDOORXWOLQHSDFNDJHQROHDGV WHUPLQDOVERG\[[PP 627 ; % ' $ $ ( $ F WHUPLQDO LQGH[DUHD GHWDLO; H WHUPLQDO LQGH[DUHD H Y Z E   & & $ % & \ & \ / N (K   'K   'LPHQVLRQV 8QLW PP PP VFDOH $ $ E F PD[    QRP     PLQ    ' 'K ( (K H H               N / Y        Z \   \  VRW 5HIHUHQFHV 2XWOLQH YHUVLRQ ,(& -('(& -(,7$ 627  02  (XURSHDQ SURMHFWLRQ ,VVXHGDWH   Fig 11. Package outline SOT1086-2 (HVSON14) UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 20 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 14. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 15.3 Wave soldering Key characteristics in wave soldering are: UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 21 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 12) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9 Table 8. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350  350 < 2.5 235 220  2.5 220 220 Table 9. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 12. UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 22 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 12. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 16. Soldering of HVSON packages Section 15 contains a brief introduction to the techniques most commonly used to solder Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON leadless package ICs can found in the following application notes: • AN10365 ‘Surface mount reflow soldering description” • AN10366 “HVQFN application information” UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 23 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 17. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes UJA1161 v.2 20140417 Product data sheet - UJA1161 v.1 Modifications: UJA1161 v.1 UJA1161 Product data sheet • • • • • • • • Section 1: text revised (2nd paragraph added) • • • Figure 7: added Section 2.1: feature added (loop delay symmetry) Figure 1: amended Table 2: CTS pin description changed; table note amended Table 3: row CAN revised Section 6.3: text and state diagram revised Section 6.5: text revised Table 7: conditions revised for symbol tstartup; parameter values changed: td(uvd); parameter tbit(RXD) added; additional measurement for parameter td(TXD-RXD) Section 12.1: text updated Fig. 10 deleted 20130926 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 - © NXP Semiconductors N.V. 2014. All rights reserved. 24 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. UJA1161 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 25 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com UJA1161 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 17 April 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 26 of 27 UJA1161 NXP Semiconductors Self-supplied high-speed CAN transceiver with Standby mode 20. Contents 1 2 2.1 2.2 2.3 2.4 2.5 3 4 5 5.1 5.2 6 6.1 6.1.1 6.1.1.1 6.1.1.2 6.1.1.3 6.1.1.4 6.1.1.5 6.1.2 6.2 6.2.1 6.2.2 6.3 6.3.1 6.3.1.1 6.3.1.2 6.3.1.3 6.3.2 6.4 6.5 6.6 6.6.1 6.6.2 6.6.3 6.6.4 7 8 9 10 11 11.1 12 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Designed for automotive applications. . . . . . . . 1 Integrated supply voltage for the CAN transceiver (VBUF) . . . . . . . . . . . . . . . . . . . . . . . 2 Power Management . . . . . . . . . . . . . . . . . . . . . 2 System control and diagnostic features . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 System controller . . . . . . . . . . . . . . . . . . . . . . . 5 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Off mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Overtemp mode . . . . . . . . . . . . . . . . . . . . . . . . 6 Hardware characterization for the UJA1161 operating modes . . . . . . . . . . . . . . . . . . . . . . . . 6 Mode control via pin STBN . . . . . . . . . . . . . . . . 7 Power supplies . . . . . . . . . . . . . . . . . . . . . . . . . 7 Battery supply voltage (VBAT) . . . . . . . . . . . . . . 7 CAN supply voltage (VBUF) . . . . . . . . . . . . . . . . 7 High-speed CAN transceiver . . . . . . . . . . . . . . 7 CAN operating modes . . . . . . . . . . . . . . . . . . . 8 CAN Active mode . . . . . . . . . . . . . . . . . . . . . . . 8 CAN Offline and Offline Bias modes. . . . . . . . . 8 CAN Off mode . . . . . . . . . . . . . . . . . . . . . . . . . 9 CAN standard wake-up. . . . . . . . . . . . . . . . . . 10 VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . 10 CAN transceiver status pin (CTS). . . . . . . . . . 10 CAN fail-safe features . . . . . . . . . . . . . . . . . . 11 TXD dominant timeout . . . . . . . . . . . . . . . . . . 11 Pull-up on TXD pin . . . . . . . . . . . . . . . . . . . . . 11 Pull-down on STBN pin . . . . . . . . . . . . . . . . . 11 Loss of power at pin BAT . . . . . . . . . . . . . . . . 11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12 Thermal characteristics . . . . . . . . . . . . . . . . . 13 Static characteristics. . . . . . . . . . . . . . . . . . . . 13 Dynamic characteristics . . . . . . . . . . . . . . . . . 16 Application information. . . . . . . . . . . . . . . . . . 18 Application diagram . . . . . . . . . . . . . . . . . . . . 18 Test information . . . . . . . . . . . . . . . . . . . . . . . . 19 12.1 13 14 15 15.1 15.2 15.3 15.4 16 17 18 18.1 18.2 18.3 18.4 19 20 Quality information . . . . . . . . . . . . . . . . . . . . . Package outline. . . . . . . . . . . . . . . . . . . . . . . . Handling information . . . . . . . . . . . . . . . . . . . Soldering of SMD packages . . . . . . . . . . . . . . Introduction to soldering. . . . . . . . . . . . . . . . . Wave and reflow soldering. . . . . . . . . . . . . . . Wave soldering . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering . . . . . . . . . . . . . . . . . . . . . . Soldering of HVSON packages . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 20 21 21 21 21 21 22 23 24 25 25 25 25 26 26 27 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 April 2014 Document identifier: UJA1161