FCP099N65S3

FCP099N65S3 MOSFET – Power, N-Channel, SUPERFET III, Easy Drive 650 V, 30 A, 99 mW www.onsemi.com Description SUPERFET III MOSFET is ON Semiconductor’s brand−new high voltage super−junction (SJ) MOSFET family that is utilizing charge balance technology for outstanding low on−resistance and lower gate charge performance. This advanced technology is tailored to minimize conduction loss, provides superior switching performance, and withstand extreme dv/dt rate. Consequently, SUPERFET III MOSFET Easy drive series helps manage EMI issues and allows for easier design implementation. VDSS RDS(ON) MAX ID MAX 650 V 99 mW @ 10 V 30 A D Features • • • • • • 700 V @ TJ = 150°C Typ. RDS(on) = 79 mW Ultra Low Gate Charge (Typ. Qg = 61 nC) Low Effective Output Capacitance (Typ. Coss(eff.) = 544 pF) 100% Avalanche Tested These Devices are Pb−Free and are RoHS Compliant G S POWER MOSFET Applications • Telecom / Server Power Supplies • Industrial Power Supplies • UPS / Solar G D S TO−220 CASE 340AT MARKING DIAGRAM $Y&Z&3&K FCP 099N65S3 $Y &Z &3 &K FCP099N65S3 = ON Semiconductor Logo = Assembly Plant Code = Data Code (Year & Week) = Lot = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2017 August, 2019 − Rev. 4 1 Publication Order Number: FCP099N65S3/D FCP099N65S3 ABSOLUTE MAXIMUM RATINGS (TC = 25°C, Unless otherwise noted) Symbol Parameter VDSS Drain to Source Voltage VGSS Gate to Source Voltage ID Drain Current Value Unit 650 V − DC ±30 V − AC (f > 1 Hz) ±30 − Continuous (TC = 25°C) 30 − Continuous (TC = 100°C) 19 IDM Drain Current 75 A EAS Single Pulsed Avalanche Energy (Note 2) 145 mJ IAS Avalanche Current (Note 2) 4.4 A EAR Repetitive Avalanche Energy (Note 1) 2.27 mJ dv/dt MOSFET dv/dt 100 V/ns Peak Diode Recovery dv/dt (Note 3) 20 PD TJ, TSTG TL − Pulsed (Note 1) A Power Dissipation (TC = 25°C) 227 W − Derate Above 25°C 1.82 W/°C −55 to +150 °C 300 °C Operating and Storage Temperature Range Maximum Lead Temperature for Soldering, 1/8″ from Case for 5 seconds Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Repetitive rating: pulse−width limited by maximum junction temperature. 2. IAS = 4.4 A, RG = 25 W, starting TJ = 25°C. 3. ISD ≤ 15 A, di/dt ≤ 200 A/ms, VDD ≤ 400 V, starting TJ = 25°C. THERMAL CHARACTERISTICS Symbol Parameter Value Unit RqJC Thermal Resistance, Junction to Case, Max. 0.55 _C/W RqJA Thermal Resistance, Junction to Ambient, Max. 62.5 PACKAGE MARKING AND ORDERING INFORMATION Part Number Top Marking Package Packing Method Reel Size Tape Width Quantity FCP099N65S3 FCP099N65S3 TO−220 Tube N/A N/A 50 Units www.onsemi.com 2 FCP099N65S3 ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Parameter Symbol Test Conditions Min. Typ. Max. Unit OFF CHARACTERISTICS BVDSS Drain to Source Breakdown Voltage VGS = 0 V, ID = 1 mA, TJ = 25_C 650 V VGS = 0 V, ID = 1 mA, TJ = 150_C 700 V DBVDSS / DTJ Breakdown Voltage Temperature Coefficient ID = 1 mA, Referenced to 25_C IDSS Zero Gate Voltage Drain Current VDS = 650 V, VGS = 0 V IGSS Gate to Body Leakage Current 0.68 V/_C 1 mA ±100 nA 4.5 V 99 mW 1.4 VDS = 520 V, TC = 125_C VGS = ±30 V, VDS = 0 V ON CHARACTERISTICS VGS(th) Gate Threshold Voltage VGS = VDS, ID = 0.74 mA RDS(on) Static Drain to Source On Resistance VGS = 10 V, ID = 15 A 79 Forward Transconductance VDS = 20 V, ID = 15 A 19 S 2480 pF 55 pF gFS 2.5 DYNAMIC CHARACTERISTICS Ciss Input Capacitance Coss Output Capacitance VDS = 400 V, VGS = 0 V, f = 1 MHz Coss(eff.) Effective Output Capacitance VDS = 0 V to 400 V, VGS = 0 V 544 pF Coss(er.) Energy Related Output Capacitance VDS = 0 V to 400 V, VGS = 0 V 78 pF Total Gate Charge at 10 V VDS = 400 V, ID = 15 A, VGS = 10 V (Note 4) 61 nC 15 nC 25 nC f = 1 MHz 0.4 W VDD = 400 V, ID = 15 A, VGS = 10 V, Rg = 4.7 W (Note 4) 23 ns 24 ns Qg(tot) Qgs Gate to Source Gate Charge Qgd Gate to Drain “Miller” Charge ESR Equivalent Series Resistance SWITCHING CHARACTERISTICS td(on) Turn-On Delay Time tr Turn-On Rise Time td(off) Turn-Off Delay Time 60 ns Turn-Off Fall Time 5 ns tf SOURCE-DRAIN DIODE CHARACTERISTICS Maximum Continuous Source to Drain Diode Forward Current 30 A ISM Maximum Pulsed Source to Drain Diode Forward Current 75 A VSD Source to Drain Diode Forward Voltage VGS = 0 V, ISD = 15 A 1.2 V trr Reverse Recovery Time Qrr Reverse Recovery Charge VDD = 400 V, ISD = 15 A, dIF/ dt = 100 A/ms IS 408 ns 8.4 mC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Essentially independent of operating temperature typical characteristics. www.onsemi.com 3 FCP099N65S3 80 80 V = 10.0 V GS 8.0 V 7.0 V 6.5 V 6.0 V 10 5.5 V ID, Drain Current (A) ID, Drain Current (A) TYPICAL PERFORMANCE CHARACTERISTICS 1 VDS = 20 V 250 ms Pulse Test 150°C 10 25°C −55°C 0.1 0.1 250 ms Pulse Test TC = 25°C 1 20 1 10 VDS, Drain−Source Voltage (V) 2 Figure 1. On−Region Characteristics 100 TC = 25°C 0.3 0.2 VGS = 10 V 0.1 VGS = 20 V 0.0 0 10 25°C 0.1 −55°C 0.01 Capacitances (pF) VGS, Gate−Source Voltage (V) 10 10000 Ciss 1000 Coss 100 0.1 0.1 VGS = 0 V f = 1 MHz Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd Crss 1 10 100 VDS, Drain−Source Voltage (V) 1.0 1.5 0.5 VSD, Body Diode Forward Voltage (V) Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature 100000 1 150°C 1 Figure 3. On−Resistance Variation vs. Drain Current and Gate Voltage 10 VGS = 0 V 250 ms Pulse Test 0.001 0.0 80 20 40 60 ID, Drain Current (A) 9 Figure 2. Transfer Characteristics IS, Reverse Drain Current (A) RDS(ON), Drain−Source On−Resistance (W) 0.4 8 3 5 4 6 7 VGS, Gate−Source Voltage (V) 8 Figure 5. Capacitance Characteristics VDS = 130 V VDS = 400 V 6 4 2 0 1000 ID = 15 A 0 15 30 45 60 Qg, Total Gate Charge (nC) 75 Figure 6. Gate Charge Characteristics www.onsemi.com 4 FCP099N65S3 TYPICAL PERFORMANCE CHARACTERISTICS (continued) 3.0 VGS = 0 V ID = 10 mA RDS(on), Drain−Source On−Resistance (Normalized) BVDSS, Drain−Source Breakdown Voltage (Normalized) 1.2 1.1 1.0 0.9 0.8 −50 2.5 2.0 1.5 1.0 0.5 0.0 50 100 150 0 TJ, Junction Temperature (5C) ID, Drain Current (A) ID, Drain Current (A) 100 ms 1 ms 10 ms DC 1 Operation in this Area is Limited by RDS(on) 0.1 0.01 TC = 25°C TJ = 150°C Single Pulse 1 10 100 VDS, Drain−Source Voltage (V) EOSS, (mJ) 10 5 130 260 390 520 VDS, Drain to Source Voltage (V) 10 50 75 100 125 TC, Case Temperature (5C) 150 Figure 10. Maximum Drain Current vs. Case Temperature 15 0 20 0 25 1000 Figure 9. Maximum Safe Operating Area 0 0 50 100 150 TJ, Junction Temperature (5C) 30 30 ms 10 −50 Figure 8. On−Resistance Variation vs. Temperature Figure 7. Breakdown Voltage Variation vs. Temperature 200 100 VGS = 10 V ID = 15 A 650 Figure 11. EOSS vs. Drain to Source Voltage www.onsemi.com 5 FCP099N65S3 r(t), Normalized Effective Transient Thermal Resistance TYPICAL PERFORMANCE CHARACTERISTICS (continued) 2 1 0.1 DUTY CYCLE − DESCENDING ORDER D = 0.5 0.2 0.1 0.05 0.02 0.01 PDM t1 0.01 0.001 −5 10 SINGLE PULSE 10 −4 t2 ZqJC(t) = r(t) x RqJC RqJC = 0.55°C/W Peak TJ = PDM x ZqJC(t) + TC Duty Cycle, D = t1 / t2 10 −3 −2 −1 10 10 t, Rectangular Pulse Duration (sec) 10 0 Figure 12. Transient Thermal Response Curve www.onsemi.com 6 10 1 10 2 FCP099N65S3 VGS RL Qg VDS VGS Qgs Qgd DUT IG = Const. Charge Figure 13. Gate Charge Test Circuit & Waveform RL VDS VDS 90% 90% 90% VDD VGS RG VGS DUT VGS 10% td(on) 10% tr td(off) ton tf toff Figure 14. Resistive Switching Test Circuit & Waveforms L E AS + 1 @ LI AS 2 VDS BVDSS ID IAS RG VDD DUT VGS 2 ID(t) VDD VDS(t) tp tp Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms www.onsemi.com 7 Time FCP099N65S3 + DUT VDS − ISD L Driver RG Same Type as DUT VGS − dv/dt controlled by RG − ISD controlled by pulse period D+ VGS (Driver) VDD Gate Pulse Width Gate Pulse Period 10 V IFM, Body Diode Forward Current ISD (DUT) di/dt IRM Body Diode Reverse Current Body Diode Recovery dv/dt VDS (DUT) VDD VSD Body Diode Forward Voltage Drop Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms SUPERFET is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−220−3LD CASE 340AT ISSUE A DATE 03 OCT 2017 Scale 1:1 DOCUMENT NUMBER: DESCRIPTION: 98AON13818G TO−220−3LD Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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