MBRD660CTT4

MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT MBRD620CT, MBRD640CT and MBRD660CT are Preferred Devices SWITCHMODE
Power Rectifiers http://onsemi.com DPAK−3 Surface Mount Package These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. SCHOTTKY BARRIER RECTIFIERS 6.0 AMPERES, 20 − 60 VOLTS Features • • • • Extremely Fast Switching Extremely Low Forward Drop Platinum Barrier with Avalanche Guardrings Pb−Free Packages are Available 1 4 3 Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • 4 1 2 3 Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds DPAK CASE 369C MARKING DIAGRAM YWW B 6x0TG Y WW B6x0T x G = Year = Work Week = Device Code = 2, 3, 4, 5, or 6 = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. Preferred devices are recommended choices for future use and best overall value.  Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 6 1 Publication Order Number: MBRD620CT/D MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT MAXIMUM RATINGS MBRD Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current TC = 130°C (Rated VR) VRRM VRWM VR Per Diode Per Device 620CT 630CT 640CT 650CT 660CT 20 30 40 50 60 Unit V IF(AV) 3 6 A Peak Repetitive Forward Current, TC = 130°C (Rated VR, Square Wave, 20 kHz) Per Diode IFRM 6 A Nonrepetitive Peak Surge Current − (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 75 A Peak Repetitive Reverse Surge Current (2
s, 1 kHz) IRRM 1 A Operating Junction Temperature (Note 1) TJ −65 to +175 °C Storage Temperature Tstg −65 to +175 °C Voltage Rate of Change (Rated VR) dv/dt 10,000 V/
s Symbol Value Unit Maximum Thermal Resistance, Junction−to−Case RJC 6 °C/W Maximum Thermal Resistance, Junction−to−Ambient (Note 2) RJA 80 °C/W THERMAL CHARACTERISTICS PER DIODE Rating ELECTRICAL CHARACTERISTICS PER DIODE Maximum Instantaneous Forward Voltage (Note 3) iF = 3 Amps, TC = 25°C iF = 3 Amps, TC = 125°C iF = 6 Amps, TC = 25°C iF = 6 Amps, TC = 125°C VF Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TC = 25°C) (Rated dc Voltage, TC = 125°C) iR V 0.7 0.65 0.9 0.85 mA 0.1 15 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dP D/dTJ < 1/RJA. 2. Rating applies when surface mounted on the minimum pad size recommended. 3. Pulse Test: Pulse Width = 300
s, Duty Cycle ≤ 2.0%. http://onsemi.com 2 MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT ORDERING INFORMATION Package Shipping† DPAK 2500 Tape & Reel DPAK (Pb−Free) 2500 Tape & Reel DPAK−3 2500 Tape & Reel DPAK (Pb−Free) 2500 Tape & Reel DPAK−3 75 Units / Rail MBRD640CTG DPAK−3 (Pb−Free) 75 Units / Rail MBRD640CTT4 DPAK−3 2500 Tape & Reel DPAK−3 (Pb−Free) 2500 Tape & Reel DPAK−3 75 Units / Rail MBRD650CTG DPAK (Pb−Free) 75 Units / Rail MBRD650CTT4 DPAK−3 2500 Tape & Reel DPAK (Pb−Free) 2500 Tape & Reel DPAK−3 75 Units / Rail MBRD660CTG DPAK−3 (Pb−Free) 75 Units / Rail MBRD660CTRL DPAK−3 1800 Tape & Reel DPAK−3 (Pb−Free) 1800 Tape & Reel DPAK−3 2500 Tape & Reel DPAK−3 (Pb−Free) 2500 Tape & Reel Device MBRD620CTT4 MBRD620CTT4G MBRD630CTT4 MBRD630CTT4G MBRD640CT MBRD640CTT4G MBRD650CT MBRD650CTT4G MBRD660CT MBRD660CTRLG MBRD660CTT4 MBRD660CTT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT TYPICAL CHARACTERISTICS 100 100 TJ = 150°C I R , REVERSE CURRENT (mA) 70 50 30 125°C 1.0 75°C 0.1 0.01 25°C 10 0.001 7.0 0 40 20 30 50 VR, REVERSE VOLTAGE (VOLTS) 10 5.0 3.0 Figure 2. Typical Reverse Current,* Per Leg 125°C 2.0 150°C 1.0 TC = 25°C 0.7 75°C 0.5 0.3 0.2 0.1 70 60 *The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these curves if VR is sufficient below rated VR. PF(AV) , AVERAGE POWER DISSIPATION (WATTS) i F, INSTANTANEOUS FORWARD CURRENT (AMPS) 20 10 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 14 13 12 11 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 SINE WAVE 5 10 IPK/IAV = 20 SQUARE WAVE dc TJ = 150°C 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 vF, INSTANTANEOUS VOLTAGE (VOLTS) IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 1. Typical Forward Voltage, Per Leg Figure 3. Average Power Dissipation, Per Leg http://onsemi.com 4 10 I F(AV) , AVERAGE FORWARD CURRENT (AMPS) 8.0 RATED VOLTAGE APPLIED 7.0 RJC = 6°C/W 6.0 TJ = 150°C 5.0 SINE WAVE OR SQUARE WAVE 4.0 3.0 2.0 dc 1.0 0 80 90 100 110 120 140 130 150 160 4.0 RJA = 80°C/W SURFACE MOUNTED ON MIN. PAD SIZE RECOMMENDED TJ = 150°C 3.5 3.0 dc SQUARE WAVE OR SINE WAVE 2.5 VR = 25 V 2.0 1.5 VR = 60 V 1.0 0.5 0 0 20 40 60 80 100 120 140 TC, CASE TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 4. Current Derating, Case, Per Leg Figure 5. Current Derating, Ambient, Per Leg 1K C, CAPACITANCE (pF) I F(AV) , AVERAGE FORWARD CURRENT (AMPS) MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT TJ = 25°C 100 10 0 10 20 30 40 50 60 VR, REVERSE VOLTAGE (VOLTS) Figure 6. Typical Capacitance, Per Leg http://onsemi.com 5 70 160 MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT PACKAGE DIMENSIONS DPAK (SINGLE GUAGE) CASE 369C ISSUE O −T− C B V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. SEATING PLANE E R 4 Z A S 1 2 DIM A B C D E F G H J K L R S U V Z 3 U K F J L H D G 2 PL 0.13 (0.005) M INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 −−− 0.035 0.050 0.155 −−− MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 −−− 0.89 1.27 3.93 −−− T SOLDERING FOOTPRINT* 6.20 0.244 3.0 0.118 2.58 0.101 5.80 0.228 1.6 0.063 6.172 0.243 SCALE 3:1 mm 
inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 6 For additional information, please contact your local Sales Representative. MBRD620CT/D