MC74LVX541M

MC74LVX541 Octal Bus Buffer The MC74LVX541 is an advanced high speed CMOS octal bus buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The MC74LVX541 is a noninverting type. When either OE1 or OE2 are high, the terminal outputs are in the high impedance state. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V systems to 3.0 V systems. http://onsemi.com SOIC−20 DW SUFFIX CASE 751D Features • • • • • • • • • • • • High Speed: tPD = 5.0 ns (Typ) at VCC = 3.3 V Low Power Dissipation: ICC = 4 A (Max) at TA = 25°C High Noise Immunity: VNIH = VNIL = 28% VCC Power Down Protection Provided on Inputs Balanced Propagation Delays Designed for 2 V to 3.6 V Operating Range Low Noise: VOLP = 1.2 V (Max) Pin and Function Compatible with Other Standard Logic Families Latchup Performance Exceeds 300 mA Chip Complexity: 134 FETs or 33.5 Equivalent Gates ESD Performance: Human Body Model > 2000 V; Machine Model > 200 V These Devices are Pb−Free and are RoHS Compliant TSSOP−20 DT SUFFIX CASE 948E PIN ASSIGNMENT OE1 1 20 VCC A1 2 19 OE2 A2 3 18 Y1 A3 4 17 Y2 A4 5 16 Y3 A5 6 15 Y4 A6 7 14 Y5 A7 8 13 Y6 A8 9 12 Y7 10 11 Y8 GND MARKING DIAGRAMS A1 A2 A3 DATA INPUTS A4 A5 A6 A7 A8 OUTPUT ENABLES OE1 OE2 2 18 3 17 4 16 5 15 6 14 7 13 8 12 9 11 Y1 20 20 Y2 LVX 541 ALYWG G LVX541 AWLYYWWG Y3 1 1 Y4 NONINVERTING OUTPUTS Y5 SOIC−20 LVX541 A WL, L Y WW, W G or G Y6 Y7 TSSOP−20 = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) Y8 1 ORDERING INFORMATION 19 See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Figure 1. Logic Diagram © Semiconductor Components Industries, LLC, 2014 August, 2014 − Rev. 5 1 Publication Order Number: MC74LVX541/D MC74LVX541 QE1 QE2 A1 A2 A3 A4 A5 A6 A7 A8 FUNCTION TABLE & 1 EN Inputs 19 Output Y 2 18 1 3 17 4 16 5 15 6 14 7 13 8 12 9 11 Y1 Y2 Y3 OE1 OE2 A L L H X L L X H L H X X L H Z Z Y4 Y5 Y6 Y7 Y8 Figure 2. IEC Logic Diagram MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage – 0.5 to + 7.0 V Vin DC Input Voltage – 0.5 to + 7.0 V Vout DC Output Voltage – 0.5 to VCC + 0.5 V IIK Input Diode Current − 20 mA IOK Output Diode Current ± 20 mA Iout DC Output Current, per Pin ± 25 mA ICC DC Supply Current, VCC and GND Pins ± 50 mA PD Power Dissipation in Still Air, 500 450 mW Tstg Storage Temperature – 65 to + 150 °C SOIC Packages† TSSOP Package† This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC ). Unused outputs must be left open. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. †Derating: SOIC Package: –7 mW/°C from 65° to 125°C TSSOP Package: −6.1 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 2.0 3.6 V DC Input Voltage 0 5.5 V DC Output Voltage 0 VCC V −40 +85 °C 0 100 ns/V VCC DC Supply Voltage Vin Vout TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time VCC = 3.3 V ± 0.3 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. http://onsemi.com 2 MC74LVX541 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Test Conditions TA = 25°C VCC V Min 1.50 2.0 2.4 VIH Minimum High−Level Input Voltage 2.0 3.0 3.6 VIL Maximum Low−Level Input Voltage 2.0 3.0 3.6 VOH Minimum High−Level Output Voltage Vin = VIH or VIL IOH = −50 A IOH = −50 A IOH = −4 mA 2.0 3.0 3.0 VOL Maximum Low−Level Output Voltage Vin = VIH or VIL IOL = 50 A IOL = 50 A IOL = 4 mA 2.0 3.0 3.0 Iin Maximum Input Leakage Current Vin = 5.5 V or GND IOZ Maximum Three−State Leakage Current ICC Maximum Quiescent Supply Current Typ TA = −40 to 85°C Max Min 0.50 0.80 0.80 1.9 2.9 2.58 Max 1.50 2.0 2.4 2.0 3.0 0.0 0.0 Unit V 0.50 0.80 0.80 1.9 2.9 2.48 V V 0.1 0.1 0.36 0.1 0.1 0.44 V 0 to 3.6 ±0.1 ±1.0 A Vin = VIL or VIH Vout = VCC or GND 3.6 ±0.2 5 ±2.5 A Vin = VCC or GND 3.6 4.0 40.0 A Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) TA = 25°C Symbol tPLH, tPHL tPZL, tPZH tPLZ, tPHZ tOSLH, tOSHL Typ Max Min Max Unit VCC = 2.7 V CL = 15 pF CL = 50 pF 5.0 7.5 7.0 10.5 1.0 1.0 8.5 12.0 ns VCC = 3.3 ± 0.3 V CL = 15 pF CL = 50 pF 3.5 5.0 5.0 7.0 1.0 1.0 6.0 8.0 VCC = 2.7 V RL = 1 k CL = 15 pF CL = 50 pF 6.8 9.3 10.5 14.0 1.0 1.0 12.5 16.0 VCC = 3.3 ± 0.3 V RL = 1 k CL = 15 pF CL = 50 pF 4.7 6.2 7.2 9.2 1.0 1.0 8.5 10.5 VCC = 2.7 V RL = 1 k CL = 50 pF 11.2 15.4 1.0 17.5 VCC = 3.3 ± 0.3 V RL = 1 k CL = 50 pF 6.0 8.8 1.0 10.0 VCC = 2.7 V (Note 1) CL = 50 pF 1.5 1.5 ns VCC = 3.3 ± 0.3 V (Note 1) CL = 50 pF 1.0 1.0 ns 10 10 pF Parameter Maximum Propagation Delay, A to Y Output Enable TIme, OE to Y Output Disable Time, OE to Y Output to Output Skew Test Conditions Min TA = −40 to 85°C Cin Maximum Input Capacitance 4.0 Cout Maximum Three−State Output Capacitance (Output in High Impedance State) 6.0 ns ns pF Typical @ 25°C, VCC = 5.0 V CPD 18 Power Dissipation Capacitance (Note 2) pF 1. Parameter guaranteed by design. tOSLH = |tPLHm − tPLHn|, tOSHL = |tPHLm − tPHLn|. 2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC / 8 (per bit). CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. http://onsemi.com 3 MC74LVX541 NOISE CHARACTERISTICS (Input tr = tf = 3.0 ns, CL = 50 pF, VCC = 3.3 V) TA = 25°C Symbol Parameter Typ Max Unit VOLP Quiet Output Maximum Dynamic VOL 0.5 0.8 V VOLV Quiet Output Minimum Dynamic VOL −0.5 −0.8 V VIHD Minimum High Level Dynamic Input Voltage 2.0 V VILD Maximum Low Level Dynamic Input Voltage 0.8 V SWITCHING WAVEFORMS VCC OE1 or OE2 VCC 50% 50% GND 50% A tPZL GND tPHL tPLH tPLZ HIGH IMPEDANCE 50% VCC Y VOL +0.3 V Y tPZH 50% VCC tPHZ VOH -0.3 V 50% VCC Y HIGH IMPEDANCE Figure 3. Figure 4. TEST CIRCUITS TEST POINT TEST POINT OUTPUT DEVICE UNDER TEST OUTPUT DEVICE UNDER TEST CL* *Includes all probe and jig capacitance 1 k CL* CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH. *Includes all probe and jig capacitance Figure 5. Figure 6. INPUT Figure 7. Input Equivalent Circuit http://onsemi.com 4 MC74LVX541 ORDERING INFORMATION Package Shipping† MC74LVX541DWG SOIC−20 (Pb−Free) 38 Units / Rail MC74LVX541DTR2G TSSOP−20 (Pb−Free) 2500 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE H DATE 22 APR 2015 SCALE 1:1 A 20 q X 45 _ M E h 0.25 H NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 1 10 20X B b 0.25 M T A S B DIM A A1 b c D E e H h L q S L A 18X e SEATING PLANE A1 c T GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT* 20 20X 20X 1.30 0.52 20 XXXXXXXXXXX XXXXXXXXXXX AWLYYWWG 11 1 11.00 1 XXXXX A WL YY WW G 10 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ 98ASB42343B SOIC−20 WB = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−20 WB CASE 948E ISSUE D DATE 17 FEB 2016 SCALE 2:1 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ K K1 S J J1 11 B SECTION N−N −U− PIN 1 IDENT 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C G D H DETAIL E 0.100 (0.004) −T− SEATING PLANE DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT 7.06 XXXX XXXX ALYWG G 1 0.65 PITCH 16X 0.36 16X 1.26 DOCUMENT NUMBER: 98ASH70169A DESCRIPTION: TSSOP−20 WB A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DIMENSIONS: MILLIMETERS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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