NB3N5573DTGEVB

NB3N5573DTGEVB NB3N5573DTGEVB Evaluation Board User's Manual http://onsemi.com Device Name: NB3N5573DTG (TSSOP−16) Board Name: NB35573DTGEVB EVAL BOARD USER’S MANUAL Description Board Features The NB3N5573 is a high precision, low phase noise clock generator that supports PCI Express and Ethernet requirements. The device takes a 25 MHz fundamental mode parallel resonant crystal and generates differential HCSL output at 25 MHz, 100 MHz, 125 MHz or 200 MHz clock frequencies. See datasheet NB3N5573/D (www.onsemi.com).The NB3N5573DTGEVB Evaluation board is designed to provide a flexible and convenient platform to quickly program, evaluate and verify the performance and operation of the NB3N5573DTG TSSOP−16 (Package Case 948F) device under test: With the device removed, this NB3N5573DTGEVB Evaluation board is designed to accept a 16 Lead TSSOP Socket (M&M Specialties, Inc., 1−800−892−8760, www.mmspec.com, M&M #50−000−00809) to permit use as an insertion test fixture. • Crystal mount source, or input external clock source • • (SMA) A TSSOP−16 NB3N5573DTG device is solder mounted or the board may be adapted for insertion testing by adding a TSSOP−16 socket. Separate supply connectors for VDD (banana jack and Anvil Clip) and GND (banana jack) Contents Description Board Features Board Layout Maps Test and Measurement Setup Procedures Appendix 1: Pin to Board Connection Information Appendix 2: Schematic Appendix 3: Bill of Materials, Lamination Stackup FRONT BACK Figure 1. NB3N5573DTGEVB Evaluation Board © Semiconductor Components Industries, LLC, 2012 February, 2012 − Rev. 1 1 Publication Order Number: EVBUM2065/D NB3N5573DTGEVB BOARD LAYOUT SEL1 GND Jack Connector VDD Jack Connector VDD ANVIL Connector SEL0 PIN3 CLK X1/CLK CLK X2 CLK1 CLK1 OE PIN8 Figure 2. FRONT Board Layout Figure 3. FRONT Layer Design http://onsemi.com 2 NB3N5573DTGEVB SEL0 GND Jack Connector VDD Jack Connector SEL1 CLK Crystal PIN3 CLK X1/CLK CLK1 X2 CLK1 OE PIN8 Figure 4. BACK Board Layout Figure 5. BACK Layer Design http://onsemi.com 3 NB3N5573DTGEVB TEST AND MEASUREMENT SET−UP AND PROCEDURE Step 1: Equipment 6. Time Transition Convertor: Agilent 14534 250 ps (or equivalent) 7. Phase noise Analyzer: Agilent E5052B (or equivalent) 1. Signal Generator: Agilent #33250A or HP8133 (or equivalent) 2. Tektronix TDS8000 Oscilloscope 3. Power Supply: Agilent #6624A or AG6626A DC (or equivalent) 4. Digital Voltmeter: Agilent 34410A or 34401 (or equivalent) 5. Matched Cables (> 20 GHz, SMA connectors): Storm or Semflex (or equivalent) Step 2: Lab Set−Up Procedure 1. Test Supply Setup: Board and Device Power Supply Connections are shown in Table 1. VDD (Banana Jack or Anvil Clip test point) and GND (Banana Jack) and may be connected by. Table 1. POWER SUPPLY CONNECTIONS Device Board Banana Jack Anvil Clip Test Point VDD VDD BJ1 J11 GND GND BJ2 J7 SUPPLY (VDD = 3.3 V; GND = 0.0 V’ VEE = 0.0 V) Comments DUTGND and SMA GND CLK1b outputs are directly connected to a LOW impedance (50 W) module, scope, or probe per Figure 6. Both lines in an HCSL pair must be terminated. Single supply operation may be accomplished by connecting VDD and GND. HCSL CLK, CLKb, CLK1, and Figure 6. Typical Termination for Output Driver and Device Evaluation Termination of a signal generator may be accomplished by placing a 50 W resistor (to GND) at location C42. The mounted crystal does not need to be removed for Single Ended input operation. For Crystal operation use a fundamental Parallel Resonant crystal (see Datasheet section on “Recommended Crystal Parameters”) of 25 MHz. The board is supplied with a thru–hole 25 MHz crystal installed, but alternatively has the tabs for a surface mount crystal. The Crystal mount is 2. Inputs: (see Appendix 1, Device Pin to Board Connection Information) For a Single Ended input to X1/CLK operation, install a zero ohm jumper resistor at R14. Do not install R16. Do not drive X2. Use a LVCMOS Clock amplitude signal at 25 MHz which satisfies datasheet VIH and VIL to drive X1/CLK. Input tr/tf transition edges should be about 250 ps. Use a TTC (Time transition Convertor) such as Agilent 14534 (250 ps) or equivalent, if needed to slow faster edges. http://onsemi.com 4 NB3N5573DTGEVB LVTTL/LVCMOS input signal levels. Load cap may be added to fine tune frequency such as 15 pF to GND on both crystal pins. Output current reference pin, IREF (Pin9) has a precision 475 W resistor (R5) installed from the output pin to GND to set the output current. Inputs OE1 and OE2 may be jumpered to VEE (GND) for a LOW level (DISABLED) using J15 (OE1) or J12 (OE2). If floated open (jumper removed), pin will default to a HIGH level (ENABLED). High Impedance probes must be used to sense the signal levels. located on the back (underside) of the board and is permanently connected to the device inputs by traces. Crystal load caps should be mounted from each crystal pin to GND (16 74− 20 pF) to fine tune frequency. Device frequency is selected by LVTTL/LVCMOS level inputs SEL0 and SEL1 per datasheet Table 2. Jumpers J12 (SEL0), J13 (SEL1) may be set to either VDD (HI) or GND (LO), or floated open (HI) to program the output frequency of operation. Jumpers may be removed to drive SEL0/1b directly with spec VIH or VIL levels. Note SEL0/1 inputs will default to VDD when left floating open. High Impedance probes must be used to sense the APPENDIX 1: DEVICE PIN TO BOARD CONNECTION INFORMATION (see current Datasheet) Table 2. DEVICE PINS TO BOARD CONNECTION Board Device Pin Device Pin Name Connection I/O Description 1 S0 SEL0 LVTTL/LVCMOS Input Frequency select input 0. Internal pullup resistor to VDD. See datasheet Table 2 2 S1 SEL1 LVTTL/LVCMOS Input Frequency select input 1. Internal pullup resistor to VDD. See datasheet Table 2 3 NC PIN3 No Connect No Connect 4 X1/CLK X1/CLK Crystal Interface Oscillator Input from Crystal. Single ended 25 Mhz LVTTL/LVCMOS Clock Input. 5 X2 X2 Crystal Interface Oscillator Output to drive Crystal 6 OE OE LVTTL/LVCMOS Input Output Enable Input pin to control CLKx (tri−states CLKx when LOW, open pin defaults to HIGH) 7 GND GND Ground Supply DUT and SMA GND Supply. All Supply pins must be connected for proper operation 8 NC PIN3 No Connect No Connect 9 IREF (−) 10 CLK1b CLK1b HCSL Output HCSL Invert Output 11 CLK1 CLK1 HCSL Output HCSL True Output 12 VDD VDD Positive Supply Positive Supply pin. All Supply pins must be connected for proper operation. 13 GND GND Ground Supply DUT and SMA GND Supply. All Supply pins must be connected for proper operation 14 CLK0b CLK0b HCSL Output HCSL Invert Output 15 CLK0 CLK0 HCSL Output HCSL True Output 16 GND GND Ground Supply DUT and SMA GND Supply. All Supply pins must be connected for proper operation (connects Pin 9 through 475 W to GND) http://onsemi.com 5 NB3N5573DTGEVB APPENDIX 2: SCHEMATIC Figure 7. Schematic http://onsemi.com 6 NB3N5573DTGEVB APPENDIX 3: BILL OF MATERIALS, LAMINATION STACKUP, AND ASSEMBLY NOTES Table 3. BILL OF MATERIAL Item Qty Schematic Value Size MFG P/N Description 1 2 BJ1−BJ2 ITT POMONA ELECTRONICS B−JACK 1/4−32 THREAD BANANAJACK 2 2 C1,C2 0.1 mF 0402 Panasonic − ECG ECJ−DEB1A104K CAP CERM .1UF 10% 10V X5R 3 2 C3,C4 0.01 mF 0402 AVX Corporation 04023C103KAT2A CAP CERM .01UF 10% 25V X7R 4 1 C9 10 mF 7343 Kemet T491C106K016AT CAP TANT 10UF 16V 10% SMD 5 5 J10,J12,J13,J15,J16 2pin Sullins Electronics Corp PEC36SACN CONN HEADER .100 SINGL STR 36 POS 6 5 J10,J12,J13,J15,J16 Sullins Electronics Corp STC02SYAN CONN JUMPER SHORTING TIN 7 4 R1,R2,R7,R8 33.2 0402 Panasonic − ECG ERJ−2RKF33R2X RES 33.2 W 1/16W 1% 0805 SMD 8 4 R3,R4,R9,R10 49.9 0402 YAGEO AMERICA 9C04021A49R8FLHF3 RES 49.9 W 1/16W 1% 0805 SMD 475 0402 Panasonic − ECG ERJ−2RKF49R9X RES 475 W 1/16W 1% 0805 SMD Emerson Network Power Connectivity Solutions 142−0701−801 CONN JACK END LAUNCH PCB .187” G KEYSTONE ELECTRONICS 5016 PC TEST POINT COMPACT SMT Ampere 2−330808−8 CONN SOCKET RCPT .013−0.21 30AU On Semiconductor NB3N5573DT 16 lead Tssop Dut 9 1 R5 10 11 J1−6,J8,J9,J14,J17,J18 11 1 J11 12 2 Y1 Socket Pins 13 U1 14 4 Standoff 15 4 Screw 16 1 Xtal ECLIPTEK ECX−6150−25.000M XTAL (Do Not Solder) 17 1 SOCKET M&M 50−000−00809 NOT INSTALLED, Not Provided SMT Nylon Standoff Nylon Screw Figure 8. 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